LME49811 LME49811 Audio Power Amplifier Series High Fidelity 200 Volt Power Amplifier Input Stage with Shutdown Literature Number: SNAS394B November 11, 2009 High Fidelity 200 Volt Power Amplifier Input Stage with Shutdown General Description Key Specifications The LME49811 is a high fidelity audio power amplifier input stage designed for demanding consumer and pro-audio applications. Amplifier output power may be scaled by changing the supply voltage and number of output devices. The LME49811 is capable of driving an output stage to deliver in excess of 500 watts single-ended into an 8 ohm load in the presence of 10% high line headroom and 20% supply regulation. The LME49811 includes thermal shut down circuitry that activates when the die temperature exceeds 150C. The LME49811's shutdown function when activated, forces the LME49811 into shutdown state. Wide operating voltage range 20V to 100V PSRR (f = DC) THD+N (f = 1kHz) 115dB (typ) 0.00035% (typ) Output Drive Current 9mA Features Very high voltage operation Scalable output power Minimum external components External compensation Thermal Shutdown Applications Powered subwoofers Pro audio Powered studio monitors Audio video receivers Guitar Amplifiers High voltage industrial applications Typical Application 30004862 FIGURE 1. Typical Audio Amplifier Application Circuit Overture(R) is a registered trademark of National Semiconductor Corporation. (c) 2009 National Semiconductor Corporation 300048 www.national.com LME49811 High Fidelity 200 Volt Power Amplifier Input Stage with Shutdown LME49811 Audio Power Amplifier Series LME49811 30004862 Typical Audio Amplifier Application Circuit www.national.com 2 LME49811 Connection Diagram 30004860 Top View See Order Number LME49811TB NS = National Logo U = Fabrication plant code Z = Assembly plant code XY = 2 Digit date code TT = Die traceability TB = Package code Pin Descriptions Pin Pin Name 1 NC No Connect, Pin electrically isolated Description 2 SD Shutdown Control 3 GND 4 IN+ Non-Inverting Input 5 IN- Inverting Input 6 Comp External Compensation Connection 7 NC No Connect, Pin electrically isolated 8 NC No Connect, Pin electrically isolated Device Ground 9 NC No Connect, Pin electrically isolated 10 -VEE Negative Power Supply 11 NC No Connect, Pin electrically isolated 12 NC No Connect, Pin electrically isolated 13 Sink Output Sink 14 Source 15 +VCC Output Source Positive Power Supply 3 www.national.com LME49811 Absolute Maximum Ratings (Note 1) Operating Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage |V+| + |V-| Differential Input Voltage Common Mode Input Range Power Dissipation (Note 3) ESD Rating(Note 4) ESD Rating (Note 5) Junction Temperature (TJMAX) (Note 8) Soldering Information T Package (10 seconds) Storage Temperature Thermal Resistance (Note 1, Note 2) Temperature Range TMIN TA TMAX Supply Voltage |V+| + |V-| -40C TA +85C +/-20V VTOTAL +/-100V 200V +/-6V 0.4 VEE to 0.4 VCC 4W 2kV 200V 150C 260C -40C to +150C JA 73C/W JC 4C/W Electrical Characteristics +VCC = -VEE = 50V (Note 1, Note 2) The following specifications apply for ISD = 1.5mA, Figure 1, unless otherwise specified. Limits apply for TA = 25C, CC = 30pF. Symbol Parameter Conditions LME49811 Typical (Note 6) Limit (Note 7) Units (Limits) ICC Total Quiescent Power Supply Current VCM = 0V, VO = 0V, IO = 0A 14 17 mA (max) IEE Total Quiescent Power Supply Current VCM = 0V, VO = 0V, IO = 0A 16 19 mA (max) THD+N Total Harmonic Distortion + Noise No load, AV = 29dB VOUT = 20VRMS, f = 1kHz 0.00055 0.0015 % (max) AV Closed Loop Voltage Gain 26 dB (min) VIN = 1mVRMS, f = 1kHz 93 f = DC 120 dB THD+N = 0.05%, Freq = 20Hz to 20kHz 33 VRMS LPF = 30kHz, Av = 29dB 100 A-weighted 70 180 V (max) Outputs Shorted 8 6.5 mA(min) mA(min) mA (max) AV Open Loop Gain VOM Output Voltage Swing VNOISE Output Noise IOUT Output Current dB V ISD Current into Shutdown Pin To put part in "play" mode 1.5 1 2 SR Slew Rate VIN = 1.2VP-P, f = 10kHz square Wave, Outputs shorted 16 13 V/s (min) VOS Input Offset Voltage VCM = 0V, IO = 0mA 1 3 mV (max) IB Input Bias Current VCM = 0V, IO = 0mA 100 PSRR Power Supply Rejection Ratio DC, Input Referred 115 www.national.com 4 nA 105 dB (min) (Note 1, Note 2) The following specifications apply for ISD = 1.5mA, Figure 1, unless otherwise specified. Limits apply for TA = 25C. Symbol Parameter Conditions LME49811 Typical (Note 6) Limit (Note 7) Units (Limits) ICC Total Quiescent Power Supply Current VCM = 0V, VO = 0V, IO = 0A 17 22 mA (max) IEE Total Quiescent Power Supply Current VCM = 0V, VO = 0V, IO = 0A 19 24 mA (max) THD+N Total Harmonic Distortion + Noise No load, AV = 30dB VOUT = 30VRMS, f = 1kHz 