®
4-1
pkg-3.7-04/99
Packaging
Introduction ..................................................................................................................4-3
Package Options: Table .........................................................................................4-3
Package Drawings
Rectangular PQFP..................................................................................................4-4
Square PQFP..........................................................................................................4-6
L/TQFP*...............................................................................................................4-10
PLCC....................................................................................................................4-14
CPGA...................................................................................................................4-16
CQFP....................................................................................................................4-18
PBGA...................................................................................................................4-20
Low-Profile BGA Dimensions and Package Drawings.......................................4-28
Mini Array BGA Dimensions..............................................................................4-29
Mini Array BGA Package Drawings ...................................................................4-30
Thermal Impedance....................................................................................................4-41
Calculating Maximum Junction Temperature............................................................4-41
Junction Temperature Calculations............................................................................4-41
Plastic Package θja Coefficients: Table......................................................................4-42
Ceramic Package θja Coefficients: Table...................................................................4-43
Package θja Coefficients for Low-Profile BGA and Mini Array BGA......................4-43
* Per New JEDEC Package Naming Convention
TQFP = 1.0mm package thickness
L/TQFP = 1. 4mm pa ckage thickness
Packaging
4-2
pkg-3.7-04/99
4-3
pkg-3.7-04/99
®
Introduction
Atmel pairs its high-performance silicon with high-
performance packages, custom designed for the
company's gate arrays. Atmel offers gate arrays in
ceramic and plastic packages. The through hole and
surface mount ceramic packages are designed to meet
Military specifications. Atmel’s plastic through hole and
surface mount packages come in a variety of lead
configurations and standard footpr ints.
Atmel’s Packaging Center can provide complete custom
package design services. Atmel’s facility has been
designing custom packages for five years and has
