November 2005 / C
Neil Solano Page 1
TAK CHEONG
®
SEMICONDUCTOR
1 Watt DO-41 Hermetically
Sealed Glass Zener Voltage
Regulators
Absolute Ma ximum Ra ti ng s TA = 25°C unless otherwise noted
Parameter Value Units
Storage Temperature Range -65 to +200 °C
Maximum Junction Operating Temperature +200 °C
Total Device Dissipation 1.0 Watt
Thermal Resistance Junction to Lead 53.5 °C / W
Thermal Resistance Junction to Ambient 100 °C / W
Lead Temperature (1/16” from case for 10 seconds) +230 °C
These ratings are limiting values above which the serviceability of the diode may be impaired.
Specification Features:
Zener Voltage Range 3.3 to 56 Volts
DO-41 Package (JEDEC)
Through-Hole Device Type Mounting
Hermetically Sealed Glass
Compression Bonded Construction
All external surfaces are corrosion resistant and leads are readily solderable
Cathode indicated by polarity band
Electrical Characteristics TA = 25°C unless otherwise noted
Device Type VZ @ IZT
(Volts)
Nominal
IZT
(mA)
ZZT @ IZT
()
Max
IZK
(mA)
ZZK @ IZK
()
Max
IR @ VR
(µA)
Max
VR
(Volts)
TC1N4728A 3.3 76 10 1 400 100 1
TC1N4729A 3.6 69 10 1 400 100 1
TC1N4730A 3.9 64 9 1 400 50 1
TC1N4731A 4.3 58 9 1 400 10 1
TC1N4732A 4.7 53 8 1 500 10 1
TC1N4733A 5.1 49 7 1 550 10 1
TC1N4734A 5.6 45 5 1 600 10 2
TC1N4735A 6.2 41 2 1 700 10 3
TC1N4736A 6.8 37 3.5 1 700 10 4
TC1N4737A 7.5 34 4 0.5 700 10 5
TC1N4738A 8.2 31 4.5 0.5 700 10 6
TC1N4739A 9.1 28 5 0.5 700 10 7
TC1N4740A 10 25 7 0.25 700 10 7.6
TC1N4741A 11 23 8 0.25 700 5 8.4
TC1N4742A 12 21 9 0.25 700 5 9.1
TC1N4743A 13 19 10 0.25 700 5 9.9
TC1N4744A 15 17 14 0.25 700 5 11.4
TC1N4745A 16 15.5 16 0.25 700 5 12.2
TC1N4746A 18 14 20 0.25 700 5 13.7
TC1N4747A 20 12.5 22 0.25 750 5 15.2
TC1N4748A 22 11.5 23 0.25 750 5 16.7
TC1N4749A 24 10.5 25 0.25 750 5 18.2
Cathode Anode
ELECTRICAL SYMBOL
TC1N4728A through TC1N4758A Series
AXIAL LEAD
DO41
L
1N
47
xx
T
DEVICE MARKING DIAGRAM
L : Logo
Device Code : TC1N47xxT
VZ Tolerance (T) : A = ±5%
C = ±2%
November 2005 / C
Neil Solano Page 2
TAK CHEONG
®
SEMICONDUCTOR
Electrical Characteristics TA = 25°C unless otherwise noted
Device
Type
VZ @ IZT
(Volts)
Nominal
IZT
(mA)
ZZT @ IZT
()
Max
IZK
(mA)
ZZK @ IZK
()
Max
IR @ VR
(µA)
Max
VR
(Volts)
TC1N4750A 27 9.5 35 0.25 750 5 20.6
TC1N4751A 30 8.5 40 0.25 1000 5 22.8
TC1N4752A 33 7.5 45 0.25 1000 5 25.1
TC1N4753A 36 7 50 0.25 1000 5 27.4
TC1N4754A 39 6.5 60 0.25 1000 5 29.7
TC1N4755A 43 6 70 0.25 1500 5 32.7
TC1N4756A 47 5.5 80 0.25 1500 5 35.8
TC1N4757A 51 5 95 0.25 1500 5 38.8
TC1N4758A 56 4.5 110 0.25 2000 5 42.6
VF Forward Voltage = 1.2 V Maximum @ IF = 200 mA for all types
Notes:
1. The device numbers listed have a standard tolerance on the nominal zener voltage of ±5%. Device tolerance of ±2% is
indicated by a “C” instead of an “A”.
