GO2922 1310nm Dual Channel Optical Transmitter Features Description * Robust error-free transmission of signals from 50Mbps to 3Gbps for up to 30km single-mode fiber * Maximum distance of 10km under worst-case conditions and 3Gbps video pathological signals * Supports video pathological patterns for SD-SDI, HD-SDI and 3G-SDI The GO2922 is a dual channel optical transmitter module designed to transmit optical serial digital signals as defined in SMPTE 297-2006. The GO2922 is specifically designed for robust performance in the presence of SDI pathological patterns for SMPTE 259M, SMPTE 344M, SMPTE 292M and SMPTE 424M serial rates. * Hot-pluggable * Two independent laser disable pins * Digital diagnostics and control via I2C interface including: The GO2922 contains two independent 1310nm transmitters. Each transmitter is designed to provide error-free transmission of signals from 50Mbps to 3Gbps over single mode fiber (9/125). It is also hot-pluggable. The GO2922 provides extensive operational status monitoring through an I2C interface. For each transmitter channel, output optical power and bias current are monitored. Other operating conditions such as supply voltage and operating temperature are also monitored. If a parameter monitored is outside the pre-defined range, the alarm flag associated with the parameter will be raised. Monitoring laser bias current, average output power, supply voltage and temperature Alarm reporting Module ID polling * Single +3.3V power supply * Low power consumption -- typically 670mW * RoHS compliant * Telcordia GR-468 compliant * 56.5mm x 13.4mm x 8.6mm SFP Package * SMPTE 297-2006 compatible Ordering Information Part Number Package Temperature Range GO2922-3131CM SFP TCASE= 0C to 70C Applications * SMPTE 297-2006 compatible electrical-to-optical interfaces * High-density video routers GO2922 1310nm Dual Channel Optical Transmitter GO2922 1310nm Dual Channel Optical Transmitter Data Sheet 40159 - 3 November 2009 www.gennum.com 1 of 28 Revision History Version ECR Date A 141244 August 2006 B 143832 February 2007 Corrected minor typos and removed references to address B0h that no longer exists. Modified average optical output power in Table 3-2: Optical Performance Specifications. Added Figure 5-1: GO2922 Typical Application Circuit. C 145191 May 2007 Corrected typo in packaging dimesion in Table 6-1. Updated Total Power Consumption values in Table 3-3: DC Electrical Specifications. Updated values in Table 3-2: Optical Performance Specifications and Table 4-2: Modules Identification Fields. Changed operating temperature, Power Cosumption to 735mW. Deleted Maximum Back Reflection in Table 3-2: Optical Performance Specifications. 0 147053 August 2007 Converted to Preliminary Data Sheet. Changed OCT in Table 3-1: Absolute Maximum Ratings, Pout and LER values in Table 3-2: Optical Performance Specifications, Typ TPC in Table 3-3: DC Electrical Specifications and Temperature Range in Ordering Information. Updated Table 4-2: Modules Identification Fields. 1 149171 May 2008 Updated Features on front page to include maximum distance under worst case conditions. Updated maximum optical signal intrinsic jitter, measured with pathological test signal at 2.97Gbps; linear extension ratio measurements; and optical signal intrinsic jitter in Table 3-2: Optical Performance Specifications. Added graphic of product to front page. Moved Ordering Information to front page. Removed List of Tables and List of Figures. Changed Gb/s and Mb/s to Gbps and Mbps. 2 149931 July 2008 Updated document to new template. Revised Features, Description, Table 3-1, Table 3-2, Table 3-3, Table 3-4, Table 4-2 and Table 6-1. Deleted Figure 6-2 and Table 6-1. Various editorial updates. 3 152968 November 2009 Updated extinction ratio and digital diagnostic specifications as a result of product changes outlined in PCN 53757. Revised wavelength and transmit power monitor specifications. Added clarifications on test conditions for various specifications. Numerous editorial updates throughout document. Document is now a Data Sheet. GO2922 Data Sheet 40159 - 3 Changes and/or Modifications New document. 