developed a CAD network specifically for IC package
design. Atmel maintains close relationships with the
world’s leading suppliers of assembly and packaging
services, and leverages these relationships to provide
innovative packaging solutions for a variety of
applications.
Atmel also offers the unique capability to provide
prototypes in plastic TQFP packages. These design
verification sample (DVS) packages are assembled in
our Colorado Springs facility and can be shipped within
72 hours of receipt of prototype dice.
Package Options
Note: 1. Partial list
Package Type Pin Count
PQFP 44, 52, 64, 80, 100, 120, 128, 132, 144, 160, 184, 208, 240, 304
Power Quad 144, 160, 208, 240, 304
L/TQFP 32, 44, 48, 64, 80, 100, 120, 128, 144, 160, 176, 216
PLCC 20, 28, 32, 44, 52, 68, 84
CPGA 64, 68, 84, 100, 124, 144, 155, 180, 223, 224, 299, 391
CQFP 64, 68, 84, 100, 120, 132, 144, 160, 224, 340
PBGA 121, 169, 208, 217, 225, 256, 272, 300, 304, 313, 316, 329, 352, 388, 420, 456
Super BGA 168, 204, 240, 256, 304, 352, 432, 560, 600
Low-Profile Mini BGA 132, 144, 160, 180, 208
Chip Scale BGA(1) 40, 49, 56, 64, 81, 84, 96, 100, 128
Packaging
4-4
pkg-3.7-04/99
Rectangular PQFP
(Plastic Quad Flat Package)
4-5
pkg-3.7-04/99
®
Rectangular PQFP Dimensions
Dimensions in Millimeters
Note: HP = High Stand Off, LP = Low Stand Off, A = Overall Thickness
Dimensions 64 Lead 80 Lead 100 Lead
MIN NOM MAX MIN NOM MAX MIN NOM MAX
AHP 3.40 3.40 3.40
ALP 3.30 3.30 3.30
A1HP 0.05 0.25 0.50 0.05 0.25 0.50 0.05 0.25 0.50
A1LP 0.00 0.25 0.00 0.25 0.00 0.25
A22.57 2.72 2.87 2.57 2.72 2.87 2.57 2.72 2.87
D 23.65 23.90 24.15 23.65 23.90 24.15 23.65 23.90 24.15
D119.90 20.00 20.10 19.90 20.00 20.10 19.90 20.00 20.10
E 17.65 17.90 18.15 17.65 17.90 18.15 17.65 17.90 18.15
E113.90 14.00 14.10 13.90 14.00 14.10 13.90 14.00 14.10
L 0.65 0.08 0.95 0.65 0.80 0.95 0.65 0.80 0.95
L11.95 1.95 1.95
e 1.00 0.80 0.65
b 0.30 0.40 0.50 0.25 0.35 0.45 0.20 0.30 0.40
Packaging
4-6
pkg-3.7-04/99
Square PQFP
(Plastic Quad Flat Package)
4-7
pkg-3.7-04/99
®
Square PQFP Dimensions
Dimensions in Millimeters
Dimensions 44 Lead 52 Lead 64 Lead
MIN NOM MAX MIN NOM MAX MIN NOM MAX
A10.05 0.25 0.50 0.05 0.25 0.50 0.05 0.25 0.50
A21.90 2.05 2.20 1.90 2.05 2.20 2.55 2.67 2.75
D 13.65 13.90 14.15 13.65 13.90 14.15 17.65 17.90 18.15
D19.90 10.00 10.10 9.90 10.00 10.10 13.90 14.00 14.10
E 13.65 13.90 14.15 13.65 13.90 14.15 17.65 17.90 18.15
E19.90 10.00 10.10 9.90 10.00 10.10 13.90 14.00 14.10
L 0.65 0.80 0.95 0.65 0.80 0.95 0.65 0.80 0.95
L11.95 1.95 1.95
e 0.80 0.65 0.80
b 0.20 0.30 0.40 0.20 0.30 0.40 0.25 0.35 0.45
Dimensions 80 Lead 120 Lead 128 Lead
MIN NOM MAX MIN NOM MAX MIN NOM MAX
A10.05 0.25 0.50 0.05 0.25 0.50 0.05 0.25 0.50
A22.55 2.67 2.75 3.17 3.32 3.47 3.17 3.32 3.47
D 17.65 17.90 18.15 31.65 31.90 32.15 31.65 31.90 32.15
D113.90 14.00 14.10 27.90 28.00 28.10 27.90 28.00 28.10
