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BSH114
N-channel enhancement mode field effect transistor
Rev. 01 — 09 November 2000 Product specification
c
c
M3D088
1. Description
N-channel enhancement mode field-effect transistor in a plastic package using
TrenchMOS1 technology.
Product availability:
BSH114 in SOT23.
2. Features
TrenchMOS™ technology
Low on-state resistance
Very fast switching
Surface mount package.
3. Applications
Relay driver
DC to DC converter
General purpose switch.
4. Pinning information
1. TrenchMOS is a trademark of Royal Philips Electronics.
Table 1: Pinning - SOT23, simplified outline and symbol
Pin Description Simplified outline Symbol
1 gate (g)
SOT23
2 source (s)
3 drain (d)
MSB003
Top view
12
3
s
d
g
MBB076
Philips Semiconductors BSH114
N-channel enhancement mode field effect transistor
Product specification Rev. 01 — 09 November 2000 2 of 13
9397 750 07708 © Philips Electronics N.V. 2000. All rights reserved.
5. Quick reference data
6. Limiting values
Table 2: Quick reference data
Symbol Parameter Conditions Typ Max Unit
VDS drain-source voltage (DC) Tj=25to150°C100 V
IDdrain current (DC) Tsp =25°C; VGS =10V 0.85 A
Ptot total power dissipation Tsp =25°C0.83 W
Tjjunction temperature 150 °C
RDSon drain-source on-state resistance VGS = 10 V; ID= 0.5 A 400 500 m
Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDS drain-source voltage (DC) Tj=25to150°C100 V
VDGR drain-gate voltage (DC) Tj=25to150°C; RGS =20kΩ−100 V
VGS gate-source voltage (DC) −±20 V
IDdrain current (DC) Tsp =25°C; VGS =10V;Figure 2 and 30.85 A
Tsp = 100 °C; VGS =10V;Figure 2 and 30.5 A
Tamb =25°C; VGS =10V 0.5 A
Tamb = 100 °C; VGS =10V 0.3 A
IDM peak drain current Tsp =25°C; tp10 µs; Figure 3 3.4 A
Ptot total power dissipation Tsp =25°C; Figure 1 0.83 W
Tamb =25°C0.36 W
Tstg storage temperature 55 +150 °C
Tjoperating junction temperature 55 +150 °C
Source-drain (reverse) diode
ISsource (diode forward) current (DC) Tsp =25°C0.85 A
ISM peak (diode forward) source current Tsp =25°C; tp10 µs3.4 A
Philips Semiconductors BSH114
N-channel enhancement mode field effect transistor
Product specification Rev. 01 — 09 November 2000 3 of 13
9397 750 07708 © Philips Electronics N.V. 2000. All rights reserved.
VGS 10 V
Fig 1. Normalized total power dissipation as a
function of solder point temperature. Fig 2. Normalized continuous drain current as a
function of solder point temperature.
Tsp =25°C; IDM is single pulse
Fig 3. Safe operating area; drain and peak currents as a function of drain source voltage.
03aa17
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175
Pder
Tsp (oC)
(%)
03aa25
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175
Ider
Tsp (oC)
(%)
Pder Ptot
Ptot 25 C
°
()
---------------------- 100%×=
IDID
ID25C
°
()
-------------------100%×=
03ac55
10-3
10-2
10-1
1
10
10-1
1 10
102 103
V
DS
(V)
I
D
(A)
D.C.
100 ms
10 ms
R
DSon
= V
DS
/ I
D
1 ms
t
p
= 10 µs
100 µs
tp
tp
T
P
t
T
δ =
Philips Semiconductors BSH114
N-channel enhancement mode field effect transistor
Product specification Rev. 01 — 09 November 2000 4 of 13
9397 750 07708 © Philips Electronics N.V. 2000. All rights reserved.
7. Thermal characteristics
7.1 Transient thermal impedance
Table 4: Thermal characteristics
Symbol Parameter Conditions Value Unit
Rth(j-sp) thermal resistance from junction to solder point mounted on a metal clad substrate; Figure 4 150 K/W
Rth(j-amb) thermal resistance from junction to ambient mounted on a printed circuit board;
minimum footprint 350 K/W
Tsp =25°C
Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration.
