NTC Thermistors for automotive devices (chip type) Multilayer NTC Thermistors Series: ERTJ Features Surface Mount Device (0402, 0603) Highly reliable multilayer / monolithic structure Wide temperature operating range (-40 to 150 Environmentally-friendly lead-free AEC-Q200 qualified RoHS compliant C) Recommended Applications For For For For For For car audio system ECUs electric pumps and compressors LED lights batteries temperature detection of various circuits Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 E R T J 0 E G 1 0 3 F M Common Code Product Code Type Code ERT NTC J Chip Type (SMD) Thermistors Multilayer Type Size Code 0 "0402" 1 "0603" Packaging Style Code E V "0402" Pressed Carrier Taping Punched Carrier Taping (Pitch : 2 mm) "0603" Punched Carrier Taping (Pitch : 4 mm) B Value Class Code 2701 to 2800 A 3301 to 3400 G 3801 to 3900 M 4001 to 4100 P 4201 to 4300 R 4301 to 4400 S 4401 to 4500 T 4601 to 4700 V Nominal Resistance R25 () The first two digits are significant figures of resistance and the third one denotes the number of zeros following them. (Example) Resistance Tolerance Code G 1% Narrow Tolerance 2% Type H J 3% Standard 5% Type F M Automotive component Construction 3 4 5 1 2 No. Name A Semiconductive Ceramics B Internal electrode C D E Terminal electrode Substrate electrode Intermediate electrode External electrode Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Mar. 2017 NTC Thermistors for automotive devices (chip type) Ratings Size code (EIA) Operating Temperature Range Rated Maximum Power Dissipation1 Dissipation Factor2 0(0402) 1(0603) -40 to 150 C 66 mW Approximately 2 mW/C 100 mW Approximately 3 mW/C 1 Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature. * The maximum value of power, and rated power is same under the condition of ambient temperature 25 C or less. If the temperature exceeds 25 C, rated power depends on the decreased power dissipation curve. * Please see "Operating Power" for details. 2 Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 C through self heat generation under stable temperatures. * Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT). Part Number List 0402(EIA) 0603(EIA) Part Number ERTJ0EG103M ERTJ0EP473M ERTJ0ER104M ERTJ0ET104M ERTJ0EV104M ERTJ0EV474M Nominal Resistance at 25 C 10 k 47 k 100 k 100 k 100 k 470 k B Value B Value at 25/50(K) at 25/85(K) 3380 K1 % 3435 K1 % 4050 K1 % (4100 K) 4250 K1 % (4300 K) 4485 K1 % (4550 K) 4700 K1 % (4750 K) 4700 K1 % (4750 K) Part Number ERTJ1VG103M ERTJ1VP473M ERTJ1VR104M ERTJ1VV104M ERTJ1VT224M Nominal Resistance at 25 C 10 k 47 k 100 k 100 k 220 k B Value B Value at 25/50(K) at 25/85(K) 3380 K1 % 3435 K1 % 4100 K1 % (4150 K) 4200 K1 % (4250 K) 4700 K1 % (4750 K) 4485 K1 % (4550 K) : Resistance Tolerance Code (F : 1%, G : 2%, H : 3%, J : 5%) : Resistance Tolerance Code (F : 1%, G : 2%, H : 3%, J : 5%) Temperature B25/50 B25/85 T(C) -40 -35 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 125 B25/50= and Resistance value (the resistance value at 25 C is set to 1)/ Reference values ERTJG~ (3380 K) 3435 K ERTJ0EP~ 4050 K (4100 K) ERTJ1VP~ 4100 K (4150 K) ERTJ0ER~ 4250 K (4300 K) ERTJ1VR~ 4200 K (4250 K) ERTJT~ 4485 K (4550 K) ERTJV~ 4700 K (4750 K) 20.52 15.48 11.79 9.069 7.037 5.507 4.344 3.453 2.764 2.227 1.806 1.474 1.211 1 0.8309 0.6941 0.5828 0.4916 0.4165 0.3543 0.3027 0.2595 0.2233 0.1929 0.1672 