H11C4 - Fairchild Semiconductor

PACKAGE SCHEMATIC

PHOTO SCR OPTOCOUPLERS

3/19/03

Page 1 of 11

H11C1 H11C2 H11C3 H11C4 H11C5 H11C6

DESCRIPTION

The H11C series consists of a gallium-arsenide infrared emitting diode optically coupled with a light activated silicon controlled

rectiﬁer in a dual-in-line package

FEATURES

• High efﬁciency, low degradation, liquid epitaxial LED

• Underwriters Laboratory (UL) recognized ﬂ File #E90700

• VDE recognized (File #94766) – ordering option .300. (e.g., H11C1.300)

• 200V/400V Peak blocking voltage

• High isolation voltage - 5300V AC (RMS)

APPLICATIONS

•Low power logic circuits

•Telecommunications equipment

•Portable electronics

• Solid state relays

• Interfacing coupling systems of different potentials and impedances.

• 10 A, T

2

L compatible, solid state relay

• 25 W logic indicator lamp driver

• 200 V symmetrical transistor coupler (H11C1, H11C2, H11C3)

• 400 V symmetrical transistor coupler (H11C4, H11C5, H11C6)

6

1

6

1

6

1CATHODE

ANODE

1

2

3

ANODE

CATHODE

4

5

6GATE

N/C

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H11C1 H11C2 H11C3 H11C4 H11C5 H11C6

Parameter Symbol Device Value Units

TOTAL DEVICE

Storage Temperature T

STG

All -55 to +150 °C

Operating Temperature T

OPR

All -55 to +100 °C

Lead Solder Temperature T

SOL

All 260 for 10 sec °C

EMITTER

Continuous Forward Current I

F

All 60 mA

Reverse Voltage V

R

All 6 V

Forward Current - Peak (1 µs pulse, 300 pps) I

F(pk)

All 3.0 A

LED Power Dissipation P

D

All 100 mW

Derate above 25°C 1.33 mW/°C

DETECTOR

Power Dissipation (ambient) P

D

All 400 mW

Derate linearly above 25°C ambient 5.3 mW/°C

Power Dissipation (case) P

D

All 1W

Derate linearly above 25°C case 13.3 mW/°C

Peak Reverse Gate Voltage V

GR

All 6 V

RMS On-State Current I

DM (RMS)

All 300 mA

Peak On-State Current (100 µS, 1% duty cycle) I

DM (Peak)

All 10 A

Surge Current (10ms) I

DM (Surge)

All 5 A

Peak Forward Voltage V

DM

H11C1, H11C2, H11C3 200 V

Peak Forward Voltage V

DM

H11C4, H11C5, H11C6 400 V

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PHOTO SCR OPTOCOUPLERS

H11C1 H11C2 H11C3 H11C4 H11C5 H11C6

*Typical values at T

A

= 25°C

ELECTRICAL CHARACTERISTICS

(T

A

= 25°C Unless otherwise speciﬁed.)

