TS1GMMC4 - Transcend Information, Inc.

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MMCplus

Transcend Information Inc.

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Description

TS128MMC4 ~ TS4GMMC4 is a 128MB ~ 4GB

MMCplus memory card. It’s a fastest, low-power,

highly integration memory card. It is designed to

provide an inexpensive, mechanically robust storage

medium in card form for multimedia consumer

applications and mobile devices (handheld PCs,

digital cameras, MP3 players, etc.) to store, copy,

and move data at high-speed transfer rate.

Placement

Features

• Storage Capacity: 128MB ~ 4GB

• Operating Voltage: 2.7~3.6V

• Support clock frequencies: 0~52MHz

• Support different Bus width: x1, x4, x8

• Operating Temperature: -25°C ~ 85°C

• Data access mode: Byte mode

• Fully compatible with MultiMediaCard system

specification version 4.0 and backwards compatibility

with previous specification

• Form Factor: 32mm x 24mm x 1.4mm

Front Back

Pin Definition

MMC Mode SPI Mode

Pin No. Name Type Description Name Type Description

1 DAT3 I/O/PP Data CS I Chip select

2 CMD I/O/PP/OD Command/Response DI I/PP Data in

3 VSS1 S Ground VSS S Ground

4 VDD S Power supply VDD S Power supply

5 CLK I Clock SCLK I Clock

6 VSS2 S Ground VSS2 S Ground

7 DAT0 I/O/PP Data DO O/PP Data out

8 DAT1 I/O/PP Data Not used

9 DAT2 I/O/PP Data Not used

10 DAT4 I/O/PP Data Not used

11 DAT5 I/O/PP Data Not used

12 DAT6 I/O/PP Data Not used

13 DAT7 I/O/PP Data Not used

S: Power Supply; I:Input; O:Output; PP:Push-Pull; OD:Open-Drain; NC:Not Connected

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MultiMediaCard Architecture

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Temperature Characteristics

Parameter Min. Max. Unit

Operating temperature -25 85 ℃

Electrical Characteristics

• Absolute Maximum Ratings

Parameter Symbol Rating Unit

Power Supply Voltage VCC -0.6~+4.6 V

Input Voltage VIN -0.6~+4.6 V

Input/Output Voltage VI/O -0.6~+4.6 V

• Recommended Operation Conditions

Parameter Symbol Min. Typ. Max. Unit

Power Supply Voltage VDDH 2.7 3.3 3.6 V

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Transcend Information Inc.

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DC Characteristics

• Power Supply (Ta=-25℃ to 85℃,VDDH=2.7V to3.6V)

Parameter Symbol Min. Typ. Max. Unit Condition

Output Low Voltage (OD) VODOL 0.3 V IOL =2mA

Output High Voltage (PP) VOH 0.75* VDDH V IOH =-100uA

Output Low Voltage (PP) VOL 0.125* VDDH V IOL =100uA

Input High Voltage VIH 0.625* VDDH VDDH +0.3 V

Input Low Voltage VIL -0.3 0.25* VDDH V

Operating Current ICC 20(TBD) mA IVCCF =0mA

Stand-by Current ISB 400(TBD) uA

Input Leakage Current ILI -10/+10 uA VIN =0 to VDDH

Output Leakage Current ILO -10/+10 uA VOUT =0 to VDDH

Pin Capacitance CP 7 pF

Power Output Voltage VF1.50 1.8 1.95 V IF＜＝240mA

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Transcend Information Inc.

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AC Characteristics

• High Speed Card Interface Timing (Ta=-25℃ to 85℃,VDDH=2.7V to3.6V)

Parameter Symbol Min. Max. Unit Notes

Clock Frequency (Data Transfer Mode) fpp 26 52 MHz

Clock Frequency (Identification Mode) fOD 0 400 KHz

Clock Low Time tWL 6.5 ns

Clock Rise Time tTLH 3 ns

Clock Fall Time tTHL 3 ns

Input Set-up Time tISU 3 ns

Input Hold Time tIH 3 ns

Output Delay Time tDLY 5 14 ns

CL＜＝30pF

Signal Rise Time trise 3 ns

CL＜＝30pF

Signal Fall Time tfall 3 ns CL＜＝30pF

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Transcend Information Inc.