0.1451 0.1261 0.1097 0.09563 0.08357 0.07317 0.06421 0.05650 0.04986 33.10 24.03 17.63 13.06 9.761 7.362 5.599 4.291 3.312 2.574 2.013 1.584 1.255 1 0.8016 0.6461 0.5235 0.4266 0.3496 0.2881 0.2386 0.1985 0.1659 0.1393 0.1174 0.09937 0.08442 0.07200 0.06166 0.05306 0.04587 0.03979 0.03460 0.03013 34.56 24.99 18.26 13.48 10.04 7.546 5.720 4.369 3.362 2.604 2.030 1.593 1.258 1 0.7994 0.6426 0.5194 0.4222 0.3451 0.2837 0.2344 0.1946 0.1623 0.1359 0.1143 0.09658 0.08189 0.06969 0.05957 0.05117 0.04415 0.03823 0.03319 0.02886 42.40 29.96 21.42 15.50 11.33 8.370 6.244 4.699 3.565 2.725 2.098 1.627 1.271 1 0.7923 0.6318 0.5069 0.4090 0.3320 0.2709 0.2222 0.1831 0.1516 0.1261 0.1054 0.08843 0.07457 0.06316 0.05371 0.04585 0.03929 0.03378 0.02913 0.02519 40.49 28.81 20.72 15.07 11.06 8.198 6.129 4.622 3.515 2.694 2.080 1.618 1.267 1 0.7944 0.6350 0.5108 0.4132 0.3363 0.2752 0.2263 0.1871 0.1554 0.1297 0.1087 0.09153 0.07738 0.06567 0.05596 0.04786 0.04108 0.03539 0.03059 0.02652 46.47 32.92 23.55 17.00 12.38 9.091 6.729 5.019 3.772 2.854 2.173 1.666 1.286 1 0.7829 0.6168 0.4888 0.3896 0.3123 0.2516 0.2037 0.1658 0.1357 0.1117 0.09236 0.07675 0.06404 0.05366 0.04518 0.03825 0.03255 0.02781 0.02382 0.02043 59.76 41.10 28.61 20.14 14.33 10.31 7.482 5.481 4.050 3.015 2.262 1.710 1.303 1 0.7734 0.6023 0.4721 0.3723 0.2954 0.2356 0.1889 0.1523 0.1236 0.1009 0.08284 0.06834 0.05662 0.04712 0.03939 0.03308 0.02791 0.02364 0.02009 0.01712 kn (R25/R50) 1/298.15-1/323.15 B25/85= kn (R25/R85) 1/298.15-1/358.15 R25=Resistance at 25.00.1 C R50=Resistance at 50.00.1 C R85=Resistance at 85.00.1 C Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Mar. 2017 NTC Thermistors for automotive devices (chip type) Specification and Test Method Item Specification Rated Zero-power Within the specified tolerance. Resistance (R25) Test Method The value is measured at a power that the influence of self-heat generation can be negligible (0.1mW or less), at the rated ambient temperature of 25.00.1C. B Value The Zero-power resistances; R1 and R2, shall be measured respectively at T1 (deg.C) and T2 (deg.C). The B value is calculated by the following equation. Shown in each Individual Specification. Individual Specification shall specify B25/50 or B25/85. BT1/T2= T1 25.0 0.1 C 25.0 0.1 C B25/50 B25/85 Adhesion kn (R1)-kn (R2) 1/(T1+273.15)-1/(T2+273.15) T2 50.0 0.1 C 85.0 0.1 C The terminal electrode shall be free from peeling Applied force : or signs of peeling. Size 0402, 0603 : 5 N Duration : 10 s Size : 0402 1.0 0.5 0.5R Test Sample Board 1.0 Size : 0603 Test Sample Bending distance : 2 mm Bending speed : 1 mm/s 20 R340 452 Bending distance Bending Strength There shall be no cracks and other mechanical damage. R25 change : within 5 % Unit : mm 452 Unit : mm Resistance to Vibration There shall be no cracks and other mechanical damage. R25 change : B Value change : Resistance to Impact within 2 % within 1 % There shall be no cracks and other mechanical damage. R25 change : B Value change : within 2 % within 1 % Solder samples on a testing substrate, then apply vibration to them. Acceleration :5G Vibrational frequency : 10 to 2000 Hz Sweep time : 20 minutes 12 cycles in three directions, which are perpendicular to each other Solder samples on a testing substrate, then apply impacts to them. Pulse waveform : Semisinusoidal wave, 11 ms Impact acceleration : 50 G