1
FEATURES
17ns maximum access time
Asynchronous operation for compatibility with industry-
standard 512K x 8 SRAMs
CMOS compatible inputs and output levels, three-state
bidirectional data bus
- I/O Voltage 3.3 volts, 1.8 volt core
Operational environment:
- Intrinsic tot a l-dose: 300 krad(Si)
- SEL Immune >100 MeV-cm2/mg
- LETth (0.25): 53.0 MeV-cm2/mg
- Memory Cell Saturated Cross Section 1.67E-7cm2/bit
- Neutron Fluence: 3.0E14n/cm2
- Dose Rate
- Upset 1.0E9 rad(Si)/sec
- Latchup 1.0E11 rad(Si)/sec
Packaging options:
- 68-lead ceramic quad flatpack (20.238 grams with lead
frame)
Standard Microcircuit Drawing 5962-04227
- QML Q & V compliant part
INTRODUCTION
The UT8CR512K32 i s a high-performance CMOS static RAM
multi-chip module (MCM), organized as four individual
524,288 words by 8 bit SRAMs with common output enable.
Easy memory expansion is provi ded by active LOW chip
enables (E), an active LOW output enable (G), and three-state
drivers. This device has a power-down feature that reduces
power consumption by more than 90% when desel ected .
Writing to each memory is accomplished by taking the
corresponding chip enable (E) input LOW and write enable (W)
input LOW . Data on the I/O pins is then written into the location
specified on the address pins (A0 through A18). Reading from
the device is accomplished by taking the chip enable (E) and
output enable (G) LOW while forcing write enable (W) HIGH.
Under these conditions, the contents of the memory location
specified by the address pins will appear on the I/O pins.
The input/output pins are placed in a high impedance state when
the device is deselected (E HIGH), the outputs are disabled (G
HIGH), or during a write operation (E LOW and W LOW).
Perform 8, 16, 24 or 32 bit accesses by making W along with E
a common input to any combination of the discrete memory die.
Standard Products
UT8CR512K32 16 Megabit SRAM
Data Sheet
September 2008
www.aeroflex.com/Memories
Figure 1. UT8CR512K32 SRAM Block Diagram
512K x 8 512K x 8 512K x 8 512K x 8
DQ(31:24)
or
DQ3(7:0)
DQ(23:16)
or
DQ2(7:0)
DQ(15:8)
or
DQ1(7:0)
DQ(7:0)
or
DQ0(7:0)
G
A(18:0)
W3
E3 E2E1 E0
W2 W1W0
2
PIN NAMES
DEVICE OPERATION
Each die in the UT8CR512K32 has three control inputs called
Enable (E), Write Enable (W), and Output Enable (G); 19
address inputs, A(18:0); and eight bidirectional data lines,
DQ(7:0). The device enable (E) controls device selection,
active, and standby modes. Asserting E enables the device,
causes IDD to rise to its active value, and decodes the 19 address
inputs to each memory die by selecting the 2,048,000 byte of
memory. W controls read and write operations. During a read
cycle, G must be asserted to enable the outputs.
Table 1. Device Operation Truth Table
Notes:
1. “X” is defined as a “don’t care” condition.
2. Device active; outputs disabled.
READ CYCLE
A combination of W greater than VIH (min) with E and G less
than VIL (max) defines a read cycle. Read access time is
measured from the latter of device enable, output enable, or valid
address to valid dat a output.
SRAM read Cycle 1, the Address Access is initiated by a change
in address inputs while the chip is enabled with G asserted and
W deasserted. V alid data appears on data outputs DQn(7:0) after
the specified tAVQV is satisfied. Outputs remain active
throughout the entire cycle. As long as device enable and output
enable are active, the address inputs may change at a rate equal
to the minimum read cycle time (tAVAV).
SRAM read Cycle 2, the Chip Enable-controlled Access is
initiated by E going active while G remains asserted, W remains
deasserted, and the addresses remain stable for the entire cycle.
After the specified tETQV is satisfied , the eight-bit word
addressed by A(18:0) is accessed and appears at the data outputs
DQn(7:0).
SRAM read Cycle 3, the Output Enable-controlled Access is
initiated by G going active while E is asserted, W is deasserted,
and the addresses are stable. Read access time is tGLQV unless
tAVQV or tETQV have not been satisfied.
