BGM13S Blue Gecko Bluetooth ® SiP
Module Data Sheet
The BGM13S is Silicon Labs’ first SiP module solution for Bluetooth 5.0 LE connectivity.
It supports 2 Mbps, 1 Mbps and coded LE Bluetooth PHYs. Also, with 512 kB of flash
and 64 kB of RAM, the BGM13S is suited to meet Bluetooth Mesh networking memory
requirements effectively.
Based on the EFR32BG13 Blue Gecko SoC, the BGM13S delivers robust RF perform-
ance, low energy consumption, a wide selection of MCU peripherals, regulatory test cer-
tificates for various regions and countries, and a simplified development experience, all
in a 6.5 × 6.5 mm package. Together with the certified software stacks and powerful
tools also offered by Silicon Labs, the BGM13S minimizes the area requirements, engi-
neering efforts and development costs associated with adding Bluetooth 5.0 or Bluetooth
Mesh connectivity to any product, accelerating its time-to-market.
The BGM13S is intended for a broad range of applications, including:
KEY FEATURES
• Bluetooth 5.0 LE compliant
•Fit for Bluetooth Mesh
• Antenna or RF Pin variants
• Up to +18 dBm TX power
• -94.1 dBm RX sensitivity at 1 Mbps
• 32-bit ARM® Cortex®-M4 core at 38.4
MHz
• 512/64 kB of flash/RAM memory
• Autonomous Hardware Crypto
Accelerators
• Integrated DC-DC converter
• 32 GPIO pins
• 6.5 mm × 6.5 mm × 1.4 mm
• Wearables
•IoT end-node devices and gateways
• Health, sports, and wellness
• Industrial, home, and building automation
• Beacons
• Smart phone, tablet, and PC accessories
Antenna Timers and Triggers
32-bit bus
Peripheral Reflex System
Serial
Interfaces
I/O Ports Analog I/F
Lowest power mode with peripheral operational:
USART
Low Energy
UARTTM
I2C
External
Interrupts
General
Purpose I/O
Pin Reset
Pin Wakeup
ADC
VDAC
Analog
Comparator
EM3—StopEM2—Deep SleepEM1—Sleep EM4—Hibernate EM4—ShutoffEM0—Active
Energy Management
Brown-Out
Detector
DC-DC
Converter
Voltage
Regulator Voltage Monitor
Power-On Reset
Other
Capacitive
Touch
Op-Amp
IDAC
CRYPTO
CRC
True Random
Number Generator
SMU
Core / Memory
ARM CortexTM M4 processor
with DSP extensions, FPU and MPU
ETM Debug Interface RAM Memory LDMA
Controller
Flash Program
Memory
Real Time
Counter and
Calendar
Cryotimer
Timer/Counter
Low Energy
Timer
Pulse Counter Watchdog Timer
Protocol Timer
Low Energy
Sensor Interface
Radio Transceiver
DEMOD
AGC
IFADC
CRC
BUFC
MOD
FRC
RAC
I
Q
RF Frontend
LNA
PA Frequency
Synthesizer
PGA
BALUN
Chip Antenna
Matching
Crystal
38.4 MHz
Clock Management
L-F
RC Oscillator
Auxiliary H-F RC
Oscillator
H-F
RC Oscillator
Ultra L-F RC
Oscillator
H-F Crystal
Oscillator
L-F Crystal
Oscillator
silabs.com | Building a more connected world. Rev. 1.0
1. Feature List
•Supported Protocols
•Bluetooth 5.0 LE
• Bluetooth Mesh
•Wireless System-on-Chip
• 2.4 GHz radio
• TX power up to +18 dBm
•High Performance 32-bit 38.4 MHz ARM Cortex®-M4 with
DSP instruction and floating-point unit for efficient signal
processing
• 512 kB flash program memory
• 64 kB RAM data memory
• Embedded Trace Macrocell (ETM) for advanced debugging
• Integrated DC-DC converter
•High Receiver Performance
• -102.1 dBm sensitivity at 125 kbit/s GFSK
• -97.9 dBm sensitivity at 500 kbit/s GFSK
• -94.1 dBm sensitivity at 1 Mbit/s GFSK
• -90.2 dBm sensitivity at 2 Mbit/s GFSK
•Low Energy Consumption
• 9.7 mA RX current at 1 Mbps, GFSK
• 8.9 mA TX current at 0 dBm output power
• 87 μA/MHz in Active Mode (EM0)
• 1.4 μA EM2 DeepSleep current (full RAM retention and
RTCC running from LFXO)
• 1.14 μA EM3 Stop current (State/RAM retention)
• Wake on Radio with signal strength detection, preamble
pattern detection, frame detection and timeout
•Regulatory Certifications
• FCC
• CE
• IC / ISEDC
• MIC / Telec
•Wide Operating Range
• 1.8 V to 3.8 V single power supply
• -40 °C to +85 °C
•Dimensions
• 6.5 mm × 6.5 mm × 1.4 mm
•Support for Internet Security
•General Purpose CRC
• True Random Number Generator (TRNG)
• 2 × Hardware Cryptographic Accelerators (CRYPTO) for
AES 128/256, SHA-1, SHA-2 (SHA-224 and SHA-256) and
ECC
•Wide Selection of MCU Peripherals
• 12-bit 1 Msps SAR Analog to Digital Converter (ADC)
• 2 × Analog Comparator (ACMP)
• 2 × Digital to Analog Converter (VDAC)
• 3 × Operational Amplifier (Opamp)
• Digital to Analog Current Converter (IDAC)
• Low-Energy Sensor Interface (LESENSE)
• Multi-channel Capacitive Sense Interface (CSEN)
• 32 pins connected to analog channels (APORT) shared be-
tween analog peripherals
• 32 General Purpose I/O pins with output state retention and
asynchronous interrupts
• 8 Channel DMA Controller
• 12 Channel Peripheral Reflex System (PRS)
• 2 ×16-bit Timer/Counter
• 3 or 4 Compare/Capture/PWM channels
• 1 × 32-bit Timer/Counter
• 3 Compare/Capture/PWM channels
• 32-bit Real Time Counter and Calendar
• 16-bit Low Energy Timer for waveform generation
• 32-bit Ultra Low Energy Timer/Counter for periodic wake-up
from any Energy Mode
• 16-bit Pulse Counter with asynchronous operation
• 2 × Watchdog Timer
• 3 × Universal Synchronous/Asynchronous Receiver/Trans-
mitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S)
•Low Energy UART (LEUART™)
•2 × I2C interface with SMBus support and address recogni-
tion in EM3 Stop
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Feature List
silabs.com | Building a more connected world. Rev. 1.0 | 2
2. Ordering Information
Table 2.1. Ordering Information
Ordering Code Protocol Stack Max TX Power Antenna
Flash
(kB)
RAM
(kB) GPIO Packaging
BGM13S32F512GA-V2 Bluetooth LE 18 dBm Built-in 512 64 32 Cut Tape
BGM13S32F512GA-V2R Bluetooth LE 18 dBm Built-in 512 64 32 Reel
BGM13S32F512GN-V2 Bluetooth LE 18 dBm RF pin 512 64 32 Cut Tape
BGM13S32F512GN-V2R Bluetooth LE 18 dBm RF pin 512 64 32 Reel
BGM13S22F512GA-V2 Bluetooth LE 8 dBm Built-in 512 64 32 Cut Tape
BGM13S22F512GA-V2R Bluetooth LE 8 dBm Built-in 512 64 32 Reel
BGM13S22F512GN-V2 Bluetooth LE 8 dBm RF pin 512 64 32 Cut Tape
BGM13S22F512GN-V2R Bluetooth LE 8 dBm RF pin 512 64 32 Reel
End-product manufacturers must verify that the module is configured to meet regulatory limits for each region in accordance with the
formal certification test reports.
