HSMS-8101, 8202, 8207, 8209
Surface Mount Microwave Schottky Mixer Diodes
Data Sheet
Features
•Optimized for use at 10-14 GHz
•Low Capacitance
•Low Conversion Loss
•Low RD
•Low Cost Surface Mount Plastic Package
•Lead-free Option Available
Plastic SOT-23 Package
Description/Applications
These low cost microwave Schottky diodes are
specifically designed for use at X/Ku-bands and are
ideal for DBS and VSAT downconverter applications.
They are available in SOT-23 and SOT-143 standard
package configurations.
Note that Avago's manufacturing techniques assure that
dice found in pairs and quads are taken from adjacent
sites on the wafer, assuring the highest degree of match.
Package Lead Code Identification (Top View)
Absolute Maximum Ratings[1], TA = +25°C
Symbol Parameter Unit Min. Max.
PTTotal Device Dissipation[2] mW — 75
PIV Peak Inverse Voltage V — 4
TJJunction Temperature °C — +150
TSTG, Top Storage and Operating °C -65 +150
Temperature
SERIES
#2
SINGLE
#1
12
3
RING
QUAD
#7
12
34
12
3
CROSS-OVER
QUAD
#9
12
34
Plastic SOT-143 Package
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. Measured in an infinite heat sink at TCASE = 25°C. Derate linearly to
zero at 150°C per diode.
Attention:
Observe precautions for
handling electrostatic
sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 0)
Refer to Avago Application Note A004R:
Electrostatic Discharge Damage and Control.
2
DC Electrical Specifications, TA = 25°C
Symbol Parameters and Test Conditions Units Min. Max. Min. Max. Min. Max. Min. Max.
VBR Breakdown Voltage V 4 4 4 4
IR = 10 µA
CTTotal Capacitance pF 0.26 0.26 0.26 0.26
VR = 0 V, f = 1 MHz
DCTCapacitance Difference pF —0.04 0.04 0.04
VR = 0 V, f = 1 MHz
RDDynamic Resistance Ω14 14 14 14
IF = 5 mA
DRDDynamic Resistance Difference Ω—222
IF = 5 mA
VFForward Voltage mV 250 350 250 350 250 350 250 350
IF = 1 mA
DVFForward Voltage Difference mV —20 20 20
IF = 1 mA
Lead Code 1 2 7 9
Package Marking Code R1x 2Rx R7x R9x
where x is date code
RF Electrical Parameters, TA = 25°C
Symbol Parameter Units Typical
LcConversion Loss at 12 GHz dB 6.3
ZIF IF Impedance Ω150
SWR SWR at 12 GHz 1.2
Note:
DC Load Resistance = 0 Ω; LO Power = 1 mW.
SPICE Parameters
IS = 4.6 E-8 EG = 0.69 TT = 0
RS = 6 CJO = 0.18 E-12
N = 1.09 PB (VJ) = 0.5
BV = 7.3 M = 0.5
IBV = 10E-5 FC = 0.5
Linear Equivalent Circuit
0.17 pF
R
j
0.08 pF
1.0 nH 1.3 nH 6 Ω
Self Bias
1 mA 2.5 mA
Rj256 142
HSMS-8202 HSMS-8207 HSMS-8209
HSMS-8101
3
Typical Performance, TC = 25°C
FORWARD VOLTAGE (V)
Figure 1. Typical Forward Current
vs. Forward Voltage at Three
Temperatures.
100
10
1
0.1
0.01
FORWARD CURRENT (mA)
0 0.2 0.4 0.6 0.8
V - FORWARD VOLTAGE (V)
Figure 2. Typical VF Match, HSMS-
820X Pairs and Quads.
30
10
IF - FORWARD CURRENT (mA)
∆VF - FORWARD VOLTAGE DIFFERENCE (mV
)
0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55
1
0.3
30
10
1
0.3
IF (Left Scale)
∆VF (Right Scale)
LOCAL OSCILLATOR POWER (dBm)
Figure 3. Typical Conversion Loss
vs. Local Oscillator Power.
9
8
7
6
CONVERSION LOSS (dB)
–7 –5 –3 –1 1 3 5 7 9 11 13
T
A
= +125°C
T
A
= +25°C
T
A
= –55°C
Profile Option Descriptions
-BLK = Bulk
-TR1 = 3K pc. Tape and Reel,
Device Orientation
Figures 4, 5
-TR2 = 10K pc. Tape and Reel,
Device Orientation
Figures 4, 5
Tape and Reeling conforms to
Electronic Industries RS-481,
“Taping of Surface Mounted
Components for Automated
Placement.”
For lead-free option, the part
number will have the character "G"
at the end, eg. -TR2G for a 10K pc
lead-free reel.
Ordering Information
Specify part number followed by option. For example:
HSMS - 8101 - XXX
Bulk or Tape and Reel Option
Part Number
Surface Mount Schottky
Device Orientation
Figure 5. Option -TR1/-TR2 for SOT-143 Packages.
