AS1 3 4 6- 49 D u a l S te p- Do wn Conver t er with Battery Monitoring 1 General Description 2 Key Features The AS1346, AS1347, AS1348, AS1349 family is a high-efficiency, constant-frequency dual buck converter available with fixed voltage versions. The device provides two independent DC/DC Converters with output currents between 0.5A and 1.2A. The wide input voltage range (2.7V to 5.5V), automatic powersave mode and minimal external component requirements make the AS134x family perfect for SSD and many other battery-powered applications. High Efficiency: Up to 95% In shutdown mode the typical supply current decreases to 1A. The highly efficient duty cycle (100%) provides low dropout operation, prolonging battery life in portable systems. 180 Out of Phase Operation An internal synchronous switching scheme increases efficiency and eliminates the need for an external Schottky diode. The fixed switching frequency (2.0MHz) allows the use of small surface mount inductors. Low Dropout Operation: 100% Duty Cycle Output Current: see Table 1 Input Voltage Range: 2.7V to 5.5V Output Voltage Range: 1.2V to 3.6V (available in 100mV steps) Constant Frequency Operation: 2.0MHz Low Battery Detection Shutdown Mode Supply Current: 1A No Schottky Diode Required The integrated monitoring function can be configured that either the output voltage (Power Okay function ) or the input voltage (Battery Monitoring Function) can be supervised. Output Disconnect in Shutdown Non standard variants available within two weeks Table 1. Available Products 12-Pin TDFN 3x3mm Package Devices IOUT1 IOUT2 AS1346 1.2A 0.5A AS1347 0.5A 0.5A AS1348 0.5A 0.95A AS1349 1.2A 1.2A 3 Applications The device is ideal for SSD applications, mobile communication devices, laptops and PDAs, ultra-low-power systems, threshold detectors/discriminators, telemetry and remote systems, medical instruments, or any other space-limited application with low powerconsumption requirements. The AS1346-49 is available in a 12-Pin TDFN 3x3mm package. Figure 1. AS1346 - Typical Application Diagram with POK Function L1 = 3.3H VIN 2.7V to 5.5V CIN SW1 PVIN PVIN AS1346 VDD FB1 SW2 EN1 VOUT1 3.3V 1200mA COUT1 L2 = 3.3H VOUT2 1.8V 500mA COUT2 FB2 EN2 LBO LBI POK Function AGND PGND www.ams.com/DC-DC_Step-Down Revision 1.10 1 - 16 AS1346-49 Datasheet - P i n A s s i g n m e n t s 4 Pin Assignments Figure 2. Pin Assignments (Top View) SW1 1 12 SW2 PVIN 2 11 PVIN EN1 3 10 VDD FB1 4 AS1346 EN2 5 LBO 6 13 9 FB2 8 AGND 7 LBI 4.1 Pin Descriptions Table 2. Pin Descriptions Pin Number Pin Name 1 SW1 2, 11 PVIN 3 EN1 4 FB1 5 EN2 6 LBO 7 LBI 8 AGND 9 FB2 10 VDD 12 SW2 13 PGND www.ams.com/DC-DC_Step-Down Description Switch Node1 Connection to Inductor. This pin connects to the drains of the internal main and synchronous power MOSFET switches. Power Supply Connector. This pin must be closely decoupled to PGND with a 4.7F ceramic capacitor. Enable1 Input. Driving this pin above 1.2V enables VOUT1. Driving this pin below 0.5V puts the device in shutdown mode. In shutdown mode all functions are disabled, drawing 1A supply current. This pin should not be left floating. Feedback Pin 1. Feedback input to the error amplifier, connect this pin to VOUT1. The output can be factory set from 1.2V to 3.6V. For further information see Ordering Information on page 15. Enable2 Input. Driving this pin above 1.2V enables VOUT2. Driving this pin below 0.5V puts the device in shutdown mode. In shutdown mode all functions are disabled, drawing 1A supply current. This pin should not be left floating. Low Battery Comperator Output. This open-drain output is low when: - the voltage on LBI is higher than 1.2V or - LBI is connected to GND and VOUT1 is below 92.5% of its nominal value. Low Battery Comperator Input. 