2 of 28 November 2009 Contents Features.................................................................................................................................................................1 Description...........................................................................................................................................................1 Ordering Information.......................................................................................................................................1 Revision History .................................................................................................................................................2 1. Functional Block Diagram..........................................................................................................................4 2. Pin Specifications ..........................................................................................................................................5 2.1 Pin Configuration .............................................................................................................................5 2.2 Pin Descriptions ................................................................................................................................6 2.3 Host Board Power Supply Requirements .................................................................................7 2.4 Optical Connector Requirements ................................................................................................7 3. Product Specifications .................................................................................................................................8 3.1 Absolute Maximum Ratings ..........................................................................................................8 3.2 Optical Performance Specifications ...........................................................................................8 3.3 DC Electrical Specifications ....................................................................................................... 10 3.4 AC Electrical Specifications ....................................................................................................... 11 3.5 Supporting Circuit Specifications ............................................................................................ 11 3.5.1 In-Rush Current Control Circuit ................................................................................... 11 4. Digital Diagnostics ..................................................................................................................................... 12 4.1 I2C Bus Interface ............................................................................................................................ 12 4.2 Serial Interface Memory Map .................................................................................................... 14 5. Application Reference Design ............................................................................................................... 22 5.1 Typical Application Circuit ........................................................................................................ 22 6. References and Relevant Standards .................................................................................................... 23 7. Package Information ................................................................................................................................. 24 7.1 Package Dimensions ..................................................................................................................... 24 7.2 Marking Information .................................................................................................................... 25 7.3 PCB Layout Recommendations ................................................................................................. 26 GO2922 Data Sheet 40159 - 3 3 of 28 November 2009 1. Functional Block Diagram Feedback Differential Electrical Input Tx1_Disable I2C Bus TOSA_1 Laser + PINmon Laser Driver Tx provision and analog maintenance Digital Diagnostics Tx2_Disable Differential Electrical Input 1310nm TOSA_2 Laser + PINmon Laser Driver 1310nm Feedback Figure 1-1: GO2922 Functional Block Diagram GO2922 Data Sheet 40159 - 3 4 of 28 November 2009 2. Pin Specifications 2.1 Pin Configuration Figure 2-1 shows the host board pad configurations for the GO2922. Figure 2-2 shows the edge connector pad configuration for the GO2922. Towards Bezel 1 VEE 2 TX1_DIS 20 NC TD1- 19 3 NC TD1+ 18 4 VEE VEE 17 5 I2C CLK VCC_TX1 16 6 I2C DATA VCC_TX2 15 7 VEE VEE 14 8 TD2+ NC 13 9 TD2- NC 12 10 TX2_DIS VEE 11 Towards ASIC Figure 2-1: Pin Configuration for GO2922 Top of Board Bottom of Board (as viewed through top of board) 20 TX1_DIS 1 VEE 19 TD1- 2 NC 18 TD1+ 3 NC 17 VEE 4 VEE 16 VCC_TX1 5 I2C CLK 15 VCC_TX2 6 I2C DATA 14 VEE 7 VEE 13 NC 8 TD2+ 