A(18:0) Address
DQ(7:0) Data Input/Output
EEnable
WWrite Enable
GOutput Enable
VDD1 Power (1.8V)
VDD2 Power (3.3V)
VSS Ground
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
68 67 66 65 64 63 62 61 60 59 58 57 56 555453 52
1819 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34
Top View
DQ0(0)
DQ1(0)
DQ2(0)
DQ3(0)
DQ4(0)
DQ5(0)
DQ6(0)
DQ7(0)
VSS
DQ0(1)
DQ1(1)
DQ2(1)
DQ3(1)
DQ4(1)
DQ5(1)
DQ6(1)
DQ7(1)
DQ0(2)
DQ1(2)
DQ2(2)
DQ3(2)
DQ4(2)
DQ5(2)
DQ6(2)
DQ7(2)
VSS
DQ0(3)
DQ1(3)
DQ2(3)
DQ3(3)
DQ4(3)
DQ5(3)
DQ6(3)
DQ7(3)
VDD1
A0
A1
A2
A3
A4
A5
E2
VSS
E3
W0
A6
A7
A8
A9
A10
VDD2
VDD2
A11
A12
A13
A14
A15
A16
E0
G
E1
A17
W1
W2
W3
A18
VDD1
VSS
G W E I/O Mode Mode
XX13-stateStandby
X 0 0 Data in Write
1103-state
Read2
010Data outRead
Figure 2. 17ns SRAM Pinout 68)
3
WRITE CYCLE
A combination of W less than VIL(max) and E less than
VIL(max) defines a write cycle. The state of G is a “don’ t care”
for a write cycle. The outputs are placed in the high-impedance
state when either G is greater than VIH(min), or when W is less
than VIL(max).
Write Cycle 1, the Write Enable-controlled Access is defined
by a write terminated by W going high, with E still active. The
write pulse width is defined by tWLWH when the write is initiated
by W, and by tETWH when the write is initiated by E. Unless the
outputs have been previously placed in the high-impedance state
by G, the user must wait tWLQZ before applying data to the eight
bidirectional pins DQn(7:0) to avoi d bus contention.
Write Cycle 2, the Chip Enable-controlled Access is defined by
a write terminated by the former of E or W going inactive. The
write pulse width is defined by tWLEF when the write is initiated
by W, and by tETEF when the write is initiated by the E going
active. For the W initiated write, unless the output s have been
previously placed in the high-impedance state by G, the user
must wait tWLQZ before applying data to the eight bidirectional
pins DQn (7:0) to avoid bus contention.
Operational Environment
The UT8CR512K32 SRAM incorporates special design and
layout features which allows operation in a limited environment.
Table 2. Operational Environment
Design Specifications1
Notes:
1. The SRAM is immune to latchup to particles >100MeV-cm2/mg.
2. 90% worst case particle environment, Geosynchronous orbit, 100 mils of
Aluminum.
Supply Sequencing
No supply voltage sequencing is required between VDD1 and
VDD2.
Total Dose 300K rad(Si)
Heavy Ion
Error Rate28.9x10-10 Errors/Bit-Day
4
ABSOLUTE MAXIMUM RATINGS1
(Referenced to VSS)
Notes:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only , and fu nctional operation of the device at
these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maxim u m ratin g
conditions for extended periods may affect device reliability and performance.
2. Maximum junction temperatu re may be incr eased to +175°C during burn- in and steady-static life.
3. Test per MIL-STD-883, Method 1012.
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER LIMITS
VDD1 DC supply voltage -0.3 to 2.0V
VDD2 DC supply voltage -0.3 to 3.8V
VI/O Voltage on any pin -0.3 to 3.8V
TSTG Storage temperature -65 to +150°C
PDMaximum power dissipation 1.2W
TJMaximum junction tem perature2+150°C
ΘJC Thermal resistance, junction-to-case35°C/W
IIDC input current ±5 mA
SYMBOL PARAMETER LIMITS
VDD1 Positive supply voltage 1.7 to 1.9V
VDD2 Positive supply voltage 3.0 to 3.6V
TCCase temperature range (C) Screening: -55 to +125°C
(W) Screening: -40 to +125°C
VIN DC input voltage 0V to VDD2
5
DC ELECTRICAL CHARACTERISTICS (Pre and Post-Radiation)*
(-55°C to +125°C for (C) scr eening and -40°C to 125°C for (W) screening)
Notes:
* Post-radiation pe rfo rm ance guaranteed at 25°C per MIL-STD-883 Method 1019 at 1.0E5 rad(Si).
