Data sheet acquired from Harris Semiconductor
SCHS052B – Revised June 2003
The CD4067B and CD4097B types are supplied
in 24-lead hermetic dual-in-line ceramic
packages (F3A suffix), 24-lead dual-in-line
plastic packages (E suffix), 24-lead
small-outline packages (M, M96, and NSR
suffixes), and 24-lead thin shrink small-outline
packages (P and PWR suffixes).
Copyright © 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
CD4067BE ACTIVE PDIP N 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4067BE
CD4067BEE4 ACTIVE PDIP N 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4067BE
CD4067BF ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4067BF
CD4067BF3A ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4067BF3A
CD4067BM ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM
CD4067BM96 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM
CD4067BM96E4 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM
CD4067BM96G4 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM
CD4067BME4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM
CD4067BMG4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM
CD4067BPW ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM067B
CD4067BPWE4 ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM067B
CD4067BPWG4 ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM067B
CD4097BE ACTIVE PDIP N 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4097BE
CD4097BEE4 ACTIVE PDIP N 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4097BE
CD4097BF ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4097BF
CD4097BM ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4097BM
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
CD4097BME4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4097BM
CD4097BMG4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4097BM
CD4097BPW ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM097B
CD4097BPWE4 ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM097B
CD4097BPWG4 ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM097B
CD4097BPWR ACTIVE TSSOP PW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM097B
CD4097BPWRE4 ACTIVE TSSOP PW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM097B
CD4097BPWRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM097B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 3
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4067B, CD4067B-MIL, CD4097B, CD4097B-MIL :
•Catalog: CD4067B, CD4097B
•Military: CD4067B-MIL, CD4097B-MIL
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
CD4067BM96 SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1
CD4067BM96G4 SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1
CD4097BPWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Oct-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4067BM96 SOIC DW 24 2000 367.0 367.0 45.0
CD4067BM96G4 SOIC DW 24 2000 367.0 367.0 45.0
CD4097BPWR TSSOP PW 24 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Oct-2012
Pack Materials-Page 2
MECHANICAL DATA
MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
J (R-GDIP-T**) CERAMIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
A
C
0.018 (0,46) MIN
Seating Plane
0.010 (0.25) MAX
Lens Protrusion (Lens Optional)
WIDENARRWIDE
32
NARRWIDE
0.125 (3,18) MIN
0.514(13,06) 0.571(14,50)
0.541(13,74) 0.598(15,19)
1.668(42,37) 1.668(42,37)
1.632(41,45) 1.632(41,45)
0.590(14,99) 0.590(14,99)
0.624(15,85) 0.624(15,85)
4040084/C 10/97
0.012 (0,30)
0.008 (0,20)
40
0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99)
2.032(51,61) 2.032(51,61)
2.068(52,53) 2.068(52,53)
0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50)
B
13
12
0.090 (2,29)
0.060 (1,53)
0.045 (1,14)
0.065 (1,65)
24
1
28
0.022 (0,56)
0.014 (0,36)
NARR
24
NARR WIDE
0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99)
1.235(31,37) 1.235(31,37)
1.265(32,13) 1.265(32,13)
0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50)
”A”
DIM
”B”
”C”
PINS **
MAX
MIN
MIN
MAX
MAX
MIN 0.514(13,06) 0.571(14,50)
0.541(13,74) 0.598(15,19)
1.465(37,21) 1.465(37,21)
1.435(36,45) 1.435(36,45)
0.590(14,99) 0.590(14,99)
0.624(15,85) 0.624(15,85)
0.175 (4,45)
0.140 (3,56)
0.100 (2,54)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin).
D. This package can be hermetically sealed with a ceramic lid using glass frit.
E. Index point is provided on cap for terminal identification.
MECHANICAL DATA
MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
N (R–PDIP–T24) PLASTIC DUAL–IN–LINE
0.020 (0,51) MIN
0.021 (0,53)
0.015 (0,38)
0.100 (2,54)
1
24
0.070 (1,78) MAX 12
13
1.222 (31,04) MAX
0.125 (3,18) MIN
0’–15’
0.010 (0,25) NOM
0.425 (10,80) MAX
Seating Plane
0.200 (5,08) MAX
0.360 (9,14) MAX
0.010 (0,25)
4040051–3/D 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS–010
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