1.2V Threshold. May not be left floating. If connected to GND, LBO is working as Output Power Okay for VOUT1. Analog Ground. Feedback 2 Pin. Feedback input to the error amplifier, connect this pin to VOUT2. The output can be factory set from 1.2V to 3.6V. For further information see Ordering Information on page 15. Supply Connector. Connect this pin to PVIN Switch Node2 Connection to Inductor. This pin connects to the drains of the internal main and synchronous power MOSFET switches. Exposed Pad. The exposed pad must be connected to AGND. Ensure a good electrical connection to the PCB to achieve optimal thermal performance. Revision 1.10 2 - 16 AS1346-49 Datasheet - A b s o l u t e M a x i m u m R a t i n g s 5 Absolute Maximum Ratings Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 3. Absolute Maximum Ratings Parameter Min Max Units VDD, PVIN to AGND -0.3 +7.0 V PGND to AGND -0.3 +0.3 V EN, FB AGND - 0.3 VDD + 0.3 V SW PGND - 0.3 PVIN + 0.3 V PVIN to VDD -0.3 +0.3 V 1 kV +150 C +150 C Notes Electrical Parameters 7.0V max Electrostatic Discharge Human Body Model Norm: MIL 883 E method 3015 Temperature Ranges and Storage Conditions Junction Temperature (TJ-MAX) Storage Temperature Range -55 Package Body Temperature Humidity non-condensing Moisture Sensitive Level www.ams.com/DC-DC_Step-Down 5 +260 C 85 % 1 The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/ JEDEC J-STD-020 "Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices". The lead finish for Pb-free leaded packages is matte tin (100% Sn). Represents a max. floor life time of unlimited Revision 1.10 3 - 16 AS1346-49 Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s 6 Electrical Characteristics PVIN = VDD = EN = 5V, unless otherwise noted. Typical values are at TA=25C. All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. Table 4. Electrical Characteristics Symbol Parameter TA Operating Temperature Range TJ Operating Junction Temperature Range VIN Input Voltage Range VOUT Output Voltage Range IQ IOUT1 IOUT2 ISHDN Conditions Min Max Units -40 +85 C -40 +125 C VIN VOUT 2.7 5.5 V (see Table 8 on page 15) 1.2 3.6 V 2.8 mA 1 2 Quiescent Supply Current Output current 1 Output current 2 Typ AS1346, VOUT1 = 3.3V 1200 mA AS1347 500 mA AS1348 500 mA AS1349 1200 mA AS1346, VOUT2 = 1.8V 500 mA AS1347 500 mA AS1348 950 mA AS1349 1200 mA Shutdown Current 0.1 1 A 3.3 3.366 V Regulation VOUT1 VOUT2 Output Voltage 1 AS1346, IOUT1 = 100mA 3.234 +2 Accuracy Output Voltage 2 AS1346, IOUT2 = 100mA 1.764 Accuracy 1.8 % 1.836 V +2 % Line Transient Response VIN = 4.5V to 5.5V, IOUT1 = 500mA, VOUT1 = 3.3V, EN2 = 0V 50 mVpk Load Transient Response VIN = 5V, IOUT1 = 0 to 500mA, VOUT1 = 3.3V, EN2 = 0V 50 mVpk fOSC Oscillator frequency tON Turn on time 1.8 2 2.2 MHz 350 s DC-DC Switches ISW1 SW1 Current Limit AS1346 1.55 A ISW2 SW2 Current Limit AS1346 800 mA RDSON1(P) Pin-Pin Resistance for PMOS1 VDD = 5.0V, ISW = 200mA 150 m RDSON1(N) Pin-Pin Resistance for NMOS1 VDD = 5.0V, ISW = 200mA 250 m www.ams.com/DC-DC_Step-Down Revision 1.10 4 - 16 AS1346-49 Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s Table 4. Electrical Characteristics Symbol Parameter Conditions Min Typ Max Units RDSON2(P) Pin-Pin Resistance for PMOS2 VDD = 5.0V, ISW = 200mA 150 m RDSON2(N) Pin-Pin Resistance for NMOS2 VDD = 5.0V, ISW = 200mA 250 m Enable VIH,EN Logic high input threshold VIH,EN Logic low input threshold 1.2 V 0.5V V 1.24 V Low Battery & Power-OK VLBI LBI Threshold Falling Edge 1.16 LBI Hysteresis 1.2 10 mV LBI = 5V, TA = 25C 1 nA ILBO = 0.1mA 0.05 V LBO Leakage Current LBO = 5V, TA = 25C 1 nA Power-OK Threshold LBI = 0V, Falling Edge LBI Leakage Current 2 LBO Voltage Low 85 88 90 % 1. The dynamic supply current is higher due to the gate charge delivered at the switching frequency. The Quiescent Current is measured while the DC-DC Converter is not switching. 2. LBO goes low in startup mode as well as during normal operation if, 1) The voltage at the LBI pin is higher than LBI threshold. 