Impact direction : X-X', Y-Y', Z-Z' In 6 directions, three times each Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Mar. 2017 NTC Thermistors for automotive devices (chip type) Specification and Test Method Item Resistance to Soldering Heat Specification There shall be no cracks and other mechanical damage. R25 change : B Value change : within 2 % within 1 % Test Method Soldering bath method Solder temperature : 260 5 C, 270 5 C Dipping period : 3.0 0.5 s, 10.0 0.5 s Preheat condition : Step 1 2 Temp (C) 80 to 100 150 to 200 Period (s) 120 to 180 120 to 180 Solderability More than 95 % of the soldered area of both terminal electrodes shall be covered with fresh solder. Soldering bath method Solder temperature : 230 5 C Dipping period : 4 1 s Solder : Sn-3.0Ag-0.5Cu Temperature Cycling R25 change : B Value change : within 2 % within 1 % Conditions of one cycle Step 1 : -553 C, 303 min. Step 2 : Room temp., 3 min. max. Step 3 : 1255 C, 303 min. Step 4 : Room temp., 3 min. max. Number of cycles: 2000 cycles Humidity R25 change : B Value change : within 2 % within 1 % Temperature : 85 2 C Relative humidity : 85 5 % Test period : 2000 +48/0 h Biased Humidity R25 change : B Value change : within 2 % within 1 % Temperature : 85 2 C Relative humidity : 85 5 % Applied power : 10 mW(D.C.) Test period : 2000 +48/0 h Low Temperature Exposure R25 change : B Value change : within 2 % within 1 % Temperature Test period : -40 3 C : 2000 +48/0 h High Temperature R25 change : Exposure 1 B Value change : within 2 % within 1 % Temperature Test period : 125 3 C : 2000 +48/0 h High Temperature R25 change : Exposure 2 B Value change : within 3 % within 2 % Temperature Test period : 150 3 C : 1000 +48/0 h Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Mar. 2017 NTC Thermistors for automotive devices (chip type) Dimensions in mm (not to scale) L W (Unit : mm) Size Code (EIA) L W T L1, L2 0 (0402) 1.00.1 0.500.05 0.500.05 0.250.15 1 (0603) 1.600.15 0.80.1 0.80.1 0.30.2 T L2 L1 Packaging Methods Size Code Reel Packing Quantities Thickness (mm) 0 (0402) 0.5 1 (0603) 0.8 for Taping Pitch Quantity (mm) (pcs./reel) Kind of Taping Punched Carrier Taping 2 10,000 4 4,000 W1 E C B Standard D Pitch W2 2 mm (Punched Carrier Taping) : Size 0402 A Feeding hole fD0 t1 Chip pocket E Symbol (mm) fB fA 180 0 -3 60.0 +1.0 0 C D E 13.00.5 21.00.8 2.00.5 W1 9.0 +1.0 0 W2 11.41.0 B F W A Dim. t2 Chip component A Symbol B W P1 P2 F E P0 P1 P2 Tape running direction P0 fD 0 t1 Dim. 0.62 1.12 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.7 (mm) 0.05 0.05 0.2 0.05 0.10 0.05 0.05 0.1 Pitch 0 t2 Feeding hole fD0 Part and Taped End Leader part Top cover tape 1.0 max. max. 4 mm (Punched Carrier Taping) : Size 0603 100 min. Vacant position 400 min. Chip pocket Taped end E t1 Leader B F W A t2 Symbol 160 min. Vacant position (Unit : mm) ERTJ0 (0402) Minimum Quantity/ Packing Unit 10,000 Packing Quantity in Carton 200,000 Carton LxWxH (mm) 250x200x200 ERTJ1 (0603) 4,000 80,000 250x200x200 A Dim. 1.0 (mm) P1 Chip component 0.1 B 1.8 0.1 W F E P2 Tape running direction P0 P1 P2 P0 fD 0 t1 t2 8.0 3.50 1.75 4.0 2.00 4.0 1.5+0.1 1.1 1.4 0.2 0.05 0.10 0.1 0.05 0.1 0 max. max. Minimum Quantity / Packing Unit Part Number (Size) Part No., quantity and country of origin are designated on outer packages in English. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Mar. 2017