INDIVIDUAL COMPONENT CHARACTERISTICS

Parameter Test Conditions Symbol Device Min Typ* Max Unit

EMITTER

Input Forward

Voltage I

F

= 10 mA V

F

All 1.2 1.5 V

Reverse Leakage

Current V

R

= 3 V I

R

All 10 µA

Capacitance V

F

= 0 V, f = 1.0 MHz C

J

All 50 pF

DETECTOR

Off-State Voltage R

GK

= 10k

Ω

, T

A

= 100°C, I

D

= 50µA V

DM

H11C1, H11C2, H11C3 200 V

R

GK

= 10k

Ω

, T

A

= 100°C, I

D

= 150µA H11C4, H11C5, H11C6 400

Reverse Voltage R

GK

= 10k

Ω

,T

A

= 100°C, I

R

= 50µA V

RM

H11C1, H11C2, H11C3 200 V

R

GK

= 10k

Ω

,T

A

= 100°C, I

R

= 150µA H11C4, H11C5, H11C6 400

On-State Voltage I

TM

= 300 mA V

TM

All 1.2 1.3 V

Off-State Current

V

DM

= 200V, T

A

= 100°C, I

F

= 0 mA,

R

GK

= 10k

Ω

I

DM

H11C1, H11C2, H11C3 50 µA

V

DM

= 400V, T

A

= 100°C, I

F

= 0 mA,

R

GK

= 10k

Ω

H11C4, H11C5, H11C6 150

Reverse Current

V

RM

= 200 V, T

A

= 100 °C, I

F

= 0 mA,

R

GK

= 10k

Ω

I

RM

H11C1, H11C2, H11C3 50

µA

V

RM

= 400 V, T

A

= 100 °C, I

F

= 0 mA,

R

GK

= 10k

Ω

H11C4, H11C5, H11C6 150

TRANSFER CHARACTERISTICS

(T

A

= 25°C Unless otherwise speciﬁed.)

Characteristics Test Conditions Symbol Device Min Typ* Max Units

Input Current to Trigger

V

AK

= 50 V, R

GK

= 10 k

Ω

I

FT

H11C1,H11C2,

H11C4, H11C5 20

H11C3, H11C6 30 mA

V

AK

= 100 V, R

GK

= 27 k

Ω

H11C1,H11C2,

H11C4, H11C5 11

H11C3, H11C6 14

Coupled dv/dt, input to

output (ﬁgure 8) dv/dt ALL 500 V/µS

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PHOTO SCR OPTOCOUPLERS

H11C1 H11C2 H11C3 H11C4 H11C5 H11C6

*Typical values at T

A

= 25°C

Note

1. For this test, LED pins 1 and 2 are common, and SCR pins 4, 5 and 6 are common.

ISOLATION CHARACTERISTICS

Characteristic Test Conditions Symbol Min Typ* Max Units

Isolation Voltage (t = 1 min.) (note 1) V

ISO

5300 V

Isolation Resistance (note 1) (V

I-O

= 500 VDC) R

ISO

10

11

Ω

Isolation Capacitance (note 1) (f = 1 MHz, V

I-O

= 0) C

I-O

0.8 pF

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PHOTO SCR OPTOCOUPLERS

H11C1 H11C2 H11C3 H11C4 H11C5 H11C6

Figure 1. LED Forward Current vs. Forward Voltage

Figure 3. Input Trigger Current vs. Temperature Figure 4. Off-State Current vs. Temperature

Figure 2. Trigger Current vs Anode-Cathode Voltage

FORWARD VOLTAGE - VF (V)

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

FORWARD CURRENT - IF (mA)

0.1

1

10

100

TA = 100˚C

TA = 25˚C

TA = -40˚C

VAK, ANODE-CATHODE VOLTAGE (V)

110100

I

FT

, NORMALIZED TRIGGER CURRENT

0.1

1

10

100

RGK

= 300 ohm

RGK = 1K

RGK = 10K

NORMALIZED TO

VAK = 50V

RGK = 10K

TA = 25oC

RGK = 27K

RGK

= 56K

TA, AMBIENT TEMPERATURE (

o

C)

-60 -40 -20 0 20 40 60 80 100

I

FT

, INPUT TRIGGER CURRENT, NORMALIZED

0.1

1

10

RGK = 300 ohm

RGK = 1K

RGK = 10K

RGK = 27K

RGK = 56K

NORMALIZED TO

TA = 25 oC

RGK = 10K

V

AK = 50V

TA, AMBIENT TEMPERATURE (

o

C)

020406080100

I

DM

, OFF-STATE FORWARD CURRENT, NORMALIZED

0.1

1

10

100

1000

oC

NORMALIZED TO

TA = 25

VAK = 50V

V

AK = 400V

V

AK = 200V

V

AK = 50V

3/19/03

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PHOTO SCR OPTOCOUPLERS

H11C1 H11C2 H11C3 H11C4 H11C5 H11C6

Figure 5. Forward Blocking Voltage, VDM vs. Temperature

T

A

, AMBIENT TEMPERATURE (

o

C)