12 NC 9 TD2- 11 VEE 10 TX2_DIS Figure 2-2: GO2922 Edge Connector Pad Configuration GO2922 Data Sheet 40159 - 3 5 of 28 November 2009 2.2 Pin Descriptions Table 2-1 lists the pin descriptions for the GO2922. Table 2-1: Pin Descriptions Number Name Type Description 1 VEE Ground 2 NC No Connect No Connection 3 NC No Connect No Connection 4 VEE Ground 5 I2C CLK Digital (Input) I2C Clock 6 I2C DATA Digital (Bi-Directional) I2C Data 7 VEE Ground 8 TD2+ Input Positive Differential Input (AC-coupled internally) 9 TD2- Input Negative Differential Input (AC-coupled internally) 10 TX2_DIS Digital (Input) 11 VEE Ground 12 NC No Connect No Connection 13 NC No Connect No Connection 14 VEE Ground 15 VCC_TX2 Power Transmitter 2 Power Supply 16 VCC_TX1 Power Transmitter 1 Power Supply 17 VEE Ground 18 TD1+ Input Positive Differential Input (AC-coupled internally) 19 TD1- Input Negative Differential Input (AC-coupled internally) 20 TX1_DIS Digital (Input) Ground connection Ground connection Ground connection Transmitter Disable. The laser is disabled on channel 2 if TX2_DIS = HIGH. Internal 4.7k pull-up. Ground connection Ground connection Ground connection Transmitter Disable. The laser is disabled on channel 1 if TX1_DIS = HIGH. Internal 4.7k pull-up. NOTES: 1. All VEE signals are connected together inside the module. 2. VCC_TX1 and VCC_TX2 are independent supplies. GO2922 Data Sheet 40159 - 3 6 of 28 November 2009 2.3 Host Board Power Supply Requirements The host board is required to provide a regulated and filtered power supply of 3.3V +/5% for the GO2922 via the on board SFP connector. The host board is required to filter the VCC_TX power supplies as recommended by the SFP MSA. Figure 2-3 shows the recommended board supply filtering. When the host board is loaded with a resistive load in place of the SFP module and sourcing the maximum rated current, the peak-to-peak power supply noise measured on the SFP connector should comply to Table 2-2. 1uH V CC_Tx1 0.1uF 10uF 1uH V 3.3V CC_Tx2 0.1uF GO2922 10uF 0.1uF 10uF Host Board Figure 2-3: Recommended Host Board Supply Filtering Table 2-2: Maximum Allowable Host Board Power Supply Noise at VCC_Tx1 and VCC_Tx2 Frequency (KHz) Peak-to-Peak Noise Amplitude (%) 0.02-1000 2 1000-10000 3 2.4 Optical Connector Requirements An LC connector with PC/UPC polish is required for each port. GO2922 Data Sheet 40159 - 3 7 of 28 November 2009 3. Product Specifications 3.1 Absolute Maximum Ratings Table 3-1 lists the absolute maximum ratings for the GO2922. Conditions exceeding the limits listed may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 3-1: Absolute Maximum Ratings Parameter Conditions Value/Units Supply Voltage - 4V Operating Case Temperature - -20C < TCASE < 80C Storage Temperature - -40C < TSTG < 100C ESD tolerance on all pins - 1kV HBM Relative Humidity (non-condensing) - 5% - 95% RH 3.2 Optical Performance Specifications Table 3-2 lists the optical performance specifications for the GO2922. Table 3-2: Optical Performance Specifications VCC = 3.3V 5%, TC = 0oC to 70oC. Typical values are at VCC = 3.3V, TA = 25oC unless otherwise specified. Parameter Symbol Condition Min Typ Max Units Notes Wavelength - 1280 1310 1340 nm 1 Spectral Line Width (RMS) - - - 1.5 3 nm - Average Optical Output Power Pout - -5 -2 0 dBm - ER - 7 - - dB 2 Extinction Ratio GO2922 Data Sheet 40159 - 3 8 of 28 November 2009 Table 3-2: Optical Performance Specifications (Continued) VCC = 3.3V 5%, TC = 0oC to 70oC. Typical values are at VCC = 3.3V, TA = 25oC unless otherwise specified. Parameter Optical Signal Intrinsic Jitter Symbol Condition Min Typ Max Units Notes - 2.97Gbps, 1.485Gbps, 270Mbps PRBS - 30 60 ps - 2.97Gbps - 45 70 ps - - 60 100 ps - - 110 180 ps - - 105 165 ps - - 120 180 ps - -2 - +2 dB - SMPTE 424M Pathological 1.485Gbps SMPTE 292M Pathological 270Mbps SMPTE 259M Pathological Optical Signal Rise Time tr 2.97Gbps SMPTE 424M Optical Signal Fall Time tf 2.97Gbps SMPTE 424M Laser Power Monitoring Accuracy - - NOTES 1. Measured at 25C. 2. Please refer to PCN 53757 for applicability of this specification. GO2922 Data Sheet 40159 - 3 9 of 28 November 2009 3.3 DC Electrical Specifications Table 3-3 lists the DC electrical specifications for the GO2922. Figure 3-1 shows the definition of the differential signal level. Table 3-3: DC Electrical Specifications VCC = 3.3V 5%, TC = 0oC to 70oC. Typical values are at VCC = 3.3V, TA = 25oC unless otherwise specified. Parameter Symbol Condition Min Typ Max Units Notes TCASE - 0 - 70 C 1 VCC - 3.13 3.3 3.47 V 1 - - - 670 1100 mW - Vp-pDiff - 0.4 - 2.4 Vpp 2 Digital Input Low VIL - 0 0.8 V - Digital Input High VIH - 2 Vcc V - Operating Temperature Range Power Supply Voltage Total Power Consumption Differential Input Data Amplitude NOTES 1. Outside the specified range, performance is not guaranteed. 