
SEMICONDUCTOR TECHNICAL DATA
2–257 REV 6
Motorola, Inc. 1996
9/96
 
The MC10H164 is a MECL 10H part which is a functional/pinout duplication
of the standard MECL 10K family part, with 100% improvement in propagation
delay, and no increase in power supply current.
The MC10H164 is designed to be used in data multiplexing and parallel to
serial conversion applications. Full parallel gating provides equal delays
through any data path. The MC10H164 incorporates an output buffer, eight
inputs and an enable. A high on the enable forces the output low. The open
emitter output allows the MC10H164 to be connected directly to a data bus. The
enable line allows an easy means of expanding to more than 8 lines using
additional MC10H164’ s.
Propagation Delay, 1.0 ns Typical
Power Dissipation, 310 mW Typical (same as MECL 10K)
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 0) VEE –8.0 to 0 Vdc
Input Voltage (VCC = 0) VI0 to VEE Vdc
Output Current— Continuous
— Surge Iout 50
100 mA
Operating Temperature Range TA0 to +75 °C
Storage Temperature Range— Plastic
— Ceramic Tstg –55 to +150
–55 to +165 °C
°C
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
0°25°75°
Characteristic Symbol Min Max Min Max Min Max Unit
Power Supply Current IE 83 75 83 mA
Input Current High IinH 512 320 320 µA
Input Current Low IinL 0.7 0.7 0.7 µA
High Output Voltage VOH –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
Low Output Voltage VOL –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
High Input Voltage VIH –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
Low Input Voltage VIL –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
AC PARAMETERS
Propagation Delay
Enable
Data
Address
tpd 0.4
0.7
1.0
1.45
2.4
2.8
0.4
0.8
1.1
1.5
2.5
2.9
0.5
0.9
1.2
1.7
2.6
3.2
ns
Rise T ime tr0.5 1.5 0.5 1.6 0.5 1.7 ns
Fall T ime tf0.5 1.5 0.5 1.6 0.5 1.7 ns
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through
a 50–ohm resistor to –2.0 volts.

DIP PIN ASSIGNMENT
VCC1
ENABLE
X3
X2
X1
X0
A
VEE
VCC2
Z
X7
X6
X5
X4
C
B
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
LOGIC DIAGRAM
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
A 7
B 9
C 10
Enable 2
X0 6
X1 5
X2 4
X3 3
X4 11
X5 12
X6 13
X7 14
Z
15
TRUTH TABLE
ADDRESS INPUTS
ENABLE CBAZ
L
L
L
L
L
L
L
L
L
L
H
H
L
H
L
H
X0
X1
X2
X3
HXLXX
L
L
L
L
H
H
H
H
L
L
H
H
L
H
L
H
X4
X5
X6
X7
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–1 1 of the Motorola MECL Data
Book (DL122/D).
MC10H164
MOTOROLA MECL Data
DL122 — Rev 6
2–258
FIGURE 2 — 1–OF–64 LINE MULTIPLEXER
FIGURE 1 — HIGH SPEED 16–BIT
MULTIPLEXER/DEMULTIPLEXER
TYPICAL APPLICATIONS
The Bit chosen is dependent on six–bit
code present on inputs 7, 9, 14 of the
MC10H161 and the A, B, C inputs of the
MC10H164.
MC10H161
MC10H164
E1
C
B
A
MC10H136
MC10H161
MC10H162
S0
S1
CR
ABCD
E
1
C
B
A
E
0
MC10H164
765432
1
0
E
1
C
B
AD0
Control Selection
MC10H136
MC10H164
S0
S1
CR
ABCD
15 14 13 12 11 10 9 8
76543210
E
1
C
B
AD0
Start/Stop
S0
15 14
13
12 11 10 9 8
E0
S1
CR
Dout
Dout
Dout
Dout
Dout
Dout
ABC
E
MC10H164
ABC
E
MC10H164
Dout
ABC
E
MC10H164
ABC
E
MC10H164
ABC
E
MC10H164
ABC
E
MC10H164
ABC
E
MC10H164
MC10H161
Dout
ABC
MSB
LSB
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
14
9
7
E
MC10H164
MC10H164
2–259 MOTOROLAMECL Data
DL122 — Rev 6
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
XG1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T–
SEATING
PLANE
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
H
VIEW S
K
K1
F
G1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.385 0.395 9.78 10.03
B0.385 0.395 9.78 10.03
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 ––– 0.51 –––
K0.025 ––– 0.64 –––
R0.350 0.356 8.89 9.04
U0.350 0.356 8.89 9.04
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y––– 0.020 ––– 0.50
Z2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
____
MC10H164
MOTOROLA MECL Data
DL122 — Rev 6
2–260
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
FC
S
HGD
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–A–
–B–
–T–
FE
G
NK
C
SEATING
PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.750 0.785 19.05 19.93
B0.240 0.295 6.10 7.49
C––– 0.200 ––– 5.08
D0.015 0.020 0.39 0.50
E0.050 BSC 1.27 BSC
F0.055 0.065 1.40 1.65
G0.100 BSC 2.54 BSC
H0.008 0.015 0.21 0.38
K0.125 0.170 3.18 4.31
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
____
16 9
18
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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Opportunity/Af firmative Action Employer.
How to reach us:
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MC10H164/D
*MC10H164/D*