Devices ship with the Gecko UART DFU bootloader 1.4.1 + NCP application from Bluetooth SDK 2.8.1.0. The firmware settings con-
form to the diagram shown in Figure 5.1 Typical Connections for BGM13S with UART Network Co-Processor on page 66.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Ordering Information
silabs.com | Building a more connected world. Rev. 1.0 | 3
Table of Contents
1. Feature List ................................2
2. Ordering Information ............................3
3. System Overview ..............................7
3.1 Introduction ...............................7
3.2 Radio .................................7
3.2.1 Antenna Interface ...........................7
3.2.2 RFSENSE ..............................8
3.2.3 Packet and State Trace .........................8
3.2.4 Random Number Generator ........................8
3.3 Power .................................9
3.3.1 Energy Management Unit (EMU) ......................10
3.3.2 DC-DC Converter ...........................10
3.3.3 Power Domains ............................10
3.4 General Purpose Input/Output (GPIO) ......................10
3.5 Clocking ................................10
3.5.1 Clock Management Unit (CMU) .......................10
3.5.2 Internal Oscillators and Crystal .......................11
3.6 Counters/Timers and PWM ..........................11
3.6.1 Timer/Counter (TIMER) .........................11
3.6.2 Wide Timer/Counter (WTIMER) .......................11
3.6.3 Real Time Counter and Calendar (RTCC) ...................11
3.6.4 Low Energy Timer (LETIMER) .......................11
3.6.5 Ultra Low Power Wake-up Timer (CRYOTIMER) .................11
3.6.6 Pulse Counter (PCNT) ..........................12
3.6.7 Watchdog Timer (WDOG) .........................12
3.7 Communications and Other Digital Peripherals ...................12
3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) ..........12
3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART) ..........12
3.7.3 Inter-Integrated Circuit Interface (I2C) .....................12
3.7.4 Peripheral Reflex System (PRS) ......................12
3.7.5 Low Energy Sensor Interface (LESENSE) ...................12
3.8 Security Features .............................12
3.8.1 GPCRC (General Purpose Cyclic Redundancy Check) ...............12
3.8.2 Crypto Accelerator (CRYPTO) .......................13
3.8.3 True Random Number Generator (TRNG) ...................13
3.8.4 Security Management Unit (SMU) ......................13
3.9 Analog.................................13
3.9.1 Analog Port (APORT) ..........................13
3.9.2 Analog Comparator (ACMP) ........................13
3.9.3 Analog to Digital Converter (ADC) ......................13
3.9.4 Capacitive Sense (CSEN) .........................13
3.9.5 Digital to Analog Current Converter (IDAC) ...................14
silabs.com | Building a more connected world. Rev. 1.0 | 4
3.9.6 Digital to Analog Converter (VDAC) .....................14
3.9.7 Operational Amplifiers ..........................14
3.10 Reset Management Unit (RMU) ........................14
3.11 Core and Memory ............................14
3.11.1 Processor Core ............................14
3.11.2 Memory System Controller (MSC) .....................14
3.11.3 Linked Direct Memory Access Controller (LDMA) ................14
3.12 Memory Map ..............................15
3.13 Configuration Summary ..........................16
4. Electrical Specifications ..........................17
4.1 Electrical Characteristics ..........................17
4.1.1 Absolute Maximum Ratings ........................18
4.1.2 Operating Conditions ..........................19
4.1.3 DC-DC Converter ...........................20
4.1.4 Current Consumption ..........................22
4.1.5 Wake Up Times ............................28
4.1.6 Brown Out Detector (BOD) ........................28
4.1.7 Frequency Synthesizer ..........................29
4.1.8 2.4 GHz RF Transceiver Characteristics ....................30
4.1.9 Oscillators ..............................39
4.1.10 Flash Memory Characteristics .......................42
4.1.11 General-Purpose I/O (GPIO) .......................43
4.1.12 Voltage Monitor (VMON) .........................44
4.1.13 Analog to Digital Converter (ADC) .....................45
4.1.14 Analog Comparator (ACMP) .......................47
4.1.15 Digital to Analog Converter (VDAC) .....................50
4.1.16 Current Digital to Analog Converter (IDAC) ..................53
4.1.17 Capacitive Sense (CSEN) ........................55
4.1.18 Operational Amplifier (OPAMP) ......................57
4.1.19 Pulse Counter (PCNT) .........................60
4.1.20 Analog Port (APORT) ..........................60
4.1.21 I2C ................................61
4.1.22 USART SPI .............................64
5. Typical Connection Diagrams ........................66
5.1 Typical BGM13S Connections .........................66
6. Layout Guidelines ............................68
6.1 Layout Guidelines .............................68
6.2 Effect of PCB Width ............................69
6.3 Effect of Plastic and Metal Materials .......................70
6.4 Effects of Human Body ...........................70
6.5 2D Radiation Pattern Plots ..........................71
7. Pin Definitions ..............................73
7.1 BGM13S Device Pinout ...........................73
silabs.com | Building a more connected world. Rev. 1.0 | 5
7.2 GPIO Functionality Table ..........................75
7.3 Alternate Functionality Overview ........................87
7.4 Analog Port (APORT) Client Maps .......................99
8. Package Specifications ..........................108
8.1 BGM13S Package Dimensions .......................108
8.2 BGM13S Recommeded PCB Land Pattern ...................111
8.3 BGM13S Package Marking ........................115
9. Soldering Recommendations ........................116
9.1 Soldering Recommendations ........................116
10. Certifications ..............................117
10.1 Qualified Antenna Types .........................117
10.2 Bluetooth ..............................117
10.3 CE ................................117
10.4 FCC ................................118
10.5 ISED Canada .............................119
10.6 Japan ...............................121
11. Revision History.............................122
silabs.com | Building a more connected world. Rev. 1.0 | 6
3. System Overview
3.1 Introduction
The BGM13S product family combines an energy-friendly MCU with a highly integrated radio transceiver and a high performance, ultra
robust antenna. The devices are well suited for any battery operated application, as well as other system where ultra-small size, reliable
high performance RF, low-power consumption and easy application development are key requirements. This section gives a short intro-
duction to the full radio and MCU system.
A detailed block diagram of the BGM13S module is shown in the figure below.
Analog Peripherals
Clock Management
HFRCO
IDAC
ARM Cortex-M4 Core
512 KB ISP Flash
Program Memory
64 KB RAM
A
H
B
Watchdog
Timer
RESETn
Digital Peripherals
Input Mux
Port
Mapper
Port I/O Configuration
Analog Comparator
12-bit ADC Temp
Sense
VDD
Internal
Reference
IOVDD
ULFRCO
LFXO
HFXO
Memory Protection Unit
LFRCO
A
P
B
DMA Controller
+
-
APORT
Floating Point Unit
Energy Management
PAVDD / RFVDD / DVDD
VBATT
bypass
VREGVDD / AVDD
IOVDD
VDAC
+
-
Op-Amp
Capacitive
Touch
LESENSE
CRC
CRYPTO
I2C
LEUART
USART
RTC / RTCC
PCNT
CRYOTIMER
TIMER
LETIMER
Port F
Drivers PFn
Port D
Drivers PDn
Port C
Drivers PCn
Port B
Drivers PBn
Port A
Drivers PAn
Mux & FB
DC-DC
Converter
Debug Signals
(shared w/GPIO)
Brown Out /
Power-On
Reset
Reset
Management
Unit
Serial Wire
and ETM
Debug /
Programming
AUXHFRCO
Radio Transciever
RF Frontend
PA
I
Q
LNA
BALUN
Frequency
Synthesizer
DEMOD
AGC
IFADC
CRC
BUFC
MOD
FRC
RAC
PGA
Antenna
Chip
Antenna
Matching
1V8
Voltage
Regulator
Voltage
Monitor
Internal Crystal
38.4 MHz Crystal
LFXTAL_P
LFXTAL_N
Figure 3.1. BGM13S Block Diagram
3.2 Radio
The BGM13S features a radio transceiver supporting Bluetooth® low energy protocol.
3.2.1 Antenna Interface
The BGM13S has two antenna solution variants. One of them is a high-performance integrated chip antenna (BGM13SxxFxxxxA) and
the other is a 50 Ohm matched RF pin to attach an external antenna to the module (BGM13SxxFxxxxN).
Table 3.1. Antenna Efficiency and Peak Gain
Parameter With optimal layout Note
Efficiency -1 to -2 dB Antenna efficiency, gain and radiation pattern are highly depend-
ent on the application PCB layout and mechanical design. Refer
to for PCB layout and antenna integration guidelines for optimal
performance.
Peak gain 1 dBi
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
System Overview
silabs.com | Building a more connected world. Rev. 1.0 | 7
3.2.2 RFSENSE
The RFSENSE block generates a system wakeup interrupt upon detection of wideband RF energy at the antenna interface, providing
true RF wakeup capabilities from low energy modes including EM2, EM3 and EM4.
RFSENSE triggers on a relatively strong RF signal and is available in the lowest energy modes, allowing exceptionally low energy con-
sumption. RFSENSE does not demodulate or otherwise qualify the received signal, but software may respond to the wakeup event by
enabling normal RF reception.
Various strategies for optimizing power consumption and system response time in presence of false alarms may be employed using
available timer peripherals.
3.2.3 Packet and State Trace
The BGM13S Frame Controller has a packet and state trace unit that provides valuable information during the development phase. It
features:
• Non-intrusive trace of transmit data, receive data and state information
• Data observability on a single-pin UART data output, or on a two-pin SPI data output
• Configurable data output bitrate / baudrate
• Multiplexed transmitted data, received data and state / meta information in a single serial data stream
3.2.4 Random Number Generator
The Frame Controller (FRC) implements a random number generator that uses entropy gathered from noise in the RF receive chain.
The data is suitable for use in cryptographic applications.
Output from the random number generator can be used either directly or as a seed or entropy source for software-based random num-
ber generator algorithms such as Fortuna.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
System Overview
silabs.com | Building a more connected world. Rev. 1.0 | 8
3.3 Power
The BGM13S has an Energy Management Unit (EMU) and efficient integrated regulators to generate internal supply voltages. Only a
single external supply voltage is required, from which all internal voltages are created. An integrated DC-DC buck regulator is utilized to
further reduce the current consumption. Figure 3.2 Power Supply Configuration for BGM13S22xxx Devices on page 9 and Figure
3.3 Power Supply Configuration for BGM13S32xxx Devices on page 9 show how the external and internal supplies of the module
are connected for different part numbers.
BGM13S22 Module
I/O Interfaces
IOVDD
1V8
DC-DC
IOVDD
DVDD
RFVDD
VBATT
Digital
RF
VREGVDD
220nF
4.9µF
EFR32BG13 SoC
10nF
4.7µF
VREGSW
4.7µH
PAVDD RF PA
Analog
2.2µF
DECOUPLE
AVDD
Figure 3.2. Power Supply Configuration for BGM13S22xxx Devices
BGM13S32 Module
I/O Interfaces
IOVDD
1V8
DC-DC
IOVDD
DVDD
RFVDD
VBATT
Digital
RF
VREGVDD
220nF
4.9µF
EFR32BG13 SoC
10nF
4.7µF
VREGSW
4.7µH
PAVDD RF PA
Analog
2.2µF
DECOUPLE
AVDD
Figure 3.3. Power Supply Configuration for BGM13S32xxx Devices
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
System Overview
silabs.com | Building a more connected world. Rev. 1.0 | 9
3.3.1 Energy Management Unit (EMU)
The Energy Management Unit manages transitions of energy modes in the device. Each energy mode defines which peripherals and
features are available and the amount of current the device consumes. The EMU can also be used to turn off the power to unused RAM
blocks, and it contains control registers for the dc-dc regulator and the Voltage Monitor (VMON). The VMON is used to monitor multiple
supply voltages. It has multiple channels which can be programmed individually by the user to determine if a sensed supply has fallen
below a chosen threshold.
3.3.2 DC-DC Converter
The DC-DC buck converter covers a wide range of load currents and provides up to 90% efficiency in energy modes EM0, EM1, EM2
and EM3. Patented RF noise mitigation allows operation of the DC-DC converter without degrading sensitivity of radio components.
Protection features include programmable current limiting, short-circuit protection, and dead-time protection. The DC-DC converter may
also enter bypass mode when the input voltage is too low for efficient operation. In bypass mode, the DC-DC input supply is internally
connected directly to its output through a low resistance switch. Bypass mode also supports in-rush current limiting to prevent input
supply voltage droops due to excessive output current transients.
3.3.3 Power Domains
The BGM13S has two peripheral power domains for operation in EM2 and EM3. If all of the peripherals in a peripheral power domain
are configured as unused, the power domain for that group will be powered off in the low-power mode, reducing the overall current
consumption of the device.
Table 3.2. Peripheral Power Subdomains
Peripheral Power Domain 1 Peripheral Power Domain 2
ACMP0 ACMP1
PCNT0 CSEN
ADC0 VDAC0
LETIMER0 LEUART0
LESENSE I2C0
APORT I2C1
- IDAC
3.4 General Purpose Input/Output (GPIO)
BGM13S has up to 32 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input.
More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin.
The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to sev-
eral GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripherals.
The GPIO subsystem supports asynchronous external pin interrupts.