0.00035 0.001 % (max) AV Closed Loop Voltage Gain 26 dB (min) VIN = 1mVRMS, f = 1kHz 93 f = DC 120 dB THD+N = 0.05%, Freq = 20Hz to 20kHz 68 VRMS LPF = 30kHz, Av = 29dB 100 A-weighted 70 180 V (max) Outputs Shorted 9 7 mA(min) mA(min) mA (max) AV Open Loop Gain VOM Output Voltage Swing VNOISE Output Noise IOUT Output Current dB V ISD Current into Shutdown Pin To put part in "play" mode 1.5 1 2 SR Slew Rate VIN = 1.2VP-P, f = 10kHz square Wave, Outputs shorted 17 14 V/s (min) VOS Input Offset Voltage VCM = 0V, IO = 0mA 1 3 mV (max) IB Input Bias Current VCM = 0V, IO = 0mA 100 PSRR Power Supply Rejection Ratio f = DC, Input Referred 115 nA (max) 105 dB (min) Note 1: "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified Note 2: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed. Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, JA, and the ambient temperature, TA. The maximum allowable power dissipation is PDMAX = (TJMAX - TA) / JA or the number given in Absolute Maximum Ratings, whichever is lower. Note 4: Human body model, applicable std. JESD22-A114C. Note 5: Machine model, applicable std. JESD22-A115-A. Note 6: Typical values represent most likely parametric norms at TA = +25C, and at the Recommended Operation Conditions at the time of product characterization and are not guaranteed. Note 7: Datasheet min/max specification limits are guaranteed by test or statistical analysis. Note 8: The maximum operating junction temperature is 150C. Note 9: The Data taken with Bandwidth = 30kHz, AV = 29dB, CC = 30pF, and TA = 25C except where specified. 5 www.national.com LME49811 Electrical Characteristics +VCC = -VEE = 100V LME49811 Typical Performance Characteristics for LME49811 (Note 9) THD+N vs Frequency +VCC = -VEE = 100V, VO = 14V THD+N vs Frequency +VCC = -VEE = 100V, VO = 30V 30004873 30004874 THD+N vs Frequency +VCC = -VEE = 50V, VO = 10V THD+N vs Frequency +VCC = -VEE = 50V, VO = 20V 30004871 30004872 THD+N vs Frequency +VCC = -VEE = 20V, VO = 5V THD+N vs Frequency +VCC = -VEE = 20V, VO = 10V 30004869 www.national.com 30004870 6 LME49811 THD+N vs Output Voltage +VCC = -VEE = 50V, f = 20Hz THD+N vs Output Voltage +VCC = -VEE = 100V, f = 20Hz 30004879 30004882 THD+N vs Output Voltage +VCC = -VEE = 50V, f = 1kHz THD+N vs Output Voltage +VCC = -VEE = 100V, f = 1kHz 30004881 30004878 THD+N vs Output Voltage +VCC = -VEE = 50V, f = 20kHz THD+N vs Output Voltage +VCC = -VEE = 100V, f = 20kHz 30004880 30004883 7 www.national.com LME49811 THD+N vs Output Voltage +VCC = -VEE = 20V, f = 20kHz THD+N vs Output Voltage +VCC = -VEE = 20V, f = 1kHz 30004876 30004875 THD+N vs Output Voltage +VCC = -VEE = 20V, f = 20kHz Closed Loop Frequency Response +VCC = -VEE = 50V, VIN = 1VRMS 30004863 30004877 Closed Loop Frequency Response +VCC = -VEE = 100V, VIN = 1VRMS Output Voltage vs Supply Voltage 300048a0 30004864 www.national.com 8 PSRR vs Frequency +VCC = -VEE = 50V, No Filters Input Referred, VRIPPLE = 1VRMS on VCC pin 30004845 30004844 PSRR vs Frequency +VCC = -VEE = 100V, No Filters Input Referred, VRIPPLE = 1VRMS on VEE pin PSRR vs Frequency +VCC = -VEE = 50V, No Filters Input Referred, VRIPPLE = 1VRMS on VEE pin 30004866 30004868 Supply Current vs Supply Voltage Open Loop and Phase Upper-Phase Lower Gain 300048a1 30004837 9 www.national.com LME49811 PSRR vs Frequency +VCC = -VEE = 100V, No Filters Input Referred, VRIPPLE = 1VRMS on VCC pin LME49811 Test Circuit 30004861 FIGURE 3. Test Circuit www.national.com 10 thermal compound, the thermal resistance, CS (case to sink), is about 0.2C/W. Since convection heat flow (power dissipation) is analogous to current flow, thermal resistance is analogous to electrical resistance, and temperature drops are analogous to voltage drops, the power dissipation out of the LME49811 is equal to the following: SHUTDOWN FUNCTION The shutdown function of the LME49811 is controlled by the amount of current that flows into the shutdown pin. If there is less than 1mA of current flowing into the shutdown pin, the part will be in shutdown. This can be achieved by shorting the shutdown pin to ground or by floating the shutdown pin. If there is between 1mA and 2mA of current flowing into the shutdown pin, the part will be in "play" mode. This can be done by connecting a reference voltage to the shutdown pin through a resistor (RM). The current into the shutdown pin can be determined by the equation ISD = (VREF - 2.9) / RM. For example, if a 5V power supply is connected through a 1.4k resistor to the shutdown pin, then the shutdown current will be 1.5mA, at the center of the specified range. It is also possible to use VCC as the power supply for the shutdown