020406080100

VDM , FORWARD BLOCKING VOLTAGE (V)

300

350

400

450

500

550

600

650

700

RGK = 10K, 20K

RGK = 50K

RGK = 100K

ON-STATE VOLTAGE - VTM (V)

0.0 0.5 1.0 1.5 2.0 2.5 3.0

ON-STATE CURRENT - ITM (mA)

1

10

100

1000

Figure 6. On-State Characteristics

Figure 7. Holding Current, IH vs. Temperature

TA = 100˚C

TA = 25˚C

TA, AMBIENT TEMPERATURE ( oC)

-60 -40 -20 0 20 40 60 80 100

IH, HOLDING CURRENT (µA)

10

100

1000

10000

RGK = 300 ohm

RGK = 1K

RGK = 10K

RGK = 27K

RGK = 56K

3/19/03

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PHOTO SCR OPTOCOUPLERS

H11C1 H11C2 H11C3 H11C4 H11C5 H11C6

TYPICAL APPLICATIONS

10A, T

2

L COMPATIBLE, SOLID

STATE RELAY

Use of the H11C4 for high sensitiv-

ity, 5300 V isolation capability,

provides this highly reliable solid

state relay design. This design is

compatible with 74, 74S and 74H

series T

2L logic systems inputs

and 120V AC (H11C1, H11C2,

H11C3) or 220V AC (H11C4,

H11C5, H11C6) loads up to 10A.

25W, LOGIC INDICATOR LAMP DRIVER

The high surge capability and non-reactive input characteris-

tics of the H11C allow it to directly couple, without buffers,

T2L and DTL logic to indicator alarm devices, without danger

of introducing noise and logic glitches.

200V/400V SYMMETRICAL TRANSISTOR COUPLER

Use of the high voltage PNP portion of the H11C provides a 400V transistor capable of

conducting positive and negative signals with current transfer ratios of over 1%. This function

is useful in remote instrumentation, high voltage power supplies and test equipment. Care

should be taken not to exceed the H11C 400mW power dissipation rating when used at high

voltages.

+5V

470 Ω

"COIL"

H11CX

56K

100 Ω

47 Ω

SC146D 0.1 µ

F

LOAD

"CONTACT"

120 VAC (H11C1, H11C2, H11C3)

220 VAC (H11C4, H11C5, H11C6)

IN5060 (4)

120 VAC (H11C1, H11C2, H11C3)

220 VAC (H11C4, H11C5, H11C6)

LOGIC

+5V

56K

470 Ω

H11CX

0.1 µ

F

100 Ω

INPUT

INDICATOR

LAMP

OUTPUT

INPUT

H11CX

Fig. 8 Coupled dv/dt - Test Circuit

tp

+

H11C4

-

Vp

H

EXPONENTIAL OSCILLOSCOPE

10 KΩ

RAMP GEN.

100 Ω

+100 VAC

Vp = 800 Volts

tp = .010 Seconds

f = 25 Hertz

TA = 25

°

C

dv / dt

.63 Vp

Vp

3/19/03

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PHOTO SCR OPTOCOUPLERS

H11C1 H11C2 H11C3 H11C4 H11C5 H11C6

Package Dimensions (Through Hole) Package Dimensions (Surface Mount)

Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for

Surface Mount Leadform

0.100 (2.54)

TYP

0.020 (0.51)

MIN

0.350 (8.89)

0.330 (8.38)

0.270 (6.86)

0.240 (6.10)

PIN 1

ID.

