Copyright ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
APA4558
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Dual Operational Amplifier
Applications
General Description
Ordering and Marking Information
•Power Supply Range:
- Signal Supply : 3V to 20V
- Dual Supply : ± 1.5V to ± 10V
•Large DC Voltage Gain : 100dB
•Large Output Swing : 0V ~ VDD- 1.5V
•Bandwidth(Unity Gain) : 2MHz
•Internally Frequency Compensated for Unity
Gain
•Low Input Offset Voltage : 1mV
•Lead Free and Green Devices Available
(RoHS Compliant)
•Amplifiers
•Filters
•Analog Circuit
The APA4558 consists of two independent, high gain,
internally frequency compensated operational amplifiers
which were designed specifically to operate from a single
power supply up to 20 volts. Operation from dual power
supplies is also possible and the power supply current
drain is essentially independent of the magnitude of the
power supply voltage.
Application areas include transducer amplifiers, DC gain
blocks, and all the conventional OP amplifier circuits which
can be more easily implemented in single power supply
systems. (For example, the APA4558 can be directly
operated from the standard +5V power supply voltage
which is normally used in digital systems).
Features
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish;
which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-
020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and
halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed
1500ppm by weight).
APA4558 Package Code
K : SOP - 8
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device G : Halogen and Lead Free Device
Handling Code
Temperature Range
Package Code
APA4558 K : APA4558
XXXXX XXXXX - Date Code
Assembly Material
Copyright ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
APA4558
www.anpec.com.tw2
Symbol
Parameter Rating Unit
VDD Supply Voltage 20 V
VID Differential Input Voltage 20 V
VI Input Voltage -0.3V to +20V V
PD Power Dissipation 500 mW
TA Operating Free-Air Temperature Range 0 to 70 οC
TSTG Storage Temperature Range -40 to +150 οC
Absolute Maximum Ratings (TA = 25°C)
Electrical Characteristics (VDD = ±10V, TA= 25°C)
APA4558
Symbol
Parameter Test Conditions Min. Typ. Max. Unit
V IO Input Offset Voltage RS ≤ 10kΩ - 1 6 mV
IIO Input Offset Current - 5 200 nA
IBIAS Input Bias Current - 25 500 nA
RIN Input Resistance 0.3 5 - MΩ
AV Large Signal Voltage Gain RL≥2kΩ, VO=±10V 86 100 - dB
VOM1 Maximum Output Voltage Swing 1 RL≥10kΩ ± 9 ± 9.5 - V
VOM2 Maximum Output Voltage Swing 2 RL≥ 2kΩ ± 8.5 ± 9.0 - V
VICM Input Common-Mode Voltage Range
±9 ± 9.5 - V
CMRR Common-Mode Rejection Ratio RS ≤ 10kΩ - 90 - dB
SVRR Supply Voltage Rejection Ratio RS ≤ 10kΩ, VP-P=100mV,
fin=100HZ 60 65 - dB
ICC Operating Current - 3.7 6 mA
VNI Equivalent Input Noise Voltage RIAA, RS =1kΩ ,30kHz, LPF - 1.4 - µVrms
SR Slew Rate - 650 - mV/µs
GBWP Gain Bandwidth Product - 2 - MHz
Copyright ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
APA4558
www.anpec.com.tw3
Typical Operating Characteristics
Open Loop Voltage Gain vs. Frequency
Frequency (Hz)
Open Loop Voltage Gain (dB)
Frequency (Hz)
Maximum Output Voltage Swing vs. Load
Resistance
Maximum Output Voltage Swing (V)
Operating Current vs. Temperature
Temperature (°C)
Operating Current (mA)
Maximum Output Voltage Swing vs. Frequency
Maximum Output Voltage Swing (V)
Load Resistance (kΩ)
Maximum Output Voltage Swing vs.
