Description
This series of bi-color ChipLEDs
is designed with the smallest
footprint to achieve high density
of components on board. They
have the industry standard
footprint of 1.6 mm x 0.8 mm
and a height of only 0.5 mm. This
makes them very suitable for
cellular phone and mobile
Agilent HSMF-C16x
Miniature Bi-Color
Surface Mount ChipLEDs
Data Sheet
Features
• Small size
• 0603 industry standard footprint
• Diffused optics
• Operating temperature range of
–30˚C to +85˚C
• Compatible with reflow soldering
• Available in various color
combination
• Available in 8 mm tape on
7" (178 mm) diameter reels
Applications
• Keypad backlighting
• Symbol indicator
• LCD backlighting
• Pushbutton backlighting
• Front panel indicator
CAUTION: HSMF-C163, HSMF-C164, HSMF-C168, and HSMF-C169 LEDs are Class 1 ESD sensitive.
Please observe appropriate precautions during handling and processing. Refer to Agilent Technolo-
gies Application Note AN-1142 for additional details.
equipment backlighting and
indication. They are available in a
wide range of color combinations.
In order to facilitate automated
pick and place operation, these
ChipLEDs are shipped in tape and
reel, with 4000 units per reel.
These parts are compatible with
reflow soldering.
Device Selection Guide
Part Number Color Package Description
HSMF-C162 AlInGaP Red / AlInGaP Amber Untinted, Diffused
HSMF-C163 AlInGaP Red / InGaN Green Untinted, Diffused
HSMF-C164 AlInGaP Red / InGaN Blue Untinted, Diffused
HSMF-C165 High Efficiency Red / GaP Green Untinted, Diffused
HSMF-C166 GaP Yellow / GaP Green Untinted, Diffused
HSMF-C167 GaP Orange / GaP Green Untinted, Diffused
HSMF-C168 InGaN Green / InGaN Blue Untinted, Diffused
HSMF-C169 AlInGaP Amber / InGaN Blue Untinted, Diffused
2
Package Dimensions
Absolute Maximum Ratings for Each Die at T A = 25˚C
Parameter AlInGaP InGaN GaP Units
DC Forward Current[1] 20 10 20 mA
Power Dissipation 48 38 52 mW
Reverse Voltage 5 5 5 V
LED Junction Temperature 95 95 95 ˚C
Operating Temperature Range –30 to +85 ˚C
Storage Temperature Range –40 to +85 ˚C
Soldering Temperature See reflow soldering profile (Figure 6 & 7)
Note:
1. Derate linearly as shown in Figure 4.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
1.6
(0.063 )
0.16 (0.006) 0.5 (0.020)
0.4
(0.016)
LED DIES
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINALS
0.8 (0.031)
CATHODE LINE
0.3 (0.012)
CATHODE LINE
1
2
3
4
POLARITY
1 3
HSMF-C162
AMBER
2 4 RED
HSMF-C163
GREEN
RED
HSMF-C164
BLUE
RED
HSMF-C165
GREEN
RED
HSMF-C166
GREEN
YELLOW
HSMF-C167
GREEN
ORANGE
HSMF-C168
BLUE
GREEN
HSMF-C169
BLUE
AMBER
3
Electrical Characteristics at TA = 25˚C
Reverse
Breakdown Capacitance Thermal
Forward Voltage VR (Volts) C (pF), @ VF = 0, Resistance
VF (Volts) @ IF[1] @ IR = 100 µA f = 1 MHz RθJ-PIN (˚C/W)
Color Typ. Max. Min. Typ. Typ.
AlInGaP Red 20 mA 1.9 2.4 5 15 300
AlInGaP Amber 20 mA 1.9 2.4 5 11 300
AlInGaP Red[2] 10 mA 1.8 2.3 5 15 300
AlInGaP Amber[2] 10 mA 1.8 2.3 5 11 300
InGaN Green 10 mA 3.4 3.8 5 35 500
InGaN Blue 10 mA 3.4 3.8 5 35 500
HER 20 mA 2.1 2.6 5 5 325
GaP Orange 20 mA 2.2 2.6 5 7 325
GaP Yellow 20 mA 2.1 2.6 5 6 325
GaP Green 20 mA 2.2 2.6 5 9 325
Optical Characteristics at TA = 25˚C
Color
Peak Dominant Luminous
Luminous Intensity Wavelength Wavelength Viewing Angle Efficacy
Iv (mcd) @ IF[1] λpeak (nm) λd[2] (nm) 2 θ1/2 Degrees[3] ηv (lm/W)
Color Min. Typ. Typ. Typ. Typ. Typ.
AlInGaP Red 20 mA 28.5 90 637 626 120 155
AlInGaP Amber 20 mA 28.5 90 595 592 120 480
AlInGaP Red[4] 10 mA 11.2 35 637 626 120 155
AlInGaP Amber[4] 10 mA 11.2 35 595 592 120 480
InGaN Green 10 mA 18 45 523 525 120 500
InGaN Blue 10 mA 2.8 10 468 470 120 80
HER 20 mA 2.8 10 630 626 120 145
GaP Orange 20 mA 2.8 8 605 604 120 380
GaP Yellow 20 mA 2.8 8 589 586 120 500
GaP Green 20 mA 4.5 15 570 572 120 595
Notes:
1. The luminous intensity Iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp
package.
