pkg-3.7-04/99 Packaging Introduction .................................................................................................................. 4-3 Package Options: Table ......................................................................................... 4-3 Package Drawings Rectangular PQFP .................................................................................................. 4-4 Square PQFP .......................................................................................................... 4-6 L/TQFP*............................................................................................................... 4-10 PLCC.................................................................................................................... 4-14 CPGA ................................................................................................................... 4-16 CQFP.................................................................................................................... 4-18 PBGA ................................................................................................................... 4-20 Low-Profile BGA Dimensions and Package Drawings ....................................... 4-28 Mini Array BGA Dimensions .............................................................................. 4-29 Mini Array BGA Package Drawings ................................................................... 4-30 Thermal Impedance .................................................................................................... 4-41 Calculating Maximum Junction Temperature ............................................................ 4-41 Junction Temperature Calculations ............................................................................ 4-41 Plastic Package ja Coefficients: Table ...................................................................... 4-42 Ceramic Package ja Coefficients: Table ................................................................... 4-43 Package ja Coefficients for Low-Profile BGA and Mini Array BGA...................... 4-43 * Per New JEDEC Package Naming Convention TQFP = 1.0mm package thickness L/TQFP = 1.4mm package thickness 4-1 (R) pkg-3.7-04/99 4-2 Packaging pkg-3.7-04/99 Introduction Atmel pairs its high-performance silicon with highperformance packages, custom designed for the company's gate arrays. Atmel offers gate arrays in ceramic and plastic packages. The through hole and surface mount ceramic packages are designed to meet Military specifications. Atmel's plastic through hole and surface mount packages come in a variety of lead configurations and standard footprints. Atmel's Packaging Center can provide complete custom package design services. Atmel's facility