ZJC00436BED
This product complies with the RoHS Directive (EU 2002/95/EC).
Publication date: November 2009 1
DSA5001
Silicon PNP epitaxial planar type
For general amplification
Complementary to DSC5001
Features
High forward current transfer ratio hFE with excellent linearity
Eco-friendly Halogen-free package
Packaging
Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)
Absolute Maximum Ratings Ta = 25°C
Parameter Symbol Rating Unit
Collector-base voltage (Emitter open) VCBO –60 V
Collector-emitter voltage (Base open) VCEO –50 V
Emitter-base voltage (Collector open) VEBO –7 V
Collector current IC–100 mA
Peak collector current ICP –200 mA
Collector power dissipation PC150 mW
Junction temperature Tj150 °C
Storage temperature Tstg –55 to +150 °C
Electrical Characteristics Ta = 25°C±3°C
Parameter Symbol Conditions Min Typ Max Unit
Collector-base voltage (Emitter open) VCBO IC = –10 mA, IE = 0 –60 V
Collector-emitter voltage (Base open) VCEO IC = –2 mA, IB = 0 –50 V
Emitter-base voltage (Collector open) VEBO IE = –10 mA, IC = 0 –7 V
Collector-base cutoff current (Emitter open) ICBO VCB = –20 V, IE = 0 – 0.1 mA
Collector-emitter cutoff current (Base open) ICEO VCE = –10 V, IB = 0 –100 mA
Forward current transfer ratio *hFE VCE = –10 V, IC = –2 mA 210 460
Collector-emitter saturation voltage VCE(sat) IC = –100 mA, IB = –10 mA – 0.2 – 0.5 V
Transition frequency fTVCE = –10 V, IC = –2 mA 150 MHz
Collector output capacitance
(Common base, input open circuited)
Cob VCB = –10 V, IE = 0, f = 1 MHz 2 pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Code R S 0
Rank R S No-rank
hFE 210 to 340 290 to 460 210 to 460
Marking Symbol A1R A1S A1
Product of no-rank is not classified and have no marking symbol for rank.
Package
Code
SMini3-F2-B
Pin Name
1. Base
2. Emitter
3. Collector
Marking Symbol: A1
ZJC00436BED
This product complies with the RoHS Directive (EU 2002/95/EC).
DSA5001
2
PC Ta IC VCE hFE IC
VCE(sat) IC IC VBE Cob VCB
00 20016040 12080
50
200
150
100
250
DSA5001_PC-Ta
Ambient temperature Ta (°C)
Collector power dissipation PC (mW)
00−12−2−10−4−8−6
−120
−100
−80
−60
−40
−20
DSA5001_IC-VCE
Collector current IC (mA)
Collector-emitter voltage VCE (V)
Ta = 25°CIB = −600 µA
−500 µA
−400 µA
−300 µA
−200 µA
−100 µA
0
− 0.1
600
500
400
300
200
100
−1−10
−100
DSA5001_hFE-IC
Forward current transfer ratio hFE
Collector current IC (mA)
25°C
−30°C
Ta = 85°C
VCE = −10 V
− 0.01
− 0.1
− 0.1
−1
−10
−1−10 −100
DSA5001_VCEsat-IC
Collector-emitter saturation voltage VCE(sat) (V)
Collector current IC (mA)
25°C
−30°C
Ta = 85°C
IC / IB = 10
00−1.2− 0.2 −1.0− 0.4 − 0.8− 0.6
−120
−100
−80
−60
−40
−20
DSA5001_IC-VBE
Collector current IC (mA)
Base-emitter voltage VBE (V)
−30°C
25°C
Ta = 85°C
VCE = −10 V
0
−1
4.0
3.0
2.0
1.0
−10 −100
DSA5001_Cob-VCB
Collector-base voltage VCB (V)
Collector output capacitance
(Common base, input open circuited) Cob (pF)
IE = 0
f = 1 MHz
Ta = 25°C
fT IC
0
− 0.1
250
200
150
100
50
−1−10 −100
DSA5001_fT-IC
Transition frequency fT (MHz)
Collector current IC (mA)
VCE = −10 V
Ta = 25°C
ZJC00436BED
This product complies with the RoHS Directive (EU 2002/95/EC).
DSA5001
3
SMini3-F2-B Unit: mm
0.30 +0.05
−0.02
0.13 +0.05
−0.02
2.00 ±0.20
0.90 ±0.10
(0.65)(0.65)
1.30 ±0.10
1.25 ±0.10
2.10 ±0.10
0.425 ±0.05
(0.49)
0 to 0.10
(5°)
(5°)
3
1 2
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
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equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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