2. Singals are AC coupled internally within the module and terminated to a 50 (single-ended) termination. VSE DATAP DATAN DATAP - DATAN V p-pDIFF = 2 x VSE 0V Figure 3-1: Definition of Differential Signal Level GO2922 Data Sheet 40159 - 3 10 of 28 November 2009 3.4 AC Electrical Specifications Table 3-4 lists the AC electrical specifications for the GO2922. Table 3-4: Timing Specifications Parameter Symbol Condition Min Max Units BR - 50 3000 Mbps Bit Rate Time to Initialize t_init From power on - 300 ms Tx_Disable Assert Time t_off Time from rising edge of Tx_Disable to when the optical output falls below 10% of nominal. - 10 s Tx_Disable Negate Time t_on Time from falling edge of Tx_Disable to when the modulated optical output rises above 90% of nominal. - 1 ms f_serial_clock - - 400 kHz Serial ID Clock Rate 3.5 Supporting Circuit Specifications 3.5.1 In-Rush Current Control Circuit Due to the hot-pluggable requirement, the GO2922 has built-in circuits to limit the in-rush current upon hot insertion. The specifications of the in-rush limiting circuits are summarized in Table 3-5. Table 3-5: In-rush Current Limiting Circuits Specifications Parameter Value Maximum in-rush current ramp rate 50mA/ms Maximum in-rush current 30mA over steady state GO2922 Data Sheet 40159 - 3 11 of 28 November 2009 4. Digital Diagnostics 4.1 I2C Bus Interface The I2C interface allows reading of diagnostic information from the module. It is comprised of I2C DATA and I2C CLK pins. All address and data bytes are transmitted through the I2C DATA pin. The I2C DATA and I2C CLK pins are open-collector and they must be pulled high (4.75k recommended) externally to the module. Data on the I2C DATA pin may only change during I2C CLK 'low' time periods. Data changes during I2C CLK 'high' periods will indicate either a START or STOP condition. Operations and conditions are described as follows: START Condition The START condition is originated by the host. A high-to-low transition of I2C DATA while I2C CLK 'high' defines a START condition that must precede any other command, see Figure 4-1. STOP Condition The STOP condition is originated by the host. A low-to-high transition of I2C DATA while I2C CLK 'high' defines a STOP condition, see Figure 4-1. START STOP I2C DATA I2C CLK Figure 4-1: I2C START and STOP Condition Acknowledge or ACK Condition The acknowledge condition occurs when the I2C DATA pin is pulled 'low' during the ninth clock pulse following an address or data byte. The module originates this condition after it has received a block or data address. The host originates this condition during a sequential address read operation. Addressing Operation The module must receive a block address following a START condition to enable a read operation. The block address is clocked into the module MSB to LSB. There are three read operations: current address read, random read, and sequential address read. Note that by the convention specified in the SFP MSA, 7-bit block addresses are left shifted by one bit when expressing them in hex. Block addresses for the different GO2922 Data Sheet 40159 - 3 12 of 28 November 2009 memory regions are specified in Section 4.2. Block addresses A0h, A2h, and B2h would therefore be transmitted defined as binary 1010000, 1011001 and 1011001 respectively. Current Address Read Operation The module has an internal register that maintains the data address used during the last read operation, incremented by one. If the most recent data address was FFh, then the register resets to 00h. Once the block address is clocked in by the host with the R/W bit set 'high', the module follows with an ACK condition, and the data byte located at the current data address is serially clocked out of the module MSB to LSB. The operation is terminated when the host does not provide an ACK condition and initiates a STOP condition. See Figure 4-2. START I2C DATA Block Address Read Data Byte STOP 7 6 5 4 3 2 1 R A 7 6 5 4 3 2 1 0 ACK Host driving data line NO ACK Module driving data line Figure 4-2: I2C Current Address Read Operation Random Address Read Operation A random read operation requires a dummy write sequence to load in the data address. Once the block and data addresses are clocked in by the host followed by an ACK condition provided by the module, the