1. Measured only for initial qualification and after process or design changes that could affect input/output capacitance.
2. Supplied as a design limit but not guaranteed or tested.
3. Not more than one output may be shorted at a time for maximum duration of one second.
4. VIH = VDD2 (max), VIL = 0V.
SYMBOL PARAMETER CONDITION MIN MAX UNIT
VIH High-level input voltage .7*VDD2 V
VIL Low-level input voltage .3*VDD2 V
VOL1 Low-level output voltage IOL = 8mA,VDD2 =VDD2 (min) .2*VDD2 V
VOH1 High-level output voltag e IOH = -4mA,VDD2 =VDD2 (min) .8*VDD2 V
CIN1Input capacitance ƒ = 1MHz @ 0V 44 pF
CIO1Bidirectional I/O capacitance ƒ = 1MHz @ 0V 21 pF
IIN Input leakage current VIN = VDD2 and VSS -2 2 μA
IOZ Three-state output leakage
current VO = VDD2 and VSS, VDD2 = VDD2 (max)
G = VDD2 (max)
-2 2 μA
IOS2, 3 Short-circuit output current VDD2 = VDD2 (max), VO = VDD2
VDD2 = VDD2 (max), VO = VSS
-100 +100 mA
IDD1(OP1) Supply current operating
@ 1MHz Inputs : VIL = VSS + 0.2V
VIH = VDD2 - 0.2V, IOUT = 0
VDD1 = VDD1 (max), VDD2 = VDD2 (max)
70 mA
IDD1(OP2) Supply current operating
@58.8MHz Inputs : VIL = VSS + 0.2V,
VIH = VDD2 - 0.2V, IOUT = 0
VDD1 = VDD1 (max), VDD2 = VDD2 (max)
122 mA
IDD2(OP1) Supply current operating
@ 1MHz Inputs : VIL = VSS + 0.2V
VIH = VDD2 - 0.2V, IOUT = 0
VDD1 = VDD1 (max), VDD2 = VDD2 (max)
.35 mA
IDD2(OP2) Supply current operating
@58.8MHz Inputs : VIL = VSS + 0.2V,
VIH = VDD2 - 0.2V, IOUT = 0
VDD1 = VDD1 (max), VDD2 = VDD2 (max)
11 mA
IDD1(SB)4
IDD2(SB)4
Supply current standby @
0Hz CMOS inputs , IOUT = 0
E = VDD2 -0.2
VDD1 = VDD1 (max), VDD2 = VDD2 (max)
65
8
mΑ
μA
IDD1(SB)4
IDD2(SB)4
Supply current standby
A(18:0) @ 58.8MHz CMOS inputs , IOUT = 0
E = VDD2 - 0.2
VDD1 = VDD1 (max), VDD2 = VDD2 (max)
65
8
mΑ
μA
6
AC CHARACTERISTICS READ CYCLE (Pre and Post-Radiation)*
(-55°C to +125°C for (C) screening and -40°C to +125°C for (W) screening, VDD1 = VDD1 (min), VDD2 = VDD2 (min))
Notes:
* Post-radiation performance guaranteed at 25°C per MIL-STD-883 Method 1019.
1. Guaranteed, but not tested.
2. Three-state is defined as a 200mV change from steady-state output voltage.
3. The ET (enable true) notation refers to the latter falling edge of E. SEU immunity does not affect the read parameters.
4. The EF (enable false) notation refers to the latter rising edge of E. SEU immunity does not affect the read parameters.
