CPC1008N Single-Pole, Normally Open 4-Pin SOP OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 100 150 8 Units VP mArms / mADC Features * 1500Vrms Input/Output Isolation * Small 4-Pin SOP Package * Low Drive Power Requirements (TTL/CMOS Compatible) * No Moving Parts * High Reliability * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Machine Insertable, Wave Solderable * Tape & Reel Version Available Description CPC1008N is a miniature, low-voltage, low on-resistance, single-pole, normally open (1-Form-A) solid state relay in a 4-Pin SOP package. It uses Clare's patented, optically coupled, OptoMOS architecture to provide 1500Vrms of input/output isolation. Using Clare's state of the art double-molded vertical construction packaging, the CPC1008N is one of the world's smallest relays. It is ideal for replacing larger, less-reliable reed and electromechanical relays. Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1175739 * EN/IEC 60950-1 Certified Component: Certificate B 10 05 49410 006 Applications * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment--Patient/Equipment Isolation * Security Systems * Aerospace * Industrial Controls * Reed Relay Replacement Ordering Information Part # CPC1008N CPC1008NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control - Control 1 4 3 2 Load Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton Pb DS-CPC1008N-R09 toff e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1008N Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Ratings Units 100 5 50 1 Input Power Dissipation 70 Total Power Dissipation 1 400 Isolation Voltage, Input to Output (60 Seconds) 1500 Operational Temperature -40 to +85 Storage Temperature -40 to +125 1 VP V mA A mW mW Vrms C C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Derate linearly 3.33 mW / C Electrical Characteristics @ 25C Parameter Conditions Symbol Output Characteristics Load Current Continuous 1 IL Peak t=10ms ILPK On-Resistance 2 IL=150mA RON Off-State Leakage Current VL=100VP ILEAK Switching Speeds Turn-On ton IF=5mA, VL=10V Turn-Off toff Output Capacitance IF=0mA, VL=50V, f=1MHz COUT Input Characteristics Input Control Current to Activate 3 IL=150mA IF Input Control Current to Deactivate IF Input Voltage Drop IF=5mA VF Reverse Input Current VR=5V IR Common Characteristics Capacitance, Input to Output CI/O 1 2 3 2 Min Typ Max Units - 4.8 - 150 350 8 1 mArms / mADC mAP A - 1 0.17 6 2 0.5 - 0.2 0.9 - 0.45 1.2 - 2 1.4 10 mA mA V A - 1 - pF ms pF Load current derates linearly from 150mA @ 25oC to 120mA @ 85oC. Measurement taken within 1 second of on time. For high temperature operation (>60C) a LED current of 4mA is recommended. www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION CPC1008N PERFORMANCE DATA (@ 25C Unless Otherwise Specified)* Typical LED Forward Voltage Drop (N=50, IF=5mA) 15 10 5 15 10 5 0 0 1.250 1.255 1.260 1.265 1.270 LED Forward Voltage (V) Typical IF for Switch Operation (N=50, IL=100mA) 5 0 0.40 0.42 0.45 0.47 LED Current (mA) 0.50 IF=50mA IF=20mA IF=10mA IF=5mA IF=2mA 1.0 -40 -20 20 40 60 Temperature (C) 80 5 5.4 106 5.6 109 112 115 118 121 Blocking Voltage (VP) 124 Typical Turn-Off Time vs. LED Forward Current 2.5 0.25 2.0 0.20 1.5 1.0 0.5 0.15 0.10 0.05 0.00 0 100 Typical IF for Switch Operation vs. Temperature (IL=120mA) 1.0 4.8 5.0 5.2 On-Resistance (:) 0.0 0 10 0 4.6 Turn-Off Time (ms) 1.3 15 Typical Turn-On Time vs. LED Forward Current Turn-On Time (ms) LED Forward Voltage (V) 20 5 4.4 1.6 1.1 Typical Blocking Voltage Distribution (N=50) 10 Typical LED Forward Voltage Drop vs. Temperature 1.4 5 0.166 0.168 0.170 0.172 0.174 0.176 0.178 Turn-Off Time (ms) 15 0.53 1.5 10 1.15 0 0.38 1.2 0.95 1.00 1.05 1.10 Turn-On Time (ms) Device Count (N) Device Count (N) Device Count (N) 10 0.90 Typical On-Resistance Distribution (N=50, IF=2mA, IL=150mA) 20 15 15 0 0.85 1.275 20 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 20 Device Count (N) 20 20 Device Count (N) Device Count (N) 25 Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 10 20 30 LED Current (mA) 40 50 0 10 20 30 LED Current (mA) 40 50 Typical Turn-Off Time vs. Temperature Typical Turn-On Time vs. Temperature 1.0 1.6 0.6 0.4 0.2 1.2 Turn-Off Time (ms) 0.8 Turn-On Time (ms) LED Current (mA) 1.4 IF=5mA 1.0 0.8 0.6 IF=10mA 0.4 0.8 IF=10mA IF=5mA 0.6 0.4 0.2 0.2 0.0 0.0 0.0 -40 -20 0 20 40 60 Temperature (C) 80 100 -40 -20 0 20 40 60 Temperature (C) 80 100 -40 -20 0 20 40 60 Temperature (C) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R09 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1008N PERFORMANCE DATA (@ 25C Unless Otherwise Specified)* Typical On-Resistance vs. Temperature (IF=2mA, IL=120mA) 10 Typical Load Current vs. Load Voltage (IF=2mA) 200 Maximum Load Current vs. Temperature (IF=5mA) 160 6 4 2 Load Current (mA) 8 Load Current (mA) On-Resistance (:) 150 100 50 0 -50 -100 -40 -20 0 20 40 60 Temperature (C) 80 -200 -1.0 100 20 116 114 112 -0.5 0.0 0.5 Load Voltage (V) 15 10 0 108 -40 -20 0 20 40 60 Temperature (C) 80 100 -40 -20 0 20 40 60 Temperature (C) 80 100 Output Capacitance vs. Load Voltage (IF=2mA, f=1MHz) 50 5 110 120 100 1.0 Output Capacitnace (pF) 118 Leakage (nA) Blocking Voltage (VP) 25 130 Typical Leakage vs. Temperature (VL=100V) Typical Blocking Voltage vs. Temperature 120 140 110 -150 0 150 40 30 20 10 0 -40 -20 0 20 40 60 Temperature (C) 80 100 10s 100s 0 20 40 60 Load Voltage (V) 80 100 Energy Rating Curve Load Current (A) 1.0 0.8 0.6 0.4 0.2 0.0 10Ps 100Ps 1ms 10ms 100ms Time (s) 1s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION CPC1008N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1008N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1008N 260C for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R09 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1008N MECHANICAL DIMENSIONS CPC1008N 4.089 0.203 (0.161 0.008) Recommended PCB Land Pattern 0.200 0.025 (0.008 0.001) 0.60 (0.0217) 6.096 0.102 (0.240 0.004) 3.810 0.076 (0.150 0.003) 0.432 0.127 (0.017 0.005) 5.60 (0.2205) 1.02 0.025 (0.040 0.001) Pin 1 2.54 Typ (0.100 Typ) 1.30 (0.0512) 2.184 Max (0.086 Max) 2.54 (0.10) Lead to package standoff: 0.0637 0.0383 (0.0025 0.0015) 0.762 0.102 (0.030 0.004) Dimensions mm (inches) 0.381 TYP. (0.015 TYP.) CPC1008NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1008N-R09 (c)Copyright 2012, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/13/2012