pin, though RM will have to be recalculated accordingly. It is not recommended to flow more than 2mA of current into the shutdown pin because damage to the LME49811 may occur. It is highly recommended to switch between shutdown and "play" modes rapidly. This is accomplished most easily through using a toggle switch that alternatively connects the shutdown pin through a resistor to either ground or the shutdown pin power supply. Slowly increasing the shutdown current may result in undesired voltages on the outputs of the LME49811, which can damage an attached speaker. PDMAX = (TJMAX-TAMB) / JA (1) where TJMAX = 150C, TAMB is the system ambient temperature and JA = JC + CS + SA. 30004855 Once the maximum package power dissipation has been calculated using equation 1, the maximum thermal resistance, SA, (heat sink to ambient) in C/W for a heat sink can be calculated. This calculation is made using equation 2 which is derived by solving for SA in equation 1. SA = [(TJMAX-TAMB)-PDMAX(JC +CS)] / PDMAX THERMAL PROTECTION The LME49811 has a thermal protection scheme to prevent long-term thermal stress of the device. When the temperature on the die exceeds 150C, the LME49811 shuts down. It starts operating again when the die temperature drops to about 145C, but if the temperature again begins to rise, shutdown will occur again above 150C. Therefore, the device is allowed to heat up to a relatively high temperature if the fault condition is temporary, but a sustained fault will cause the device to cycle in a Schmitt Trigger fashion between the thermal shutdown temperature limits of 150C and 145C. This greatly reduces the stress imposed on the IC by thermal cycling, which in turn improves its reliability under sustained fault conditions. Since the die temperature is directly dependent upon the heat sink used, the heat sink should be chosen so that thermal shutdown is not activated during normal operation. Using the best heat sink possible within the cost and space constraints of the system will improve the long-term reliability of any power semiconductor device, as discussed in the Determining the Correct Heat Sink section. (2) Again it must be noted that the value of SA is dependent upon the system designer's amplifier requirements. If the ambient temperature that the audio amplifier is to be working under is higher than 25C, then the thermal resistance for the heat sink, given all other things are equal, will need to be smaller. PROPER SELECTION OF EXTERNAL COMPONENTS Proper selection of external components is required to meet the design targets of an application. The choice of external component values that will affect gain and low frequency response are discussed below. The gain of each amplifier is set by resistors RF and Ri for the non-inverting configuration shown in Figure 1. The gain is found by Equation 3 below: AV = RF / Ri (V/V) (3) For best noise performance, lower values of resistors are used. A value of 1k is commonly used for Ri and then setting the value of RF for the desired gain. For the LME49811 the gain should be set no lower than 26dB. Gain settings below 26dB may experience instability. The combination of Ri with Ci (see Figure 1) creates a high pass filter. The low frequency response is determined by these two components. The -3dB point can be found from Equation 4 shown below: POWER DISSIPATION AND HEAT SINKING When in "play" mode, the LME49811 draws a constant amount of current, regardless of the input signal amplitude. Consequently, the power dissipation is constant for a given supply voltage and can be computed with the equation PDMAX = ICC* (VCC- VEE). fi = 1 / (2RiCi) (Hz) DETERMINING THE CORRECT HEAT SINK The choice of a heat sink for a high-power audio amplifier is made entirely to keep the die temperature at a level such that the thermal protection circuitry is not activated under normal circumstances. The thermal resistance from the die to the outside air, JA (junction to ambient), is a combination of three thermal resistances, JC (junction to case), CS (case to sink), and SA (sink to ambient). The thermal resistance, JC (junction to case), of the LME49811 is 0.4 C/W. Using Thermalloy Thermacote (4) If an input coupling capacitor is used to block DC from the inputs as shown in Figure 5, there will be another high pass filter created with the combination of CIN and RIN. When using a input coupling capacitor RIN is needed to set the DC bias point on the amplifier's input terminal. The resulting -3dB frequency response due to the combination of CIN and RIN can be found from Equation 5 shown below: fIN = 1 / (2RINCIN) (Hz) 11 (5) www.national.com LME49811 