03ac54
1
10
102
103
10-5 10-4 10-3 10-2 10-1
1 10
t
p
(s)
Z
th(j-sp)
(K/W)
0.1
0.2
0.05
0.02
δ = 0.5
single pulse
tp
tp
T
P
t
T
δ =
Philips Semiconductors BSH114
N-channel enhancement mode field effect transistor
Product specification Rev. 01 — 09 November 2000 5 of 13
9397 750 07708 © Philips Electronics N.V. 2000. All rights reserved.
8. Characteristics
Table 5: Characteristics
T
j
=25
°
C unless otherwise specified
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V(BR)DSS drain-source breakdown voltage ID= 250 µA; VGS =0V
Tj=25°C 100 130 V
Tj=55 °C95−−V
VGS(th) gate-source threshold voltage ID= 1 mA; VDS =V
GS;Figure 9
Tj=25°C 234V
Tj= 150 °C 1.2 −−V
Tj=55 °C−−6V
IDSS drain-source leakage current VDS = 100 V; VGS =0V
Tj=25°C125µA
Tj= 150 °C4 250 µA
IGSS gate-source leakage current VGS =±20 V; VDS =0V 10 100 nA
RDSon drain-source on-state resistance VGS = 10 V; ID= 0.5 A; Figure 7 and 8
Tj=25°C400 500 m
Tj= 150 °C−−1.15
Dynamic characteristics
gfs forward transconductance VDS =20V; I
D= 0.5 A; Figure 11 0.5 1.2 S
Qg(tot) total gate charge ID= 0.5 A; VDD =80V; V
GS =10V;Figure 14 4.6 nC
Qgs gate-source charge 0.8 nC
Qgd gate-drain (Miller) charge 2.1 nC
Ciss input capacitance VGS =0V; V
DD = 25 V; f = 1 MHz; Figure 12 138 pF
Coss output capacitance 21 pF
Crss reverse transfer capacitance 12 pF
td(on) turn-on delay time VDD =50V; R
D= 100 ; VGS =10V;R
G=6Ω− 6ns
trrise time 13 ns
td(off) turn-off delay time 8ns
tffall time 5ns
Source-drain (reverse) diode
VSD source-drain (diode forward) voltage IS= 0.85 A; VGS =0V;Figure 13 0.84 1 V
trr reverse recovery time IS= 0.5 A; dIS/dt = 100 A/µs;
VGS =0V;V
DS =30V 24 ns
Qrrecovered charge 37 nC
Philips Semiconductors BSH114
N-channel enhancement mode field effect transistor
Product specification Rev. 01 — 09 November 2000 6 of 13
9397 750 07708 © Philips Electronics N.V. 2000. All rights reserved.
Tj=25°CT
j=25°C and 150 °C; VDS >IDxR
DSon
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values. Fig 6. Transfer characteristic: drain current as a
function of gate-source voltage; typical values.
Tj=25°C
Fig 7. Drain-source on-state resistance as a function
of drain current; typical values. Fig 8. Normalized drain-source on-state resistance
factor as a function of junction temperature.
03ac56
0
1
2
3
0 0.5 1 1.5 2
V
DS
(V)
I
D
(A) 5.8 V
5.6 V
5.4 V
5.2 V
5.0 V
4.8 V
6 V
V
GS
= 10 V 7 V
T
j
= 25 ºC
03ac58
0
1
2
3
02468
V
GS
(V)
I
D
(A)
T
j
= 25 ºCT
j
= 150 ºC
V
DS
> I
D
X R
DSon
03ac57
0
1
2
3
01234
I
D
(A)
R
DSon
()
5.8 V
V
GS
= 4.8 V
5.0 V
5.2 V
5.4 V5.6 V
7 V
10 V
6 V
T
j
= 25 ºC
03aa29
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
2.8
3
-60 -20 20 60 100 140 180
Tj (oC)
a
aRDSon
RDSon 25 C
°
()
----------------------------
=
Philips Semiconductors BSH114
N-channel enhancement mode field effect transistor
Product specification Rev. 01 — 09 November 2000 7 of 13
9397 750 07708 © Philips Electronics N.V. 2000. All rights reserved.