E 17.65 17.90 18.15 31.65 31.90 32.15 31.65 31.90 32.15
E113.90 14.00 14.10 27.90 28.00 28.10 27.90 28.00 28.10
L 0.65 0.80 0.95 0.65 0.80 0.95 0.65 0.80 0.95
L11.95 1.95 1.95
e 0.65 0.80 0.80
b 0.25 0.35 0.45 0.25 0.35 0.45 0.25 0.35 0.45
Packaging
4-8
pkg-3.7-04/99
Square PQFP Dimensions
Dimensions in Millimeters
Dimensions 132 Lead 144 Lead 160 Lead
MIN NOM MAX MIN NOM MAX MIN NOM MAX
A10.05 0.25 0.50 0.05 0.25 0.50 0.05 0.25 0.50
A23.17 3.32 3.47 3.17 3.32 3.47 3.17 3.32 3.47
D 31.65 31.90 32.15 31.65 31.90 32.15 31.65 31.90 32.15
D127.90 28.00 28.10 27.90 28.00 28.10 27.90 28.00 28.10
E 31.65 31.90 32.15 31.65 31.90 32.15 31.65 31.90 32.15
E127.90 28.00 28.10 27.90 28.00 28.10 27.90 28.00 28.10
L 0.65 0.80 0.95 0.65 0.80 0.95 0.65 0.80 0.95
L11.95 1.95 1.95
e 0.80 0.65 0.65
b 0.25 0.35 0.45 0.20 0.30 0.40 0.20 0.30 0.40
Dimensions 184 Lead 208 Lead 240 Lead
MIN NOM MAX MIN NOM MAX MIN NOM MAX
A10.05 0.25 0.50 0.05 0.25 0.50 0.25 0.35 0.45
A23.17 3.32 3.47 3.17 3.32 3.47 3.17 3.32 3.47
D 30.35 30.60 30.85 30.35 30.60 30.85 34.35 34.60 34.85
D127.90 28.00 28.10 27.90 28.00 28.10 31.90 32.00 32.10
E 30.35 30.60 30.85 30.35 30.60 30.85 34.35 34.60 34.85
E127.90 28.00 28.10 27.90 28.00 28.10 31.90 32.00 32.10
L 0.35 0.50 0.65 0.45 0.60 0.75 0.35 0.50 0.65
L11.30 1.30 1.30
e 0.50 0.50 0.50
b 0.10 0.20 0.30 0.13 0.18 0.23 0.10 0.20 0.30
Dimensions 256 Lead 304 Lead
MIN NOM MAX MIN NOM MAX
A 3.45/4.10 3.95 4.23 4.50
A10.05 0.25 0.50 0.25 0.43
A23.17 3.32 3.47 3.70 3.80 3.90
D 30.60 42.40 42.60 42.80
D128.00 39.90 40.00 40.10
E 30.60 42.40 42.60 42.80
E128.00 39.90 40.00 40.10
L 0.50 0.60 0.75 0.46 0.56 0.66
L11.30 1.30
256.00 304.00
e 0.40 BSC 0.50 BSC
b 0.13 0.18 0.23 0.17 0.27
b10.13 0.16 0.16 0.17 0.20 0.23
4-9
pkg-3.7-04/99
®
Packaging
4-10
pkg-3.7-04/99
L/TQFP
(Thin Qua d Flat Package)
4-11
pkg-3.7-04/99
®
L/TQFP Dimensions
Dimensions in Millimeters
Dimensions 32 Lead 48 Lead
MIN NOM MAX MIN NOM MAX
A10.05 0.10 0.15 0.05 0.10 0.15
A21.35/0.95 1.40/1.00 1.45/1.12 1.35/0.95 1.40/1.00 1.45/1.12
D 8.75 9.00 9.25 8.75 9.00 9.25
D16.90 7.00 7.10 6.90 7.00 7.10
E 8.75 9.00 9.25 8.75 9.00 9.25
E16.90 7.00 7.10 6.90 7.00 7.10
L 0.45 0.60 0.75 0.45 0.60 0.75
L11.00 1.00
e 0.80 0.50
b 0.30 0.37 0.45 0.17 0.22 0.27
Dimensions 64 Lead 80 Lead 100 Lead
MIN NOM MAX MIN NOM MAX MIN NOM MAX
A10.05 0.10 0.15 0.05 0.10 0.15 0.05 0.10 0.15
A21.35/0.95 1.40/1.00 1.45/1.12 1.35/0.95 1.40/1.00 1.45/1.05 1.35/0.95 1.40/1.00 1.45/1.05
D 11.75 12.00 12.25 15.75 16.00 16.25 15.75 16.00 16.25
D19.90 10.00 10.10 13.90 14.00 14.10 13.90 14.00 14.10
E 11.75 12.00 12.25 15.75 16.00 16.25 15.75 16.00 16.25
E19.90 10.00 10.10 13.90 14.00 14.10 13.90 14.00 14.10
L 0.45 0.60 0.75 0.45 0.60 0.75 0.45 0.60 0.75
L11.00 1.00 1.00
e 0.50 0.65 0.50
b 0.17 0.22 0.27 0.22 0.32 0.38 0.17 0.22 0.27
Dimensions 120 Lead 128 Lead 128 Lead
