SLLS459C - NOVEMBER 2000 - REVISED MARCH 2005 D Three Differential Transceivers in One D D D D D D D D D D D Package Signaling Rates Up to 30 Mbps Low Power and High Speed Designed for TIA/EIA-485, TIA/EIA-422, ISO 8482, and ANSI X3.277 (HVD SCSI Fast-20) Applications Common-Mode Bus Voltage Range -7 V to 12 V ESD Protection on Bus Terminals Exceeds 12 kV Driver Output Current up to 60 mA Thermal Shutdown Protection Driver Positive and Negative Current Limiting Power-Up, Power-Down Glitch-Free Operation Pin-Compatible With the SN75ALS170 Available in Shrink Small-Outline Package SN65LBC170DB (marked as BL170) SN75LBC170DB (marked as BL170) (TOP VIEW) 1D 1DIR NC GND 2D 2DIR 3D 3DIR These devices combine three 3-state differential line drivers and three differential input line receivers, all of which operate from a single 5-V power supply. The driver differential outputs and the receiver differential inputs are connected internally to form three differential input/output (I/O) bus ports that are designed to offer minimum loading to the bus whenever the driver is disabled or VCC = 0. These ports feature a wide common-mode voltage range making the device suitable for party-line applications over long cable runs. 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 1B 1A NC VCC 2B 2A 3B 3A SN65LBC170DW (marked as 65LBC170) SN75LBC170DW (marked as 75LBC170) (TOP VIEW) 1D 1DIR NC GND NC 2D 2DIR NC 3D 3DIR description The SN65LBC170 and SN75LBC170 are monolithic integrated circuits designed for bidirectional data communication on multipoint bus-transmission lines. Potential applications include serial or parallel data transmission, cabled peripheral buses with twin axial, ribbon, or twisted-pair cabling. These devices are suitable for FAST-20 SCSI and can transmit or receive data pulses as short as 25 ns, with skew less than 3 ns. 1 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 1B 1A NC NC VCC 2B 2A 3B 3A NC NC - No internal connection logic diagram 1DIR 1A 1B 1D 2DIR 2A 2B 2D 3DIR 3A 3B 3D Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. The signaling rate of a line is the number of voltage transitions that are made per second expressed in the units bps (bits per second). Copyright 2002, Texas Instruments Incorporated !"# $"%&! '#( '"! ! $#!! $# )# # #* "# '' +,( '"! $!#- '# #!#&, !&"'# #- && $##( POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SLLS459C - NOVEMBER 2000 - REVISED MARCH 2005 description (continued) The driver's active-high enable and the receiver's active-low enable are tied together internally and provide a direction input for each driver/receiver pair. The SN75LBC170 is characterized for operation over the temperature range of 0C to 70C. The SN65LBC170 is characterized for operation over the temperature range of -40C to 85C. AVAILABLE OPTIONS PACKAGE TA PLASTIC SHRINK SMALL-OUTLINE (JEDEC MO-150) PLASTIC SMALL-OUTLINE (JEDEC MS-013) 0C to 70C SN75LBC170DB SN75LBC170DW -40C to 85C SN65LBC170DB SN65LBC170DW Add R suffix for taped and reel For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Function Tables EACH DRIVER INPUT D ENABLE DIR EACH RECEIVER OUTPUTS DIFFERENTIAL INPUT ENABLE OUTPUT (VA-VB) DIR D VID 0.2 V L H B A L H H H -0.2 V < VID < 0.2 V L H L H L VID -0.2 V L H OPEN H L X H Z X Z L L OPEN X X OPEN X H = high level, L = low level, X = irrelevant, Z = high impedance (off), ? = indeterminate ? L Z H equivalent input and output schematic diagrams DIR INPUTS A INPUT B INPUT VCC VCC 100 k 16 V VCC 4 k 4 k 16 V 18 k 18 k Input 1 k Input Input 100 k 16 V 16 V 4 k 4 k 100 k 8V A AND B OUTPUT D I/O VCC VCC VCC 16 V 4 k 18 k Output 40 100 k 4 k 8V 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 16 V SLLS459C - NOVEMBER 2000 - REVISED MARCH 2005 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 6 V Voltage range at any bus I/O terminal (steady state) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -10 V to 15 V Voltage input range, A and B, (transient pulse through 100 , see Figure 12) . . . . . . . . . . . . . . -30 V to 30 V Voltage range at any D or DIR terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 0.5 V to VCC + 0.5 V Receiver output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA Electrostatic discharge: Human body model (A, B, GND) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . 12 kV All pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 kV Charged-device model (all pins) (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Power Dissipation Rating Table Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. 2. Tested in accordance with JEDEC Standard 22, Test Method A114-A. 3. Tested in accordance with JEDEC Standard 22, Test Method C101. POWER DISSIPATION RATING TABLE PACKAGE TA 25C POWER RATING DERATING FACTOR} ABOVE TA = 25C TA = 70C POWER RATING TA = 85C POWER RATING 515 mW DB 995 mW 8.0 mW/C 635 mW DW 1480 mW 11.8 mW/C 950 mW 770 mW This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. recommended operating conditions Supply voltage, VCC Voltage at any bus I/O terminal High-level input voltage, VIH Low-level input voltage, VIL Differential input voltage, VID Output current Operating free-air temperature, TA MIN NOM MAX UNIT 4.75 5 5.25 V -7 12 V 2 0 VCC 0.8 V A with respect to B -12 12 V Driver -60 60 -8 8 SN75LBC170 0 70 SN65LBC170 -40 85 A, B D, DIR Receiver POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 mA C 3 SLLS459C - NOVEMBER 2000 - REVISED MARCH 2005 DRIVER SECTION electrical characteristics over recommended operating conditions PARAMETER VIK VO Input clamp voltage TEST CONDITIONS D and DIR Open-circuit output voltage (single-ended) II = 18 mA A or B, No load Steady-state differential output voltage magnitude RL = 54 , See Figure 1 With common-mode loading, See Figure 2 VOD Change in differential output voltage magnitude, | VOD(H) | - |VOD(L) | VOC(SS) Steady-state common-mode output voltage VOC(SS) Change in steady-state common-mode output voltage (VOC(H) - VOC(L)) II IO Input current D, DIR Output current with power off VCC = 0 V, VO = -7 V to 12 V, TYP -1.5 -0.7 0 No load |VOD(SS)| MIN See Figure 1 VO = -7 V to 12 V See Figure 7 UNIT V 4.3 VCC VCC V 3.8 1 1.6 2.4 V 1 1.6 2.4 -0.2 RL = 54 , CL = 50 pF MAX 2 0.2 2.4 V 2.8 -0.2 0.2 V -100 100 A -700 900 A IOS Short-circuit output current -250 250 mA ICC Supply current (driver enabled) D at 0 V or VCC, DIR at VCC, No load 14 20 mA All typical values are at VCC = 5 V and TA = 25C. The minimum VOD may not fully comply with TIA/EIA-485-A at operating temperatures below 0C. System designers should take the possibly lower output signal into account in determining the maximum signal-transmission distance. switching characteristics over recommended operating conditions MIN TYP MAX tPLH tPHL Differential output propagation delay, low-to high PARAMETER TEST CONDITIONS 4 8.5 12 Differential output propagation delay, high-to-low 4 8.5 11 tr tf Differential output rise time 3 7.5 11 3 7.5 11 tsk(p) tsk(o) Pulse skew | (tPLH - tPHL) | Output skew tsk(pp) tPLH Part-to-part skew RL = 54 , CL = 50 pF, See Figure 3 Differential output fall time 1.5 2 Differential output propagation delay, low-to high 3 7 10 Differential output propagation delay, high-to-low 3 7.5 10 Differential output rise time 3 7.5 12 tf tsk(p) Differential output fall time 3 7.5 12 tPZH tPHZ See Figure 4, (HVD SCSI double-terminated load) Pulse skew | (tPLH - tPHL) | Output skew Output disable time from high level ns 3 1.5 Part-to-part skew Output enable time to high level ns 2 tPHL tr tsk(o) tsk(pp) UNIT 2.5 See Figure 5 15 25 18 25 ns tPZL Output enable time to low level 10 25 See Figure 6 ns tPLZ Output disable time from low level 17 25 Output skew (tsk(o)) is the magnitude of the time delay difference between the outputs of a single device with all of the inputs connected together. Part-to-part skew (tsk(pp)) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same input signals, the same supply voltages, at the same temperature, and have identical packages and test circuits. 