SPBTLE-RF0 - STMICROELECTRONICS

July 2017

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This is information on a product in full production.

www.st.com

SPBTLE-RF0

Very low power network processor module for Bluetooth® Low

Energy v4.1

Datasheet - production data

Features

 Bluetooth v4.1 compliant

 Supports master and slave modes

 Multiple roles supported simultaneously

 Embedded Bluetooth low energy protocol

stack

 GAP, GATT, SM, L2CAP, LL, RFPHY

 Bluetooth low energy profiles provided

separately

 Bluetooth radio performance:

 Embedded ST BlueNRG-MS

 Tx power: + 4 dBm

 Rx sensitivity: - 88 dBm

 Provides up to 92 dB link budget with

excellent link reliability

 Host interface

 SPI, IRQ, and RESET

 On-field stack upgrading available via

SPI

 AES security co-processor

 Certifications:

 CE qualified

 FCC, IC modular approval certified

 BT SIG qualified

 On-board chip antenna

 Operating supply voltage: from 1.7 to 3.6 V

 Operating temperature range: -40 °C to

 85 °C

Applications

 Watches

 Fitness, wellness and sports

 Consumer medical

 Security/proximity–

 Remote control

 Home and industrial automation

 Assisted living

 Mobile phone peripherals

 PC peripherals

Description

The SPBTLE-RF0 is an easy to use Bluetooth®

Low Energy network processor module,

compliant with Bluetooth v4.1. The SPBTLE-RF0

module supports multiple roles simultaneously,

and can act at the same time as Bluetooth Low

Energy master and slave device.

The entire Bluetooth Low Energy stack and

protocols are embedded into SPBTLE-RF0

module. The external host application processor,

where the application resides, is connected to the

SPBTLE-RF0 module through a standard SPI

interface.

The SPBTLE-RF0 module provides a complete

RF platform in a tiny form factor. Radio, antenna

and high frequency oscillators are integrated to

offer a certified solution to optimize the time to

market of the final applications.

The SPBTLE-RF0 can be powered directly with a

pair of AAA batteries or any power source from

1.7 to 3.6 V.

Contents

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Contents

1 General description ......................................................................... 5

2 Block schematic .............................................................................. 6

3 Software development .................................................................... 7

4 Software architecture ...................................................................... 8

5 Hardware specifications ................................................................. 9

5.1 Current consumption ......................................................................... 9

5.2 Pin assignment ................................................................................ 14

5.3 Mechanical dimensions ................................................................... 15

6 Hardware design ........................................................................... 17

6.1 Reflow soldering .............................................................................. 17

7 Regulatory compliance ................................................................. 19

7.1 FCC certification .............................................................................. 19

7.1.1 Labeling instructions ......................................................................... 19

7.1.2 Product manual instructions ............................................................. 20

7.2 IC certification ................................................................................. 21

7.2.1 Labelling instructions ........................................................................ 21

7.2.2 Product manual instructions ............................................................. 23

7.3 CE certification for SPBTLE-RF0 module ....................................... 24

7.4 Bluetooth certification ...................................................................... 24

8 Ordering information ..................................................................... 25

9 ECOPACK® .................................................................................... 26

10 Traceability .................................................................................... 27

11 Revision history ............................................................................ 28

SPBTLE-RF0

List of tables

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List of tables

Table 1: Absolute maximum ratings ........................................................................................................... 9

Table 2: Recommended operating conditions ............................................................................................ 9

Table 3: Current consumption .................................................................................................................... 9

Table 4: Pin description ............................................................................................................................ 14

Table 5: Soldering ..................................................................................................................................... 17

Table 6: Ordering information ................................................................................................................... 25

Table 7: Traceability information ............................................................................................................... 27

Table 8: Document revision history .......................................................................................................... 28

List of figures

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List of figures

Figure 1: HW block diagram ....................................................................................................................... 6

Figure 2: IFR configuration for SPBTLE-RF0 ............................................................................................. 7

Figure 3: SPBTLE-RF0 application block diagram ..................................................................................... 8