ID= 1 mA; VDS =V
GS Tj=25°C; VDS =5V
Fig 9. Gate-source threshold voltage as a function of
junction temperature. Fig 10. Sub-threshold drain current as a function of
gate-source voltage.
Tj=25°C and 150 °C; VDS >IDxR
DSon VGS = 0 V; f = 1 MHz
Fig 11. Forward transconductance as a function of
drain current; typical values. Fig 12. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values.
03aa32
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
-60 -20 20 60 100 140 180
VGS(th)
Tj (oC)
(V) max.
typ.
min
03aa35
10-6
10-5
10-4
10-3
10-2
10-1
012345
maxtypmin
VGS (V)
ID
(A)
03ac59
0
0.5
1
1.5
2
2.5
0123
I
D
(A)
gfs
(S) T
j
= 25 ºC
T
j
=150 ºC
V
DS
> I
D
X R
DSon
03ac60
0
1
2
3
0 0.4 0.8 1.2
V
SD
(V)
I
S
(A)
T
j
= 25 ºCT
j
=150 ºC
V
GS
= 0 V
Philips Semiconductors BSH114
N-channel enhancement mode field effect transistor
Product specification Rev. 01 — 09 November 2000 8 of 13
9397 750 07708 © Philips Electronics N.V. 2000. All rights reserved.
Tj=25°C and 150 °C; VGS =0V I
D= 0.5 A; VDD = 20 V and 80 V
Fig 13. Source (diode forward) current as a function of
source-drain (diode forward) voltage;
typical values.
Fig 14. Gate-source voltage as a function of gate
charge; typical values.
03ac60
0
1
2
3
0 0.4 0.8 1.2
V
SD
(V)
I
S
(A)
T
j
= 25 ºCT
j
=150 ºC
V
GS
= 0 V
03ac62
0
5
10
15
02468
Q
G
(nC)
V
GS
(V)
V
DD
= 20 V V
DD
= 80 V
T
j
= 25 ºC
I
D
= 0.5 A
Philips Semiconductors BSH114
N-channel enhancement mode field effect transistor
Product specification Rev. 01 — 09 November 2000 9 of 13
9397 750 07708 © Philips Electronics N.V. 2000. All rights reserved.
9. Package outline
Fig 15. SOT23.
UNIT A1
max. bpcDE e1HELpQwv
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
97-02-28
99-09-13
IEC JEDEC EIAJ
mm 0.1 0.48
0.38 0.15
0.09 3.0
2.8 1.4
1.2 0.95
e
1.9 2.5
2.1 0.55
0.45 0.1
0.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
SOT23 TO-236AB
bp
D
e1
e
A
A1
Lp
Q
detail X
HE
E
wM
vMA
B
AB
0 1 2 mm
scale
A
1.1
0.9
c
X
12
3
Plastic surface mounted package; 3 leads SOT23
Philips Semiconductors BSH114
N-channel enhancement mode field effect transistor
Product specification Rev. 01 — 09 November 2000 10 of 13
9397 750 07708 © Philips Electronics N.V. 2000. All rights reserved.
10. Revision history
Table 6: Revision history
Rev Date CPCN Description
01 20001109 - Product specification; initial version
Philips Semiconductors BSH114
N-channel enhancement mode field effect transistor
Product specification Rev. 01 — 09 November 2000 11 of 13
9397 750 07708 © Philips Electronics N.V. 2000 All rights reserved.
11. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
12. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
13. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products
are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Datasheet status Product status Definition[1]
Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may
change in any manner without notice.
Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any
time without notice in order to improve design and supply the best possible product.
Philips Semiconductors BSH114
N-channel enhancement mode field effect transistor
Product specification Rev. 01 — 09 November 2000 12 of 13
9397 750 07708 © Philips Electronics N.V. 2000. All rights reserved.
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(SCA70)
© Philips Electronics N.V. 2000. Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 09 November 2000 Document order number: 9397 750 07708
Contents
Philips Semiconductors BSH114
N-channel enhancement mode field effect transistor
1 Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
5 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
7 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
7.1 Transient thermal impedance. . . . . . . . . . . . . . 4
8 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
11 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 11
12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11