0.022 (0.56)

0.016 (0.41)

0.070 (1.78)

0.045 (1.14)

0.200 (5.08)

0.115 (2.92)

0.300 (7.62)

TYP

0° to 15°

0.154 (3.90)

0.100 (2.54)

SEATING PLANE

0.016 (0.40)

0.008 (0.20)

Lead Coplanarity : 0.004 (0.10) MAX

0.270 (6.86)

0.240 (6.10)

0.350 (8.89)

0.330 (8.38)

0.300 (7.62)

TYP

0.405 (10.30)

MAX

0.315 (8.00)

MIN

0.016 (0.40) MIN

2

5

PIN 1

ID.

0.016 (0.41)

0.008 (0.20)

0.100 (2.54)

TYP

0.022 (0.56)

0.016 (0.41)

0.070 (1.78)

0.045 (1.14)

0.200 (5.08)

0.165 (4.18)

4

3

0.020 (0.51)

MIN

1

6

SEATING PLANE

0.016 (0.40)

0.008 (0.20)

0.070 (1.78)

0.045 (1.14)

0.350 (8.89)

0.330 (8.38)

0.154 (3.90)

0.100 (2.54)

0.200 (5.08)

0.135 (3.43)

0.004 (0.10)

MIN

0.270 (6.86)

0.240 (6.10)

0.400 (10.16)

TYP

0° to 15°

0.022 (0.56)

0.016 (0.41)

0.100 (2.54) TYP

0.070

(

1.78

)

0.060

(

1.52

)

0.030

(

0.76

)

0.100

(

2.54

)

0.295

(

7.49

)

0.415

(

10.54

)

Note

All dimensions are in inches (millimeters)

3/19/03

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PHOTO SCR OPTOCOUPLERS

H11C1 H11C2 H11C3 H11C4 H11C5 H11C6

ORDERING INFORMATION

MARKING INFORMATION

Option Order Entry Identiﬁer Description

S.S Surface Mount Lead Bend

SD .SD Surface Mount; Tape and Reel

W.W 0.4" Lead Spacing

300 .300 VDE 0884

300W .300W VDE 0884, 0.4" Lead Spacing

3S .3S VDE 0884, Surface Mount

3SD .3SD VDE 0884, Surface Mount, Tape and Reel

H11C1

V XX YY K

1

2

6

43 5

Deﬁnitions

1Fairchild logo

2Device number

3VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table)

4Two digit year code, e.g., ‘03’

5Two digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

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PHOTO SCR OPTOCOUPLERS

H11C1 H11C2 H11C3 H11C4 H11C5 H11C6

NOTE

All dimensions are in inches (millimeters)

Reﬂow Proﬁle (Black Package, No Sufﬁx)

Carrier Tape Specifications

4.0 ± 0.1

Ø1.55 ± 0.05

User Direction of Feed

4.0 ± 0.1

1.75 ± 0.10

7.5 ± 0.1

16.0 ± 0.3

12.0 ± 0.1

0.30 ± 0.05

13.2 ± 0.2

4.85 ± 0.20

0.1 MAX 10.30 ± 0.20

9.55 ± 0.20

Ø1.6 ± 0.1

• Peak reflow temperature: 225° C (package surface temperature)

• Time of temperature higher than 183° C for 60–150 seconds

• One time soldering reflow is recommended

215°C, 10–30 s

225 C peak

Time (Minute)

0

300

250

200

150

100

50

0

0.5 1 1.5 2 2.5 3 3.5 4 4.5

Temperature (°C)

Time above 183° C, 60–150 sec

Ramp up = 3 C/sec

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES

OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR

CORPORATION. As used herein:

1. Life support devices or systems are devices or systems

which, (a) are intended for surgical implant into the body, or

(b) support or sustain life, and (c) whose failure to perform

when properly used in accordance with instructions for use

provided in the labeling, can be reasonably expected to

result in a significant injury of the user.

2. A critical component in any component of a life support

device or system whose failure to perform can be

reasonably expected to cause the failure of the life support

device or system, or to affect its safety or effectiveness.

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO

ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME

ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;

NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

3/19/03

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PHOTO SCR OPTOCOUPLERS

H11C1 H11C2 H11C3 H11C4 H11C5 H11C6