Temperature
Temperature (°C)
Maximum Output Voltage Swing (V)
Input Offset Voltage vs. Temperature
Input Offset Voltage (mV)
Temperature (°C)
0
120
20
40
60
80
100
10 5M100 1k 10k 100k 1M
TA= 25oC
VDD= ±0V
RL=2kΩ
1 10 100 1k 10k 100k 1M
0
2
4
6
8
10
12
14
16
18
20
TA= 25oC
VDD= ±10V
RL=2kΩ
10
12
14
16
18
20
0.1 1102
0.2 0.5 5
TA= 25oC
VDD=±10V
-50 -25 0 25 50 75 100
-15
-10
-5
0
5
10
15
VDD=±10V
RL=10kΩ
2
-50 -25 0 25 50 75 100
-2
-1.5
-1
-0.5
0
0.5
1
1.5 VDD=±10V
-50 -25 0 25 50 75 100
0
1
2
3
4
5
6
7
8
9
10
VDD=±10V
Copyright ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
APA4558
www.anpec.com.tw4
Input Bias Current vs. Temperature
Temperature (°C)
Input Bias Current (nA)
Operating Voltage (V)
Maximum Output Voltage Swing (V)
Maximum Output Voltage Swing vs.
Operating Voltage
Typical Operating Characteristics (Cont.)
Operating Voltage (V)
Operating Current (mA)
Operating Current vs. Operating VoltageVoltage Follower Pulse Response
Time (µs)
Input Voltage - V Output Voltage (V)
-50 -25 025 50 75 100
0
10
20
30
40
50
60
70
80
90
100 VDD=±10V
-10
-8
-6
-4
-2
0
2
4
6
8
10
±2±3±4±5±6±7±8±9±10
TA= 25oC
RL=2kΩ
0
1
2
3
4
5
6
7
8
9
10
±2±3±4±5±6±7±8±9±10±10
TA= 25oC
2.5
5
7.5
0
2.5
5
7.5
0
0 20 40 60 80 100
Block Diagram
Output B
Inverting Input B
1
2
3
45
6
7
8
Output A
Inverting Input A
Non-inverting Input B
VDD+
VDD-
B-+
A
-+
Non-inverting Input A
Copyright ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
APA4558
www.anpec.com.tw5
Package Information
SOP-8
S
Y
M
B
O
LMIN. MAX.
1.75
0.10
0.17 0.25
0.25
A
A1
c
D
E
E1
e
h
L
MILLIMETERS
b0.31 0.51
SOP-8
0.25 0.50
0.40 1.27
MIN. MAX.
INCHES
0.069
0.004
0.012 0.020
0.007 0.010
0.010 0.020
0.016 0.050
0
0.010
1.27 BSC 0.050 BSC
A2 1.25 0.049
0
°
8
°
0
°
8
°
D
e
E
E1
SEE VIEW A
cb
h X 45
°
A
A1A2
L
VIEW A
0.25
SEATING PLANE
GAUGE PLANE
Note: 1. Follow JEDEC MS-012 AA.
2. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.
3. Dimension “E” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
3.80
5.80
4.80
4.00
6.20
5.00 0.189 0.197
0.228 0.244
0.150 0.157
Copyright ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
APA4558
www.anpec.com.tw6
Application
A H T1 C d D W E1 F
330.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
SOP-8
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.40±0.20
5.20±0.20
2.10±0.20
(mm)
Carrier Tape & Reel Dimensions
Package Type Unit Quantity
SOP-8 Tape & Reel 2500
Devices Per Unit
A
E1
A
B
W
F
T
P0
OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
H
T1
A
d
Copyright ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
APA4558
www.anpec.com.tw7
Test item Method Description
SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec
HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C
PCT JESD-22-B,A102 168 Hrs, 100%RH, 121°C
TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V
Latch-Up JESD 78 10ms, 1tr > 100mA
Reflow Condition (IR/Convection or VPR Reflow)
t 25 C to Peak
tp
Ramp-up
tL
Ramp-down
ts
Preheat
Tsmax
Tsmin
TL
TP
25
Temperature
Time
Critical Zone
TL to TP
°
Reliability Test Program
Taping Direction Information
SOP-8
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
APA4558
www.anpec.com.tw8
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate
(TL to TP) 3°C/second max. 3°C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL) 183°C
60-150 seconds 217°C
60-150 seconds
Peak/Classification Temperature (Tp)
See table 1 See table 2
Time within 5°C of actual
Peak Temperature (tp) 10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated
classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL
level.
Customer Service
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350
<2.5 mm 240 +0/-5°C 225 +0/-5°C
≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Classification Reflow Profiles
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