has been designing custom packages for five years and has developed a CAD network specifically for IC package design. Atmel maintains close relationships with the world's leading suppliers of assembly and packaging services, and leverages these relationships to provide innovative packaging solutions for a variety of applications. Atmel also offers the unique capability to provide prototypes in plastic TQFP packages. These design verification sample (DVS) packages are assembled in our Colorado Springs facility and can be shipped within 72 hours of receipt of prototype dice. Package Options Package Type Pin Count PQFP 44, 52, 64, 80, 100, 120, 128, 132, 144, 160, 184, 208, 240, 304 Power Quad 144, 160, 208, 240, 304 L/TQFP 32, 44, 48, 64, 80, 100, 120, 128, 144, 160, 176, 216 PLCC 20, 28, 32, 44, 52, 68, 84 CPGA 64, 68, 84, 100, 124, 144, 155, 180, 223, 224, 299, 391 CQFP 64, 68, 84, 100, 120, 132, 144, 160, 224, 340 PBGA 121, 169, 208, 217, 225, 256, 272, 300, 304, 313, 316, 329, 352, 388, 420, 456 Super BGA 168, 204, 240, 256, 304, 352, 432, 560, 600 Low-Profile Mini BGA 132, 144, 160, 180, 208 Chip Scale BGA(1) 40, 49, 56, 64, 81, 84, 96, 100, 128 Note: 1. Partial list 4-3 (R) pkg-3.7-04/99 Rectangular PQFP (Plastic Quad Flat Package) 4-4 Packaging pkg-3.7-04/99 Rectangular PQFP Dimensions Dimensions in Millimeters Dimensions 64 Lead MIN NOM 80 Lead MAX MIN NOM 100 Lead MAX MIN NOM MAX AHP 3.40 3.40 3.40 ALP 3.30 3.30 3.30 A1HP 0.05 A1LP 0.00 A2 2.57 D 0.25 0.50 0.05 0.25 0.00 2.72 2.87 2.57 23.65 23.90 24.15 D1 19.90 20.00 E 17.65 E1 L 0.25 0.50 0.05 0.25 0.25 0.00 2.72 2.87 2.57 2.72 2.87 23.65 23.90 24.15 23.65 23.90 24.15 20.10 19.90 20.00 20.10 19.90 20.00 20.10 17.90 18.15 17.65 17.90 18.15 17.65 17.90 18.15 13.90 14.00 14.10 13.90 14.00 14.10 13.90 14.00 14.10 0.65 0.08 0.95 0.65 0.80 0.95 0.65 0.80 0.95 0.25 L1 1.95 1.95 1.95 e 1.00 0.80 0.65 b 0.30 0.40 0.50 0.25 0.35 0.45 0.20 0.50 0.30 0.40 Note: HP = High Stand Off, LP = Low Stand Off, A = Overall Thickness 4-5 (R) pkg-3.7-04/99 Square PQFP (Plastic Quad Flat Package) 4-6 Packaging pkg-3.7-04/99 Square PQFP Dimensions Dimensions in Millimeters Dimensions 44 Lead 52 Lead 64 Lead MIN NOM MAX MIN NOM MAX MIN NOM MAX A1 0.05 0.25 0.50 0.05 0.25 0.50 0.05 0.25 0.50 A2 1.90 2.05 2.20 1.90 2.05 2.20 2.55 2.67 2.75 D 13.65 13.90 14.15 13.65 13.90 14.15 17.65 17.90 18.15 D1 9.90 10.00 10.10 9.90 10.00 10.10 13.90 14.00 14.10 E 13.65 13.90 14.15 13.65 13.90 14.15 17.65 17.90 18.15 E1 9.90 10.00 10.10 9.90 10.00 10.10 13.90 14.00 14.10 L 0.65 0.80 0.95 0.65 0.80 0.95 0.65 0.80 0.95 L1 1.95 1.95 1.95 e 0.80 0.65 0.80 b 0.20 Dimensions 0.30 0.40 0.20 80 Lead 0.30 0.40 0.25 120 Lead 0.35 0.45 128 Lead MIN NOM MAX MIN NOM MAX MIN NOM MAX A1 0.05 0.25 0.50 0.05 0.25 0.50 0.05 0.25 0.50 A2 2.55 