Supertex inc. MD1810
Supertex inc. ● 1235 Bordeaux Drive, Sunnyvale, CA 94089 ● Tel: 408-222-8888 ● www.supertex.com
Features
►6.0ns rise and fall time with 1000pF load
►2.0A peak output source/sink current
►1.8 to 5.0V input CMOS compatible
►5.0 to 12V total supply voltage
►Smart logic threshold
►Low jitter design
►Four matched channels
►Outputs can swing below ground
►Output is high impedence when disabled
►Low inductance package
►High-performance thermally-enhanced QFN
Applications
►Medical ultrasound imaging
►Piezoelectric transducer drivers
►Non-Destructive Testing (NDT)
►PIN diode driver
►CCD Clock driver/buffer
►High speed level translator
General Description
The Supertex MD1810 is a high-speed quad MOSFET driver. It
is designed to drive high voltage P- and N-channel MOSFETs for
medical ultrasound imaging applications. The MD1810 can also be
used for ultrasound metal aw detection, Non-Destructive Testing
(NDT), piezoelectric transducer drive, clock drive, and PIN diode
drive.
The MD1810 has four inputs which individually control four outputs.
It also has an output enable (OE) pin. When OE is low, all of the
outputs will be in a high impedence state regardless of their logic
input control. When OE is high, the MD1810 sets the threshold logic
transition to (VOE+VGND)/2. This ensures the transition to always be
at half the amplitude of the logic input signal. This allows the device
to have inherent propagation delay matching regardless of the logic
input amplitude.
The output stage of the MD1810 has separate power connections
enabling the output signal L and H levels to be chosen independently
from the VDD and VSS supply voltages. As an example, the input logic
levels may be 0 and 1.8V, the control logic may be powered by +5.0
and -5.0V, and the output L and H levels may be varied anywhere
over the range of -5.0 to +5.0V. The output stage is capable of peak
currents of up to ±2.0A, depending on the supply voltages used and
Typical Application Circuit
VDD VH
+12V +12V
0.47μF
0.47μF
VSS VL
GND
MD1810
10nF
10nF
1.0μF
+100V
1.0μF
-100V
10nF
TC6320
10nF
1.0μF
+10V
1.0μF
-10V
OE
INA
INB
INC
IND
OUTA
3.3V CMOS
Logic Inputs
OUTB
OUTC
OUTD
TC6320
High Speed Quad MOSFET Driver
2
MD1810
Supertex inc. ● 1235 Bordeaux Drive, Sunnyvale, CA 94089 ● Tel: 408-222-8888 ● www.supertex.com
VDD - VSS Logic supply voltage 4.5 - 13 V 2.5V ≤ VDD ≤13V
VSS Low side supply voltage -5.5 - 0 V ---
VHOutput high supply voltage VSS +2 - VDD V ---
VLOutput low supply voltage VSS - VDD -2 V ---
IDDQ VDD quiescent current - 0.8 - mA No input transitions, OE = 1
IHQ VH quiescent current - - 10 µA
IDD VDD average current - 7.0 - mA One channel on at 5.0Mhz,
No load
IHVH average current - 18 - mA
VIH Input logic voltage high VOE -0.3 - 5.0 V
For logic inputs INA, INB, INC, and
IND
VIL Input logic voltage low 0 - 0.3 V
IIH Input logic current high - 1.0 µA
IIL Input logic current low - - 1.0 µA
VIH OE input logic voltage high 1.7 - 5.0 V
For logic input OEVIL OE input logic voltage low 0 - 0.3 V
RIN Input logic impedance to GND 10 20 30 KΩ
CIN Logic input capacitance - 5.0 10 pF ---
DC Electrical Characteristics (VH = VDD = 12V, VL = VSS = GND = 0V, VOE = 3.3V, TA = 25°C)
Sym Parameter Min Typ Max Units Conditions
Absolute Maximum Ratings
Parameter Value
VDD -VSS, Logic supply voltage -0.5V to +13.5V
VH, Output high supply voltage VL - 0.5V to VDD +0.5V
VL, Output low supply voltage VSS - 0.5V to VH+0.5V
VSS, Low side supply voltage -7.0V to +0.5V
Logic input levels VSS - 0.5V to GND +7V
Maximum junction temperature +125°C
Storage temperature -65°C to 150°C
Operating temperature -20°C to +85°C
Package power dissipation 2.2W
Thermal resistance (θJA)* 45°C/W
-G indicates package is RoHS compliant (‘Green’)
Ordering Information
Device
16-Lead QFN
4.00x4.00mm body
1.00mm height (max)
0.65mm pitch
MD1810 MD1810K6-G
1810
YWLL
Y = Last Digit of Year Sealed
W = Code for Week Sealed
L = Lot Number
= “Green” Packaging
Product Marking
16-Lead QFN (K6)
1
16
16-Lead QFN (K6)
(top view)
Pin Conguration
Absolute Maximum Ratings are those values beyond which damage to the device
may occur. Functional operation under these conditions is not implied. Continuous
operation of the device at the absolute rating level may affect device reliability. All
voltages are referenced to device ground.