2. For detailed information on price, availability and delivery of nominal zener voltages between the voltages sho wn and tighter
voltage tolerances, contact your nearest Tak Cheong’s representative.
3. The z ener impedance is derived from the 60-cycle ac voltage, which results when an ac current having an rms value equal to
10% of the dc zener current (IZT or IZK) is superimposed to IZT or IZK.
Electrical Symbol Definition Typical Characteristics
Symbol Parameter
VZ Reverse Zener Voltage @ IZT
IZT Reverse Current
ZZT Maximum Zener Impedance @ IZT
IZK Reverse Current
ZZK Maximum Zener Impedance @ IZK
IR Reverse Leakage Current @ VR
VR Breakdown Voltage
IF Forward Current
VF Forward Voltage @ IF
Ordering Information
Device Package Quantity
TC1N47xxA Bulk 5,000
TC1N47xxA.TB Tape and Ammo 3,000
TC1N47xxA.TR Tape and Reel 5,000
TC1N47xxA Others (…contact Tak Cheong sales representatives)
Axial-Lead Tape Packaging Standards
This axial-lead component’s packaging requirements use in automatic testing and assembly equipment. And this standard practices for
lead-tape packaging of axial-lead components meets the require ments of EIA Stan dard RS-296-D “Lead-taping of C omponents on A xial
Lead Configuration for Automatic Insertion”.
V
I
(mV)
(V)
(mA)
(mA)
VF
IF
VR IR
VZ
IZT
(nA)
November 2005 / C
Neil Solano Page 3
TAK CHEONG
®
SEMICONDUCTOR
Tape & Reel Packaging Information
Tape & Reel
Outline
Reel Dimensions
DIM Millimeters
D1 356
D2 30
D3 84
W1 77.5
Quantity Per Reel
PKG Type Quantity Per Reel
DO-41 5,000
November 2005 / C
Neil Solano Page 4
TAK CHEONG
®
SEMICONDUCTOR
Tape & Ammo Packaging Information
Tape & Ammo
Outline
Quantity Per Ammo
Box
PKG Type Quantity Per Box
DO-41 3,000
Taping Dimensions
Description Millimeters
Standard Width 52 26
Tape Spacing (B) 52 ± 0.69 26 +0.5 / -0
Component Pitch (C) 5.08 ± 0.4 5.08 ± 0.4
Untaped Lead (L1 – L2) ± 0.69 ± 0.69
Glass Offset (F ) ± 0.69 ± 0. 69
Bent (D) 1.2 Max 1.2 Max
Tape Width (G) 6.138 ± 0.576 6.138 ± 0.576
Tape Mismatch (E) 0.55 Max 0.55 Max
Taped Lead (G) 3.2 Min 3.2 Min
Lead Beyond Tape (H) 0 0
250mm x 80mm x 80mm
November 2005 / C
Neil Solano Page 5
TAK CHEONG
®
SEMICONDUCTOR
Bulk Packaging Information
Bulk Outline
Quantity Per Box
PKG Type Quantity Per Box
DO-41 5,000
Plastic Bag
DO-41 500 x 10 Plastic Bag
Quantity Per Plastic Bag
190mm x 150mm x 65mm
November 2005 / C
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TAK CHEONG
®
SEMICONDUCTOR
Package Outline
Package Case Outline
DO-41 D0-41
Millimeters Inches
DIM
Min Max Min Max
A 0.72 0.86 0.028 0.034
B 4.07 5.20 0.160 0.205
C 25.40 --- 1.000 ---
D 2.04 2.71 0.080 0.107
Notes: 1. All dimensions are within JEDEC standard.
2. DO41 polarity denoted by cathode band.