2.67 2.75 3.17 3.32 3.47 3.17 3.32 3.47 D 17.65 17.90 18.15 31.65 31.90 32.15 31.65 31.90 32.15 D1 13.90 14.00 14.10 27.90 28.00 28.10 27.90 28.00 28.10 E 17.65 17.90 18.15 31.65 31.90 32.15 31.65 31.90 32.15 E1 13.90 14.00 14.10 27.90 28.00 28.10 27.90 28.00 28.10 L 0.65 0.80 0.95 0.65 0.80 0.95 0.65 0.80 0.95 L1 1.95 1.95 1.95 e 0.65 0.80 0.80 b 0.25 0.35 0.45 0.25 0.35 0.45 0.25 0.35 0.45 4-7 (R) pkg-3.7-04/99 Square PQFP Dimensions Dimensions in Millimeters Dimensions 132 Lead 144 Lead MIN NOM MAX MIN NOM MAX MIN NOM MAX A1 0.05 0.25 0.50 0.05 0.25 0.50 0.05 0.25 0.50 A2 3.17 3.32 3.47 3.17 3.32 3.47 3.17 3.32 3.47 D 31.65 31.90 32.15 31.65 31.90 32.15 31.65 31.90 32.15 D1 27.90 28.00 28.10 27.90 28.00 28.10 27.90 28.00 28.10 E 31.65 31.90 32.15 31.65 31.90 32.15 31.65 31.90 32.15 E1 27.90 28.00 28.10 27.90 28.00 28.10 27.90 28.00 28.10 L 0.65 0.80 0.95 0.65 0.80 0.95 0.65 0.80 0.95 L1 1.95 1.95 1.95 e 0.80 0.65 0.65 b 0.25 Dimensions 0.35 0.45 0.20 184 Lead 0.30 0.40 0.20 208 Lead 0.30 0.40 240 Lead MIN NOM MAX MIN NOM MAX MIN NOM MAX A1 0.05 0.25 0.50 0.05 0.25 0.50 0.25 0.35 0.45 A2 3.17 3.32 3.47 3.17 3.32 3.47 3.17 3.32 3.47 D 30.35 30.60 30.85 30.35 30.60 30.85 34.35 34.60 34.85 D1 27.90 28.00 28.10 27.90 28.00 28.10 31.90 32.00 32.10 E 30.35 30.60 30.85 30.35 30.60 30.85 34.35 34.60 34.85 E1 27.90 28.00 28.10 27.90 28.00 28.10 31.90 32.00 32.10 L 0.35 0.50 0.65 0.45 0.60 0.75 0.35 0.50 0.65 L1 1.30 1.30 1.30 e 0.50 0.50 0.50 b 0.10 Dimensions 0.20 0.30 0.13 0.18 0.23 256 Lead MIN NOM A 0.10 0.20 0.30 304 Lead MAX MIN NOM MAX 3.45/4.10 3.95 4.23 4.50 A1 0.05 0.25 0.50 0.25 0.43 A2 3.17 3.32 3.47 3.70 3.80 3.90 D 30.60 42.40 42.60 42.80 D1 28.00 39.90 40.00 40.10 E 30.60 42.40 42.60 42.80 E1 28.00 39.90 40.00 40.10 0.46 0.56 0.66 L 0.50 L1 e 4-8 160 Lead 0.60 0.75 1.30 1.30 256.00 304.00 0.40 BSC 0.50 BSC b 0.13 0.18 0.23 0.17 b1 0.13 0.16 0.16 0.17 Packaging 0.27 0.20 0.23 pkg-3.7-04/99 4-9 (R) pkg-3.7-04/99 L/TQFP (Thin Quad Flat Package) 4-10 Packaging pkg-3.7-04/99 L/TQFP Dimensions Dimensions in Millimeters Dimensions 32 Lead A1 A2 48 Lead MIN NOM MAX MIN NOM MAX 0.05 0.10 0.15 0.05 0.10 0.15 1.35/0.95 1.40/1.00 1.45/1.12 1.35/0.95 1.40/1.00 1.45/1.12 D 8.75 9.00 9.25 8.75 9.00 9.25 D1 6.90 7.00 7.10 6.90 7.00 7.10 E 8.75 9.00 9.25 8.75 9.00 9.25 E1 6.90 7.00 7.10 6.90 7.00 7.10 L 0.45 0.60 0.75 0.45 0.60 0.75 L1 1.00 1.00 e 0.80 0.50 b 0.30 Dimensions 0.45 0.17 64 Lead A1 A2 0.37 0.22 0.27 80 Lead 100 Lead MIN NOM MAX MIN NOM MAX MIN NOM MAX 0.05 0.10 0.15 0.05 0.10 0.15 0.05 0.10 0.15 1.35/0.95 1.40/1.00 1.45/1.12 1.35/0.95 1.40/1.00 1.45/1.05 1.35/0.95 1.40/1.00 1.45/1.05 D 11.75 12.00 12.25 15.75 16.00 16.25 15.75 16.00 16.25 D1 9.90 10.00 10.10 13.90 14.00 14.10 13.90 14.00 14.10 E 11.75 12.00 12.25 15.75 16.00 16.25 15.75 16.00 