* 1.0oz 4-layer 3x4” PCB Package may or may not include the following marks: Si or
3
MD1810
Supertex inc. ● 1235 Bordeaux Drive, Sunnyvale, CA 94089 ● Tel: 408-222-8888 ● www.supertex.com
RSINK Output sink resistance - - 12.5 ΩISINK = 50mA
RSOURCE Output source resistance - - 12.5 ΩISOURCE = 50mA
ISINK Peak output sink current - 2.0 - A ---
ISOURCE Peak output source current - 2.0 - A ---
tirf Input or OE rise & fall time - - 10 ns Logic input edge speed requirement
tPLH
Propagation delay when output
is from low to high - 7.0 - ns
CLOAD = 1000pF, see timing diagram
Input signal rise/fall time 2.0ns
tPHL
Propagation delay when output
is from high to low - 7.0 - ns
trOutput rise time - 6.0 - ns
tfOutput fall time - 6.0 - ns
l tr - tf l Rise and fall time matching - 1.0 -
ns For each channel
l tPLH-tPHL lPropagation low to high and high
to low matching - 1.0 -
∆tdm Propagation delay matching - ±2.0 - ns Device to device delay match
tOE_ON Output enable time - 200 - ns ---
tOE_OFF - 9.0 -
Logic Truth Table
Logic Inputs Output
OE IN
H L VL
H H VH
L X High Z
Timing Diagram
3.3V
INPUT
0V
tPLH
10%
90%
50% 50%
tPHL
tr
90%
10%
tf
12V
OUTPUT
0V
V
OE
V
TH
2.0
1.5
1.0
0.5
0
0.6V
V
OE/2
V
TH
vs V
OE
0 1.0 2.0 3.0 4.0 5.0
VTH / VOE Curve
DC Electrical Characteristics (cont.) (VH = VDD = 12V, VL = VSS = GND = 0V, VOE = 3.3V, TA = 25°C)
Sym Parameter Min Typ Max Units Conditions
AC Electrical Characteristics (VH = VDD = 12V, VL = VSS = GND = 0V, VOE = 3.3V, TA = 25°C)
Sym Parameter Min Typ Max Units Conditions
4
MD1810
Supertex inc. ● 1235 Bordeaux Drive, Sunnyvale, CA 94089 ● Tel: 408-222-8888 ● www.supertex.com
Simplied Block Diagram
Detailed Block Diagram
MD1810
GND VSS VL
OUTA
OUTB
OUTC
OUTD
OE
INA
INB
INC
IND
VDD VH
VDD
VSS
VDD VH
VL
INA
OUTA
VH
INB
OUTB
INC
OUTC
VSS VL
IND
OUTD
OE
GND
SUB
Level
Shifter
Level
Shifter
Level
Shifter
Level
Shifter
Level
Shifter
VDD
VSS
VDD
VSS
VDD
VSS
VDD
VSS
VDD
VSS
VDD
VSS
VL
VH
VL
VH
5
MD1810
Supertex inc. ● 1235 Bordeaux Drive, Sunnyvale, CA 94089 ● Tel: 408-222-8888 ● www.supertex.com
Typical Applications
10nF
+100V
Supertex
TC6320TG
To Piezoelectric
Transducer
10nF
10nF
10nF
0.1μF
0.1μF
0.1μF
-100V
+100V
-100V
Supertex
TC6320TG
To Piezoelectric
Transducer
Supertex
MD1810
VSS
VDDVH
VL
OE
INA
GND
INB
INC
IND
OUTA
+12V
3.3V CMOS
Logic Inputs
OUTB
OUTC
OUTD
+12V
0.47μF
0.47μF
0.1μF
2-Channel +100V to -100V Pulser
Single Channel ±100V to 0V Pulser
-5.0V
0.47μF
-5.0V
0.47μF
Supertex
MD1810
VSS VL
GND
+5.0V +5.0V
0.47μF 0.47μF
Supertex
TC6320
To Piezoelectric
Transducer
3.3V CMOS
Logic Inputs
VDD VH
OE
INA
INB
INC
IND
OUTA
OUTB
OUTC
OUTD
10nF
10nF
0.1μF
0.1μF
-100V
+100V
Supertex
TC2320
6
MD1810
Supertex inc. ● 1235 Bordeaux Drive, Sunnyvale, CA 94089 ● Tel: 408-222-8888 ● www.supertex.com
Application Information
For proper operation of the MD1810, low inductance bypass
capacitors should be used on the various supply pins. The
GND pin should be connected to the logic ground. The INA,
INB INC, IND, and OE pins should be connected to a logic
source with a swing of GND to OE, where OE is 1.8 to 5.0 V.
Good trace practices should be followed corresponding to the
desired operating speed. The internal circuitry of the MD1810
is capable of operating up to 100MHz, with the primary speed
limitation being the loading effects of the load capacitance.
Because of this speed and the high transient currents that
result with capacitive loads, the bypass capacitors should
be as close to the chip pins as possible. Unless the load
specically requires bipolar drive, the VSS, and VL pins should
have low inductance feed-through connections directly to a
ground plane. If these voltages are not zero, then they need
bypass capacitors in a manner similar to the positive power
supplies. The power connection VDD should have a ceramic
bypass capacitor to the ground plane with short leads and
decoupling components to prevent resonance in the power
leads.