MIN NOM MAX MIN NOM MAX MIN NOM MAX
A10.05 0.10 0.15 0.05 0.10 0.15 0.05 0.10 0.15
A21.35 1.40 1.45 1.35 1.40 1.45 1.35 1.40 1.45
D 15.75 16.00 16.25 21.75 22.00 22.25 15.75 16.00 16.25
D113.90 14.00 14.10 19.90 20.00 20.10 13.90 14.00 14.10
E 15.75 16.00 16.25 21.75 22.00 22.25 15.75 16.00 16.25
E113.90 14.00 14.10 19.90 20.00 20.10 13.90 14.00 14.10
L 0.450.600.750.450.600.750.450.600.70
L11.00 1.00 1.00
e 0.40 0.50 0.40
b 0.130.180.230.170.220.270.130.180.23
Packaging
4-12
pkg-3.7-04/99
L/TQFP Dimensions
Dimensions in Millimeters
Dimensions 144 Lead 160 Lead 176 Lead
MIN NOM MAX MIN NOM MAX MIN NOM MAX
A10.50 0.10 0.15 0.05 0.10 0.15 0.05 0.10 0.15
A21.35 1.40 1.45 1.35 1.40 1.45 1.35 1.40 1.45
D 21.75 22.00 22.25 25.75 26.00 26.25 25.75 26.00 26.25
D119.90 20.00 20.10 23.90 24.00 24.10 23.90 24.00 24.10
E 21.75 22.00 22.25 25.75 26.00 26.25 25.75 26.00 26.25
E119.90 20.00 20.10 23.90 24.00 24.10 23.90 24.00 24.10
L 0.45 0.60 0.75 0.45 0.60 0.75 0.45 0.60 0.75
L11.00 1.00 1.00
e 0.50 0.50 0.50
b 0.17 0.22 0.27 0.17 0.22 0.27 0.17 0.22 0.27
Dimensions 208 Lead
MIN NOM MAX
A1.60
A10.05 0.15
A21.35 1.40 1.45
D 30 BSC
D128 BSC
E 3 0 BSC
E128 BSC
L 0.35 0.55 0.75
L11.00
e0.50
b 0.17 0.20 0.23
4-13
pkg-3.7-04/99
®
Packaging
4-14
pkg-3.7-04/99
PLCC
(Plastic Leaded Chip Carrier)
4-15
pkg-3.7-04/99
®
PLCC Dimensions
Dimensions in Inches
Dimensions 20 Lead 28 Lead 32 Lead 44 Lead
MIN NOM MAX MIN NOM MAX MIN NOM MAX MIN NOM MAX
TF0.009 0.010 0.012 0.009 0.010 0.012 0.009 0.010 0.012 0.009 0.010 0.012
TP0.165 0.172 0.180 0.165 0.172 0.180 0.165 0.172 0.180 0.165 0.172 0.180
WT0.350 0.353 0.356 0.450 0.453 0.456 0.447
0.547
0.450
0.550
0.453
0.553
0.650 0.653 0.656
WO0.385 0.390 0.395 0.485 0.490 0.495 0.485
0.585
0.490
0.590
0.495
0.595
0.685 0.690 0.695
WC0.290 0.310 0.330 0.390 0.410 0.430 0.390
0.490
0.410
0.510
0.430
0.530
0.590 0.610 0.630
Dimensions 52 Lead 68 Lead 84 Lead
MIN NOM MAX MIN NOM MAX MIN NOM MAX
TF0.009 0.010 0.012 0.009 0.010 0.012 0.009 0.010 0.012
TP0.165 0.170 0.180 0.165 0.170 0.200 0.165 0.170 0.200
WT0.750 0.753 0.756 0.950 0.954 0.958 1.150 1.154 1.158
WO0.785 0.790 0.795 0.985 0.990 0.995 1.185 1.190 1.195
WC0.690 0.710 0.730 0.890 0.910 0.930 1.090 1.110 1.130
Packaging
4-16
pkg-3.7-04/99
CPGA
(Ceramic Pin Grid Array)
4-17
pkg-3.7-04/99
®
CPGA Dimensions
Dimensions in Inches
Dimensions 84 Lead 100 Lead 124 Lead
MIN NOM MAX MIN NOM MAX MIN NOM MAX
D 1.080 1.100 1.120 1.308 1.320 1.332 1.297 1.310 1.323
D10.995 1.000 1.005 1.195 1.200 1.205 1.195 1.200 1.205
E 1.080 1.100 1.120 1.308 1.320 1.332 1.297 1.310 1.323
P 0.095 0.100 0.195 0.100 0.095 0.100 0.105
C 0 0 0.010 0.020 0.035
e 0.016 0.018 0.020 0.016 0.018 0.020 0.017 0.018 0.019
A 0.072 0.080 0.088 0.072 0.080 0.088 0.081 0.090 0.099
H 0.045 0.050 0.055 0.045 0.050 0.055 0.045 0.050 0.055
K 0.008 REF 0.008 REF 0.008 REF