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• Backwards Compatible Card Interface Timing (Ta=-25℃ to 85℃,VDDH=2.7V to3.6V)

Parameter Symbol Min. Max. Unit Notes

Clock Frequency (Data Transfer Mode) fpp 0 20 MHz

Clock Frequency (Identification Mode) fOD 0 400 KHz

Clock Low Time tWL 10 ns

Clock Rise Time tTLH 10 ns

Clock Fall Time tTHL 10 ns

Input Set-up Time tISU 3 ns

Input Hold Time tIH 3 ns

Output Delay Time tDLY 9.7 35 ns

CL＜＝30pF

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• Command Latch Cycle

Parameter Symbol Min. Unit Notes

CLE Setup Time tCLS1 30 ns CL<=80pF

CLE Hold Time tCLH1 15 ns CL<=80pF

CE Setup Time tCS1 40 ns CL<=80pF

CE Hold Time tCH1 90 ns CL<=80pF

ALE Setup Time tALS1 90 ns CL<=80pF

ALE Hold Time tALH1 75 ns CL<=80pF

WE Pulse Width tWP1 45 ns CL<=80pF

Data Setup Time tDS1 90 ns CL<=80pF

Data Hold Time tDH1 30 ns CL<=80pF

• Address Latch Cycle

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Parameter Symbol Min. Unit Remark

CLE Setup Time tCLS2 90 ns CL<=80pF

CE Setup Time tCS2 195 ns CL<=80pF

ALE Setup Time tALS2 30 ns CL<=80pF

ALE Hold Time tALH2 15 ns CL<=80pF

Write Cycle Time tWC2 150 ns CL<=80pF

WE Pulse Width tWP2 45 ns CL<=80pF

WE High Hold Time tWH2 105 ns CL<=80pF

Data Setup Time tDS2 90 ns CL<=80pF

Data Hold Time tDH2 30 ns CL<=80pF

• Input Data Latch Cycle

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Parameter Symbol Min. Unit Remark

CLE Hold Time tCLH3 285 ns CL<=80pF

CE Hold Time tCH3 195 ns CL<=80pF

ALE Setup Time tALS3 90 ns CL<=80pF

Write Cycle Time tWC3 60 ns CL<=80pF

WE Pulse Width tWP3 45 ns CL<=80pF

WE High Hold Time tWH3 15 ns CL<=80pF

Data Setup Time tDS3 30 ns CL<=80pF

Data Hold Time tDH3 30 ns CL<=80pF

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Transcend Information Inc.

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• Serial Access Cycle after Read

Parameter Symbol Min. Unit Remark

CE Access Time tCEA4 285 ns CL<=80pF

Read Cycle Time tRC4 60 ns CL<=80pF

RE Pulse Width tRP4 45 ns CL<=80pF

RE High Hold Time tREH4 15 ns CL<=80pF

Data Setup Time tDS4 5(TBD) ns CL<=80pF

Data Hold Time tDH4 5(TBD) ns CL<=80pF

Ready to RE Low tRR4 285 ns CL<=80pF

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MMCplus

Transcend Information Inc.

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Reliability and Durability

Temperature Operation: -25°C / 85°C

Moisture and corrosion Operation: 25°C / 95% rel. humidity

Stress: 40°C / 93% rel. hum./500h

Salt Water Spray: 3% NaCl/35C; 24h acc. MIL STD Method 1009

ESD protection Contact Pads:

+/-4kV, Human body model according to ANSI EOS/ESD-S5.1-1998

Non Contact Pads area:

+/-8kV(coupling plane discharge)

+/-15kV(air discharge)

Human body model according to IEC61000-4-2

Durability 10.000 mating cycles; test procedure: t.b.d.

Bending t.b.d.

Torque t.b.d.

Drop test 1.5m free fall

UV light exposure UV: 200nm, 15Ws/cm² according to ISO 7816-1

Visual inspection

Shape and form No warp page; no mold skin; complete form; no cavities surface smoothness sigma

-0.1 mm/cm² within contour; no cracks; no pollution (fat, oil dust, etc.)

Above technical information is based on MMC4.0 standard specification and tested to be reliable. However, Transcend

makes no warranty, either expressed or implied, as to its accuracy and assumes no liability in connection with the use of

this product. Transcend reserves the right to make changes in specifications at any time without prior notice.