The voltages of VH and VL decide the output signal levels.
These two pins can draw fast transient currents of up to
2.0A, so they should be provided with an appropriate bypass
capacitor located next to the chip pins. A ceramic capacitor
of up to 1.0µF may be appropriate, with a series ferrite bead
to prevent resonance in the power supply lead coming to
the capacitor. Pay particular attention to minimizing trace
lengths, current loop area and using sufcient trace width to
reduce inductance. Surface mount components are highly
recommended. Since the output impedance of this driver is
very low, in some cases it may be desirable to add a small
series resistance in series with the output signal to obtain
better waveform transitions at the load terminals. This will of
course reduce the output voltage slew rate at the terminals
of a capacitive load.
Pay particular attention that parasitic couplings are minimized
from the output to the input signal terminals. The parasitic
feedback may cause oscillations or spurious waveform
shapes on the edges of signal transitions. Since the input
operates with signals down to 1.8V even small coupled
voltages may cause problems. Use of a solid ground plane
and good power and signal layout practices will prevent this
problem. Be careful that a circulating ground return current
from a capacitive load cannot react with common inductance
to cause noise voltages in the input logic circuitry.
7
MD1810
Supertex inc. ● 1235 Bordeaux Drive, Sunnyvale, CA 94089 ● Tel: 408-222-8888 ● www.supertex.com
Pin # Function Description
1INB Logic input. Input logic high will cause the output to swing to VH. Input logic low will
cause the output to swing to VL. Keep all logic inputs low until IC powered up.
2 VL Supply voltage for N-channel output stage.
3 GND Logic input ground reference.
4 VL Supply voltage for N-channel output stage.
5 INC Logic input. Input logic high will cause the output to swing to VH. Input logic low will
cause the output to swing to VL. Keep all logic inputs low until IC powered up.
6 IND
7 VSS Low side supply voltage. VSS is also connected to the IC substrate. It is required to
connect to the most negative potential of voltage supplies and powered-up rst.
8 OUTD Output drivers
9 OUTC
10, 11 VH Supply voltage for P-channel output stage.
12 OUTB Output drivers
13 OUTA
14 VDD High side supply voltage.
15 INA Logic input. Input logic high will cause the output to swing to VH. Input logic low will
cause the output to swing to VL. Keep all logic inputs low until IC powered up.
16 OE
Output enable logic input. When OE is high, (VOE+VGND)/2 sets the threshold transition
between logic level high and low. When OE is low, all outputs are at high impedance.
Keep OE low until IC powered up.
Substrate The IC substrate is internally connected to the thermal pad. Thermal pad and VSS
must be connected externally.
Pin Description
Supertex inc. does not recommend the use of its products in life support applications, and will not knowingly sell them for use in such applications unless it receives
an adequate “product liability indemnification insurance agreement.” Supertex inc. does not assume responsibility for use of devices described, and limits its liability
to the replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and
specifications are subject to change without notice. For the latest product specifications refer to the Supertex inc. (website: http//www.supertex.com)
©2012 Supertex inc. All rights reserved. Unauthorized use or reproduction is prohibited. Supertex inc.
1235 Bordeaux Drive, Sunnyvale, CA 94089
Tel: 408-222-8888
www.supertex.com
8
MD1810
(The package drawing(s) in this data sheet may not reect the most current specications. For the latest package outline
information go to http://www.supertex.com/packaging.html.)
Doc.# DSFP-MD1810
C011612
16-Lead QFN Package Outline (K6)
4.00x4.00mm body, 1.00mm height (max), 0.65mm pitch
Symbol A A1 A3 b D D2 E E2 e L L1 θ
Dimension
(mm)
MIN 0.80 0.00
0.20
REF
0.25 3.85* 2.50 3.85* 2.50
0.65
BSC
0.30†0.00 0O
NOM 0.90 0.02 0.30 4.00 2.65 4.00 2.65 0.40†- -
MAX 1.00 0.05 0.35 4.15* 2.80 4.15* 2.80 0.50†0.15 14O
JEDEC Registration MO-220, Variation VGGC-2, Issue K, June 2006.
* This dimension is not specied in the JEDEC drawing.
† This dimension differs from the JEDEC drawing.
Drawings not to scale.
Supertex Doc.#: DSPD-16QFNK64X4P065, Version C041009.
Seating
Plane
Top View
Side View
Bottom View
A
A1
D
E
D2
e
b
E2
A3
L
L1
View B
View B
1
Note 3
Note 2
Note 1
(Index Area
D/2 x E/2)
Note 1
(Index Area
D/2 x E/2)
16
1
16
θ
Notes:
1. A Pin 1 identier must be located in the index area indicated. The Pin 1 identier can be: a molded mark/identier; an embedded metal marker; or
a printed indicator.
2. Depending on the method of manufacturing, a maximum of 0.15mm pullback (L1) may be present.
3. The inner tip of the lead may be either rounded or square.