R 0.045 0.050 0.055 0.045 0.050 0.055 0.042 0.047 0.052
B 0.170 0.180 0.190 0.170 0.180 0.190 0.170 0.180 0.190
Z 0.080 0.095 0.110 0.080 0.095 0.110 0.090 0.105 0.120
Dimensions 144 Lead 180 Lead 224 Lead
MIN NOM MAX MIN NOM MAX MIN NOM MAX
D 1.559 1.575 1.591 1.559 1.575 1.591 1.559 1.575 1.591
D11.395 1.400 1.405 1.395 1.400 1.405 1.395 1.400 1.405
E 1.559 1.575 1.591 1.559 1.575 1.591 1.559 1.575 1.591
P 0.095 0.100 0.105 0.095 0.100 0.105 0.095 0.100 0.105
C 0 0.015 0.030 0.045 0.015 0.030 0.045
e 0.016 0.018 0.020 0.016 0.018 0.020 0.016 0.018 0.020
A 0.070 0.080 0.090 0.090 0.100 0.110 0.090 0.100 0.110
H 0.045 0.050 0.055 0.045 0.050 0.055 0.045 0.050 0.055
K 0.008 REF 0.008 REF 0.008 REF
R 0.045 0.050 0.055 0.045 0.050 0.055 0.045 0.050 0.055
B 0.170 0.180 0.190 0.170 0.180 0.190 0.170 0.180 0.190
Z 0.080 0.095 0.110 0.100 0.115 0.130 0.100 0.115 0.130
Packaging
4-18
pkg-3.7-04/99
CQFP
(Ceramic Quad Flat Pa ckage)
4-19
pkg-3.7-04/99
®
CQFP Dimensions
Dimensions in Inches
Dimensions 84 Lead 132 Lead 224 Lead
MIN NOM MAX MIN NOM MAX MIN NOM MAX
D 1.149 1.161 1.173 0.945 0.950 0.960 1.509 1.525 1.541
D11.800 1.550 1.900
D21.000 0.800 1.375
G 0.300 0.345 0.300
E 1.149 1.161 1.173 0.945 0.950 0.960 1.509 1.525 1.541
E11.800 1.550 2.000
E21.000 0.800 1.375
P 0.050 0.025 0.025
t 0.016 0.018 0.020 0.007 0.008 0.010 0.006 0.008 0.010
ZL0.009 0.010 0.012 0.004 0.005 0.007 0.005 0.006 0.007
ZH0.045 0.050 0.056 0.053 0.063 0.073 0.081 0.096 0.111
Z 0.072 0.080 0.088 0.067 0.075 0.0837 0.081 0.096 0.111
ZT0.080 0.093 0.105 0.075 0.090 0.100 0.096 0.111 0.126
Packaging
4-20
pkg-3.7-04/99
121 PBGA Ortho View
(Ball Grid Array Package)
4-21
pkg-3.7-04/99
®
169 PBGA Ortho View
Packaging
4-22
pkg-3.7-04/99
225 PBGA Ortho View
4-23
pkg-3.7-04/99
®
256 PBGA Ortho View
1.27
Packaging
4-24
pkg-3.7-04/99
313 PBGA Ortho View
4-25
pkg-3.7-04/99
®
Packaging
4-26
pkg-3.7-04/99
352 PBGA Ortho View
Pin One Corner
Pin One Corner
Side View
Top View
Bottom View
Pin One ID
1.0mm diameter
(optional)
45° Chamfer
4Places Available Marking Area
30°±1°
1.17
2.33
0.60
35.00
30.00 35.00
30.00
0.76
1.62 REF
1.0 REF
3 Places 1.62
REF 1.27
1.27
1.00 REF
26.65 REF
26.65
REF
Seating Plan
4-27
pkg-3.7-04/99
®
352 PBGA Dimensions
Dimension 352 Lead
MIN NOM MAX
A 2.12 2.33 2.52 (2.54)
A10.50 0.60 0.70
A21.12 1.17 1.22
D 34.80 35.00 35.20
D130.00 30.70
E 34.80 35.00 35.20
E130.00 30.70
N352
e 1.27 1.27 1.27
I 1.62 REF
J 1.62 REF
M 26 Depopulated
b 0.60 0.76 0.90
d 1.00 REF
f 1.00 REF
aaa 0.15
bbb 0.35
Packaging
4-28
pkg-3.7-04/99
Low Profile BGA Dimensions
Low Profile BGA
Ball Count Ball Pitch Row Array Body Size Package Height
132 .8mm P 3 Rows 12mm x 12mm 1.1mm
144 .8mm P 4 Rows 12mm x 12mm 1.1mm
160 .8mm P 4 Rows 12mm x 12mm 1.1mm
180 .8mm P 5 Rows 12mm x 12mm 1.1mm
208 .8mm P 4 Rows 15mm x 15mm 1.1mm
2X R 0.25
0.085
1.1 (± .1mm)