2. The dominant wavelength λd is derived from the CIE Chromatically Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4. The product testing is based on 20 mA. This is for reference purpose.
Notes:
1. VF Tolerance: ± 0.1 V.
2. The product testing is based on 20 mA. This is for reference only.
4
Intensity (Iv) Bin Limits[1]
Intensity @ 20 mA (mcd)
Bin ID Min. Max.
A 0.11 0.18
B 0.18 0.29
C 0.29 0.45
D 0.45 0.72
E 0.72 1.10
F 1.10 1.80
G 1.80 2.80
H 2.80 4.50
J 4.50 7.20
K 7.20 11.20
L 11.20 18.00
M 18.00 28.50
N 28.50 45.00
P 45.00 71.50
Q 71.50 112.50
R 112.50 180.00
S 180.00 285.00
T 285.00 450.00
U 450.00 715.00
V 715.00 1125.00
W 1125.00 1800.00
X 1800.00 2850.00
Y 2850.00 4500.00
Tolerance: ± 15%.
Green Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 561.5 564.5
B 564.5 567.5
C 567.5 570.5
D 570.5 573.5
E 573.5 576.5
Tolerance: ± 0.5 nm
Blue Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Tolerance: ± 1 nm
Orange Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 597.0 600.0
B 600.0 603.0
C 603.0 606.0
D 606.0 609.0
E 609.0 612.0
F 612.0 615.0
Tolerance: ± 1 nm
Color Bin Limits[1]
Yellow/Amber Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Tolerance: ± 0.5 nm
InGaN Green Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Tolerance: ± 1 nm
Note:
1. Bin categories are established for classifi-
cation of products. Products may not be
available in all categories. Please contact
your Agilent representative for information
on currently available bins.
Note:
1. Bin categories are established for classifi-
cation of products. Products may not be
available in all categories. Please contact
your Agilent representative for information
on currently available bins.
5
Figure 2. Forward current vs. forward voltage.
Figure 1. Relative intensity vs. wavelength.
Figure 3. Luminous intensity vs. forward current.
400
100
0600 700
20
RELATIVE INTENSITY – %
WAVELENGTH – nm
500
60
40
80
450 550 650
10
50
30
70
90
InGaN
BLUE
InGaN
GREEN
AS
AMBER
AS
RED
AS
ORANGE
100
10
1
0.11.5 2.5 3.5 4.0
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
3.02.0
InGaN
AS AlInGaP
05 15
I
F
– FORWARD CURRENT – mA
0
0.4
1.4
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
30
0.8
0.2
1.0
10
0.6
1.2
AS AlInGaP
20 25
04 12
I
F
– FORWARD CURRENT – mA
0
0.4
1.4
1.6
LUMINOUS INTENSITY
(NORMALIZED AT 10 mA)
16
0.8
0.2
1.0
8
0.6
1.2
2 6 10 14
InGaN
GaP GREEN
GaP YELLOW
GaP ORANGE
HER
500 550 600 650 700 750
WAVELENGTH - nm
RELATIVE INTENSITY
1.0
0.5
0
1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
100
10
1
0
HER
GaP
ORANGE GaP YELLOW
GaP GREEN
05 15
I
F
– FORWARD CURRENT – mA
0
0.4
1.0
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
20
0.6
0.2
0.8
10 30
1.4
25
1.2
GaP
6
Figure 4. Maximum forward current vs.
ambient temperature. Figure 5. Relative intensity vs. angle.
Figure 7. Recommended Pb-free reflow soldering profile.
Figure 8. Recommended soldering pad pattern.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
0.70
(0.028) 0.70
(0.028)
0.30
(0.012)
0.40
(0.016)
0.60
(0.024)
0.40
(0.016)
0
25
020 60 80 100
5
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
T
A
– AMBIENT TEMPERATURE – °C
40
15
20
10
10 30 50 70 90
InGaN
AlInGaP/GaP
217 °C
MAX. 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
100 - 150 °C
255 °C (+5/-0)
60 to 150 SEC.
10 to 20 SEC.
TIME
TEMPERATURE
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 6. Recommended reflow soldering profile.
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
–3°C/SEC.
M
7
Figure 9. Reeling orientation.
Figure 10. Reel dimensions.
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
x
x
x
x
x
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
6
PS
178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020) 5.0 ± 0.5
(0.197 ± 0.020)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
Figure 11. Tape dimensions.
Figure 12. Tape leader and trailer dimensions.
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS. THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
8
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1) 0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157) 1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (± 0.004) DIM. B
± 0.10 (± 0.004)PART NUMBER DIM. C
± 0.10 (± 0.004)
HSMF-C16x SERIES 1.75 (0.069) 0.95 (0.037) 0.60 (0.024)
Reflow Soldering
For more information on reflow
soldering, refer to Application
Note 1060, Surface Mounting
SMT LED Indicator
Components.
Storage Condition:
5 to 30˚C @ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 ± 5˚C for 20 hours.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152 (Domestic/Interna-
tional), or 0120-61-1280 (Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5988-5606EN
April 23, 2004
5989-0401EN