3.5 Clocking
3.5.1 Clock Management Unit (CMU)
The Clock Management Unit controls oscillators and clocks in the BGM13S. Individual enabling and disabling of clocks to all peripher-
als is performed by the CMU. The CMU also controls enabling and configuration of the oscillators. A high degree of flexibility allows
software to optimize energy consumption in any specific application by minimizing power dissipation in unused peripherals and oscilla-
tors.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
System Overview
silabs.com | Building a more connected world. Rev. 1.0 | 10
3.5.2 Internal Oscillators and Crystal
The BGM13S fully integrates two crystal oscillators, four RC oscillators, and a 38.4 MHz crystal.
• The high-frequency crystal oscillator (HFXO) and integrated 38.4 MHz crystal provide a precise timing reference for the MCU and
radio.
• The low-frequency crystal oscillator (LFXO) provides an accurate timing reference for low energy modes and the real-time-clock cir-
cuits.
• An integrated high frequency RC oscillator (HFRCO) is available for the MCU system, when crystal accuracy is not required. The
HFRCO employs fast startup at minimal energy consumption combined with a wide frequency range.
• An integrated auxilliary high frequency RC oscillator (AUXHFRCO) is available for timing the general-purpose ADC and the Serial
Wire Viewer port with a wide frequency range.
• An integrated low frequency 32.768 kHz RC oscillator (LFRCO) for low power operation where high accuracy is not required.
• An integrated ultra-low frequency 1 kHz RC oscillator (ULFRCO) is available to provide a timing reference at the lowest energy con-
sumption in low energy modes.
3.6 Counters/Timers and PWM
3.6.1 Timer/Counter (TIMER)
TIMER peripherals keep track of timing, count events, generate PWM outputs and trigger timed actions in other peripherals through the
PRS system. The core of each TIMER is a 16-bit counter with up to 4 compare/capture channels. Each channel is configurable in one
of three modes. In capture mode, the counter state is stored in a buffer at a selected input event. In compare mode, the channel output
reflects the comparison of the counter to a programmed threshold value. In PWM mode, the TIMER supports generation of pulse-width
modulation (PWM) outputs of arbitrary waveforms defined by the sequence of values written to the compare registers, with optional
dead-time insertion available in timer unit TIMER_0 only.
3.6.2 Wide Timer/Counter (WTIMER)
WTIMER peripherals function just as TIMER peripherals, but are 32 bits wide. They keep track of timing, count events, generate PWM
outputs and trigger timed actions in other peripherals through the PRS system. The core of each WTIMER is a 32-bit counter with up to
4 compare/capture channels. Each channel is configurable in one of three modes. In capture mode, the counter state is stored in a
buffer at a selected input event. In compare mode, the channel output reflects the comparison of the counter to a programmed thresh-
old value. In PWM mode, the WTIMER supports generation of pulse-width modulation (PWM) outputs of arbitrary waveforms defined by
the sequence of values written to the compare registers, with optional dead-time insertion available in timer unit WTIMER_0 only.
3.6.3 Real Time Counter and Calendar (RTCC)
The Real Time Counter and Calendar (RTCC) is a 32-bit counter providing timekeeping in all energy modes. The RTCC includes a
Binary Coded Decimal (BCD) calendar mode for easy time and date keeping. The RTCC can be clocked by any of the on-board oscilla-
tors with the exception of the AUXHFRCO, and it is capable of providing system wake-up at user defined instances. When receiving
frames, the RTCC value can be used for timestamping. The RTCC includes 128 bytes of general purpose data retention, allowing easy
and convenient data storage in all energy modes down to EM4H.
A secondary RTC is used by the RF protocol stack for event scheduling, leaving the primary RTCC block available exclusively for appli-
cation software.
3.6.4 Low Energy Timer (LETIMER)
The unique LETIMER is a 16-bit timer that is available in energy mode EM2 Deep Sleep in addition to EM1 Sleep and EM0 Active. This
allows it to be used for timing and output generation when most of the device is powered down, allowing simple tasks to be performed
while the power consumption of the system is kept at an absolute minimum. The LETIMER can be used to output a variety of wave-
forms with minimal software intervention. The LETIMER is connected to the Real Time Counter and Calendar (RTCC), and can be con-
figured to start counting on compare matches from the RTCC.
3.6.5 Ultra Low Power Wake-up Timer (CRYOTIMER)
The CRYOTIMER is a 32-bit counter that is capable of running in all energy modes. It can be clocked by either the 32.768 kHz crystal
oscillator (LFXO), the 32.768 kHz RC oscillator (LFRCO), or the 1 kHz RC oscillator (ULFRCO). It can provide periodic Wakeup events
and PRS signals which can be used to wake up peripherals from any energy mode. The CRYOTIMER provides a wide range of inter-
rupt periods, facilitating flexible ultra-low energy operation.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
System Overview
silabs.com | Building a more connected world. Rev. 1.0 | 11
3.6.6 Pulse Counter (PCNT)
The Pulse Counter (PCNT) peripheral can be used for counting pulses on a single input or to decode quadrature encoded inputs. The
clock for PCNT is selectable from either an external source on pin PCTNn_S0IN or from an internal timing reference, selectable from
among any of the internal oscillators, except the AUXHFRCO. The peripheral may operate in energy mode EM0 Active, EM1 Sleep,
EM2 Deep Sleep, and EM3 Stop.
3.6.7 Watchdog Timer (WDOG)
The watchdog timer can act both as an independent watchdog or as a watchdog synchronous with the CPU clock. It has windowed
monitoring capabilities, and can generate a reset or different interrupts depending on the failure mode of the system. The watchdog can
also monitor autonomous systems driven by PRS.
3.7 Communications and Other Digital Peripherals
3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART)
The Universal Synchronous/Asynchronous Receiver/Transmitter is a flexible serial I/O interface. It supports full duplex asynchronous
UART communication with hardware flow control as well as RS-485, SPI, MicroWire and 3-wire. It can also interface with devices sup-
porting:
• ISO7816 SmartCards
• IrDA
•I2S
3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART)
The unique LEUARTTM provides two-way UART communication on a strict power budget. Only a 32.768 kHz clock is needed to allow
UART communication up to 9600 baud. The LEUART includes all necessary hardware to make asynchronous serial communication
possible with a minimum of software intervention and energy consumption.
3.7.3 Inter-Integrated Circuit Interface (I2C)
The I2C interface enables communication between the MCU and a serial I2C bus. It is capable of acting as both a master and a slave
and supports multi-master buses. Standard-mode, fast-mode and fast-mode plus speeds are supported, allowing transmission rates
from 10 kbit/s up to 1 Mbit/s. Slave arbitration and timeouts are also available, allowing implementation of an SMBus-compliant system.
The interface provided to software by the I2C peripheral allows precise timing control of the transmission process and highly automated
transfers. Automatic recognition of slave addresses is provided in active and low energy modes.
3.7.4 Peripheral Reflex System (PRS)
The Peripheral Reflex System provides a communication network between different peripherals without software involvement. Peripher-
als producing Reflex signals are called producers. The PRS routes Reflex signals from producers to consumer peripherals, which in
turn perform actions in response. Edge triggers and other functionality such as simple logic operations (AND, OR, NOT) can be applied
by the PRS to the signals. The PRS allows peripheral to act autonomously without waking the MCU core, saving power.
3.7.5 Low Energy Sensor Interface (LESENSE)
The Low Energy Sensor Interface LESENSETM is a highly configurable sensor interface with support for up to 16 individually configura-
ble sensors. By controlling the analog comparators, ADC, and DAC, LESENSE is capable of supporting a wide range of sensors and
measurement schemes, and can for instance measure LC sensors, resistive sensors and capacitive sensors. LESENSE also includes a
programmable finite state machine which enables simple processing of measurement results without CPU intervention. LESENSE is
available in energy mode EM2, in addition to EM0 and EM1, making it ideal for sensor monitoring in applications with a strict energy
budget.
3.8 Security Features
3.8.1 GPCRC (General Purpose Cyclic Redundancy Check)
The GPCRC block implements a Cyclic Redundancy Check (CRC) function. It supports both 32-bit and 16-bit polynomials. The suppor-
ted 32-bit polynomial is 0x04C11DB7 (IEEE 802.3), while the 16-bit polynomial can be programmed to any value, depending on the
needs of the application.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
System Overview
silabs.com | Building a more connected world. Rev. 1.0 | 12
3.8.2 Crypto Accelerator (CRYPTO)
The Crypto Accelerator is a fast and energy-efficient autonomous hardware encryption and decryption accelerator. EFR32 devices sup-
port AES encryption and decryption with 128- or 256-bit keys, ECC over both GF(P) and GF(2m), SHA-1 and SHA-2 (SHA-224 and
SHA-256).
Supported block cipher modes of operation for AES include: ECB, CTR, CBC, PCBC, CFB, OFB, GCM, CBC-MAC, GMAC and CCM.
Supported ECC NIST recommended curves include P-192, P-224, P-256, K-163, K-233, B-163 and B-233.
The CRYPTO1 block is tightly linked to the Radio Buffer Controller (BUFC) enabling fast and efficient autonomous cipher operations on
data buffer content. It allows fast processing of GCM (AES), ECC and SHA with little CPU intervention.
CRYPTO also provides trigger signals for DMA read and write operations.
3.8.3 True Random Number Generator (TRNG)
The TRNG is a non-deterministic random number generator based on a full hardware solution. The TRNG is validated with NIST800-22
and AIS-31 test suites as well as being suitable for FIPS 140-2 certification (for the purposes of cryptographic key generation).
3.8.4 Security Management Unit (SMU)
The Security Management Unit (SMU) allows software to set up fine-grained security for peripheral access, which is not possible in the
Memory Protection Unit (MPU). Peripherals may be secured by hardware on an individual basis, such that only priveleged accesses to
the peripheral's register interface will be allowed. When an access fault occurs, the SMU reports the specific peripheral involved and
can optionally generate an interrupt.
3.9 Analog
3.9.1 Analog Port (APORT)
The Analog Port (APORT) is an analog interconnect matrix allowing access to many analog peripherals on a flexible selection of pins.
Each APORT bus consists of analog switches connected to a common wire. Since many clients can operate differentially, buses are
grouped by X/Y pairs.
3.9.2 Analog Comparator (ACMP)
The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is high-
er. Inputs are selected from among internal references and external pins. The tradeoff between response time and current consumption
is configurable by software. Two 6-bit reference dividers allow for a wide range of internally-programmable reference sources. The
ACMP can also be used to monitor the supply voltage. An interrupt can be generated when the supply falls below or rises above the
programmable threshold.