Figure 4. Option -TR1/-TR2 for SOT-23 Packages.
USER
FEED
DIRECTION
COVER TAPE
CARRIER
TAPE
REEL
Note: "AB" represents package marking code.
"C" represents date code.
END VIE
W
8 mm
4 mm
TOP VIEW
ABC ABC ABC ABC
Note: "AB" represents package marking code.
"C" re
p
resents date code.
END VIE
W
8 mm
4 mm
TOP VIEW
ABC ABC ABC ABC
4
Outline 143 (SOT-143)
Package Dimensions
Outline 23 (SOT-23)
Package Characteristics
Lead Material ...................................................................................... Alloy 42
Lead Finish ................................... Tin-Lead 85-15% (Non lead-free option)
or Tin 100% (Lead-free option)
Maximum Soldering Temperature .............................. 260°C for 5 seconds
Minimum Lead Strength .......................................................... 2 pounds pull
Typical Package Inductance .................................................................. 2 nH
Typical Package Capacitance .............................. 0.08 pF (opposite leads)
e
B
e2
e1
E1
C
EXXX
L
D
A
A1
Notes:
XXX-package marking
Drawings are not to scale
DIMENSIONS (mm)
MIN.
0.79
0.000
0.37
0.086
2.73
1.15
0.89
1.78
0.45
2.10
0.45
MAX.
1.20
0.100
0.54
0.152
3.13
1.50
1.02
2.04
0.60
2.70
0.69
SYMBOL
A
A1
B
C
D
E1
e
e1
e2
E
L
eB
e2
B1
e1
E1
C
EXXX
L
D
A
A1
Notes:
XXX-package marking
Drawings are not to scale
DIMENSIONS (mm)
MIN.
0.79
0.013
0.36
0.76
0.086
2.80
1.20
0.89
1.78
0.45
2.10
0.45
MAX.
1.097
0.10
0.54
0.92
0.152
3.06
1.40
1.02
2.04
0.60
2.65
0.69
SYMBOL
A
A1
B
B1
C
D
E1
e
e1
e2
E
L
e
0.081
2.05 0.071
1.8
0.112
2.85
0.079
2
0.033
0.85
0.048
1.2
0.114
2.9
0.033
0.85
0.047
1.2
0.031
0.8
0.033
0.85
Dimensions in inches
mm
0.039
1
0.039
1
0.079
2.0
0.031
0.8
Dimensions in inches
mm
0.035
0.9
Recommended PCB Pad Layout for
Avago’s SOT-23 Products
Recommended PCB Pad Layout for
Avago’s SOT-143 Products
5
Tape Dimensions and Product Orientation
For Outline SOT-23
9° MAX
A
0
P
P
0
DP
2
E
F
W
D
1
Ko 8° MAX
B
0
13.5° MAX
t1
DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A
0
B
0
K
0
P
D
1
3.15 ± 0.10
2.77 ± 0.10
1.22 ± 0.10
4.00 ± 0.10
1.00 + 0.05
0.124 ± 0.004
0.109 ± 0.004
0.048 ± 0.004
0.157 ± 0.004
0.039 ± 0.002
CAVITY
DIAMETER
PITCH
POSITION
D
P
0
E
1.50 + 0.10
4.00 ± 0.10
1.75 ± 0.10
0.059 + 0.004
0.157 ± 0.004
0.069 ± 0.004
PERFORATION
WIDTH
THICKNESS
W
t1
8.00 + 0.30 – 0.10
0.229 ± 0.013
0.315 + 0.012 – 0.004
0.009 ± 0.0005
CARRIER TAPE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
F
P
2
3.50 ± 0.05
2.00 ± 0.05
0.138 ± 0.002
0.079 ± 0.002
DISTANCE
BETWEEN
CENTERLINE
W
F
E
P2
P0
D
P
D1
DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A0
B0
K0
P
D1
3.19 ± 0.10
2.80 ± 0.10
1.31 ± 0.10
4.00 ± 0.10
1.00 + 0.25
0.126 ± 0.004
0.110 ± 0.004
0.052 ± 0.004
0.157 ± 0.004
0.039 + 0.010
CAVITY
DIAMETER
PITCH
POSITION
D
P0
E
1.50 + 0.10
4.00 ± 0.10
1.75 ± 0.10
0.059 + 0.004
0.157 ± 0.004
0.069 ± 0.004
PERFORATION
WIDTH
THICKNESS
W
t1
8.00 + 0.30 – 0.10
0.254 ± 0.013
0.315+ 0.012 – 0.004
0.0100 ± 0.0005
CARRIER TAPE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
F
P2
3.50 ± 0.05
2.00 ± 0.05
0.138 ± 0.002
0.079 ± 0.002
DISTANCE
A0
9° MAX 9° MAX
t1
B
0
K
0
Tape Dimensions and Product Orientation
For Outline SOT-143
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte.
in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
Obsoletes 5989-2496EN
5989-4024EN September 8, 2006