Figure 4: Configuration of the “BlueNRG current consumption estimation tool” ...................................... 10

Figure 5: Peripheral in advertising (Adv Int = 20 ms) ............................................................................... 10

Figure 6: Peripheral in advertising (Adv Int = 40 ms) ............................................................................... 11

Figure 7: Peripheral in connection (Conn Int = 80 ms) ............................................................................. 11

Figure 8: Peripheral in connection (Conn Int = 40 ms) ............................................................................. 12

Figure 9: Central in scan mode (Scan Int = 1250 ms, Scan Window = 1250 ms) .................................... 12

Figure 10: Central in scan mode (Scan Int = 1250 ms, Scan Window = 625 ms) .................................... 13

Figure 11: Central in connection (Conn Int = 40 ms) ................................................................................ 13

Figure 12: Pin assignment ........................................................................................................................ 14

Figure 13: SPBTLE-RF0 module mechanical dimensions ....................................................................... 15

Figure 14: Recommend land pattern top view .......................................................................................... 16

Figure 15: Soldering profiles ..................................................................................................................... 18

Figure 16: CE certified .............................................................................................................................. 24

SPBTLE-RF0

General description

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1 General description

The SPBTLE-RF0 is a Bluetooth Low Energy network processor module compliant with

Bluetooth® v4.1.

The SPBTLE-RF0 module integrates the BlueNRG-MS BT radio controller with an on-

board power-optimized Bluetooth stack.

It supports:

 Both master and slave roles

 GAP: central, peripheral, observer or broadcaster roles

 ATT/GATT: client and server

 SM: privacy, authentication and authorization

 L2CAP

The BlueNRG-MS radio embeds nonvolatile Flash memory which allows on-field stack

upgrading.

In accordance with Bluetooth specification v4.1, the SPBTLE-RF0 module supports:

 Multiple simultaneous roles

 Simultaneous advertising and scanning

 Acting as slave for up to two masters simultaneously

 Privacy V1.1

 Low duty cycle directed advertising

 Connection parameter request procedure

 LE Ping

 32 bits UUIDs

 L2CAP connection oriented channels

Both standard and proprietary Bluetooth low energy profiles, as well as a wide set of

examples are available for the SPBTLE-RF0 from the ST website.

The external host application processor where the application resides is interfaced with the

SPBTLE-RF0 module through an application controller interface protocol based on a

standard SPI interface.

With the SPBTLE-RF0 module, developers can enable wireless connectivity in electronic

devices without requiring any RF experience or expertise for integration into the final

product. The SPBTLE-RF0 module provides a complete RF platform in a tiny form factor

(13.5 x 11.5 x 2 mm) and, being a certified solution, optimizes the time to market of the final

applications.

The SPBTLE-RF0 module allows applications to meet the tight peak current requirements

when using standard coin cell batteries. SPBTLE-RF0 can be powered directly from a

standard 3 V coin cell battery, a pair of AAA batteries or any power source from 1.7 to 3.6

ST may update the FW provided with the modules at any time. ST recommends that users

regularly check for documentation and the current FW version available at

www.st.com/bluemodules.

Block schematic

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2 Block schematic

Figure 1: HW block diagram

RF antenna

Battery or External Supply

SPI LINE

Crystal

32 MHz

clock

SUPPLY FILTER

Bead Ferrite

BALUN

+ Filter

INTERNAL 2.45 GHz

BLUETOOTH

BLUENRG-MS

Host Controller

interface

32 MHz

internal

clock

32.768 kHz

internal

Ring Oscillator

I/0

Signals

(Optionals)

I/0 & Interrupt

SPBTLE-RF0

LDO

SPBTLE-RF0

Software development

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3 Software development

The SPBTLE-RF0 module embeds the BlueNRG-MS application processor. Refer to the

BlueNRG-MS web page (http://www.st.com/en/wireless-connectivity/bluenrg-ms.html) to

access:

 BlueNRG-MS datasheet

 development kit

 application notes

 user manuals

 tools and software

 design note and tips

For module firmware updates (BlueNRG-MS Bluetooth Stack), take into account the

SPBTLE-RF0-specific configuration (see the block diagram) to select the proper binary file

from the BlueNRG-MS Development Kit (STSW-BLUENRG-DK).