16.25 E1 9.90 10.00 10.10 13.90 14.00 14.10 13.90 14.00 14.10 L 0.45 0.60 0.75 0.45 0.60 0.75 0.45 0.60 0.75 L1 1.00 1.00 1.00 e 0.50 0.65 0.50 b 0.17 Dimensions 0.22 0.27 0.22 120 Lead 0.32 0.38 0.17 128 Lead 0.22 0.27 128 Lead MIN NOM MAX MIN NOM MAX MIN NOM MAX A1 0.05 0.10 0.15 0.05 0.10 0.15 0.05 0.10 0.15 A2 1.35 1.40 1.45 1.35 1.40 1.45 1.35 1.40 1.45 D 15.75 16.00 16.25 21.75 22.00 22.25 15.75 16.00 16.25 D1 13.90 14.00 14.10 19.90 20.00 20.10 13.90 14.00 14.10 E 15.75 16.00 16.25 21.75 22.00 22.25 15.75 16.00 16.25 E1 13.90 14.00 14.10 19.90 20.00 20.10 13.90 14.00 14.10 L 0.45 0.60 0.75 0.45 0.60 0.75 0.45 0.60 0.70 L1 1.00 1.00 1.00 e 0.40 0.50 0.40 b 0.13 0.18 0.23 0.17 0.22 0.27 0.13 0.18 0.23 4-11 (R) pkg-3.7-04/99 L/TQFP Dimensions Dimensions in Millimeters Dimensions 144 Lead 160 Lead MIN NOM MAX MIN NOM MAX MIN NOM MAX A1 0.50 0.10 0.15 0.05 0.10 0.15 0.05 0.10 0.15 A2 1.35 1.40 1.45 1.35 1.40 1.45 1.35 1.40 1.45 D 21.75 22.00 22.25 25.75 26.00 26.25 25.75 26.00 26.25 D1 19.90 20.00 20.10 23.90 24.00 24.10 23.90 24.00 24.10 E 21.75 22.00 22.25 25.75 26.00 26.25 25.75 26.00 26.25 E1 19.90 20.00 20.10 23.90 24.00 24.10 23.90 24.00 24.10 L 0.45 0.60 0.75 0.45 0.60 0.75 0.45 0.60 0.75 L1 1.00 1.00 1.00 e 0.50 0.50 0.50 b 0.17 0.22 Dimensions 0.27 NOM A 0.05 A2 1.35 0.15 1.40 D 30 BSC D1 28 BSC E 30 BSC E1 28 BSC 0.35 0.55 L1 1.00 e 0.50 b MAX 1.60 A1 L 0.17 208 Lead MIN 4-12 176 Lead 0.17 Packaging 0.20 1.45 0.75 0.23 0.22 0.27 0.17 0.22 0.27 pkg-3.7-04/99 4-13 (R) pkg-3.7-04/99 PLCC (Plastic Leaded Chip Carrier) 4-14 Packaging pkg-3.7-04/99 PLCC Dimensions Dimensions in Inches Dimensions 20 Lead MIN NOM 28 Lead MAX MIN NOM 32 Lead MAX MIN NOM 44 Lead MAX MIN NOM MAX TF 0.009 0.010 0.012 0.009 0.010 0.012 0.009 0.010 0.012 0.009 0.010 0.012 TP 0.165 0.172 0.180 0.165 0.172 0.180 0.165 0.172 0.180 0.165 0.172 0.180 WT 0.350 0.353 0.356 0.450 0.453 0.456 0.447 0.450 0.453 0.650 0.653 0.656 0.547 0.550 0.553 0.485 0.490 0.495 0.685 0.690 0.695 0.585 0.590 0.595 0.390 0.410 0.430 0.590 0.610 0.630 0.490 0.510 0.530 WO 0.385 0.290 WC Dimensions 0.390 0.395 0.310 0.330 0.485 0.390 0.490 0.495 0.410 0.430 52 Lead 68 Lead 84 Lead MIN NOM MAX MIN NOM MAX MIN NOM MAX TF 0.009 0.010 0.012 0.009 0.010 0.012 0.009 0.010 0.012 TP 0.165 0.170 0.180 0.165 0.170 0.200 0.165 0.170 0.200 WT 0.750 0.753 0.756 0.950 0.954 0.958 1.150 1.154 1.158 WO 0.785 0.790 0.795 0.985 0.990 0.995 1.185 1.190 1.195 WC 0.690 0.710 0.730 0.890 0.910 0.930 1.090 1.110 1.130 4-15 (R) pkg-3.7-04/99 CPGA (Ceramic Pin Grid Array) 4-16 Packaging pkg-3.7-04/99 CPGA Dimensions Dimensions in Inches Dimensions 84 Lead 100 Lead 124 Lead MIN NOM MAX MIN NOM MAX MIN NOM MAX D 1.080 1.100 1.120 1.308 1.320 1.332 1.297 1.310 1.323 D1 0.995 1.000 1.005 1.195 1.200 1.205 1.195 1.200 