0.350
0.800
30˚
0.30±0.07
Top View
0.80 TYP.
2
1
F
E
D
C
B
A
13
12
11
9
8
7
6
5
4
310
N
L
K
J
H
G
M
0.80 TYP.
0.80 TYP.
0.80 TYP.
P
14
BALL PAD A1 CORNER INDICATOR
(NO SOLDER BALL)
Bottom View
Side View
4. The Maximum Allowable Number Of Solder Balls Is 180.
3. The Maximum Solder Ball Matrix Size Is 14 x 14.
2. The Maximum Solder Ball Grid Pitch Is 0.80mm.
1. All Dimensions And Tolerances Conform To ASME Y14.5M-1994
Notes: Unless Otherwise Specified
4-29
pkg-3.7-04/99
®
Mini Array BGA Dimensions
Ball Count Ball Pitch Row Array Body Size Package Height
40 .5mm P 2 Rows 5mm x 5mm 1.24mm
49 .8mm Full Array 7mm x 7mm 1.4mm
56 .5mm P 2 Rows 6mm x 6mm 1.24mm
64 .8mm Full Array 8mm x 8mm 1.1mm
64 1.0mm Full Array 9mm x 9mm 1.4mm
81 .8mm Full Array 9mm x 9mm 1.4mm
84 .5mm P3 Rows 7mm x 7mm 1.24mm
96 .8mm P4 Rows 10mm x 10mm 1.4mm
100 .8mm Full Array 10mm x 10mm 1.4mm
100 1.0mm Full Array 11mm x 11mm 1.4mm
128 .8mm P4 Rows 11mm x 11mm 1.4mm
Packaging
4-30
pkg-3.7-04/99
Mini Array BGA 40/.5
A1 BALL PAD CORNER 1.24 ±0.10
0.20 ±0.05
5.00
5.00
0.50
0.75 REF
0.75 REF 0.50
A1 BALL PAD CORNER
1
B
C
D
E
F
G
H
243567
A
8
1.0 SPACE
T op View Side View
Bottom View
4-31
pkg-3.7-04/99
®
Mini Array BGA 49/.8
T op View Side View
Bottom View
54 21376
G
F
E
D
B
C
A
A1 BALL PAD CORNER
0.80
0.80
4.80 TYP
4.80 TYP
7.00
7.00
A1 BALL PAD CORNER 1.40 ±0.10
0.36 ±0.05
0.70 ±0.05
Packaging
4-32
pkg-3.7-04/99
Mini Array BGA 56/.5
T op View Side View
Bottom View
6.00
6.00
A1 BALL PAD CORNER
1
B
C
D
E
F
G
H
243567
A
8910
J
K
A1 BALL PAD CORNER
1.0 SPACE
0.50
0.50
0.75 REF
0.75 REF
1.24 ±0.10
0.20 ±0.05
0.70 ±0.05
4-33
pkg-3.7-04/99
®
Mini Array BGA 64/.8
T op View Side View
Bottom View
0.70 ±0.05
0.36 ±0.05
1.40 ±0.10
8.00
8.00
A1 BALL PAD CORNER
A
1
B
D
C
F
E
234567
G
H
8
A1 BALL PAD CORNER
0.80
0.80
1.20 REF
1.20 REF
Packaging
4-34
pkg-3.7-04/99
Mini Array BGA 64/1.0
T op View Side View
Bottom View
1.40 ±0.10
0.70 ±0.05
0.36 ±0.05
A1 BALL PAD CORNER 9.00
9.00
1
B
D
C
F
E
234567
8
H
G
A
A1 BALL PAD CORNER
1.00
1.00 REF
1.00 REF
1.00
4-35
pkg-3.7-04/99
®
Mini Array BGA 81/.8
T op View Side View
Bottom View
9.00
9.00
A1 BALL PAD CORNER 1.40 ±0.10
0.36 ±0.05
0.70 ±0.05
1
B
D
C
E
2345
A
9876
J
H
G
F
A1 BALL PAD CORNER
0.80
1.30 REF
1.30 REF
0.80
Packaging
4-36
pkg-3.7-04/99
Mini Array BGA 84/.5
T op View Side View
Bottom View
A
5
B
C
D
E
F
G
H
J
426
7
8
9
10
11 3 1
K
L
M
12
A1 BALL PAD CORNER
0.50
0.50
0.75 REF
0.75 REF
7.00
7.00
A1 BALL PAD CORNER
1.24 ±0.10
1.20 ±0.05
0.70 ±0.05
4-37
