MP3V5004G
Rev 2, 06/2010
Freescale Semiconductor
© Freescale Semiconductor, Inc., 2008, 2010 . All rights reserved.
Pressure
Integrated Silicon Pressure Sensor,
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MP3V5004G series piezoresistive tra nsducer is a state-of-the-art
monolithic silicon pressure sensor desi gned for a wide range of
applications, but particularly those employi ng a microcontroller or
microprocessor with A/D inputs. This sensor combines a highly sensitive
implanted strain gauge with advanced micromachining techniques, thin-film
metallization, and bipolar processing to provide an accurate, high level
analog output signal that is proportional to the applied pressure.
Features
• Temperature Compensated from 10°C to 60°C
• Available in Gauge Surface Mount (SMT) Configuration
• Durable Thermoplastic (PPS) Package
ORDERING INFORMATION
Device Name Package
Options Case
No. # of Ports Pressure Type Device Marking
None Single Dual Gauge Differential Absolute
Small Outline Package (MP3V5004 Series)
MP3V5004GC6U Rail 482A • • MP3V5004G
MP3V5004GC6T1 Tape & Reel 482A • • MP3V5004G
MP3V5004DP Trays 1351 • • MP3V5004DP
MP3V5004GVP Trays 1368 • • MP3V5004GV
MP3V5004GP Trays 1369 • • MP3V5004GP
MP3V5004G
0 to 3.92 kPa (0 to 400 mm H2O)
0.6 to 3.0 V Output
Series
MP3V5004GVP
CASE 1368 MP3V5004GP
CASE 1369
MP3V5004GC6U/6T1
CASE 482A MP3V5004DP
CASE 1351
SMALL OUTLINE PACKAGES
Typical Applications
• Washing Machine Water Level
• Ideally Suited for Microprocessor or
Microcontroller-Based Systems
MP3V5004G
Sensors
2Freescale Semiconductor
Pressure
Operating Characteristics
Table 1. Operating Characte ristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2.
Characteristic Symbol Min Typ Max Unit
Pressure Range POP 0—3.92
400 kPa
mm H2O
Supply Voltage(1)
1. Device is ratiometric within this specified excitation range.
VS2.7 3.0 3.3 VDC
Supply Current IS— — 10 mAdc
Span at 306 mm H2O (3 kPa)(2)
2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated
pressure.
VFSS —1.8 — V
Offset(3) (4)
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure, at 25°C.
Offset Stability: Output deviation, after 1000 temperature cycles, -30° to 100°C, and 1.5 million pressure cycles, with minimum
rated pressure applied.
TcSpan: Output deviation over the temperature range of 10° to 60°C, relative to 25°C.
TcOffset: Output deviation with m inimum ra ted pressur e applie d, over the temperatu re range of 10
°
to 60
°
C, relative to 25
°
C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
VOFF 0.45 0.6 0.75 V
Sensitivity V/P —0.6
5.9 —V/kPa
mV/mm H2O
Accuracy(4) (5) 0 to 100 mm H2O (10 to 60°C)
100 to 400 mm H2O (10 to 60°C)
5. Auto-Zero at Factory Installation: Due to the sensitivity of the MP3V5004G, external mechanical stresses and mounting position can affect
the zero pressure output reading. Auto-zeroing is defined as storing the zero pressure output reading and subtracting this from the device's
output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temper ature
change of ±5°C between auto-zero and measurement.
—
——
——
—±1.5
±2.5 %VFSS
%VFSS
MP3V5004G
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Freescale Semiconductor 3
Pressure
Maximum Ratings
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
Figure 1. Fu lly Inte g rat ed Pres s ure Sensor Schematic
Table 2. Maximum Ratings(1)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating Symbol Value Units
Maximum Pressure (P1 > P2) PMAX 16 kPa
Storage Temperature TSTG –30 to +100 °C
Operating Temperature TA0 to +85 °C
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
Sensing
Element VOUT
VS
Gain Stage #2
GND
and Ground
Reference
Shift
Circuitry
Thin Film
Temperature
Compensation
and
Gain Stage #1
4
2
3
MP3V5004G
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4Freescale Semiconductor
Pressure
On-chip Temperature Compensation and Calibration
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the gauge con fig uration in the basic
chip carrier (Case 482A). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the silicon diaphragm.