1.205 E 1.080 1.100 1.120 1.308 1.320 1.332 1.297 1.310 1.323 P 0.095 0.100 0.195 0.100 0.095 0.100 0.105 0 0.010 0.020 0.035 C 0 e 0.016 0.018 0.020 0.016 0.018 0.020 0.017 0.018 0.019 A 0.072 0.080 0.088 0.072 0.080 0.088 0.081 0.090 0.099 H 0.045 0.050 0.055 0.045 0.050 0.055 0.045 0.050 0.055 K 0.008 REF 0.008 REF 0.008 REF R 0.045 0.050 0.055 0.045 0.050 0.055 0.042 0.047 0.052 B 0.170 0.180 0.190 0.170 0.180 0.190 0.170 0.180 0.190 Z 0.080 0.095 0.110 0.080 0.095 0.110 0.090 0.105 0.120 Dimensions 144 Lead 180 Lead 224 Lead MIN NOM MAX MIN NOM MAX MIN NOM MAX D 1.559 1.575 1.591 1.559 1.575 1.591 1.559 1.575 1.591 D1 1.395 1.400 1.405 1.395 1.400 1.405 1.395 1.400 1.405 E 1.559 1.575 1.591 1.559 1.575 1.591 1.559 1.575 1.591 P 0.095 0.100 0.105 0.095 0.100 0.105 0.095 0.100 0.105 0.015 0.030 0.045 0.015 0.030 0.045 C 0 e 0.016 0.018 0.020 0.016 0.018 0.020 0.016 0.018 0.020 A 0.070 0.080 0.090 0.090 0.100 0.110 0.090 0.100 0.110 H 0.045 0.050 0.055 0.045 0.050 0.055 0.045 0.050 0.055 K 0.008 REF 0.008 REF 0.008 REF R 0.045 0.050 0.055 0.045 0.050 0.055 0.045 0.050 0.055 B 0.170 0.180 0.190 0.170 0.180 0.190 0.170 0.180 0.190 Z 0.080 0.095 0.110 0.100 0.115 0.130 0.100 0.115 0.130 4-17 (R) pkg-3.7-04/99 CQFP (Ceramic Quad Flat Package) 4-18 Packaging pkg-3.7-04/99 CQFP Dimensions Dimensions in Inches Dimensions 84 Lead D 132 Lead MIN NOM MAX MIN NOM MAX MIN NOM MAX 1.149 1.161 1.173 0.945 0.950 0.960 1.509 1.525 1.541 D1 1.800 D2 1.550 1.000 G 1.149 1.161 E1 1.900 0.800 0.300 E 224 Lead 1.173 1.375 0.345 0.945 0.950 1.800 0.300 0.960 1.509 1.525 1.550 1.541 2.000 E2 1.000 0.800 1.375 P 0.050 0.025 0.025 t 0.016 0.018 0.020 0.007 0.008 0.010 0.006 0.008 0.010 ZL 0.009 0.010 0.012 0.004 0.005 0.007 0.005 0.006 0.007 ZH 0.045 0.050 0.056 0.053 0.063 0.073 0.081 0.096 0.111 Z 0.072 0.080 0.088 0.067 0.075 0.0837 0.081 0.096 0.111 ZT 0.080 0.093 0.105 0.075 0.090 0.100 0.096 0.111 0.126 4-19 (R) pkg-3.7-04/99 121 PBGA Ortho View (Ball Grid Array Package) 4-20 Packaging pkg-3.7-04/99 169 PBGA Ortho View 4-21 (R) pkg-3.7-04/99 225 PBGA Ortho View 4-22 Packaging pkg-3.7-04/99 256 PBGA Ortho View 1.27 4-23 (R) pkg-3.7-04/99 313 PBGA Ortho View 4-24 Packaging pkg-3.7-04/99 4-25 (R) pkg-3.7-04/99 352 PBGA Ortho View 301 1.17 2.33 Side View 0.60 Seating Plan 35.00 30.00 Pin One Corner 26.65 REF Pin One ID 1.0mm diameter (optional) 26.65 30.00 35.00 REF 45 Chamfer 4 Places Top View Available Marking Area 1.00 REF Pin One Corner 0.76 Bottom View 1.27 1.62 REF 1.0 REF 3 Places 4-26 1.62 REF Packaging 1.27 pkg-3.7-04/99 352 PBGA Dimensions 352 Lead Dimension MIN NOM MAX A 2.12 2.33 2.52 (2.54) A1 0.50 0.60 0.70 A2 1.12 1.17 1.22 D 34.80 35.00 35.20 30.00 30.70 35.00 35.20 E1 30.00 30.70 N 352 D1 E 34.80 e 1.27 1.27 I 1.62 REF J 1.62 REF M 26 Depopulated