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®
Mini Array BGA 96/.8
1
B
D
C
E
2345
A
10 9 8 7 6
K
J
H
G
F
T op View Side View
Bottom View
1.40 ±0.10 0.36 ±0.05
0.70 ±0.05
A1 BALL PAD CORNER 10.00
10.00
0.80
0.80
1.40 REF
1.40 REF
A1 BALL PAD CORNER
Packaging
4-38
pkg-3.7-04/99
Mini Array BGA 100/.8
T op View Side View
Bottom View
1.40 ±0.10 0.36 ±0.05
0.70 ±0.05
10.00
10.00
A1 BALL PAD CORNER
A1 BALL PAD CORNER
1
B
D
C
E
2
345
A
10 9 8 7 6
K
J
H
G
F
1.40 REF 0.80
1.40 REF
0.80
4-39
pkg-3.7-04/99
®
Mini Array BGA 100/1.0
1.40 ±0.10
0.36 ±0.05
0.70 ±0.05
A1 BALL PAD CORNER 11.00
11.00
1
A1 BALL PAD CORNER
B
D
C
E
2345
1.00 REF
A
1.00 REF
1.00
109876
K
J
H
G
F
1.00
T op View Side View
Bottom View
Packaging
4-40
pkg-3.7-04/99
Mini Array BGA 128/.8
T op View Side View
Bottom View
1.40 ±0.10
0.36 ±0.05
0.70 ±0.05
A1 BALL PAD CORNER 11.00
11.00
A1 BALL PAD CORNER
1
B
D
C
E
2345
A
10 9 8 7 6
K
J
H
G
F
1112
M
L
0.80
1.10 REF
0.80
1.10 REF
4-41
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®
Thermal Impedance
The net thermal impedance of a pa rticular package or
package/heat sink system is determined by a number of
different factors. The package configuration, the
package material, the die attach material and process, the
type and placement of a heat sink, and the method of
device placement on the board all interact to determine
the total thermal impedance. Thermal impedance (θja) is
typically described by the expression:
θja = θsilicon + θdie attach + θpackage to ambient
Where θja is the measure of heat transference, junction
to ambient, in degrees C per watt.
Atmel's advanced packaging services include high-per-
formance assembly with Ag glass and epoxy die attach.
Atmel also offers industry proven heatsink technology
as well as unique thermal dissipation solutions. θja is
empirically measured and defined as follows:
Rθja = where; Tj = The junction temperature
of the device
Ta = The ambient temperature
Pd = device operating power
Calculating Maximum Junction
Temperature
To the designer working to high performance or military
requirements, the maximum junction temperature is of
primary concern and is expressed by the following:
Tj = Ta + Pd*θja
Depending on the operating conditions, industry
measured values of θja in ceramic package s can range
from 2°C to 20°C per watt. For an Atmel high-
performance gate array operating at 2 watts this would
suggest a maximum junction operating temperature of
anywhere from 29°C to 65°C at an ambient temperature
of 25°C.