host must generate another START condition. The host now initiates a current address read operation by sending the block address with the R/W bit set 'high'. The module provides an ACK condition and serially clocks out the data byte. The operation is terminated when the host does not provide an ACK condition and initiates a STOP condition. See Figure 4-3. START I2C DATA Block Address Write START Data Address 7 6 5 4 3 2 1 W A 7 6 5 4 3 2 1 0 A Read Data Byte STOP 7 6 5 4 3 2 1 R A 7 6 5 4 3 2 1 0 ACK ACK Host driving data line Block Address ACK NO ACK Module driving data line Figure 4-3: I2C Random Access Read Operation Sequential Address Read Operation The sequential address read operation is initiated by either a current address read or random address read operation. After the host receives the first data byte, it responds with an ACK condition. As long as the module receives the ACK condition after a data byte is read, the host can clock out additional data bytes from the module. After the data address reaches FFh, it resets to 00h. The operation is terminated when the host does not provide an ACK condition and initiates a STOP condition. See Figure 4-4. GO2922 Data Sheet 40159 - 3 13 of 28 November 2009 START I2C DATA Block Address Read Data Byte (N+1) Data Byte (N) Data Byte (N+M) STOP 7 6 5 4 3 2 1 R A 7 6 5 4 3 2 1 0 A 7 6 5 4 3 2 1 0 A 7 6 5 4 3 2 1 0 ACK ACK Host driving data line ACK NO ACK Module driving data line Figure 4-4: I2C Sequential Read Access Operation 4.2 Serial Interface Memory Map Module identification and digital diagnostic monitoring information is accessible through the memory map addresses shown in this section. The items below outline the different block addresses of the module: * Block address A0h contains serial ID information of the module. * Block address A2h contains alarm flags, warning flags, thresholds and real-time digital diagnostic features set for channel 1. * Block address B2h contains alarm flags, warning flags, thresholds and real-time digital diagnostic features set for channel 2. The 16-bit digital diagnostic monitoring information is internally calibrated over Gennum's specified operating temperature and voltage. Alarm and warning threshold values are calibrated in the same manner and can be interpreted as defined below. Internally measured module temperature is represented as a 16-bit signed two's complement value in increments of 1/256 degrees Celsius, yielding a total range of -128C to +128C. To calculate the temperature, treat the two's complement value as a 16-bit unsigned integer and divide it by 256. If the result is greater or equal to 128, subtract 256 from the result. See Table 4-1 for temperature conversion examples. Table 4-1: Temperature Conversion Examples MSB (BIN) LSB (BIN) Temperature (C) 01000000 00000000 64C 01000000 00001111 64.059C 01011111 00000000 95C 11110110 00000000 -10C 11011000 00000000 -40C Internally measured module supply voltage is represented as a 16-bit unsigned integer with the voltage defined as the full 16-bit value with the LSB equal to 100V, yielding a total range of 0 to +6.55V. To calculate the supply voltage, multiply the 16-bit unsigned integer by 100V. Internally measured laser bias current is represented as a 16-bit unsigned integer with the current defined as the full 16-bit value with the LSB equal to 2A, yielding a total GO2922 Data Sheet 40159 - 3 14 of 28 November 2009 range of 0 to 131 mA. To calculate the laser bias current, multiply the 16-bit unsigned integer by 2A. Internally measured TX optical power is represented as a 16-bit unsigned integer with the power defined as the full 16-bit value with the LSB equal to 0.1 W, yielding a total range of 0 to 6.5535 mW (~ -40 to +8.2 dBm). To calculate the TX optical power, multiply the 16-bit unsigned integer by 0.1 W. Table 4-2: Modules Identification Fields Block Address: A0h Address Size Name Description and Value of the Field 0 1 Identifier Type of serial transceiver. 81h 1 1 Ext. Identifier Extended identifier of type of serial transceiver. 04h 2 1 Connector Code for connector type. 07h for LC connectors. 3 1 Standards Compliance 41h, for SMPTE259M/344M/292M/424M and SMPTE 297M. 4-10 8 Transceiver Code Code for electronic compatibility or optical compatibility. Not applicable for GO2922. 11 1 Encoding Code for serial encoding algorithm. Value: 03H for NRZ. 12 1 BR, Nominal Nominal bit rate, units of 100 MBits/sec, 1Eh for 3Gbps. 13 1 Reserved Xxh 14 1 Length(9mm) km Link length supported for standard SMF, units of km, 1Eh (30km at HD-SDI with GO2920). 