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLLS459C - NOVEMBER 2000 - REVISED MARCH 2005 RECEIVER SECTION electrical characteristics over recommended operating conditions PARAMETER TEST CONDITIONS VIT+ VIT- Positive-going differential input voltage threshold Vhys VOH Hysteresis voltage (VIT+ - VIT-) VOL Low-level output voltage VID = 200 mV, IOH = -8 mA, See Figure 8 VID = -200 mV, IOL = -8 mA, See Figure 8 II Line input current Other input = 0 V RI Input resistance A, B Negative-going differential input voltage threshold MIN TYP MAX V -0.2 See Figure 8 40 High-level output voltage ICC Supply current (receiver enabled) All typical values are at VCC = 5 V and TA = 25C. UNIT 0.2 VI = 12 V VI = -7 V 4 4.7 0 0.2 mV VCC 0.4 V 0.9 mA -0.7 12 k A, B, D, and DIR open 16 mA switching characteristics over recommended operating conditions PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tPLH tPHL Propagation delay time, low-to-high level output 7 16 ns Propagation delay time, high-to-low level output 7 16 ns tr tf Receiver output rise time 3 ns Receiver output fall time 1.3 3 ns tPZH tPHZ Receiver output enable time to high level 26 40 tPZL tPLZ Receiver output enable time to low level tsk(p) tsk(o) Pulse skew (| tPLH - tPHL |) Output skew See Figure 9 Receiver output disable time from high level 1.3 See Figure 10 40 29 Receiver output enable time to high level See Figure 11 ns 40 40 2 ns ns 1.5 ns tsk(pp) Part-to-part skew 3 ns Output skew (tsk(o)) is the magnitude of the time delay difference between the outputs of a single device with all of the inputs connected together. Part-to-part skew (tsk(pp)) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same input signals, the same supply voltages, at the same temperature, and have identical packages and test circuits. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 SLLS459C - NOVEMBER 2000 - REVISED MARCH 2005 PARAMETER MEASUREMENT INFORMATION IO 27 II 0 V or 3 V IO VO VOD 50 pF 27 VOC VO Includes probe and jig capacitance Figure 1. Driver Test Circuit, VOD and VOC Without Common-Mode Loading 375 Input VOD 60 VTEST = -7 V to 12 V 375 VTEST Figure 2. Driver Test Circuit, VOD With Common-Mode Loading 3V RL = 54 Signal Generator{ Input CL = 50 pF} 1.5 V 1.5 V 0V VOD tPLH 50 Output tPHL 90% 90% 10% tr PRR = 1 MHz, 50% Duty Cycle, tr < 6 ns, tf < 6 ns, Zo = 50 Includes probe and jig capacitance Figure 3. Driver Switching Test Circuit and Waveforms, 485-Loading 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 10% tf VOD(H) 0V VOD(L) SLLS459C - NOVEMBER 2000 - REVISED MARCH 2005 PARAMETER MEASUREMENT INFORMATION 5V S1 0V 375 3V 60 pF 165 Input 1.5 V 1.5 V 0V tPLH 75 Signal Generator{ tPHL VOD 165 10% 60 pF 375 5V VOD(H) 0V VOD(L) 90% 90% Output 50 10% tr tf S2 0V PRR = 1 MHz, 50% Duty Cycle, tr < 6 ns, tf < 6 ns, Zo = 50 Includes probe and jig capacitance Figure 4. Driver Switching Test Circuit and Waveforms, HVD SCSI-Loading (double terminated) A 1.5 V Output 0 V or 3 V{ 1.5 V 0V B RL = 110 CL = 50 pF Input Generator} 3V Input S1 0.5 V tPZH Output VOH 2.3 V 0V 50 tPHZ 3 V if testing A output, 0 V if testing B output PRR = 1 MHz, 50% Duty Cycle, tr < 6 ns, tf < 6 ns, Zo = 50 w Includes probe and jig capacitance Figure 5. Driver Enable/Disable Test, High Output 5V RL = 110 A Input S1 0 V or 3 V{ 3V 1.5 V 1.5 V 0V Output tPZL B CL = 50 pF Input Output tPLZ 5V 2.3 V VOL Generator 50 0.5 V 0 V if testing A output, 3 V if testing B output PRR = 1 MHz, 50% Duty Cycle, tr < 6 ns, tf < 6 ns, Zo = 50 w Includes probe and jig capacitance Figure 6. Driver Enable/Disable Test, Low Output POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 SLLS459C - NOVEMBER 2000 - REVISED MARCH 2005 PARAMETER MEASUREMENT INFORMATION IOS VO IO VID Voltage Source VO Figure 7. Driver Short-Circuit Test Generator{ Figure 8. Receiver DC Parameters 50 Input B A D VID Generator{ 1.5 V Input A 0V B CL = 15 pF} 50 3V IO tPLH VO tPHL Output 1.5 V 10% 90% 90% VOH 1.5 V 10% V OL tr PRR = 1 MHz, 50% Duty Cycle, tr < 6 ns, tf < 6 ns, Zo = 50 Includes probe and jig capacitance tf Figure 9. Receiver Switching Test Circuit and Waveforms 1.5 V VCC A D B 1 k 1.5 V 0V tPZH tPHZ 1.5 V 50 VOH VOH -0.5 V GND PRR = 1 MHz, 50% Duty Cycle, tr < 6 ns, tf < 6 ns, Zo = 50 Includes probe and jig capacitance Figure 10. Receiver