SYMBOL PARAMETER 8CR512-155
MIN MAX
UNIT
tAVAV1Read cycle time 17 ns
tAVQV Read access time 17 ns
tAXQX2Output hold time 3 ns
tGLQX1,2 G-controlled output enab le tim e 0 ns
tGLQV G-controlled read access time 7 ns
tGHQZ2G-controlled output three-state tim e 7 ns
tETQX2,3 E-controlled output enable time 5 ns
tETQV3E-controlled access time 17 ns
tEFQZ4E-controlled output three-state time210 ns
7
Figure 3c. SRAM Read Cycle 3: Output Enable-Controlled Access
A(18:0)
DQn(7:0)
GtGHQZ
Assumptions:
1. E < VIL (max) and W > VIH (min)
tGLQV
tGLQX
tAVQV
DATA VALID
Assumptions:
1. E and G < VIL (max) and W > VIH (min)
A(18:0)
DQn(7:0)
Figure 3a. SRAM Read Cycle 1: Address Access
tAVAV
tAVQV
tAXQX
Previous Valid Data Valid Data
Assumptions:
1. G < VIL (max) and W > VIH (min)
A(18:0)
Figure 3b. SRAM Read Cycle 2: Chip Enable-Controlled Access
E
DATA VALID
tEFQZ
tETQX
tETQV
DQn(7:0)
8
AC CHARACTERISTICS WRITE CYCLE (Pre and Post-Radiation)*
(-55°C to +125°C for (C) screening and -40°C to +125°C for (W) screening, VDD1 = VDD1 (min), VDD2 = VDD2 (min))
Notes:
* Post-radiation performance guaranteed at 25°C per MIL-STD-883 Method 1019.
1. Test with G high.
2. Three-state is defined as 200mV change from steady-state output voltage .
SYMBOL PARAMETER 8ER512
MIN MAX
UNIT
tAVAV1Write cycle time 17 ns
tETWH Device enable to end of write 12 ns
tAVET Address setup time for write (E- control led) 0 ns
tAVWL Address setup time for write (W - controlled) 0 ns
tWLWH Write pulse width 12 ns
tWHAX Address hold time for write (W - controlled) 2 ns
tEFAX Address hold time for device enable (E- controlled ) 0 ns
tWLQZ2W - controlled three-state time 5 ns
tWHQX2W - controlled output enable time 4 ns
tETEF Device enable pulse width (E - controlled) 12 ns
tDVWH Data setup time 7 ns
tWHDX Data hold time 2 ns
tWLEF Device enable controlled write pulse width 12 ns
tDVEF Data setup time 12 ns
tEFDX Data hold time 0 ns
tAVWH Address valid to end of write 12 ns
tWHWL1Write disable time 3 ns
tWLMZ2TBD
tWHMX2TBD
9
Assumptions:
1. G < VIL (max). If G > VIH (min) then Qn(8:0) will be
in three-state for the entire cycle.
W
tAVWL
Figure 4a. SRAM Write Cycle 1: Write Enable - Controlled Access
A(18:0)
Qn(7:0)
E
Dn(7:0) APPLIED DATA
tDVWH tWHDX
tETWH
tWLWH tWHAX
tWHQX
tWLQZ
tAVWH
tWHWL
10
tEFDX
Assumptions & Notes:
1. G < VIL (max). If G > VIH (min) then Qn(7:0) will be in three-state for the entire cycle.
2. Either E scenario above can occur.
A(18:0)
Figure 4b. SRAM Write Cycle 2: Chip Enable - Controlled Access
W
E
Dn(7:0) APPLIED DATA
E
Qn(7:0) tWLQZ
tETEF
tWLEF
tDVEF
tAVET
tAVET
tETEF
tEFAX
tEFAX
or
11
DATA RETENTION CHARACTERISTICS (Pre-Radiation)* (VDD2 = VDD2 (min), 1 Sec DR Pulse)
Notes:
* Post-radiation performance guaranteed at 25°C per MIL-STD-883 Method 1019.
1. E = VDD2 all other inputs = VDD2 or VSS
2. VDD2 = 0 volts to VDD2 (max)
SYMBOL PARAMETER TEMP MINIMUM MAXIMUM UNIT
VDR VDD1 for data retention -- 1.0 -- V
IDDR 1
Device Type 1
Data retention current -55°C
25°C
125°C
--
--
--
700
700
55
μA
μA
mA
IDDR 1
Device Type 2
Data retention current -40°C
25°
125°C
--
--
--
700
700
55
μA
μA
mA
tEFR1,2 Chip deselect to data retention time -- 0-- ns
tR1,2 Operation recovery time -- tAVAV -- ns
VDD1
DATA RETENTION MODE
tR
1.7V
VDR > 1.0V
Figure 5. Low VDD Data Retention Waveform
tEFR
EVDD2
VIN <0.3VDD2 CMOS
VSS
VIN >0.7VDD2 CMOS
1.7V
Notes:
1. 50pF including scope probe and test socket.