2) The voltage at the LBI pin is below 0.1V (connected to GND) and VOUT1 is below 92.5% of its nominal value. www.ams.com/DC-DC_Step-Down Revision 1.10 5 - 16 AS1346-49 Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s 7 Typical Operating Characteristics Figure 3. AS1346 Efficiency vs. IOUT, VOUT1 = 3.3V Figure 4. AS1346 Efficiency vs. IOUT, VOUT2 = 1.8V Figure 5. AS1346 Efficiency vs. VIN, VOUT1 = 3.3V Figure 6. AS1346 Efficiency vs. VIN, VOUT2 = 1.8V Figure 7. Efficiency vs. IOUT, VOUT1 = 2.5V Figure 8. Efficiency vs. IOUT, VOUT2 = 1.2V www.ams.com/DC-DC_Step-Down Revision 1.10 6 - 16 AS1346-49 Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s Figure 9. AS1346 Load Regulation; VIN = 4.0V, VOUT1 = 3.3V Figure 11. AS1346 Line Regulation, VOUT1 = 3.3V Figure 10. AS1346 Load Regulation; VIN = 4.0V, VOUT2 =1.8V Figure 12. AS1346 Line Regulation, VOUT2 = 1.8V LDO mode Figure 13. AS1346 VOUT vs. Temp.; VIN = 5.5V, IOUT = 1A www.ams.com/DC-DC_Step-Down Figure 14. AS1346 VOUT vs. Temp.; VIN = 5.5V, IOUT = 500mA Revision 1.10 7 - 16 AS1346-49 Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s Figure 15. AS1346 IQ vs. VIN www.ams.com/DC-DC_Step-Down Figure 16. AS1346 IQ vs. VIN, both VOUT enabled Revision 1.10 8 - 16 AS1346-49 Datasheet - D e t a i l e d D e s c r i p t i o n 8 Detailed Description The AS1346, AS1347, AS1348, AS1349 family is a high-efficiency buck converter that uses a constant-frequency current-mode architecture. The device contains two internal MOSFET switches and is available with a fixed output voltage (see Ordering Information on page 15). Figure 17. AS1346 - Block Diagram VDD PVIN AS1346 Current Sense PWM COMP Error Amplifier FB1 Soft Start EN1 SW1 Mosfet Control Logic Main Control Shutdown Control VDD EN2 PVIN Oscillator Current Sense PWM COMP Error Amplifier FB2 Mosfet Control Logic Soft Start LBI Power-OK www.ams.com/DC-DC_Step-Down LBO Compare Logic AGND Revision 1.10 SW2 PGND 9 - 16 AS1346-49 Datasheet - D e t a i l e d D e s c r i p t i o n 8.1 Main Control Loop During normal operation, the internal top power MOSFET is turned on each cycle when the oscillator sets the RS latch. This switch is turned off when the current comparator resets the RS latch. The peak inductor current (IPK) at which ICOMP resets the RS latch, is controlled by the error amplifier. When ILOAD increases, VFB decreases slightly relative to the internal 0.6V reference, causing the error amplifier's output voltage to increase until the average inductor current matches the new load current. When the top MOSFET is off, the bottom MOSFET is turned on until the inductor current starts to reverse as indicated by the current reversal comparator, or the next clock cycle begins. The over-voltage detection comparator guards against transient overshoots >7.8% by turning the main switch off and keeping it off until the transient is removed. 8.2 Short-Circuit Protection The short-circuit protection turns off the power switches as long as the short is applied. When the short is removed the device is continuing normal operation. 8.3 Dropout Operation The AS1346, AS1347, AS1348, AS1349 is working with a low input-to-output voltage difference by operating at 100% duty cycle. In this state, the PMOS is always on. This is particularly useful in battery-powered applications with a 3.3V output. The AS1346, AS1347, AS1348, AS1349 allows the output to follow the input battery voltage as it drops below the regulation voltage. The quiescent current in this state is reduced to a minimal value, which aids in extending battery life. This dropout (100% duty-cycle) operation achieves long battery life by taking full advantage of the entire battery range. The input voltage requires maintaining regulation and is a function of the output voltage and the load. The difference between the minimum input voltage and the output voltage is called the dropout voltage. The dropout voltage is therefore a function of the on-resistance of the internal PMOS (RDS(ON)PMOS) and the inductor resistance (DCR) and this is proportional to the load current. Note: At low VIN values, the RDS(ON) of the P-channel switch increases (see Electrical Characteristics on page 4). Therefore, power dissipation should be taken in consideration. 