Application Information LME49811 With large values of RIN oscillations may be observed on the outputs when the inputs are left floating. Decreasing the value of RIN or not letting the inputs float will remove the oscillations. If the value of RIN is decreased then the value of CIN will need to increase in order to maintain the same -3dB frequency response. signed output stage, combine with a VBE multiplier, can eliminate the trim pot and virtually eliminate crossover distortion. The VCE voltage of QMULT (also called BIAS of the output stage) can be set by following formula: VBIAS = VBE(1+RB2/RB1) COMPENSATION CAPACITOR The compensation capacitor (CC) is one of the most critical external components in value, placement and type. The capacitor should be placed close to the LME49811 and a silver mica type will give good performance. The value of the capacitor will affect slew rate and stability. The highest slew rate is possible while also maintaining stability through out the power and frequency range of operation results in the best audio performance. The value shown in Figure 1 should be considered a starting value with optimization done on the bench and in listening testing. (6) When using a bipolar output stage with the LME49811 (as in Figure 1), the designer must beware of thermal runaway. Thermal runaway is a result of the temperature dependence of VBE (an inherent property of the transistor). As temperature increases, VBE decreases. In practice, current flowing through a bipolar transistor heats up the transistor, which lowers the VBE. This in turn increases the current gain, and the cycle repeats. If the system is not designed properly this positive feedback mechanism can destroy the bipolar transistors used in the output stage. One of the recommended methods of preventing thermal runaway is to use the same heat sink on the bipolar output stage transistor together with VBE multiplier transistor. When the VBE multiplier transistor is mounted to the same heat sink as the bipolar output stage transistors, it temperature will track that of the output transistors. Its VBE is dependent upon temperature as well, and so it will draw more current as the output transistors heat up, reducing the bias voltage to compensate. This will limit the base current into the output transistors, which counteracts thermal runaway. Another widely popular method of preventing thermal runaway is to use low value emitter degeneration resistors (RE1 and RE2). As current increases, the voltage at the emitter also increases, which decreases the voltage across the base and emitter. This mechanism helps to limit the current and counteracts thermal runaway. SUPPLY BYPASSING The LME49811 has excellent power supply rejection and does not require a regulated supply. However, to eliminate possible oscillations all op amps and power op amps should have their supply leads bypassed with low-inductance capacitors having short leads and located close to the package terminals. Inadequate power supply bypassing will manifest itself by a low frequency oscillation known as "motorboating" or by high frequency instabilities. These instabilities can be eliminated through multiple bypassing utilizing a large electrolytic capacitor (10F or larger) which is used to absorb low frequency variations and a small ceramic capacitor (0.1F) to prevent any high frequency feedback through the power supply lines. If adequate bypassing is not provided the current in the supply leads which is a rectified component of the load current may be fed back into internal circuitry. This signal causes low distortion at high frequencies requiring that the supplies be bypassed at the package terminals with an electrolytic capacitor of 470F or more. LAYOUT CONSIDERATION AND AVOIDING GROUND LOOPS A proper layout is virtually essential for a high performance audio amplifier. It is very important to return the load ground, supply grounds of output transistors, and the low level (feedback and input) grounds to the circuit board common ground point through separate paths. When ground is routed in this fashion, it is called a star ground or a single point ground. It is advisable to keep the supply decoupling capacitors of 0.1F close as possible to LME49811 to reduce the effects of PCB trace resistance and inductance. Following the general rules will optimize the PCB layout and avoid ground loops problems: a) Make use of symmetrical placement of components. b) Make high current traces, such as output path traces, as wide as possible to accommodate output stage current requirement. c) To reduce the PCB trace resistance and inductance, same ground returns