3.9.3 Analog to Digital Converter (ADC)
The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to 12 bits at up to 1 Msps. The output
sample resolution is configurable and additional resolution is possible using integrated hardware for averaging over multiple samples.
The ADC includes integrated voltage references and an integrated temperature sensor. Inputs are selectable from a wide range of
sources, including pins configurable as either single-ended or differential.
3.9.4 Capacitive Sense (CSEN)
The CSEN peripheral is a dedicated Capacitive Sensing block for implementing touch-sensitive user interface elements such a
switches and sliders. The CSEN peripheral uses a charge ramping measurement technique, which provides robust sensing even in
adverse conditions including radiated noise and moisture. The peripheral can be configured to take measurements on a single port pin
or scan through multiple pins and store results to memory through DMA. Several channels can also be shorted together to measure the
combined capacitance or implement wake-on-touch from very low energy modes. Hardware includes a digital accumulator and an aver-
aging filter, as well as digital threshold comparators to reduce software overhead.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
System Overview
silabs.com | Building a more connected world. Rev. 1.0 | 13
3.9.5 Digital to Analog Current Converter (IDAC)
The IDAC can source or sink a configurable constant current. This current can be driven on an output pin or routed to the selected ADC
input pin for capacitive sensing. The full-scale current is programmable between 0.05 µA and 64 µA with several ranges consisting of
various step sizes.
3.9.6 Digital to Analog Converter (VDAC)
The Digital to Analog Converter (VDAC) can convert a digital value to an analog output voltage. The VDAC is a fully differential, 500
ksps, 12-bit converter. The opamps are used in conjunction with the VDAC, to provide output buffering. One opamp is used per single-
ended channel, or two opamps are used to provide differential outputs. The VDAC may be used for a number of different applications
such as sensor interfaces or sound output. The VDAC can generate high-resolution analog signals while the MCU is operating at low
frequencies and with low total power consumption. Using DMA and a timer, the VDAC can be used to generate waveforms without any
CPU intervention. The VDAC is available in all energy modes down to and including EM3.
3.9.7 Operational Amplifiers
The opamps are low power amplifiers with a high degree of flexibility targeting a wide variety of standard opamp application areas, and
are available down to EM3. With flexible built-in programming for gain and interconnection they can be configured to support multiple
common opamp functions. All pins are also available externally for filter configurations. Each opamp has a rail to rail input and a rail to
rail output. They can be used in conjunction with the VDAC peripheral or in stand-alone configurations. The opamps save energy, PCB
space, and cost as compared with standalone opamps because they are integrated on-chip.
3.10 Reset Management Unit (RMU)
The RMU is responsible for handling reset of the BGM13S. A wide range of reset sources are available, including several power supply
monitors, pin reset, software controlled reset, core lockup reset, and watchdog reset.
3.11 Core and Memory
3.11.1 Processor Core
The ARM Cortex-M processor includes a 32-bit RISC processor integrating the following features and tasks in the system:
• ARM Cortex-M4 RISC processor achieving 1.25 Dhrystone MIPS/MHz
• Memory Protection Unit (MPU) supporting up to 8 memory segments
• Up to 512 kB flash program memory
• Up to 64 kB RAM data memory
• Configuration and event handling of all peripherals
• 2-pin Serial-Wire debug interface
3.11.2 Memory System Controller (MSC)
The Memory System Controller (MSC) is the program memory unit of the microcontroller. The flash memory is readable and writable
from both the Cortex-M and DMA. The flash memory is divided into two blocks; the main block and the information block. Program code
is normally written to the main block, whereas the information block is available for special user data and flash lock bits. There is also a
read-only page in the information block containing system and device calibration data. Read and write operations are supported in en-
ergy modes EM0 Active and EM1 Sleep.
3.11.3 Linked Direct Memory Access Controller (LDMA)
The Linked Direct Memory Access (LDMA) controller allows the system to perform memory operations independently of software. This
reduces both energy consumption and software workload. The LDMA allows operations to be linked together and staged, enabling so-
phisticated operations to be implemented.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
System Overview
silabs.com | Building a more connected world. Rev. 1.0 | 14
3.12 Memory Map
The BGM13S memory map is shown in the figures below. RAM and flash sizes are for the largest memory configuration.
Figure 3.4. BGM13S Memory Map — Core Peripherals and Code Space
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
System Overview
silabs.com | Building a more connected world. Rev. 1.0 | 15
Figure 3.5. BGM13S Memory Map — Peripherals
3.13 Configuration Summary
Many peripherals on the BGM13S are available in multiple instances. However, certain USART, TIMER and WTIMER instances imple-
ment only a subset of the full features for that peripheral type. The table below describes the specific features available on these periph-
eral instances. All remaining peripherals support full configuration.
Table 3.3. Configuration Summary
Peripheral Configuration Pin Connections
USART0 IrDA SmartCard US0_TX, US0_RX, US0_CLK, US0_CS
USART1 IrDA I2S SmartCard US1_TX, US1_RX, US1_CLK, US1_CS
USART2 IrDA SmartCard US2_TX, US2_RX, US2_CLK, US2_CS
TIMER0 with DTI TIM0_CC[2:0], TIM0_CDTI[2:0]
TIMER1 - TIM1_CC[3:0]
WTIMER0 with DTI WTIM0_CC[2:0], WTIM0_CDTI[2:0]
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
System Overview
silabs.com | Building a more connected world. Rev. 1.0 | 16
4. Electrical Specifications
4.1 Electrical Characteristics
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
•Typical values are based on TAMB=25 °C and VDD= 3.3 V, by production test and/or technology characterization.
• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow-
er-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,
unless stated otherwise.
The BGM13S module is powered primarily from the VBATT supply pin. GPIO are powered from the IOVDD supply pin. There are also
several internal supply rails mentioned in the electrical specifications, whose connections vary based on transmit power configuration.
Refer to 3.3 Power for the relationship between the module's external supply pins and the internal voltage supply rails.
Refer to Table 4.2 General Operating Conditions on page 19 for more details about operational supply and temperature limits.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 17
4.1.1 Absolute Maximum Ratings
Stress levels beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional opera-
tion of the devices at those or any other conditions beyond those indicated in the operation listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality
and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.
Table 4.1. Absolute Maximum Ratings
Parameter Symbol Test Condition Min Typ Max Unit
Storage temperature range TSTG -40 — 85 °C
Voltage on any supply pin VDDMAX -0.3 — 3.8 V
Voltage ramp rate on any
supply pin
VDDRAMPMAX — — 1 V / µs
DC voltage on any GPIO pin VDIGPIN 5V tolerant GPIO pins1 2 3-0.3 — Min of 5.25
and IOVDD
+2
V
Standard GPIO pins -0.3 — IOVDD+0.3 V
Maximum RF level at input PRFMAX2G4 — — 10 dBm
Total current into supply pins IVDDMAX Source — — 200 mA
Total current into VSS
ground lines
IVSSMAX Sink — — 200 mA
Current per I/O pin IIOMAX Sink — — 50 mA
Source — — 50 mA
Current for all I/O pins IIOALLMAX Sink — — 200 mA
Source — — 200 mA
Junction temperature TJ-40 — 105 °C
Note:
1. When a GPIO pin is routed to the analog module through the APORT, the maximum voltage = IOVDD.
2. Valid for IOVDD in valid operating range or when IOVDD is undriven (high-Z). If IOVDD is connected to a low-impedance source
below the valid operating range (e.g. IOVDD shorted to VSS), the pin voltage maximum is IOVDD + 0.3 V, to avoid exceeding the
maximum IO current specifications.
3. To operate above the IOVDD supply rail, over-voltage tolerance must be enabled according to the GPIO_Px_OVTDIS register.
Pins with over-voltage tolerance disabled have the same limits as Standard GPIO.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 18
4.1.2 Operating Conditions
The following subsections define the operating conditions for the module.
4.1.2.1 General Operating Conditions
Table 4.2. General Operating Conditions
Parameter Symbol Test Condition Min Typ Max Unit
Operating ambient tempera-
ture range
TA-G temperature grade -40 25 85 °C
VBATT operating supply
voltage1
VVBATT DCDC in regulation 2.4 3.3 3.8 V
DCDC in bypass 50mA load 1.8 3.3 3.8 V
VBATT current IVBATT DCDC in bypass, T ≤ 85 °C — — 200 mA
HFCORECLK frequency fCORE VSCALE2, MODE = WS1 — — 40 MHz
VSCALE0, MODE = WS0 — — 20 MHz
HFCLK frequency fHFCLK VSCALE2 — — 40 MHz
VSCALE0 — — 20 MHz
Note:
1. The minimum voltage required in bypass mode is calculated using RBYP from the DCDC specification table. Requirements for
other loads can be calculated as VVBATT_min+ILOAD * RBYP_max.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 19
4.1.3 DC-DC Converter
Test conditions: V_DCDC_I=3.3 V, V_DCDC_O=1.8 V, I_DCDC_LOAD=50 mA, Heavy Drive configuration, F_DCDC_LN=7 MHz, un-
less otherwise indicated.
Table 4.3. DC-DC Converter
Parameter Symbol Test Condition Min Typ Max Unit
Input voltage range VDCDC_I Bypass mode, IDCDC_LOAD = 50
mA
1.8 — VVREGVDD_
MAX
V
Low noise (LN) mode, 1.8 V out-
put, IDCDC_LOAD = 100 mA, or
Low power (LP) mode, 1.8 V out-
put, IDCDC_LOAD = 10 mA
2.4 — VVREGVDD_
MAX
V
Output voltage programma-
ble range1
VDCDC_O 1.8 — VVREGVDD V
Regulation DC accuracy ACCDC Low Noise (LN) mode, 1.8 V tar-
get output
1.7 — 1.9 V
Regulation window2WINREG Low Power (LP) mode,
LPCMPBIASEMxx3 = 0, 1.8 V tar-
get output, IDCDC_LOAD ≤ 75 µA
1.63 — 2.2 V
Low Power (LP) mode,
LPCMPBIASEMxx3 = 3, 1.8 V tar-
get output, IDCDC_LOAD ≤ 10 mA
1.63 — 2.1 V
Steady-state output ripple VRRadio disabled — 3 — mVpp
Output voltage under/over-
shoot
VOV CCM Mode (LNFORCECCM3 =
1), Load changes between 0 mA
and 100 mA
— 25 60 mV
DCM Mode (LNFORCECCM3 =
0), Load changes between 0 mA
and 10 mA
— 45 90 mV
Overshoot during LP to LN
CCM/DCM mode transitions com-
pared to DC level in LN mode
— 200 — mV
Undershoot during BYP/LP to LN
CCM (LNFORCECCM3 = 1) mode
transitions compared to DC level
in LN mode
— 40 — mV
Undershoot during BYP/LP to LN
DCM (LNFORCECCM3 = 0) mode
transitions compared to DC level
in LN mode
— 100 — mV
DC line regulation VREG Input changes between
VVREGVDD_MAX and 2.4 V
— 0.1 — %
DC load regulation IREG Load changes between 0 mA and
100 mA in CCM mode
— 0.1 — %
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 20
Parameter Symbol Test Condition Min Typ Max Unit
Max load current ILOAD_MAX Low noise (LN) mode, Medium or
Heavy Drive4
— — 80 mA
Low noise (LN) mode, Light
Drive4
— — 50 mA
Low power (LP) mode,
LPCMPBIASEMxx3 = 0
— — 75 µA
Low power (LP) mode,
LPCMPBIASEMxx3 = 3
— — 10 mA
Note:
1. Due to internal dropout, the DC-DC output will never be able to reach its input voltage, VVREGVDD.
2. LP mode controller is a hysteretic controller that maintains the output voltage within the specified limits.
3. LPCMPBIASEMxx refers to either LPCMPBIASEM234H in the EMU_DCDCMISCCTRL register or LPCMPBIASEM01 in the
EMU_DCDCLOEM01CFG register, depending on the energy mode.