15 1 Length(9mm) Link length supported for standard SMF, units of 100 m, 00h 16 1 Length (50mm) Link length supported for 50/125 mm fiber, units of 10 m. 00h 17 1 Length (62.5mm) Link length supported for 62.5/125 mm fiber, units of 10 m. 00h 18 1 Length (Copper) Link length supported for copper, units of meters. 00h 19 1 Reserved Xxh 20-35 16 Vendor name SFP with OM transceiver vendor name (ASCII). G E N N U M 20 1 G 47h 21 1 E 45h 22 1 N 4Eh GO2922 Data Sheet 40159 - 3 15 of 28 November 2009 Table 4-2: Modules Identification Fields (Continued) Block Address: A0h Address Size Name Description and Value of the Field 23 1 N 4Eh 24 1 U 55h 25 1 M 4Dh 26-35 10 - 20h for each byte 36 1 Reserved - 37-39 3 Vendor OUI SFP with OM transceiver vendor IEEE company ID. 00 00 00h 40-55 16 Vendor PN Part number provided by SFP with OM transceiver vendor. G O 2 9 2 2 - 3 1 3 1 C M Refer to PCN 53757. 40 1 G 47h 41 1 O 4Fh 42 1 2 32h 43 1 9 39h 44 1 2 32h 45 1 2 32h 46 1 - 2Dh 47 1 3 33h 48 1 1 31h 49 1 3 33h 50 1 1 31h 51 1 C 43h 52 1 M 4Dh 53-55 3 56-58 3 - Reserved 59 1 Vendor Rev Revision level for part number provided by vendor. 60 1 Wavelength 1Fh for the middle two digits of 1310. 61 1 Wavelength 1Fh for the middle two digits of 1310. 62 1 Reserved Xxh 63 1 CC_BASE Check code for Base ID Fields (The value of the lower 8 bits of the sum of the contents from address 0 to 62). GO2922 Data Sheet 40159 - 3 20h 16 of 28 November 2009 Table 4-2: Modules Identification Fields (Continued) Block Address: A0h Address Size Name Description and Value of the Field 64-65 2 Options Indicates which optional SFP with OM signals are implemented. 64 1 - Xxh 65 1 - x001100xh 66 1 BR, max Upper bit rate margin, units of %, 5h. 67 1 BR, min Lower bit rate margin, units of %, 5Fh. 68-83 16 Vendor SN Serial number provided by vendor (ASCII) 84-85 2 Year Manufacturing date code (ASCII). 86-87 2 Month Manufacturing date code (ASCII). 88-89 2 Day Manufacturing date code (ASCII). 90-91 2 Blank - 92 1 Calibration flag 20h for calibrated average output power 93 1 - E0h, Enhanced alarm/warning flags. 94 1 Reserved Xxh 95 1 CC_EXT Check code for the Extended ID Fields (The value of the lower 8 bits of the sum of the contents from address 64 to 94) 96-127 32 Reserved - Table 4-3: Alarm and Warning Thresholds Block Address: A2h for Transmit Channel 1, B2h for Transmit Channel 2 Address Size 0-1 2 Name Description and Value of the Field Temp High Alarm MSB at lower address. 78C case temp. Refer to PCN 53757. 2-3 2 Temp Low Alarm MSB at lower address. -8C case temp. Refer to PCN 53757. 4-5 6-7 2 2 Temp High Warning MSB at lower address. 73C case temp. Temp Low Warning MSB at lower address. -3C case temp. Refer to PCN 53757. Refer to PCN 53757. 8-9 2 Supply Voltage High Alarm MSB at lower address. 3.6V 10-11 2 Supply Voltage Low Alarm MSB at lower address. 3.0V GO2922 Data Sheet 40159 - 3 17 of 28 November 2009 Table 4-3: Alarm and Warning Thresholds (Continued) Block Address: A2h for Transmit Channel 1, B2h for Transmit Channel 2 Address Size Name Description and Value of the Field 12-13 2 Supply Voltage High Warning MSB at lower address. 3.47V 14-15 2 Supply Voltage Low Warning MSB at lower address. 3.14V 16-17 2 Laser Bias High Alarm MSB at lower address. 100mA. 18-19 2 Laser Bias Low Alarm MSB at lower address. 5mA. 20-21 2 Laser Bias High Warning MSB at lower address. 90mA. 22-23 2 Laser Bias Low Warning MSB at lower address. 10mA 24-25 2 Tx Power High Alarm MSB at lower address. 0dBm. 26-27 2 Tx Power Low Alarm MSB at lower address. -7dBm. Tx Power High Warning MSB at lower address. -1dBm. 28-29 2 Refer to PCN 53757. Refer to PCN 53757. 30-31 2 Tx Power Low Warning MSB at lower address. -6dBm. 32-94 64 Reserved. - 95 1 CC_EXT Byte 95 contains the low order 8 bits of the check sum of byte 0 -94 Table 4-4: Alarms and Real time Diagnostic information Block Address: A2h for Transmit Channel 1, B2h for Transmit Channel 2 Address Size 96 1 Name Description and Value of the Field Temperature MSB Internally measure module temperature (approximately equal to case temperature) Refer to PCN 53757. 97 1 Temperature LSB Internally measure module temperature (approximately equal to case temperature) Refer to PCN 53757. 98 1 VCC MSB Internally measure module supply voltage 99 1 VCC LSB Internally measure module supply voltage GO2922 Data Sheet 40159 - 3 18 of 28 November 2009 Table 4-4: Alarms and Real time Diagnostic information (Continued) Block Address: A2h for Transmit Channel 1, B2h for Transmit Channel 2 Address Size Name Description and Value of the Field 100 1 Laser Bias MSB Internally measure laser bias current. 