Enable/Disable Test, High Output 8 1.5 V CL = 15 pF} DIR Generator{ 3V DIR POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLLS459C - NOVEMBER 2000 - REVISED MARCH 2005 PARAMETER MEASUREMENT INFORMATION -1.5 V VCC A D B DIR 3V DIR 1 k 1.5 V 1.5 V 0V CL = 15 pF} tPZL tPLZ VCC 1.5 V Generator{ 50 VOL + 0.5 V VOL PRR = 1 MHz, 50% Duty Cycle, tr < 6 ns, tf < 6 ns, Zo = 50 Includes probe and jig capacitance Figure 11. Receiver Enable/Disable Test, Low Output 100 Pulse Generator, 15-s Duration, 1% Duty Cycle VTEST 0V 15 s 1.5 ms -VTEST Figure 12. Test Circuit and Waveform, Transient Over Voltage Test POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 9 SLLS459C - NOVEMBER 2000 - REVISED MARCH 2005 TYPICAL CHARACTERISTICS DIFFERENTIAL OUTPUT VOLTAGE vs OUTPUT CURRENT DIFFERENTIAL OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE 2.5 3.5 VOD - Differential Output Voltage - V VOD - Differential Output Voltage - V 4 3 VCC = 5.25 V 2.5 VCC = 5 V 2 1.5 VCC = 4.75 V 1 0.5 0 0 20 40 60 80 IO - Output Current - mA VCC = 5 V 1.5 VCC = 4.75 V 1 0.5 0 -60 100 VCC = 5.25 V 2 -40 Figure 13 165 160 10 I CC - Supply Current - mA Driver Propagation Delay - ns 11 SCSI Load 9 8 RS-485 Load 6 All 3 Channels Driving RL = 54 , CL = 50 pF (Each Channel), Pseudorandom NRZ Data 155 150 145 140 5 -20 0 20 40 60 TA - Free-Air Temperature - C 80 135 0.1 Figure 15 10 100 SUPPLY CURRENT vs SIGNALING RATE 12 4 -40 80 Figure 14 DRIVER PROPAGATION DELAY vs FREE-AIR TEMPERATURE 7 -20 0 20 40 60 TA - Free-Air Temperature - C 1 10 Signaling Rate - Mbps Figure 16 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 100 SLLS459C - NOVEMBER 2000 - REVISED MARCH 2005 TYPICAL CHARACTERISTICS BUS INPUT CURRENT vs BUS INPUT VOLTAGE RECEIVER PROPAGATION DELAY TIME vs FREE-AIR TEMPERATURE 800 t pd - Receiver Propagation Delay Time - ns 12 600 Bus Input Current - A VCC = 0 V 400 VCC = 5 V 200 0 -200 -400 -600 -10 -5 0 5 10 11 10 tPHL 9 tPLH 8 7 6 5 4 -40 15 -20 Bus Input Voltage - V Figure 17 0 20 40 60 TA - Free-Air TemperatureC 80 Figure 18 SN65LBC170 (as Driver) 15 Meters, Cat. 5 Twisted-Pair Cable Signal Generator SN65LBC170 (as Receiver) 100 15 pF Figure 19. Circuit Diagram for Signaling Characteristics POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 11 SLLS459C - NOVEMBER 2000 - REVISED MARCH 2005 TYPICAL CHARACTERISTICS Driver Input (5 V/div) Driver Output (2 V/div) Receiver Input (2 V/div) 25 ns Receiver Output (5 V/div) Figure 20. Signal Waveforms at 30 Mbps Driver Input (5 V/div) Driver Output (2 V/div) Receiver Input (2 V/div) 12.5 ns Receiver Output (5 V/div) Figure 21. Eye Patterns, Pseudorandom Data at 30 Mbps 12 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLLS459C - NOVEMBER 2000 - REVISED MARCH 2005 TYPICAL CHARACTERISTICS Driver Input (5 V/div) Driver Output (2 V/div) Receiver Input (2 V/div) 25 ns Receiver Output (5 V/div) Figure 22. Signal Waveforms at 50 Mbps Driver Input (5 V/div) Driver Output (2 V/div) Receiver Input (2 V/div) 12.5 ns Receiver Output (5 V/div) Figure 23. Eye Patterns, Pseudorandom Data at 50 Mbps POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 13 PACKAGE OPTION ADDENDUM www.ti.com 27-Aug-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65LBC170DB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC170DBG4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC170DBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC170DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC170DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC170DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC170DB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC170DBG4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC170DBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC170DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN65LBC170DBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN75LBC170DBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN65LBC170DBR SSOP DB 16 2000 367.0 367.0 38.0 SN75LBC170DBR SSOP DB 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. 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