The MP3V5004G series sensor operating characteristics
are based on the use of dry air as pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Internal reliability and
qualification test for dry air , and other media, are available
from the factory . Contact the factory for information regarding
media tolerance in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the MP3 V 5004G to the A/D input of
the microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to
pressure input. T ypical, minimum and maximum output
curves are shown for operation over a temperature range of
10°C to 60°C using the decoupling circuit shown in Figure 3
The output will saturate outside of the specified pressure
range.
Figure 2. Cross Sectional Diagram SSOP (not to sca le) Figure 3. Rec ommend ed Po wer Supp ly De coup ling and
Output Filtering.
(For additional output filte r ing, please refer to Application
Note AN1646.)
Figure 4. Output vs. Pressure Differential at ±2.5% VFSS
(See Note 5 in Operating Char acteristics tab l e)
+3 V
1.0 μF0.01 μF470 pFGND
Vs
Vout
IPS
OUTPUT
Fluorosilicone
Gel Die Coat
Differential Sensing
Element
Stainless
Steel Cap
P1
P2
Die Bond
Die
Thermoplas-
tic
Lead
Frame
Wire
Bond
3.0
1.0
2.0
0.6
Max Min
Typical
Output (V)
2 kPa
200 mm H2O4 kPa
400 mm H2O
TRANSFER FUNCTION:
Vout = VS*[(0.2*P) + 0.2] ± 2.5% VFSS
VS = 3.0 V ± 0.30 Vdc
TEMP = 10 to 60°C
MP3V5004G
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Freescale Semiconductor 5
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale Semiconductor designates the two sides of the
pressure sensor as the Pressure (P1) side and the Vacuum
(P2) side. The Pressure (P1) side is the side containing
silicone gel which isolates the die from the environment. The
Freescale Semiconductor pressure sensor is designed to
operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below.
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridgi ng and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
Figure 5. SOP Footprint
Part Number Case Type Pressure (P1) Side Identifier
MP3V5004GC6U/T1 482A Side with Port Attached
MP3V5004GP 1369 Side with Port Attached
MP3V5004DP 1351 Side with Part Marking
MP3V5004GVP 1368 Stainless Steel Cap
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm SCALE 2:1
MP3V5004G
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6Freescale Semiconductor
Pressure PACKAGE DIMENSIONS
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A10.540.4250.415 10.79
B10.540.4250.415 10.79
C12.700.5200.500 13.21
D0.960.0420.038 1.07
G0.100 BSC 2.54 BSC
H0.002 0.010 0.05 0.25
J0.009 0.011 0.23 0.28
K0.061 0.071 1.55 1.80
M0 7 0 7
N0.444 0.448 11.28 11.38
S0.709 0.725 18.01 18.41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
S
D
G
8 PL
4
5
8
1
S
B
M
0.25 (0.010) A S
T
–A–
–B–
C
M
J
K
PIN 1 IDENTIFIER
H
SEATING
PLANE
–T–
N
V
W
V0.245 0.255 6.22 6.48
W0.115 0.125 2.92 3.17
MP3V5004G
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Pressure
PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MP3V5004G
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Pressure PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MP3V5004G
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Pressure
PACKAGE DIMENSIONS
CASE 1368-01
ISSUE C
SMALL OUTLINE PACKAGE
MP3V5004G
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Pressure PACKAGE DIMENSIONS
CASE 1368-01
ISSUE C
SMALL OUTLINE PACKAGE
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Pressure
PACKAGE DIMENSIONS
CASE 1368-01
ISSUE C
SMALL OUTLINE PACKAGE
MP3V5004G
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Pressure PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MP3V5004G
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Pressure
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MP3V5004G
Rev. 2
06/2010
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