8.4 Shutdown Connecting EN to GND or logic low places the AS1346, AS1347, AS1348, AS1349 in shutdown mode and reduces the supply current to 0.1A. In shutdown the control circuitry and the internal NMOS and PMOS turn off and SW becomes high impedance disconnecting the input from the output. The output capacitance and load current determine the voltage decay rate. For normal operation connect EN to VIN or logic high. Note: Pin EN should not be left floating. 8.4.1 Power-OK and Low-Battery-Detect Functionality LBO goes low in startup mode as well as during normal operation if, - The voltage at the LBI pin is above LBI threshold (1.2V). This can be used to monitor the battery voltage. - LBI pin is connected to GND and VOUT1 is below 92.5% of its nominal value. LBO works as a power-OK signal in this case. The LBI pin can be connected to a resistive-divider to monitor a particular definable voltage and compare it with a 1.2V internal reference. If LBI is connected to GND (see Figure 1 on page 1) an internal resistive-divider is activated and connected to the output. Therefore, the Power-OK functionality can be realized with no additional external components. The Power-OK feature is not active during shutdown. To obtain a logic-level output, connect a pull-up resistor from pin LBO to pin VOUT or VDD. Larger values for this resistor will help to minimize current consumption; a 100k resistor is perfect for most applications (see Figure 18 on page 11). For the circuit shown in the left of Figure 18 on page 11, the input bias current into LBI is very low, permitting large-value resistor-divider networks while maintaining accuracy. Place the resistor-divider network as close to the device as possible. Use a defined resistor for R2 and then calculate R1 as: V IN (EQ 1) R 1 = R 2 ------------ 1 V LBI Where: VLBI (the internal sense reference voltage) is 1.2V. In case of the LBI pin is connected to GND, an internal resistor-divider network is activated and compares the output voltage with a 92.5% voltage threshold (see AS1346 - Typical Application Diagram with POK Function on page 1). For this particular Power-OK application, no external resistive components (R1 and R2) are necessary. www.ams.com/DC-DC_Step-Down Revision 1.10 10 - 16 AS1346-49 Datasheet - D e t a i l e d D e s c r i p t i o n Figure 18. Typical Application Diagram with Adjustable Battery Monitoring L1 = 3.3H VIN 4.5V to 5.5V PVIN CIN PVIN AS1346 VDD R2 FB1 COUT1 L2 = 3.3H VOUT2 1.8V 500mA SW2 EN1 R1 VOUT1 3.3V 1200mA SW1 FB2 EN2 COUT2 R3 LBO LBI AGND PGND 8.5 Thermal Shutdown Due to its high-efficiency design, the AS1346 will not dissipate much heat in most applications. However, in applications where the AS1346 is running at high ambient temperature, uses a low supply voltage, and runs with high duty cycles (such as in dropout) the heat dissipated may exceed the maximum junction temperature of the device. As soon as the junction temperature reaches approximately 150C the AS1346 goes in thermal shutdown. In this mode the internal PMOS & NMOS switch are turned off. The device will power up again, as soon as the temperature falls below +140C again. www.ams.com/DC-DC_Step-Down Revision 1.10 11 - 16 AS1346-49 Datasheet - A p p l i c a t i o n I n f o r m a t i o n 9 Application Information 9.1 Component Selection Only three power components are required to complete the design of the buck converter. For the adjustable LBI two external resistors are needed. 