paths should be as short as possible. If possible, make the output traces short and equal in length. d) To reduce the PCB trace resistance and inductance, ground returns paths should be as short as possible. e) If possible, star ground or a single point ground should be observed. Advanced planning before starting the PCB can improve audio performance. OUTPUT STAGE USING BIPOLAR TRANSISTORS With a properly designed output stage and supply voltage of 100V, an output power up to 500W can be generated at 0.05% THD+N into an 8 speaker load. With an output current of several amperes, the output transistors need substantial base current drive because power transistors usually have quite low current gain--typical hfe of 50 or so. To increase the current gain, audio amplifiers commonly use Darlington style devices or additional driver stages. Power transistors should be mounted together with the V BE multiplier transistor on the same heat sink to avoid thermal run away. Please see the section Biasing Technique and Avoiding Thermal Runaway for additional information. BIASING TECHNIQUES AND AVOIDING THERMAL RUNAWAY A class AB amplifier has some amount of distortion called Crossover distortion. To effectively minimize the crossover distortion from the output, a VBE multiplier may be used instead of two biasing diodes. A VBE multiplier normally consists of a bipolar transistor (QMULT, see Figure 1) and two resistors (RB1 and RB2, see Figure 1). A trim pot can also be added in series with RB1 for optional bias adjustment. A properly de- www.national.com (V) 12 LME49811 Demonstration Board Layout 300048f5 Silkscreen Layer 300048f6 Top Layer 13 www.national.com LME49811 300048f4 Bottom Layer www.national.com 14 LME49811 Revision History Rev Date 1.0 12/19/07 Initial release. Description 1.01 01/04/08 Edited the project title (replaced "Driver" with "Power Amplifier Input Stage". 1.02 11/11/09 Fixed the spacing between the equations 3, 4, 5, and 6 to the units measures. 15 www.national.com LME49811 Physical Dimensions inches (millimeters) unless otherwise noted Non-Isolated TO-247 15 Lead Package NS Package Number TB15A www.national.com 16 LME49811 Notes 17 www.national.com LME49811 High Fidelity 200 Volt Power Amplifier Input Stage with Shutdown Notes For more National Semiconductor product information and proven design tools, visit the following Web sites at: Products Design Support Amplifiers www.national.com/amplifiers WEBENCH(R) Tools www.national.com/webench Audio www.national.com/audio App Notes www.national.com/appnotes Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns Data Converters www.national.com/adc Samples www.national.com/samples Interface www.national.com/interface Eval Boards www.national.com/evalboards LVDS www.national.com/lvds Packaging www.national.com/packaging Power Management www.national.com/power Green Compliance www.national.com/quality/green Switching Regulators www.national.com/switchers Distributors www.national.com/contacts LDOs www.national.com/ldo Quality and Reliability www.national.com/quality LED Lighting www.national.com/led Feedback/Support www.national.com/feedback Voltage Reference www.national.com/vref Design Made Easy www.national.com/easy www.national.com/powerwise Solutions www.national.com/solutions Mil/Aero www.national.com/milaero PowerWise(R) Solutions Serial Digital Interface (SDI) www.national.com/sdi Temperature Sensors www.national.com/tempsensors SolarMagicTM www.national.com/solarmagic Wireless (PLL/VCO) www.national.com/wireless www.national.com/training PowerWise(R) Design University THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION ("NATIONAL") PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS, IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT NATIONAL'S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS. EXCEPT AS PROVIDED IN NATIONAL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness. National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other brand or product names may be trademarks or registered trademarks of their respective holders. Copyright(c) 2009 National Semiconductor Corporation For the most current product information visit us at www.national.com National Semiconductor Americas Technical Support Center Email: support@nsc.com Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Technical Support Center Email: europe.support@nsc.com National Semiconductor Asia Pacific Technical Support Center Email: ap.support@nsc.com National Semiconductor Japan Technical Support Center Email: jpn.feedback@nsc.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2011, Texas Instruments Incorporated