In particular the SPBTLE-RF0 module is configured with:

 32 MHz crystal oscillator

 32 KHz Ring Oscillator

 Internal LDO ( SMPS Off)

From the prebuilt image files provided for the BlueNRG-MS Development Kit, only the files

with “32MHz”, “RO32K”, and “SMPS_OFF” in the file name are suitable for the SPBTLE-

RF0.

For example only the ifr_3v1_003_mode02-32MHz-RO32K_SMPS_OFF.dat file is suitable

for the SPBTLE-RF0.

When used with the BlueNRG-GUI, the IFR configuration settings should reflect those

pictured below.

Figure 2: IFR configuration for SPBTLE-RF0

Software architecture

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4 Software architecture

The SPBTLE-RF0 module has been designed to work with an external Host processor

connected via SPI.

Figure 3: SPBTLE-RF0 application block diagram

SPBTLE-RF0

Hardware specifications

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5 Hardware specifications

General conditions (VIN = 3.3 V and 25 °C)

Table 1: Absolute maximum ratings

Rating

Min.

Typ.

Max.

Unit

Storage temperature range

- 40

+ 85

°C

Supply voltage, VIN

- 0.3

+ 3.9

I/O pin Voltage (VIO five-volt tolerant pin)

- 0.3

+ 3.9

RF saturation input power

dBm

Table 2: Recommended operating conditions

Rating

Min.

Typ.

Max.

Unit

Operating temperature range

- 40

+ 85

°C

Supply voltage, VIN

1.7

1.8

3.6

Signals & I/O pin voltage (according supply voltage)

1.7

3.6

RF Frequency

2402

2480

MHz

5.1 Current consumption

Measurement conditions: VIN = 3.0 V, TX output power = +4 dBm, temperature = 25 °C,

FW version = 7.1e

Table 3: Current consumption

Symbol

Parameter

Test conditions

Typ.

Peak

Unit

IDD

Supply

current

Shutdown / STANDBY

1.98

µA

Peripheral in Advertising (Adv Int = 20 ms)

1.36

20.5

Peripheral in Advertising (Adv Int = 40 ms)

0.68

20.5

Peripheral in Advertising (Adv Int = 80 ms)

0.34

20.5

Peripheral in connection (Conn Int = 40 ms)

0.20

20.5

Central in Scan Mode (Scan Int = 1250 ms, Scan

Window = 1250 ms)

14.49

Central in Scan Mode (Scan Int = 1250 ms, Scan

Window = 625 ms)

7.24

14.49

Central in connection (Conn Int = 40 ms)

0.186

20.5

To increase the SPBTLE-RF0 module power efficiency, it is suggested to use 1.7 V power

supply.

For each calculated value refer to the following screenshots:

Hardware specifications

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Figure 4: Configuration of the “BlueNRG current consumption estimation tool”

Figure 5: Peripheral in advertising (Adv Int = 20 ms)

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Figure 6: Peripheral in advertising (Adv Int = 40 ms)

Figure 7: Peripheral in connection (Conn Int = 80 ms)

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Figure 8: Peripheral in connection (Conn Int = 40 ms)

Figure 9: Central in scan mode (Scan Int = 1250 ms, Scan Window = 1250 ms)

SPBTLE-RF0

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Figure 10: Central in scan mode (Scan Int = 1250 ms, Scan Window = 625 ms)

Figure 11: Central in connection (Conn Int = 40 ms)

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5.2 Pin assignment

Figure 12: Pin assignment

Table 4: Pin description

Name

Type

Pin n°

Description

V max. tolerant

SPI Interface

SPI_IRQ

SPI IRQ (SLAVE has data for MASTER)

Vin

SPI_IRQSPI_CLK

SPI CLOCK (Max. 8 MHz)

Vin

SPI_MISO

SPI MISO (MASTER in / SLAVE out)

Vin

SPI_MOSI

SPI MOSI (MASTER out SLAVE in)

Vin

SPI_CS

SPI “Chip select” (SPI slave select)

Vin

Power and ground

Vin

(1.7 V - 3.6 V max.)