2. Measurement of data output occurs at the low to high or high to low transition mid-point
(i.e., CMOS input = VDD2/2).
90%
Figure 6. AC Test Loads and Input Waveforms
Input Pulses
10%
< 2ns < 2ns
1.4V
188 ohms
50pF
CMOS
0.0V
VDD2-0.05V
12
PACKAGING
Figure 7. 68-pin Ceramic FLATPACK
Notes:
1. All exposed metalized areas are gold plated
over electroplated nickel per MIL-PRF-3 8535.
2. The lid is electrically connected to VSS.
3. Lead finishes are in accordance to MIL-PRF-
38535.
4. Ceramic shall be dark alumina.
5. Letter designations are to cross reference to
MIL-STD-1835.
6. Dogleg geometries are optional within
dimensions shown.
7. These areas may have notches and tabs
different than shown.
8. Lead true position t olerances an d coplanarity
are not measured.
9. Packages may be shipped with repaired leads
as shown. Coplanarity requirements do not
apply in the repaired area.
10. Numbering and lettering on the ceramic are
not subject to visual or marking criteria.
13
ORDERING INFORMATION
512K32 SRAM:
UT **** * - * * * * *
Lead Finish:
(A) = Hot solder dipped
(C) = Gold
(X) = Factory option (gold or solder)
Screening:
(C) = HiRel Temperature Range flow (-55°C to +125°C)
(P) = Prototype flow
(W) = Extended industrial temperature range flow (-40°C to +125°C)
Package Type:
(V) = 68-lead ceramic FP
Access Time:
(17) = 17ns access time
Device Type:
(8CR512K32) = 512K x 32SRAM
Notes:
1. Lead finish (A,C, or X) must be specified.
2. If an “X” is specified when ordering, then the part marking will match the lead finish and will be either “A” (solder) or “C” (gold).
3. Prototype flow per Aer oflex Colorado Springs Manufacturing Flows Document. T ested at 25°C only . Lead finish is GOLD ONLY.
Radiation neither tested nor guaranteed.
4. HiRelT emperature Range flow per Aeroflex Colorado Springs Manufacturing Flows Document. Devices are tested at -55°C, room
temp, and 125°C. Radiation neither tested nor guaranteed.
5. Extended Industrial Range flow per Aeroflex Colorado Springs Manufacturing Flows Document. Devices are tested at -40°C, room
temp, and 125°C. Radiation neither tested nor guaranteed.
14
512K x 32 SRAM: SMD
5962 - 04227 *** ** Lead Finish:
(A) = Hot solder dipped
(C) = Gold
(X) = Factory Option (gold or solder)
Case Outline:
(X) = 68-lead ceramic flatpack
Class Designator:
(Q) = QML Class Q
(V) = QML Class V
Device Type
(01) = 17ns access time, CMOS I/O, 68-lea d flat pack package (-55°C to +125°C)
(02) = 17ns access time, CMOS I/O, 68-lea d flat pack package (-40°C to +125°C)
(02TBD)=15ns access time, CMOS I/O, 40-lead flatpack package, dual chip enable (not available)
Drawing Number: 04227
Total Dose:
(R) = 100K rad(Si)
(F) = 300K rad(Si)
Federal Stock Class Designator: No options
** *
Notes:
1.Lead finish (A,C , or X) must be specified.
2.If an “X” is specified when ordering, pa rt marking will match the lead finish and will be either “A” (solder) or “C” (gold).
3.Total dose radiation must be specified when ordering. QML Q and QML V not available without radiation hardening.
15
NOTES
16
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Aeroflex UTMC Microelectronic Systems Inc. (Aeroflex)
reserves the right to make changes to any products and
services herein at any time without notice. Consult Aeroflex
or an authorized sales representative to verify that the
information in this data sheet is current before using this
product. Aeroflex does not assume any responsibility or
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or service described herein, except as expressly agreed to in
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Aeroflex Colordo Springs - Datasheet Definition
Advanced Datasheet - Product In Development
Preliminary Datasheet - Shipping Prototype
Datasheet - Shipping QML & Reduced Hi-Rel