The following describes how to calculate a gate array's
maximum junction temperature based on estimated
power consumption, package style, ambient air
temperature and air flow.
Junction Temperature Calculations
Tj = Ta + Pd*θja
Where:
Tj = Junction Temperature (degrees C)
Pd = Power consumption of the die (watts)
θja = Temperature coefficient of the package
(degrees C/watt). Refer to the table
on the following pages.
Example Calculation:
Die = ATL60/15
Power consumption = 0.75 watts
Max air temp = 70°C
Package = 80 PQFP
Air flow = 0 LFPM (linear feet per minute)
Junction temperature:
Tj = 70°C + (0.75 watts)*(46°C/watt) = 104.5°C
Tj Ta–()
Pd
-----------------------
Packaging
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Plastic Package θja Coefficients
All values are estimated and actual values depend
on die size, pad size, power dissipation and ambi-
ent air temperature. All estimated values are based
on a 4 layer PCB. All θja values are in degrees C
per Watt.
Package Style Body Size (mm) Lead Count θja
(0 LFPM) θja
(225 LFPM) θja
(500 LFPM)
PQFP 10 x 10 44 62 51 47
10 x 10 52 60 53 47
14 x 14 64 49 41 37
14 x 20 80 46 37 33
14 x 20 100 44 36 32
28 x 28 120 36 36 32
28 x 28 128 36 34 29
24 x 24 132 30 25 23
28 x 28 144 35 27 23
28 x 28 160 34 24 20
28 x 28 184 33 29 25
28 x 28 208 32 28 24
32 x 32 240 27
40 x 40 304 19
TQFP 7 x 7 32 79 69 61
10 x 10 44 59 52 41
7 x 7 48 77 67 63
10 x 10 64 73 60 52
14 x 14 80 50 42 37
14 x 14 100 47 39 33
14 x 14 120
14 x 20 128 59 48 42
20 x 20 144 35
24 x 24 160 32
24 x 24 176 34
24 x 24 216
PLCC 20 90 68 60
28 79 60 51
32 71 64 53
44 56 43 37
52 50 38 33
68 43 32 28
84 37 30 25
PBGA 121 33
169 29
225 26
313 22
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®
Ceramic Package θja Coefficie nts
All values are simulated or calculated and may differ from actual. Actual values depend on die
size, pad size, power dissipation and ambient air temperature. All θja values are in degrees C per Watt.
84 CQFP - Tja = 49 for die size of 238 x 314 mils, 1 Watt, Ta = 25°C
Tja = 58.4 for die size of 182 x 204 mils, 1 Watt, Ta = 25°C
100 PGA - Values for die size of 330 x 330 mils, 2 Watts, Ta = 25°C
124 PGA - Values for die size of 270 x 270 mils, 2 Watts, Ta = 25°C
124 PGA - Values for die size of 230 x 230 mils, 2 Watts, Ta = 25°C
224 PGA - Values for die size of 375 x 375 mils, 2 Watts, Ta = 25°C
299 PGA - Values for die size of 530 x 530 mils, 2 Watts, Ta = 25°C
391 PGA - Values for die size of 450 x 450 mils, 2 Watts, Ta = 25°C
447 PGA - Values for die size of 524 x 550 mils, 2-10 Watts, Ta = 25°C
Package θja Coefficients for Low Profile BGA and Mini Array BGA
Package Style Lead Count θja
(0 LFPM) θja
(200 LFPM) θja
(225 LFPM) θja
(400 LFPM) θja
(500 LFPM)
CQFP 84 49.00
PGA 100 31.50 22.7 20.2
124 28.10 20.2 18.0
160 32.90 23.7 21.1
224 22.70 16.3 14.5
299 14.40 9.5 8.1
391 14.40 9.5 8.1
447 12.80 8.4 7.2
Package Style Body Size (mm) Lead Count θja
(0 LFPM) θja
(200 LFPM) θja
(500 LFPM)
Low Profile BGA 12 x 12 144 58.4 47.5 42.0
Mini Array BGA 6 x 6 48 85.3 80.1 77.1
Mini Array BGA 8 x 8 64 61.5 56.1 53.4
Mini Array BGA 11 x 11 128 29.5 25.6 23.7