7530h corresponds to 60mA. All other readings should be scaled linearly using this factor. 101 1 Laser Bias LSB Internally measure laser bias current. 7530h corresponds to 60mA. All other readings should be scaled linearly using this factor. 102 1 Tx Power MSB Internally measure Tx Power. 103 1 Tx Power LSB Internally measure Tx Power. 104-109 11 Reserved - 110 1 N/A Bit 7 N/A Bit 6 Reserved Bit 5 N/A Bit 4 N/A Bit 3 Tx Fault Bit 2 N/A Bit 1 Data_Ready Bit 0 Conversion Update - Temp Update Bit 7 goes to high after a temperature update VCC Update Bit 6 goes to high after a VCC update Mon1 Update Bit 5 goes to high after a Tx bias current update Mon2 Update Bit 4 goes to high after a Tx power update Mon3 Update Bit 3 goes to high after a Tx modulation current update. Reserved Bit 0 to Bit 2. 111 GO2922 Data Sheet 40159 - 3 1 19 of 28 November 2009 Table 4-4: Alarms and Real time Diagnostic information (Continued) Block Address: A2h for Transmit Channel 1, B2h for Transmit Channel 2 Address Size 112 1 113 114-115 GO2922 Data Sheet 40159 - 3 1 2 Name Description and Value of the Field Temp High Alarm Flag Bit 7, set when the internal temperature exceeds the high temp alarm threshold. Temp Low Alarm Flag Bit 6, set when the internal temperature goes below the low temp alarm threshold. Supply Voltage High Alarm Flag Bit 5, set when the internal VCC exceeds the supply voltage high alarm threshold. Supply Voltage Low Alarm Flag Bit 4, set when the internal VCC goes below the supply voltage low alarm threshold. Laser Bias High Alarm Flag Bit 3, set when the monitored laser bias current exceeds the laser bias high alarm threshold. Laser Bias Low Alarm Flag Bit 2, set when monitored laser bias current goes below the laser bias low alarm threshold. Tx Power High Alarm Flag Bit 1, set when the monitored Tx power exceeds the Tx power high alarm threshold. Tx Power Low Alarm Flag Bit 0, set when monitored Tx power current goes below the Tx power low alarm threshold. Mod Current High Alarm Flag Bit 7, set when the monitored laser modulation current exceeds the laser bias high alarm threshold. Mod Current Low Alarm Flat Bit 6, set when monitored laser bias current goes below the laser modulation low alarm threshold. Reserved Bit 0 - 5. Reserved - 20 of 28 November 2009 Table 4-4: Alarms and Real time Diagnostic information (Continued) Block Address: A2h for Transmit Channel 1, B2h for Transmit Channel 2 Address Size 116 1 117 118-127 1 10 Name Description and Value of the Field Temp High Warning Flag Bit 7, set when the internal temperature exceeds the high temp warning threshold. Temp Low Warning Flag Bit 6, set when the internal temperature goes below the low temp warning threshold. Supply Voltage High Warning Flag Bit 5, set when the internal VCC exceeds the supply voltage high warning threshold. Supply Voltage Low Warning Flag Bit 4, set when the internal VCC goes below the supply voltage low warning threshold. Laser Bias High Warning Flag Bit 3, set when the monitored laser bias current exceeds the laser bias high warning threshold. Laser Bias Low Warning Flag Bit 2, set when monitored laser bias current goes below the laser bias low warning threshold. Tx Power High Warning Flag Bit 1, set when the monitored Tx power exceeds the Tx power high warning threshold. Tx Power Low Warning Flag Bit 0, set when monitored Tx power current goes below the Tx power low warning threshold. Mod Current High Warning Flag Bit 7, set when the monitored laser modulation current exceeds the laser bias high alarm threshold. Mod Current Low Warning Flag Bit 6, set when monitored laser bias current goes below the laser modulation low alarm threshold. Reserved Bit 0 - 5 Reserved - Table 4-5: Writeable Area Block Address: B2h Address Size Name Description and Value 128-247 120 Writeable Area - 248-255 8 Reserved - GO2922 Data Sheet 40159 - 3 21 of 28 November 2009 5. Application Reference Design 5.1 Typical Application Circuit Figure 5-1 shows a typical application circuit for the GO2922. 