4. Drive levels are defined by configuration of the PFETCNT and NFETCNT registers. Light Drive: PFETCNT=NFETCNT=3; Medi-
um Drive: PFETCNT=NFETCNT=7; Heavy Drive: PFETCNT=NFETCNT=15.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 21
4.1.4 Current Consumption
4.1.4.1 Current Consumption 3.3 V using DC-DC Converter
Unless otherwise indicated, typical conditions are: VBATT = 3.3 V. T = 25 °C. Minimum and maximum values in this table represent the
worst conditions across process variation at T = 25 °C.
Table 4.4. Current Consumption 3.3 V using DC-DC Converter
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in EM0
mode with all peripherals dis-
abled, DCDC in Low Noise
DCM mode1
IACTIVE_DCM 38.4 MHz crystal, CPU running
while loop from flash2
— 87 — µA/MHz
38 MHz HFRCO, CPU running
Prime from flash
— 69 — µA/MHz
38 MHz HFRCO, CPU running
while loop from flash
— 70 — µA/MHz
38 MHz HFRCO, CPU running
CoreMark from flash
— 82 — µA/MHz
26 MHz HFRCO, CPU running
while loop from flash
— 76 — µA/MHz
1 MHz HFRCO, CPU running
while loop from flash
— 615 — µA/MHz
Current consumption in EM0
mode with all peripherals dis-
abled, DCDC in Low Noise
CCM mode3
IACTIVE_CCM 38.4 MHz crystal, CPU running
while loop from flash2
— 97 — µA/MHz
38 MHz HFRCO, CPU running
Prime from flash
— 80 — µA/MHz
38 MHz HFRCO, CPU running
while loop from flash
— 81 — µA/MHz
38 MHz HFRCO, CPU running
CoreMark from flash
— 92 — µA/MHz
26 MHz HFRCO, CPU running
while loop from flash
— 94 — µA/MHz
1 MHz HFRCO, CPU running
while loop from flash
— 1145 — µA/MHz
Current consumption in EM0
mode with all peripherals dis-
abled and voltage scaling
enabled, DCDC in Low
Noise CCM mode3
IACTIVE_CCM_VS 19 MHz HFRCO, CPU running
while loop from flash
— 101 — µA/MHz
1 MHz HFRCO, CPU running
while loop from flash
— 1124 — µA/MHz
Current consumption in EM1
mode with all peripherals dis-
abled, DCDC in Low Noise
DCM mode1
IEM1_DCM 38.4 MHz crystal2— 56 — µA/MHz
38 MHz HFRCO — 39 — µA/MHz
26 MHz HFRCO — 46 — µA/MHz
1 MHz HFRCO — 588 — µA/MHz
Current consumption in EM1
mode with all peripherals dis-
abled and voltage scaling
enabled, DCDC in Low
Noise DCM mode1
IEM1_DCM_VS 19 MHz HFRCO — 50 — µA/MHz
1 MHz HFRCO — 572 — µA/MHz
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 22
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in EM2
mode, with voltage scaling
enabled, DCDC in LP mode4
IEM2_VS Full 64 kB RAM retention and
RTCC running from LFXO
— 1.4 — µA
Full 64 kB RAM retention and
RTCC running from LFRCO
— 1.5 — µA
1 bank RAM retention and RTCC
running from LFRCO5
— 1.3 — µA
Current consumption in EM3
mode, with voltage scaling
enabled
IEM3_VS Full 64 kB RAM retention and
CRYOTIMER running from ULFR-
CO
— 1.14 — µA
Current consumption in
EM4H mode, with voltage
scaling enabled
IEM4H_VS 128 byte RAM retention, RTCC
running from LFXO
— 0.75 — µA
128 byte RAM retention, CRYO-
TIMER running from ULFRCO
— 0.44 — µA
128 byte RAM retention, no RTCC — 0.42 — µA
Current consumption in
EM4S mode
IEM4S No RAM retention, no RTCC — 0.07 — µA
Note:
1. DCDC Low Noise DCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=3.0 MHz (RCOBAND=0), ANASW=DVDD.
2. CMU_HFXOCTRL_LOWPOWER=0.
3. DCDC Low Noise CCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=6.4 MHz (RCOBAND=4), ANASW=DVDD.
4. DCDC Low Power Mode = Medium Drive (PFETCNT=NFETCNT=7), LPOSCDIV=1, LPCMPBIASEM234H=0, LPCLIMILIM-
SEL=1, ANASW=DVDD.
5. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 23
4.1.4.2 Current Consumption 1.8 V (DC-DC Converter in Bypass Mode)
Unless otherwise indicated, typical conditions are: VBATT = 1.8 V. T = 25 °C. Minimum and maximum values in this table represent the
worst conditions across process variation at T = 25 °C.
Table 4.5. Current Consumption 1.8 V (DC-DC Converter in Bypass Mode)
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in EM0
mode with all peripherals dis-
abled
IACTIVE 38.4 MHz crystal, CPU running
while loop from flash1
— 128 — µA/MHz
38 MHz HFRCO, CPU running
Prime from flash
— 97 — µA/MHz
38 MHz HFRCO, CPU running
while loop from flash
— 98 — µA/MHz
38 MHz HFRCO, CPU running
CoreMark from flash
— 119 — µA/MHz
26 MHz HFRCO, CPU running
while loop from flash
— 100 — µA/MHz
1 MHz HFRCO, CPU running
while loop from flash
— 243 — µA/MHz
Current consumption in EM0
mode with all peripherals dis-
abled and voltage scaling
enabled
IACTIVE_VS 19 MHz HFRCO, CPU running
while loop from flash
— 86 — µA/MHz
1 MHz HFRCO, CPU running
while loop from flash
— 206 — µA/MHz
Current consumption in EM1
mode with all peripherals dis-
abled
IEM1 38.4 MHz crystal1— 76 — µA/MHz
38 MHz HFRCO — 47 — µA/MHz
26 MHz HFRCO — 48 — µA/MHz
1 MHz HFRCO — 191 — µA/MHz
Current consumption in EM1
mode with all peripherals dis-
abled and voltage scaling
enabled
IEM1_VS 19 MHz HFRCO — 43 — µA/MHz
1 MHz HFRCO — 163 — µA/MHz
Current consumption in EM2
mode, with voltage scaling
enabled
IEM2_VS Full 64 kB RAM retention and
RTCC running from LFXO
— 1.8 — µA
Full 64 kB RAM retention and
RTCC running from LFRCO
— 2.0 — µA
1 bank (16 kB) RAM retention and
RTCC running from LFRCO2
— 1.6 — µA
Current consumption in EM3
mode, with voltage scaling
enabled
IEM3_VS Full 64 kB RAM retention and
CRYOTIMER running from ULFR-
CO
— 1.43 — µA
Current consumption in
EM4H mode, with voltage
scaling enabled
IEM4H_VS 128 byte RAM retention, RTCC
running from LFXO
— 0.83 — µA
128 byte RAM retention, CRYO-
TIMER running from ULFRCO
— 0.37 — µA
128 byte RAM retention, no RTCC — 0.36 — µA
Current consumption in
EM4S mode
IEM4S no RAM retention, no RTCC — 0.05 — µA
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 24
Parameter Symbol Test Condition Min Typ Max Unit
Note:
1. CMU_HFXOCTRL_LOWPOWER=0.
2. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 25
4.1.4.3 Current Consumption 3.3 V (DC-DC Converter in Bypass Mode)
Unless otherwise indicated, typical conditions are: VBATT = 3.3 V. T = 25 °C. Minimum and maximum values in this table represent the
worst conditions across process variation at T = 25 °C.
Table 4.6. Current Consumption 3.3 V (DC-DC Converter in Bypass Mode)
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in EM0
mode with all peripherals dis-
abled
IACTIVE 38.4 MHz crystal, CPU running
while loop from flash1
— 128 — µA/MHz
38 MHz HFRCO, CPU running
Prime from flash
— 97 — µA/MHz
38 MHz HFRCO, CPU running
while loop from flash
— 98 107 µA/MHz
38 MHz HFRCO, CPU running
CoreMark from flash
— 119 — µA/MHz
26 MHz HFRCO, CPU running
while loop from flash
— 100 109 µA/MHz
1 MHz HFRCO, CPU running
while loop from flash
— 246 430 µA/MHz
Current consumption in EM0
mode with all peripherals dis-
abled and voltage scaling
enabled
IACTIVE_VS 19 MHz HFRCO, CPU running
while loop from flash
— 86 — µA/MHz
1 MHz HFRCO, CPU running
while loop from flash
— 209 — µA/MHz
Current consumption in EM1
mode with all peripherals dis-
abled
IEM1 38.4 MHz crystal1— 76 — µA/MHz
38 MHz HFRCO — 47 51 µA/MHz
26 MHz HFRCO — 49 55 µA/MHz
1 MHz HFRCO — 195 374 µA/MHz
Current consumption in EM1
mode with all peripherals dis-
abled and voltage scaling
enabled
IEM1_VS 19 MHz HFRCO — 43 — µA/MHz
1 MHz HFRCO — 167 — µA/MHz
Current consumption in EM2
mode, with voltage scaling
enabled
IEM2_VS Full 64 kB RAM retention and
RTCC running from LFXO
— 1.9 — µA
Full 64 kB RAM retention and
RTCC running from LFRCO
— 2.2 — µA
1 bank (16 kB) RAM retention and
RTCC running from LFRCO2
— 1.9 3.3 µA
Current consumption in EM3
mode, with voltage scaling
enabled
IEM3_VS Full 64 kB RAM retention and
CRYOTIMER running from ULFR-
CO
— 1.53 3.0 µA
Current consumption in
EM4H mode, with voltage
scaling enabled
IEM4H_VS 128 byte RAM retention, RTCC
running from LFXO
— 0.93 — µA
128 byte RAM retention, CRYO-
TIMER running from ULFRCO
— 0.45 — µA
128 byte RAM retention, no RTCC — 0.44 0.9 µA
Current consumption in
EM4S mode
IEM4S No RAM retention, no RTCC — 0.04 0.18 µA
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 26
Parameter Symbol Test Condition Min Typ Max Unit
Note:
1. CMU_HFXOCTRL_LOWPOWER=0.
2. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1
4.1.4.4 Current Consumption Using Radio
Unless otherwise indicated, typical conditions are: VBATT = 3.3 V. T = 25 °C. DC-DC on. Minimum and maximum values in this table
represent the worst conditions across process variation at T = 25 °C.
