This product complies with the RoHS Directive (EU 2002/95/EC). DSA5001 Silicon PNP epitaxial planar type For general amplification Complementary to DSC5001 Features Package High forward current transfer ratio hFE with excellent linearity Eco-friendly Halogen-free package Code SMini3-F2-B Pin Name 1. Base 2. Emitter 3. Collector Packaging Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard) Absolute Maximum Ratings Ta = 25C Parameter Symbol Rating Unit Collector-base voltage (Emitter open) VCBO -60 V Collector-emitter voltage (Base open) VCEO -50 V Emitter-base voltage (Collector open) VEBO -7 V Collector current IC -100 mA Peak collector current ICP -200 mA Collector power dissipation PC 150 mW Junction temperature Tj 150 C Storage temperature Tstg -55 to +150 C Marking Symbol: A1 Electrical Characteristics Ta = 25C3C Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) VCBO IC = -10 mA, IE = 0 -60 V Collector-emitter voltage (Base open) VCEO IC = -2 mA, IB = 0 -50 V Emitter-base voltage (Collector open) VEBO IE = -10 mA, IC = 0 -7 V Collector-base cutoff current (Emitter open) ICBO VCB = -20 V, IE = 0 - 0.1 mA Collector-emitter cutoff current (Base open) ICEO VCE = -10 V, IB = 0 -100 mA Forward current transfer ratio * hFE VCE = -10 V, IC = -2 mA 460 - 0.5 V Collector-emitter saturation voltage VCE(sat) Transition frequency fT Collector output capacitance (Common base, input open circuited) Cob 210 IC = -100 mA, IB = -10 mA - 0.2 VCE = -10 V, IC = -2 mA 150 MHz 2 pF VCB = -10 V, IE = 0, f = 1 MHz Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Rank classification Code R S 0 Rank R S No-rank hFE 210 to 340 290 to 460 210 to 460 Marking Symbol A1R A1S A1 Product of no-rank is not classified and have no marking symbol for rank. Publication date: November 2009 ZJC00436BED 1 This product complies with the RoHS Directive (EU 2002/95/EC). DSA5001 DSA5001_IC-VCE DSA5001_PC-Ta PC Ta 150 100 50 -500 A -80 -400 A -60 -300 A -40 -200 A -20 40 80 120 160 0 200 0 -2 -4 -1 Ta = 85C -30C VCE = -10 V -30C -60 -40 -100 -1 -10 -100 Collector current IC (mA) IE = 0 f = 1 MHz Ta = 25C 3.0 1.0 0 0 - 0.2 - 0.4 - 0.6 - 0.8 -1.0 -1.2 Base-emitter voltage VBE (V) fT IC VCE = -10 V Ta = 25C 150 100 50 -10 0 - 0.1 2.0 250 -1 100 4.0 25C Ta = 85C -80 DSA5001_fT-IC 0 - 0.1 -30C Cob VCB -20 Collector current IC (mA) 200 200 DSA5001_Cob-VCB 25C -10 25C -12 -120 Collector current IC (mA) Collector-emitter saturation voltage VCE(sat) (V) IC / IB = 10 -1 300 IC VBE -100 - 0.01 - 0.1 Transition frequency fT (MHz) -10 Ta = 85C DSA5001_IC-VBE VCE(sat) IC - 0.1 -8 400 Collector-emitter voltage VCE (V) DSA5001_VCEsat-IC -10 -6 500 Collector output capacitance (Common base, input open circuited) Cob (pF) 0 -100 A VCE = -10 V Forward current transfer ratio hFE IB = -600 A -100 200 Collector current IC (mA) Collector power dissipation PC (mW) 600 Ta = 25C Ambient temperature Ta (C) -100 Collector current IC (mA) 2 hFE IC -120 250 0 DSA5001_hFE-IC IC VCE ZJC00436BED 0 -1 -10 -100 Collector-base voltage VCB (V) This product complies with the RoHS Directive (EU 2002/95/EC). DSA5001 SMini3-F2-B Unit: mm 2.00 0.20 +0.05 0.30 -0.02 1 0.425 0.05 (5) 2.10 0.10 1.25 0.10 3 2 (0.65) (0.65) +0.05 0.13 -0.02 (0.49) 1.30 0.10 0 to 0.10 0.90 0.10 (5) ZJC00436BED 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: - Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. - Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805