9.2 Inductor Selection For the external inductor, a 3.3H inductor is recommended. Minimum inductor size is dependant on the desired efficiency and output current. Inductors with low core losses and small DCR at 2MHz are recommended. Table 5. Recommended Inductor L DCR Current Rating 3.3H m IMAX Calculation of IMAX: I OUT 1 V OUT 1 + I OUT 2 V OUT 2 I MAX = ------------------------------------------------------------------------------------0 7 V IN (EQ 2) 9.3 Capacitor Selection A 10F capacitor is recommended for CIN as well as a 10F for COUT. Small-sized X5R or X7R ceramic capacitors are recommended as they retain capacitance over wide ranges of voltages and temperatures. 9.3.1 Input and Output Capacitor Selection Low ESR input capacitors reduce input switching noise and reduce the peak current drawn from the battery. Also low ESR capacitors should be used to minimize VOUT ripple. Multi-layer ceramic capacitors are recommended since they have extremely low ESR and are available in small footprints. For input decoupling the ceramic capacitor should be located as close to the device as practical. A 22F input capacitor is sufficient for most applications. Larger values may be used without limitations. A 2.2F to 10F output ceramic capacitor is sufficient for most applications. Larger values up to 22F may be used to obtain extremely low output voltage ripple and improve transient response. Table 6. Recommended Input and Output Capacitor C TC Code Rated Voltage CIN 10 - 47F X5R 6.3V COUT1, COUT2 2.2 - 10F X7R 25V www.ams.com/DC-DC_Step-Down Revision 1.10 12 - 16 AS1346-49 Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s 10 Package Drawings and Markings Figure 19. 12-Pin TDFN 3x3mm Marking Table 7. Packaging Code YYWWQZZ XXXX YY marketing code year www.ams.com/DC-DC_Step-Down WW manufacturing week Q ZZ plant identifier free choice / traceability code Revision 1.10 13 - 16 AS1346-49 Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s Figure 20. 12-Pin TDFN 3x3mm Package www.ams.com/DC-DC_Step-Down Revision 1.10 14 - 16 AS1346-49 Datasheet - O r d e r i n g I n f o r m a t i o n 11 Ordering Information The device is available as the standard products listed below. Table 8. Ordering Information Ordering Code Marking AS1346-BTDT-3318 ASSL AS1347-BTDT-1812 ASU6 AS1347-BTDT-3310 ASU7 AS1348-BTDT-3312 ASTZ AS1346-BTDT-xxyy 1 1 AS1347-BTDTxxyy 1 AS1348-BTDTxxyy 1 AS1349-BTDTxxyy tbd tbd tbd tbd Channel Vout Iout OUT1 3.3V 1.2A OUT2 1.8V 0.5A OUT1 1.8V 0.5A OUT2 1.2V 0.5A OUT1 3.3V 0.5A OUT2 1.0V 0.5A OUT1 3.3V 0.5A OUT2 1.2V 0.95A OUT1 xx 1.2A OUT2 yy 0.5A OUT1 xx 0.5A OUT2 yy 0.5A OUT1 xx 0.5A OUT2 yy 0.95A OUT1 xx 1.2A OUT2 yy 1.2A Description Dual Step-Down Converter with Battery Monitoring Dual Step-Down Converter with Battery Monitoring Dual Step-Down Converter with Battery Monitoring Dual Step-Down Converter with Battery Monitoring Dual Step-Down Converter with Battery Monitoring Dual Step-Down Converter with Battery Monitoring Dual Step-Down Converter with Battery Monitoring Dual Step-Down Converter with Battery Monitoring Delivery Form Package Tape and Reel 12-Pin TDFN 3x3mm Tape and Reel 12-Pin TDFN 3x3mm Tape and Reel 12-Pin TDFN 3x3mm Tape and Reel 12-Pin TDFN 3x3mm Tape and Reel 12-Pin TDFN 3x3mm Tape and Reel 12-Pin TDFN 3x3mm Tape and Reel 12-Pin TDFN 3x3mm Tape and Reel 12-Pin TDFN 3x3mm 1. Non-standard devices from 1.2V to 3.6V are available in 100mV steps. For more information and inquiries contact http://www.ams.com/contact Receive samples within 2 weeks for any non standard output voltage variant! Note: All products are RoHS compliant. Buy our products or get free samples online at ICdirect: http://www.ams.com/ICdirect Technical Support is found at http://www.ams.com/Technical-Support For further information and requests, please contact us mailto:sales@ams.com or find your local distributor at http://www.ams.com/distributor www.ams.com/DC-DC_Step-Down Revision 1.10 15 - 16 AS1346-49 Datasheet Copyrights Copyright (c) 1997-2011, ams AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered (R). All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. 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