Table 4.7. Current Consumption Using Radio
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in re-
ceive mode, active packet
reception (MCU in EM1 @
38.4 MHz, peripheral clocks
disabled), T ≤ 85 °C
IRX_ACTIVE 125 kbit/s, 2GFSK, F = 2.4 GHz,
Radio clock prescaled by 4
— 9.4 — mA
500 kbit/s, 2GFSK, F = 2.4 GHz,
Radio clock prescaled by 4
— 9.4 — mA
1 Mbit/s, 2GFSK, F = 2.4 GHz,
Radio clock prescaled by 4
— 9.7 — mA
2 Mbit/s, 2GFSK, F = 2.4 GHz,
Radio clock prescaled by 4
— 10.5 — mA
Current consumption in re-
ceive mode, listening for
packet (MCU in EM1 @ 38.4
MHz, peripheral clocks disa-
bled), T ≤ 85 °C
IRX_LISTEN 125 kbit/s, 2GFSK, F = 2.4 GHz,
No radio clock prescaling
— 10.4 — mA
500 kbit/s, 2GFSK, F = 2.4 GHz,
No radio clock prescaling
— 10.4 — mA
1 Mbit/s, 2GFSK, F = 2.4 GHz, No
radio clock prescaling
— 10.7 — mA
2 Mbit/s, 2GFSK, F = 2.4 GHz, No
radio clock prescaling
— 11.5 — mA
Current consumption in
transmit mode (MCU in EM1
@ 38.4 MHz, peripheral
clocks disabled), T ≤ 85 °C
ITX F = 2.4 GHz, CW, 0 dBm output
power, Radio clock prescaled by 3
— 8.9 — mA
F = 2.4 GHz, CW, 0 dBm output
power, Radio clock prescaled by 1
— 9.7 — mA
F = 2.4 GHz, CW, 8 dBm output
power
— 27.4 — mA
F = 2.4 GHz, CW, 18 dBm output
power, PAVDD connected directly
to external 3.3V supply
— 122.7 — mA
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 27
4.1.5 Wake Up Times
Table 4.8. Wake Up Times
Parameter Symbol Test Condition Min Typ Max Unit
Wake up time from EM1 tEM1_WU — 3 — AHB
Clocks
Wake up from EM2 tEM2_WU Code execution from flash — 10.9 — µs
Code execution from RAM — 3.8 — µs
Wake up from EM3 tEM3_WU Code execution from flash — 10.9 — µs
Code execution from RAM — 3.8 — µs
Wake up from EM4H1tEM4H_WU Executing from flash — 90 — µs
Wake up from EM4S1tEM4S_WU Executing from flash — 300 — µs
Time from release of reset
source to first instruction ex-
ecution
tRESET Soft Pin Reset released — 51 — µs
Any other reset released — 358 — µs
Power mode scaling time tSCALE VSCALE0 to VSCALE2, HFCLK =
19 MHz2 3
— 31.8 — µs
VSCALE2 to VSCALE0, HFCLK =
19 MHz4
— 4.3 — µs
Note:
1. Time from wake up request until first instruction is executed. Wakeup results in device reset.
2. Scaling up from VSCALE0 to VSCALE2 requires approximately 30.3 µs + 28 HFCLKs.
3. VSCALE0 to VSCALE2 voltage change transitions occur at a rate of 10 mV/µs for approximately 20 µs. During this transition,
peak currents will be dependent on the value of the DECOUPLE output capacitor, from 35 mA (with a 1 µF capacitor) to 70 mA
(with a 2.7 µF capacitor).
4. Scaling down from VSCALE2 to VSCALE0 requires approximately 2.8 µs + 29 HFCLKs.
4.1.6 Brown Out Detector (BOD)
Table 4.9. Brown Out Detector (BOD)
Parameter Symbol Test Condition Min Typ Max Unit
AVDD BOD threshold VAVDDBOD AVDD rising — — 1.8 V
AVDD falling (EM0/EM1) 1.62 — — V
AVDD falling (EM2/EM3) 1.53 — — V
AVDD BOD hysteresis VAVDDBOD_HYST — 20 — mV
AVDD BOD response time tAVDDBOD_DELAY Supply drops at 0.1V/µs rate — 2.4 — µs
EM4 BOD threshold VEM4DBOD AVDD rising — — 1.7 V
AVDD falling 1.45 — — V
EM4 BOD hysteresis VEM4BOD_HYST — 25 — mV
EM4 BOD response time tEM4BOD_DELAY Supply drops at 0.1V/µs rate — 300 — µs
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 28
4.1.7 Frequency Synthesizer
Table 4.10. Frequency Synthesizer
Parameter Symbol Test Condition Min Typ Max Unit
RF synthesizer frequency
range
fRANGE 2400 - 2483.5 MHz 2400 — 2483.5 MHz
LO tuning frequency resolu-
tion with 38.4 MHz crystal
fRES 2400 - 2483.5 MHz — — 73 Hz
Frequency deviation resolu-
tion with 38.4 MHz crystal
dfRES 2400 - 2483.5 MHz — — 73 Hz
Maximum frequency devia-
tion with 38.4 MHz crystal
dfMAX 2400 - 2483.5 MHz — — 1677 kHz
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 29
4.1.8 2.4 GHz RF Transceiver Characteristics
4.1.8.1 RF Transmitter General Characteristics for 2.4 GHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.11. RF Transmitter General Characteristics for 2.4 GHz Band
Parameter Symbol Test Condition Min Typ Max Unit
Maximum TX power1POUTMAX 18 dBm-rated part numbers. — 17.9 — dBm
8 dBm-rated part numbers — 7.8 — dBm
Minimum active TX Power POUTMIN CW -30 — dBm
Output power step size POUTSTEP -5 dBm< Output power < 0 dBm — 1 — dB
0 dBm < output power <
POUTMAX
— 0.5 — dB
Output power variation vs
supply at POUTMAX
POUTVAR_V 1.8 V < VVREGVDD < 3.3 V,
PAVDD connected directly to ex-
ternal supply, for output power >
10 dBm.
— 4.5 — dB
1.8 V < VVREGVDD < 3.3 V using
DC-DC converter
— 2.1 — dB
Output power variation vs
temperature at POUTMAX
POUTVAR_T From -40 to +85 °C, PAVDD con-
nected to DC-DC output
— 1.7 — dB
From -40 to +85 °C, PAVDD con-
nected to external supply
— 1.7 — dB
Output power variation vs RF
frequency at POUTMAX
POUTVAR_F Over RF tuning frequency range,
PAVDD connected to external
supply
— 0.3 — dB
RF tuning frequency range FRANGE 2400 — 2483.5 MHz
Note:
1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-
ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 30
4.1.8.2 RF Receiver General Characteristics for 2.4 GHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.12. RF Receiver General Characteristics for 2.4 GHz Band
Parameter Symbol Test Condition Min Typ Max Unit
RF tuning frequency range FRANGE 2400 — 2483.5 MHz
Receive mode maximum
spurious emission
SPURRX 30 MHz to 1 GHz — -57 — dBm
1 GHz to 12 GHz — -47 — dBm
Max spurious emissions dur-
ing active receive mode, per
FCC Part 15.109(a)
SPURRX_FCC 216 MHz to 960 MHz, Conducted
Measurement
— -55.2 — dBm
Above 960 MHz, Conducted
Measurement
— -47.2 — dBm
Level above which
RFSENSE will trigger1
RFSENSETRIG CW at 2.45 GHz — -24 — dBm
Level below which
RFSENSE will not trigger1
RFSENSETHRES CW at 2.45 GHz — -50 — dBm
Note:
1. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.
4.1.8.3 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 125 kbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.13. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 125 kbps Data Rate
Parameter Symbol Test Condition Min Typ Max Unit
Power spectral density limit PSDLIMIT Per FCC part 15.247 at 10 dBm — — 8 dBm/
3kHz
Per FCC part 15.247 at 20 dBm1— — 8 dBm/
3kHz
Spurious emissions out-of-
band, excluding harmonics
captured in SPURHARM,FCC.
Emissions taken at
POUTMAX, PAVDD connec-
ted to external 3.3 V supply
SPUROOB_FCC Per FCC part 15.205/15.209,
Above 2.483 GHz or below 2.4
GHz; continuous transmission of
CW carrier, Restricted Bands2 3
— -47 — dBm
Note:
1. Output power limited to 14 dBm to ensure compliance with FCC specifications.
2. For 2476 MHz, 1.2 dB of power backoff is used to achieve this value.
3. For 2478 MHz, 5.8 dB of power backoff is used to achieve this value.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 31
4.1.8.4 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 125 kbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.14. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 125 kbps Data Rate
Parameter Symbol Test Condition Min Typ Max Unit
Max usable receiver input
level, 0.1% BER
SAT Signal is reference signal1. Packet
length is 20 bytes.
— 10 — dBm
Sensitivity, 0.1% BER SENS Signal is reference signal1. Using
DC-DC converter.
— -102.1 — dBm
With non-ideal signals as speci-
fied in RF-PHY.TS.4.2.2, section
4.6.1.