b 0.60 0.76 d 1.00 REF f 1.00 REF 1.27 0.90 aaa 0.15 bbb 0.35 4-27 (R) pkg-3.7-04/99 Low Profile BGA Dimensions Ball Count Ball Pitch Row Array Body Size Package Height 132 .8mm P 3 Rows 12mm x 12mm 1.1mm 144 .8mm P 4 Rows 12mm x 12mm 1.1mm 160 .8mm P 4 Rows 12mm x 12mm 1.1mm 180 .8mm P 5 Rows 12mm x 12mm 1.1mm 208 .8mm P 4 Rows 15mm x 15mm 1.1mm Low Profile BGA Top View Side View 30 Bottom View 2X R 0.25 0.80 TYP. 0.80 TYP. 1.1 ( .1mm) P 0.800 N 0.350 M L 0.80 TYP. 0.300.07 K J H G 0.085 F E D C B A 2 3 4 5 6 7 8 9 10 11 12 13 14 BALL PAD A1 CORNER INDICATOR (NO SOLDER BALL) 0.80 TYP. 1 4. The Maximum Allowable Number Of Solder Balls Is 180. 3. The Maximum Solder Ball Matrix Size Is 14 x 14. 2. The Maximum Solder Ball Grid Pitch Is 0.80mm. 1. All Dimensions And Tolerances Conform To ASME Y14.5M-1994 Notes: Unless Otherwise Specified 4-28 Packaging pkg-3.7-04/99 Mini Array BGA Dimensions Ball Count Ball Pitch Row Array Body Size Package Height 40 .5mm P 2 Rows 5mm x 5mm 1.24mm 49 .8mm Full Array 7mm x 7mm 1.4mm 56 .5mm P 2 Rows 6mm x 6mm 1.24mm 64 .8mm Full Array 8mm x 8mm 1.1mm 64 1.0mm Full Array 9mm x 9mm 1.4mm 81 .8mm Full Array 9mm x 9mm 1.4mm 84 .5mm P3 Rows 7mm x 7mm 1.24mm 96 .8mm P4 Rows 10mm x 10mm 1.4mm 100 .8mm Full Array 10mm x 10mm 1.4mm 100 1.0mm Full Array 11mm x 11mm 1.4mm 128 .8mm P4 Rows 11mm x 11mm 1.4mm 4-29 (R) pkg-3.7-04/99 Mini Array BGA 40/.5 Top View A1 BALL PAD CORNER Side View 5.00 1.24 0.10 5.00 0.20 0.05 Bottom View A1 BALL PAD CORNER 7 6 5 4 3 2 1 0.50 8 A 1.0 SPACE B C D E F G 0.75 REF H 0.75 REF 4-30 Packaging 0.50 pkg-3.7-04/99 Mini Array BGA 49/.8 Side View Top View A1 BALL PAD CORNER 1.40 0.10 7.00 7.00 0.36 0.05 0.70 0.05 Bottom View 0.80 A1 BALL PAD CORNER 7 6 5 4 3 2 1 A 4.80 TYP B C D E F G 0.80 4.80 TYP 4-31 (R) pkg-3.7-04/99 Mini Array BGA 56/.5 Side View Top View 1.24 0.10 A1 BALL PAD CORNER 6.00 6.00 0.20 0.05 0.70 0.05 Bottom View A1 BALL PAD CORNER 9 8 7 6 0.50 10 5 4 3 2 1 A B 1.0 SPACE C D E F G H J 0.75 REF K 4-32 Packaging 0.75 REF 0.50 pkg-3.7-04/99 Mini Array BGA 64/.8 Top View A1 BALL PAD CORNER Side View 8.00 1.40 0.10 8.00 0.36 0.05 0.70 0.05 Bottom View 0.80 A1 BALL PAD CORNER 8 7 6 5 4 3 2 1 A B 1.20 REF C D E F G H 0.80 1.20 REF 4-33 (R) pkg-3.7-04/99 Mini Array BGA 64/1.0 Side View Top View A1 BALL PAD CORNER 9.00 1.40 0.10 9.00 0.36 0.05 0.70 0.05 Bottom View A1 BALL PAD CORNER 7 6 5 4 3 2 1 1.00 8 A B C 1.00 REF D E F G H 1.00 1.00 REF 4-34 Packaging pkg-3.7-04/99 Mini Array BGA 81/.8 Top View A1 BALL PAD CORNER Side View 1.40 0.10 9.00 9.00 0.36 0.05 0.70 0.05 Bottom View 0.80 A1 BALL PAD CORNER 9 8 7 6 5 4 3 2 1 A B C 1.30 REF D E F G H J 0.80 1.30 REF 4-35 (R) pkg-3.7-04/99 Mini Array BGA 84/.5 Top View Side View 1.24 0.10 7.00 A1 BALL PAD CORNER 7.00 1.20 0.05 0.70 0.05 Bottom