1 VCC_3V3 VCC_3V3 2 3 4.75k 4.75k 4 5 I C CLK 2 6 I C DATA 2 7 From GS2975A Reclocker Differential TD2+ 8 TD2- 9 TX2_DIS 10 GO2922 VEE TX1_DIS NC TD1- NC TD1+ VEE VEE I C CLK 2 I2C DATA VEE TD2+ TD2TX2_DIS VCC_TX1 VCC_TX2 VEE NC NC VEE 20 TX1_Dis 19 TD1- 18 TD1+ Differential From GS2975A Reclocker 17 16 100nF 15 VCC_3V3 1uH 1uH 14 13 10uF 100nF 10uF 100nF 10uF 12 11 Figure 5-1: GO2922 Typical Application Circuit GO2922 Data Sheet 40159 - 3 22 of 28 November 2009 6. References and Relevant Standards Table 6-1: References and Relevant Standards INF-8074i Rev 1.0 SFP (Small Formfactor Pluggable) Transceiver SMPTE 259M-2008 SDTV Digital Signal/Data - Serial Digital Interface SMPTE 292M-2008 1.5 Gb/s Signal / Data Serial Interface SMPTE 297-2006 Serial Digital Fiber Transmission System for SMPTE 259M, SMPTE 344M, SMPTE 292 and SMPTE 424M Signals SMPTE 344M-2000 540 Mb/s Serial Digital Interface SMPTE 424M-2006 3 Gb/s Signal/Data Serial Interface GO2922 Data Sheet 40159 - 3 23 of 28 November 2009 7. Package Information 7.1 Package Dimensions A common mechanical outline, as shown in Figure 7-1, is used for all SFP modules. CH CH Figure 7-1: Common SFP Package Outline GO2922 Data Sheet 40159 - 3 24 of 28 November 2009 7.2 Marking Information Figure 7-2 illustrates the markings on the GO2922. Table 7-1 provides a description of the parameters in the marking diagram. GO2922-3131CM S/N ZZZZZZZZ M-PC-ABCD-1310 yyyyWww 1310 nm Class 1 21CFR1040.10 Made in Canada Figure 7-2: GO2922 Marking Diagram Table 7-1: Marking Parameter Description Parameter Description ZZZZZZZZ 8-digit serial number. yyyyWww Date code. Example: 2008W36 GO2922 Data Sheet 40159 - 3 25 of 28 November 2009 7.3 PCB Layout Recommendations Notes: 1. Datum and basic dimensions established by customer 2. Pads and vias are chassis-ground in 11 places 3. Through-holes and plating are optional Figure 7-3: Host PCB Layout - Part 1 GO2922 Data Sheet 40159 - 3 26 of 28 November 2009 Figure 7-4: Host PCB Layout - Part 2 GO2922 Data Sheet 40159 - 3 27 of 28 November 2009 DOCUMENT IDENTIFICATION CAUTION DATA SHEET ELECTROSTATIC SENSITIVE DEVICES The product is in production. Gennum reserves the right to make changes to the product at any time to improve reliability, function or design, in order to provide the best product possible. DO NOT OPEN PACKAGES OR HANDLE EXCEPT AT A STATIC-FREE WORKSTATION GENNUM CORPORATE HEADQUARTERS Phone: +1 (905) 632-2996 Fax: +1 (905) 632-2055 4281 Harvester Road, Burlington, Ontario L7L 5M4 Canada E-mail: corporate@gennum.com www.gennum.com OTTAWA SNOWBUSH IP - A DIVISION OF GENNUM GERMANY 232 Herzberg Road, Suite 101 Kanata, Ontario K2K 2A1 Canada 439 University Ave. Suite 1700 Toronto, Ontario M5G 1Y8 Canada Hainbuchenstrae 2 80935 Muenchen (Munich), Germany Phone: +1 (613) 270-0458 Phone: +1 (416) 925-5643 Fax: +49-89-35804653 Fax: +1 (613) 270-0429 Fax: +1 (416) 925-0581 E-mail: gennum-germany@gennum.com CALGARY E-mail: sales@snowbush.com 3553 - 31st St. N.W., Suite 210 Calgary, Alberta T2L 2K7 Canada Web Site: http://www.snowbush.com Phone: +1 (403) 284-2672 UNITED KINGDOM North Building, Walden Court Parsonage Lane, Bishop's Stortford Hertfordshire, CM23 5DB United Kingdom MEXICO 288-A Paseo de Maravillas Jesus Ma., Aguascalientes Mexico 20900 Phone: +49-89-35831696 NORTH AMERICA WESTERN REGION 691 South Milpitas Blvd., Suite #200 Milpitas, CA 95035 United States Phone: +1 (408) 934-1301 Fax: +1 (408) 934-1029 Phone: +1 (416) 848-0328 E-mail: naw_sales@gennum.com JAPAN KK NORTH AMERICA EASTERN REGION Fax: +44 1279 714171 Shinjuku Green Tower Building 27F 6-14-1, Nishi Shinjuku Shinjuku-ku, Tokyo, 160-0023 Japan INDIA Phone: +81 (03) 3349-5501 #208(A), Nirmala Plaza, Airport Road, Forest Park Square Bhubaneswar 751009 India Fax: +81 (03) 3349-5505 Web Site: http://www.gennum.co.jp KOREA Phone: +91 (674) 653-4815 TAIWAN Fax: +91 (674) 259-5733 6F-4, No.51, Sec.2, Keelung Rd. Sinyi District, Taipei City 11502 Taiwan R.O.C. 8F Jinnex Lakeview Bldg. 65-2, Bangidong, Songpagu Seoul, Korea 138-828 Phone: +44 1279 714170 E-mail: gennum-japan@gennum.com Phone: (886) 2-8732-8879 Fax: (886) 2-8732-8870 4281 Harvester Road Burlington, Ontario L7L 5M4 Canada Phone: +1 (905) 632-2996 Fax: +1 (905) 632-2055 E-mail: nae_sales@gennum.com Phone: +82-2-414-2991 Fax: +82-2-414-2998 E-mail: gennum-korea@gennum.com E-mail: gennum-taiwan@gennum.com Gennum Corporation assumes no liability for any errors or omissions in this document, or for the use of the circuits or devices described herein. The sale of the circuit or device described herein does not imply any patent license, and Gennum makes no representation that the circuit or device is free from patent infringement. All other trademarks mentioned are the properties of their respective owners. GENNUM and the Gennum logo are registered trademarks of Gennum Corporation. (c) Copyright 2009 Gennum Corporation. All rights reserved. www.gennum.com GO2922 1310nm Dual Channel Optical Transmitter Data Sheet 40159 - 3 November 2009 28 of 28 28