GND

Reset

BT_RESET

Reset input (active low < 0.35 Vin)

(1.7 V - 3.6 V max.)

Not connected

EXT_LPCLK

Not connected. Must be left floating.

GPIO2

I/O

Not connected. Must be left floating.

ANA TEST 0

Not connected. Must be left floating.

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5.3 Mechanical dimensions

Figure 13: SPBTLE-RF0 module mechanical dimensions

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Figure 14: Recommend land pattern top view

SPBTLE-RF0

Hardware design

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6 Hardware design

SPBTLE-RF0 module supports SPI hardware interfaces.

 All unused pins should be left floating; do not ground

 All GND pins must be well grounded

 The area around the module should be free of any ground planes, power

planes, trace routings, or metal for 6 mm from the module antenna position,

in all directions.

 Traces should not be routed underneath the module

 Reset pin must be keep low until Vin is stable

6.1 Reflow soldering

The SPBTLE-RF0 is a high temperature strength surface mount Bluetooth® module

supplied on an 11-pin, 4-layer PCB. The recommended final assembly reflow profiles are

indicated below.

The soldering phase must be executed with care: pay special attention to the set up of the

peak temperature to avoid undesired melting.

Below are some soldering profile recommendations.

Table 5: Soldering

Profile feature

Pb-free assembly

Average ramp up rate (TSMAX to Tp)

3 °C / sec max

Preheat

Temperature min (TS min)

150 °C

Temperature max (TS max)

200 °C

Time (tS min to tS max) (tS))

60 - 100 sec

Time maintained above

Temperature TL

217 °C

Time tL

60 - 70 sec

Peak temperature (TP)

240 + 0 °C

Time within 5 °C of actual peak temperature (TP)

10 - 20 sec

Ramp down rate

6 °C / sec

Time from 25 °C to peak temperature

8 minutes max

Hardware design

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Figure 15: Soldering profiles

SPBTLE-RF0

Regulatory compliance

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7 Regulatory compliance

7.1 FCC certification

This module has been tested and found to comply with the FCC part 15 rules. These limits

are designed to provide reasonable protection against harmful interference in approved

installations. This equipment generates, uses, and can radiate radio frequency energy and,

if not installed and used in accordance with the instructions, may cause harmful

interference to radio communications.

However, there is no guarantee that interference may not occur in a particular installation.

This device complies with part 15 of the FCC rules. Operation is subject to the following

two conditions:

1. This device may not cause harmful interference,

and

2. this device must accept any interference received, including interference that may

cause undesired operation.

Modifications or changes to this equipment not expressly approved by STMicroelectronics

may render void the user's authority to operate this equipment.

Modular approval

FCC ID: S9NSPBTLERF

In accordance with FCC part 15, the SPBTLE-RF0 is listed as a modular transmitter

device.

This module is evaluated for stand-alone use only. Finished products incorporating multiple

transmitters must comply with collocation and RF exposure requirements in accordance

with FCC multi-transmitter product procedures. Collocated transmitters operating in

portable RF Exposure conditions (e.g. < 20 cm from persons including but not limited to

body worn and hand held devices) may require separate approval.

7.1.1 Labeling instructions

When integrating the SPBTLE-RF0 into the final product, the OEM must ensure that the

FCC labeling requirements are satisfied. A statement must be included on the exterior of

the final product which indicates the product includes a certified module. The label should

state the following (or similar wording that conveys the same meaning):

Contains FCC ID: S9NSPBTLERF

This product contains FCC ID: S9NSPBTLERF

The OEM must include the following statements on the exterior of the final product unless

the product is too small (e.g. less than 4 x 4 inches):

This device complies with Part 15 of the FCC Rules. Operation is subject to the following

two conditions:

 this device may not cause harmful interference,

and

 this device must accept any interference received, including any interference that may

cause undesired operation.

