www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED,INCLUDING THE IMPLIED
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replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
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THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
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PDS_HF_625_12.08
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Bramenber g 9a, 3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company - Asia
Room 15,8/F W ah Wai Industrial Centre
No.38-40,Au Pui Wan Street
Fotan, Shatin, N.T. Hong Kong
Ph: 852.2690.9296
Fax: 852.2690.2344
Hi-Flow
®
625
Electr ically Insulating,Ther mally Conductive Phase Change Material
Features and Benefits
• Thermal impedance:
0.71°C-in2/W (@25 psi)
• Electrically isolating
• 65°C phase change compound coated
on PEN film
• Tack-free and scr atch-resistant
Hi-Flow 625 is a film-reinforced phase change
mater ial.The product consists of a ther mally
conductive 65°C phase change compound
coated on PEN film.Hi-Flow 625 is designed
to be used as a ther mal interface mater ial
between electronic power devices that
require electrical isolation and a heat sink.The
reinforcement makes Hi-Flow 625 easy to
handle , and the 65°C phase change
temperature of the coating material eliminates
shipping and handling problems.The PEN film
has a continuous use temperature of 150°C.
Hi-Flow 625 is tack-free and scratch-resistant at
production temperature and does not require
a protective liner in most shipping situations.
The mater ial has the thermal performance of
2-3 mil mica and grease assemblies.
Typical Applications Include:
• Spring / clip mounted
• Power semiconductors
• Power modules
Configurations Available:
• Sheet form, die-cut parts and roll for m
• With or without pressure sensitive adhesive
Building a Part Number Standard Options
Hi- Flow®: U.S. Patents 6,197,859 and 5,950,066.
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
HF625 = Hi-Flow 625 Phase Change Material
HF625 0.005 AC––––1212 NA
Note: To build a part number, visit our website at www.bergquistcompany.com.
Standard thicknesses available: 0.005"
AC = Adhesive, one side
00 = No adhesive
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/200 = 12" x 200' rolls, or
00 = custom configuration
TYPICAL PROPERTIES OF HI-FLOW 625
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Green Green Visual
Reinforcement Carr ier PEN Film PEN Film —
Thickness (inch) / (mm) 0.005 0.127 ASTM D374
Elongation (%45° to Warp andFill) 60 60 ASTM D882A
Tensile Strength (psi) / (MPa) 30,000 206 ASTM D882A
Continuous Use Temp (°F) / (°C) 302 150 —
Phase Change Temp (°F) / (°C) 149 65 ASTM D3418
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 4000 4000 ASTM D149
Dielectric Constant (1000 Hz) 3.5 3.5 ASTM D150
Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257
Flame Rating V-O V-O U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1) 0.5 0.5 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Perfor mance (°C/W) 2.26 2.10 2.00 1.93 1.87
Thermal Impedance (°C-in2/W) (2) 0.79 0.71 0.70 0.67 0.61
1) This is the measured ther mal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layer s will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change , thin film products is highly dependent upon the heat and pressure applied.This character istic is
not accounted for in ASTM D5470. Please contact Ber gquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C pr ior to test.The recorded value includes
interfacial thermal resistance .These values are provided for reference only.Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