View 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M 0.75 REF 0.50 A1 BALL PAD CORNER 0.50 0.75 REF 4-36 Packaging pkg-3.7-04/99 Mini Array BGA 96/.8 Side View Top View A1 BALL PAD CORNER 1.40 0.10 10.00 10.00 0.36 0.05 0.70 0.05 Bottom View 0.80 A1 BALL PAD CORNER 10 9 8 7 6 5 4 3 2 1 A B C D 1.40 REF E F G H J K 0.80 1.40 REF 4-37 (R) pkg-3.7-04/99 Mini Array BGA 100/.8 Side View Top View A1 BALL PAD CORNER 1.40 0.10 10.00 10.00 0.36 0.05 0.70 0.05 Bottom View 0.80 A1 BALL PAD CORNER 10 9 8 7 6 5 4 3 2 1 A B C D 1.40 REF E F G H J K 0.80 1.40 REF 4-38 Packaging pkg-3.7-04/99 Mini Array BGA 100/1.0 Top View A1 BALL PAD CORNER Side View 11.00 1.40 0.10 11.00 0.36 0.05 0.70 0.05 Bottom View 1.00 A1 BALL PAD CORNER 10 9 8 7 6 5 4 3 2 1 A B C D E 1.00 REF F G H J K 1.00 1.00 REF 4-39 (R) pkg-3.7-04/99 Mini Array BGA 128/.8 Side View Top View A1 BALL PAD CORNER 1.40 0.10 11.00 11.00 0.36 0.05 0.70 0.05 Bottom View 0.80 A1 BALL PAD CORNER 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F 1.10 REF G H J K L M 1.10 REF 4-40 Packaging 0.80 pkg-3.7-04/99 Thermal Impedance The net thermal impedance of a particular package or package/heat sink system is determined by a number of different factors. The package configuration, the package material, the die attach material and process, the type and placement of a heat sink, and the method of device placement on the board all interact to determine the total thermal impedance. Thermal impedance (ja) is typically described by the expression: ja = silicon + die attach + package to ambient Where ja is the measure of heat transference, junction to ambient, in degrees C per watt. Atmel's advanced packaging services include high-performance assembly with Ag glass and epoxy die attach. Atmel also offers industry proven heatsink technology as well as unique thermal dissipation solutions. ja is empirically measured and defined as follows: ( Tj - Ta ) Rja = ----------------------- where; Tj = The junction temperature Pd of the device Ta = The ambient temperature Pd = device operating power Calculating Maximum Junction Temperature To the designer working to high performance or military requirements, the maximum junction temperature is of primary concern and is expressed by the following: Tj = Ta + Pd*ja Depending on the operating conditions, industry measured values of ja in ceramic packages can range from 2C to 20C per watt. For an Atmel highperformance gate array operating at 2 watts this would suggest a maximum junction operating temperature of anywhere from 29C to 65C at an ambient temperature of 25C. The following describes how to calculate a gate array's maximum junction temperature based on estimated power consumption, package style, ambient air temperature and air flow. Junction Temperature Calculations