Regulatory compliance

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7.1.2 Product manual instructions

This section applies to OEM final products containing the SPBTLE-RF0 module, subject to

FCC compliance. The final product manual must contain the following statement (or a

similar statement that conveys the same meaning):

Changes or modifications not expressly approved by the party responsible for

compliance could void the user's authority to operate the equipment. (Part. 15.21)

In the case where an OEM seeks Class B (residential) limits for the final product, the

following statement must be included in the final product manual:

This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to part 15 of the FCC Rules. These limits are designed to

provide reasonable protection against harmful interference in a residential

installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may

cause harmful interference to radio communications. However, there is no

guarantee that interference will not occur in a particular installation. If this

equipment does cause harmful interference to radio or television reception, which

can be determined by turning the equipment off and on, the user is encouraged to

try to correct the interference by one or more of the following measures:

 Reorient or relocate the receiving antenna

 Increase the separation between the equipment and receiver

 Connect the equipment into an outlet on a circuit different from that to which

the receiver is connected

 Consult the dealer or an experienced radio/TV technician for help

In the case where an OEM seeks the lesser category of a Class A digital device for the final

product, the following statement must be included in the final product manual:

This equipment has been tested and found to comply with the limits for a Class A

digital device, pursuant to part 15 of the FCC Rules. These limits are designed to

provide reasonable protection against harmful interference when the equipment is

operated in a commercial environment. This equipment generates, uses, and can

radiate radio frequency energy and, if not installed and used in accordance with

the instruction manual, may cause harmful interference to radio communications.

Operation of this equipment in a residential area is likely to cause harmful

interference in which case the user will be required to correct the interference at

his expense.

For more information refer to Test Report No. AR16-0006125-01 performed in accordance

with:

 FCC Rules: Code of Federal Regulations (CFR) no. 47 Part 15 subpart C Section

15.247

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7.2 IC certification

The SPBTLE-RF0 module has been tested and found compliant with the IC RSS-210 rules.

These limits are designed to provide reasonable protection against harmful interference in

approved installations. This equipment generates, uses, and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause

harmful interference to radio communications.

However, there is no guarantee that interference may not occur in a particular installation.

This device complies with RSS-210 of the IC rules. Operation is subject to the following two

conditions:

 this device may not cause harmful interference

and

 this device must accept any interference received, including interference that may

cause undesired operation

Modifications or changes to this equipment not expressly approved by STMicroelectronics

may render void the user's authority to operate this equipment.

Modular approval

IC: 8976C-SPBTLERF

In accordance with IC RSS-210, the SPBTLE-RF0 is listed as a modular transmitter device.

This module is evaluated for stand-alone use only. Finished products incorporating multiple

transmitters must comply with colocation and RF exposure requirements in accordance

with IC multi-transmitter product procedures. Collocated transmitters operating in portable

RF Exposure conditions (e.g. < 20 cm from persons including but not limited to body worn

and hand held devices) may require separate approval.

7.2.1 Labelling instructions

When integrating the SPBTLE-RF0 into the final product, the OEM must ensure that the IC

labeling requirements are satisfied. A statement must be included on the exterior of the

final product which indicates that the product includes a certified module. The label should

state the following (or similar wording that conveys the same meaning):

Contains IC: 8976C-SPBTLERF

This product contains IC: 8976C-SPBTLERF

The OEM must include the following statements on the exterior of the final product unless

the product is too small (e.g. less than 4 x 4 inches):

This device complies with RSS-210 of the IC Rules. Operation is subject to the following

two conditions:

 this device may not cause harmful interference

and

 this device must accept any interference received, including any interference that may

cause undesired operation

Regulatory compliance

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7.2.2 Product manual instructions

This section applies to OEM final products containing the SPBTLE-RF0 module, subject to

IC compliance. The final product manual must contain the following statement (or a similar

statement that conveys the same meaning):

Changes or modifications not expressly approved by the party responsible for

compliance could void the user's authority to operate the equipment. (RSS-210)

In the case where an OEM seeks Class B (residential) limits for the final product, the

following statement must be included in the final product manual:

This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to RSS-210 of the IC Rules. These limits are designed to