— -101.8 — dBm
N+1 adjacent channel selec-
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
reference signal at -79 dBm
C/I1+ Interferer is reference signal at +1
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
— -14.0 — dB
N-1 adjacent channel selec-
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
reference signal at -79 dBm
C/I1- Interferer is reference signal at -1
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
— -13.6 — dB
Selectivity to image frequen-
cy, 0.1% BER. Desired is ref-
erence signal at -79 dBm
C/IIM Interferer is reference signal at im-
age frequency with 1 MHz preci-
sion
— -51.6 — dB
Selectivity to image frequen-
cy ± 1 MHz, 0.1% BER. De-
sired is reference signal at
-79 dBm
C/IIM+1 Interferer is reference signal at im-
age frequency ± 1 MHz with 1
MHz precision
— -55.5 — dB
Note:
1. Reference signal is defined 2GFSK at -79 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 125 kbps, desired data = PRBS9;
interferer data = PRBS15; frequency accuracy better than 1 ppm.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 32
4.1.8.5 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 500 kbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.15. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 500 kbps Data Rate
Parameter Symbol Test Condition Min Typ Max Unit
Power spectral density limit PSDLIMIT Per FCC part 15.247 at 10 dBm — -9.8 — dBm/
3kHz
Per FCC part 15.247 at 20 dBm1— — 8 dBm/
3kHz
Spurious emissions out-of-
band, excluding harmonics
captured in SPURHARM,FCC.
Emissions taken at
POUTMAX, PAVDD connec-
ted to external 3.3 V supply
SPUROOB_FCC Per FCC part 15.205/15.209,
Above 2.483 GHz or below 2.4
GHz; continuous transmission of
CW carrier, Restricted Bands2 3
— -47 — dBm
Note:
1. Output power limited to 14 dBm to ensure compliance with FCC specifications.
2. For 2476 MHz, 1.2 dB of power backoff is used to achieve this value.
3. For 2478 MHz, 5.8 dB of power backoff is used to achieve this value.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 33
4.1.8.6 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 500 kbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.16. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 500 kbps Data Rate
Parameter Symbol Test Condition Min Typ Max Unit
Max usable receiver input
level, 0.1% BER
SAT Signal is reference signal1. Packet
length is 20 bytes.
— 10 — dBm
Sensitivity, 0.1% BER SENS Signal is reference signal1. Using
DC-DC converter.
— -97.9 — dBm
With non-ideal signals as speci-
fied in RF-PHY.TS.4.2.2, section
4.6.1.
— -97.0 — dBm
N+1 adjacent channel selec-
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
reference signal at -72 dBm
C/I1+ Interferer is reference signal at +1
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
— -9.2 — dB
N-1 adjacent channel selec-
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
reference signal at -72 dBm
C/I1- Interferer is reference signal at -1
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
— -9.0 — dB
Alternate selectivity, 0.1%
BER, with allowable excep-
tions. Desired is reference
signal at -72 dBm
C/I2Interferer is reference signal at ± 2
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
— -46.5 — dB
Selectivity to image frequen-
cy, 0.1% BER. Desired is ref-
erence signal at -72 dBm
C/IIM Interferer is reference signal at im-
age frequency with 1 MHz preci-
sion
— -46.5 — dB
Selectivity to image frequen-
cy ± 1 MHz, 0.1% BER. De-
sired is reference signal at
-72 dBm
C/IIM+1 Interferer is reference signal at im-
age frequency ± 1 MHz with 1
MHz precision
— -50.7 — dB
Note:
1. Reference signal is defined 2GFSK at -72 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 500 kbps, desired data = PRBS9;
interferer data = PRBS15; frequency accuracy better than 1 ppm.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 34
4.1.8.7 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.17. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate
Parameter Symbol Test Condition Min Typ Max Unit
In-band spurious emissions,
with allowed exceptions1
SPURINB At ± 2 MHz, 10 dBm — -39.7 — dBm
At ± 3 MHz, 10 dBm — -43.6 — dBm
At ± 2 MHz, 20 dBm — — -20 dBm
At ± 3 MHz, 20 dBm — — -30 dBm
Spurious emissions out-of-
band, excluding harmonics
captured in SPURHARM,FCC.
Emissions taken at
POUTMAX, PAVDD connec-
ted to external 3.3 V supply
SPUROOB_FCC Per FCC part 15.205/15.209,
Above 2.483 GHz or below 2.4
GHz; continuous transmission of
CW carrier, Restricted Bands2 3
— -47 — dBm
Note:
1. Per Bluetooth Core_5.0, Vol.6 Part A, Section 3.2.2, exceptions are allowed in up to three bands of 1 MHz width, centered on a
frequency which is an integer multiple of 1 MHz. These exceptions shall have an absolute value of -20 dBm or less.
2. For 2476 MHz, 1.5 dB of power backoff is used to achieve this value.
3. For 2478 MHz, 4.2 dB of power backoff is used to achieve this value.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 35
4.1.8.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.18. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate
Parameter Symbol Test Condition Min Typ Max Unit
Max usable receiver input
level, 0.1% BER
SAT Signal is reference signal1. Packet
length is 20 bytes.
— 10 — dBm
Sensitivity, 0.1% BER SENS Signal is reference signal1. Using
DC-DC converter.
— -94.1 — dBm
With non-ideal signals as speci-
fied in RF-PHY.TS.4.2.2, section
4.6.1.
— -93.8 — dBm
Signal to co-channel interfer-
er, 0.1% BER
C/ICC Desired signal 3 dB above refer-
ence sensitivity.
— 9.0 — dB
N+1 adjacent channel selec-
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
reference signal at -67 dBm
C/I1+ Interferer is reference signal at +1
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
— -3.3 — dB
N-1 adjacent channel selec-
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
reference signal at -67 dBm
C/I1- Interferer is reference signal at -1
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
— -1.6 — dB
Alternate selectivity, 0.1%
BER, with allowable excep-
tions. Desired is reference
signal at -67 dBm
C/I2Interferer is reference signal at ± 2
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
— -42.0 — dB
Alternate selectivity, 0.1%
BER, with allowable excep-
tions. Desired is reference
signal at -67 dBm
C/I3Interferer is reference signal at ± 3
MHz offset. Desired frequency
2404 MHz ≤ Fc ≤ 2480 MHz
— -46.4 — dB
Selectivity to image frequen-
cy, 0.1% BER. Desired is ref-
erence signal at -67 dBm
C/IIM Interferer is reference signal at im-
age frequency with 1 MHz preci-
sion
— -42.0 — dB
Selectivity to image frequen-
cy ± 1 MHz, 0.1% BER. De-
sired is reference signal at
-67 dBm
C/IIM+1 Interferer is reference signal at im-
age frequency ± 1 MHz with 1
MHz precision
— -47.1 — dB
Intermodulation performance IM Per Core_4.1, Vol 6, Part A, Sec-
tion 4.4 with n = 3
— -18.4 — dBm
Note:
1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 1 Mbps, desired data = PRBS9;
interferer data = PRBS15; frequency accuracy better than 1 ppm.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 36
4.1.8.9 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.19. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate
Parameter Symbol Test Condition Min Typ Max Unit
In-band spurious emissions,
with allowed exceptions1
SPURINB At ± 4 MHz, 10 dBm — -38.2 — dBm
At ± 6 MHz, 10 dBm — -41.1 — dBm
At ± 4 MHz, 20 dBm — -30.1 — dBm
At ± 6 MHz, 20 dBm — -31.4 — dBm
Spurious emissions out-of-
band, excluding harmonics
captured in SPURHARM,FCC.
Emissions taken at
POUTMAX, PAVDD connec-
ted to external 3.3 V supply
SPUROOB_FCC Per FCC part 15.205/15.209,
Above 2.483 GHz or below 2.4
GHz; continuous transmission of
CW carrier, Restricted Bands2 3 4
5
— -47 — dBm
Note:
1. Per Bluetooth Core_5.0, Vol.6 Part A, Section 3.2.2, exceptions are allowed in up to three bands of 1 MHz width, centered on a
frequency which is an integer multiple of 1 MHz. These exceptions shall have an absolute value of -20 dBm or less.
2. For 2472 MHz, 1.3 dB of power backoff is used to achieve this value.
3. For 2474 MHz, 3.8 dB of power backoff is used to achieve this value.
4. For 2476 MHz, 7 dB of power backoff is used to achieve this value.
5. For 2478 MHz, 11.2 dB of power backoff is used to achieve this value.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 37
4.1.8.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.20. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate
Parameter Symbol Test Condition Min Typ Max Unit
Max usable receiver input
level, 0.1% BER
SAT Signal is reference signal1. Packet
length is 20 bytes.
— 10 — dBm
Sensitivity, 0.1% BER SENS Signal is reference signal1. Using
DC-DC converter.
— -90.2 — dBm
With non-ideal signals as speci-
fied in RF-PHY.TS.4.2.2, section
4.6.1.
— -89.9 — dBm
Signal to co-channel interfer-
er, 0.1% BER
C/ICC Desired signal 3 dB above refer-
ence sensitivity.
— 8.6 — dB
N+1 adjacent channel selec-
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
reference signal at -67 dBm
C/I1+ Interferer is reference signal at +2
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
— -7.6 — dB
N-1 adjacent channel selec-
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
reference signal at -67 dBm
C/I1- Interferer is reference signal at -2
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
— -11.4 — dB
Alternate selectivity, 0.1%
BER, with allowable excep-
tions. Desired is reference
signal at -67 dBm
C/I2Interferer is reference signal at ± 4
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
— -40.3 — dB
Alternate selectivity, 0.1%
BER, with allowable excep-
tions. Desired is reference
signal at -67 dBm
C/I3Interferer is reference signal at ± 6
MHz offset. Desired frequency
2404 MHz ≤ Fc ≤ 2480 MHz
— -45.1 — dB
Selectivity to image frequen-
cy, 0.1% BER. Desired is ref-
erence signal at -67 dBm
C/IIM Interferer is reference signal at im-
age frequency with 1 MHz preci-
sion
— -7.6 — dB
Selectivity to image frequen-
cy ± 2 MHz, 0.1% BER. De-
sired is reference signal at
-67 dBm
C/IIM+1 Interferer is reference signal at im-
age frequency ± 2 MHz with 2
MHz precision
— -40.30 — dB
Intermodulation performance IM Per Core_4.1, Vol 6, Part A, Sec-
tion 4.4 with n = 3
— -18.4 — dBm
Note:
1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 2 Mbps, desired data = PRBS9;
interferer data = PRBS15; frequency accuracy better than 1 ppm.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 38
4.1.9 Oscillators
4.1.9.1 Low-Frequency Crystal Oscillator (LFXO)
Table 4.21. Low-Frequency Crystal Oscillator (LFXO)
Parameter Symbol Test Condition Min Typ Max Unit
Crystal frequency fLFXO — 32.768 — kHz
Supported crystal equivalent
series resistance (ESR)
ESRLFXO — — 70 kΩ
Supported range of crystal
load capacitance 1
CLFXO_CL 6 — 18 pF
On-chip tuning cap range 2CLFXO_T On each of LFXTAL_N and
LFXTAL_P pins
8 — 40 pF
On-chip tuning cap step size SSLFXO — 0.25 — pF
Current consumption after
startup 3
ILFXO ESR = 70 kOhm, CL = 7 pF,
GAIN4 = 2, AGC4 = 1
— 273 — nA
Start- up time tLFXO ESR = 70 kOhm, CL = 7 pF,
GAIN4 = 2
— 308 — ms
Note:
1. Total load capacitance as seen by the crystal.
2. The effective load capacitance seen by the crystal will be CLFXO_T /2. This is because each XTAL pin has a tuning cap and the
two caps will be seen in series by the crystal.