Tj = Ta + Pd*ja Where: Tj = Junction Temperature (degrees C) Pd = Power consumption of the die (watts) ja = Temperature coefficient of the package (degrees C/watt). Refer to the table on the following pages. Example Calculation: Die = ATL60/15 Power consumption = 0.75 watts Max air temp = 70C Package = 80 PQFP Air flow = 0 LFPM (linear feet per minute) Junction temperature: Tj = 70C + (0.75 watts)*(46C/watt) = 104.5C 4-41 (R) pkg-3.7-04/99 Plastic Package ja Coefficients All values are estimated and actual values depend on die size, pad size, power dissipation and ambient air temperature. All estimated values are based Package Style PQFP TQFP Body Size (mm) Lead Count ja (0 LFPM) ja (225 LFPM) ja (500 LFPM) 10 x 10 44 62 51 47 10 x 10 52 60 53 47 14 x 14 64 49 41 37 14 x 20 80 46 37 33 14 x 20 100 44 36 32 28 x 28 120 36 36 32 28 x 28 128 36 34 29 24 x 24 132 30 25 23 28 x 28 144 35 27 23 28 x 28 160 34 24 20 28 x 28 184 33 29 25 28 x 28 208 32 28 24 32 x 32 240 27 40 x 40 304 19 7x7 32 79 69 61 10 x 10 44 59 52 41 7x7 48 77 67 63 10 x 10 64 73 60 52 14 x 14 80 50 42 37 14 x 14 100 47 39 33 14 x 14 120 14 x 20 128 59 48 42 20 x 20 144 35 24 x 24 160 32 24 x 24 176 34 24 x 24 216 PLCC PBGA 4-42 on a 4 layer PCB. All ja values are in degrees C per Watt. Packaging 20 90 68 60 28 79 60 51 32 71 64 53 44 56 43 37 52 50 38 33 68 43 32 28 84 37 30 25 121 33 169 29 225 26 313 22 pkg-3.7-04/99 Ceramic Package ja Coefficients All values are simulated or calculated and may differ from actual. Actual values depend on die size, pad size, power dissipation and ambient air temperature. All ja values are in degrees C per Watt. Lead Count ja (0 LFPM) CQFP 84 49.00 PGA 100 31.50 22.7 20.2 124 28.10 20.2 18.0 160 32.90 23.7 21.1 224 22.70 16.3 14.5 299 14.40 9.5 8.1 391 14.40 9.5 8.1 447 12.80 8.4 7.2 Package Style ja (200 LFPM) ja (225 LFPM) ja (400 LFPM) ja (500 LFPM) 84 CQFP - Tja = 49 for die size of 238 x 314 mils, 1 Watt, Ta = 25C Tja = 58.4 for die size of 182 x 204 mils, 1 Watt, Ta = 25C 100 PGA - Values for die size of 330 x 330 mils, 2 Watts, Ta = 25C 124 PGA - Values for die size of 270 x 270 mils, 2 Watts, Ta = 25C 124 PGA - Values for die size of 230 x 230 mils, 2 Watts, Ta = 25C 224 PGA - Values for die size of 375 x 375 mils, 2 Watts, Ta = 25C 299 PGA - Values for die size of 530 x 530 mils, 2 Watts, Ta = 25C 391 PGA - Values for die size of 450 x 450 mils, 2 Watts, Ta = 25C 447 PGA - Values for die size of 524 x 550 mils, 2-10 Watts, Ta = 25C Package ja Coefficients for Low Profile BGA and Mini Array BGA Package Style Body Size (mm) Lead Count ja (0 LFPM) ja (200 LFPM) ja (500 LFPM) Low Profile BGA 12 x 12 144 58.4 47.5 42.0 Mini Array BGA 6x6 48 85.3 80.1 77.1 Mini Array BGA 8x8 64 61.5 56.1 53.4 Mini Array BGA 11 x 11 128 29.5 25.6 23.7 4-43 (R)