3. Block is supplied by AVDD if ANASW = 0, or DVDD if ANASW=1 in EMU_PWRCTRL register.
4. In CMU_LFXOCTRL register.
4.1.9.2 High-Frequency Crystal Oscillator (HFXO)
Table 4.22. High-Frequency Crystal Oscillator (HFXO)
Parameter Symbol Test Condition Min Typ Max Unit
Crystal frequency fHFXO 38.4 MHz required for radio trans-
ciever operation
— 38.4 — MHz
Frequency tolerance for the
crystal
FTHFXO -40 — 40 ppm
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 39
4.1.9.3 Low-Frequency RC Oscillator (LFRCO)
Table 4.23. Low-Frequency RC Oscillator (LFRCO)
Parameter Symbol Test Condition Min Typ Max Unit
Oscillation frequency fLFRCO ENVREF1 = 1 31.3 32.768 33.6 kHz
ENVREF1 = 0 31.3 32.768 33.4 kHz
Startup time tLFRCO — 500 — µs
Current consumption 2ILFRCO ENVREF = 1 in
CMU_LFRCOCTRL
— 342 — nA
ENVREF = 0 in
CMU_LFRCOCTRL
— 494 — nA
Note:
1. In CMU_LFRCOCTRL register.
2. Block is supplied by AVDD if ANASW = 0, or DVDD if ANASW=1 in EMU_PWRCTRL register.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 40
4.1.9.4 High-Frequency RC Oscillator (HFRCO)
Table 4.24. High-Frequency RC Oscillator (HFRCO)
Parameter Symbol Test Condition Min Typ Max Unit
Frequency accuracy fHFRCO_ACC At production calibrated frequen-
cies, across supply voltage and
temperature
-2.5 — 2.5 %
Start-up time tHFRCO fHFRCO ≥ 19 MHz — 300 — ns
4 < fHFRCO < 19 MHz — 1 — µs
fHFRCO ≤ 4 MHz — 2.5 — µs
Current consumption on all
supplies
IHFRCO fHFRCO = 38 MHz — 267 299 µA
fHFRCO = 32 MHz — 224 248 µA
fHFRCO = 26 MHz — 189 211 µA
fHFRCO = 19 MHz — 154 172 µA
fHFRCO = 16 MHz — 133 148 µA
fHFRCO = 13 MHz — 118 135 µA
fHFRCO = 7 MHz — 89 100 µA
fHFRCO = 4 MHz — 34 44 µA
fHFRCO = 2 MHz — 29 40 µA
fHFRCO = 1 MHz — 26 36 µA
Coarse trim step size (% of
period)
SSHFRCO_COARS
E
— 0.8 — %
Fine trim step size (% of pe-
riod)
SSHFRCO_FINE — 0.1 — %
Period jitter PJHFRCO — 0.2 — % RMS
Frequency limits fHFRCO_BAND FREQRANGE = 0, FINETUNIN-
GEN = 0
3.47 — 6.15 MHz
FREQRANGE = 3, FINETUNIN-
GEN = 0
6.24 — 11.45 MHz
FREQRANGE = 6, FINETUNIN-
GEN = 0
11.3 — 19.8 MHz
FREQRANGE = 7, FINETUNIN-
GEN = 0
13.45 — 22.8 MHz
FREQRANGE = 8, FINETUNIN-
GEN = 0
16.5 — 29.0 MHz
FREQRANGE = 10, FINETUNIN-
GEN = 0
23.11 — 40.63 MHz
FREQRANGE = 11, FINETUNIN-
GEN = 0
27.27 — 48 MHz
FREQRANGE = 12, FINETUNIN-
GEN = 0
33.33 — 54 MHz
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 41
4.1.9.5 Ultra-low Frequency RC Oscillator (ULFRCO)
Table 4.25. Ultra-low Frequency RC Oscillator (ULFRCO)
Parameter Symbol Test Condition Min Typ Max Unit
Oscillation frequency fULFRCO 0.95 1 1.07 kHz
4.1.10 Flash Memory Characteristics1
Table 4.26. Flash Memory Characteristics1
Parameter Symbol Test Condition Min Typ Max Unit
Flash erase cycles before
failure
ECFLASH 10000 — — cycles
Flash data retention RETFLASH 10 — — years
Word (32-bit) programming
time
tW_PROG Burst write, 128 words, average
time per word
20 26.3 30 µs
Single word 62 68.9 80 µs
Page erase time2tPERASE 20 29.5 40 ms
Mass erase time3tMERASE 20 30 40 ms
Device erase time4 5tDERASE — 56.2 70 ms
Erase current6IERASE Page Erase — — 2.0 mA
Write current6IWRITE — — 3.5 mA
Supply voltage during flash
erase and write
VFLASH 1.62 — 3.6 V
Note:
1. Flash data retention information is published in the Quarterly Quality and Reliability Report.
2. From setting the ERASEPAGE bit in MSC_WRITECMD to 1 until the BUSY bit in MSC_STATUS is cleared to 0. Internal setup
and hold times for flash control signals are included.
3. Mass erase is issued by the CPU and erases all flash.
4. Device erase is issued over the AAP interface and erases all flash, SRAM, the Lock Bit (LB) page, and the User data page Lock
Word (ULW).
5. From setting the DEVICEERASE bit in AAP_CMD to 1 until the ERASEBUSY bit in AAP_STATUS is cleared to 0. Internal setup
and hold times for flash control signals are included.
6. Measured at 25 °C.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 42
4.1.11 General-Purpose I/O (GPIO)
Table 4.27. General-Purpose I/O (GPIO)
Parameter Symbol Test Condition Min Typ Max Unit
Input low voltage VIL GPIO pins — — IOVDD*0.3 V
Input high voltage VIH GPIO pins IOVDD*0.7 — — V
Output high voltage relative
to IOVDD
VOH Sourcing 3 mA, IOVDD ≥ 3 V,
DRIVESTRENGTH1 = WEAK
IOVDD*0.8 — — V
Sourcing 1.2 mA, IOVDD ≥ 1.62
V,
DRIVESTRENGTH1 = WEAK
IOVDD*0.6 — — V
Sourcing 20 mA, IOVDD ≥ 3 V,
DRIVESTRENGTH1 = STRONG
IOVDD*0.8 — — V
Sourcing 8 mA, IOVDD ≥ 1.62 V,
DRIVESTRENGTH1 = STRONG
IOVDD*0.6 — — V
Output low voltage relative to
IOVDD
VOL Sinking 3 mA, IOVDD ≥ 3 V,
DRIVESTRENGTH1 = WEAK
— — IOVDD*0.2 V
Sinking 1.2 mA, IOVDD ≥ 1.62 V,
DRIVESTRENGTH1 = WEAK
— — IOVDD*0.4 V
Sinking 20 mA, IOVDD ≥ 3 V,
DRIVESTRENGTH1 = STRONG
— — IOVDD*0.2 V
Sinking 8 mA, IOVDD ≥ 1.62 V,
DRIVESTRENGTH1 = STRONG
— — IOVDD*0.4 V
Input leakage current IIOLEAK All GPIO except LFXO pins, GPIO
≤ IOVDD
— 0.1 30 nA
LFXO Pins, GPIO ≤ IOVDD — 0.1 50 nA
Input leakage current on
5VTOL pads above IOVDD
I5VTOLLEAK IOVDD < GPIO ≤ IOVDD + 2 V — 3.3 15 µA
I/O pin pull-up/pull-down re-
sistor
RPUD 30 40 65 kΩ
Pulse width of pulses re-
moved by the glitch suppres-
sion filter
tIOGLITCH 15 25 45 ns
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 43
Parameter Symbol Test Condition Min Typ Max Unit
Output fall time, From 70%
to 30% of VIO
tIOOF CL = 50 pF,
DRIVESTRENGTH1 = STRONG,
SLEWRATE1 = 0x6
— 1.8 — ns
CL = 50 pF,
DRIVESTRENGTH1 = WEAK,
SLEWRATE1 = 0x6
— 4.5 — ns
Output rise time, From 30%
to 70% of VIO
tIOOR CL = 50 pF,
DRIVESTRENGTH1 = STRONG,
SLEWRATE = 0x61
— 2.2 — ns
CL = 50 pF,
DRIVESTRENGTH1 = WEAK,
SLEWRATE1 = 0x6
— 7.4 — ns
Note:
1. In GPIO_Pn_CTRL register.
4.1.12 Voltage Monitor (VMON)
Table 4.28. Voltage Monitor (VMON)
Parameter Symbol Test Condition Min Typ Max Unit
Supply current (including
I_SENSE)
IVMON In EM0 or EM1, 1 active channel — 6.3 8 µA
In EM0 or EM1, All channels ac-
tive
— 12.5 15 µA
In EM2, EM3 or EM4, 1 channel
active and above threshold
— 62 — nA
In EM2, EM3 or EM4, 1 channel
active and below threshold
— 62 — nA
In EM2, EM3 or EM4, All channels
active and above threshold
— 99 — nA
In EM2, EM3 or EM4, All channels
active and below threshold
— 99 — nA
Loading of monitored supply ISENSE In EM0 or EM1 — 2 — µA
In EM2, EM3 or EM4 — 2 — nA
Threshold range VVMON_RANGE 1.62 — 3.4 V
Threshold step size NVMON_STESP Coarse — 200 — mV
Fine — 20 — mV
Response time tVMON_RES Supply drops at 1V/µs rate — 460 — ns
Hysteresis VVMON_HYST — 26 — mV
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 44
4.1.13 Analog to Digital Converter (ADC)
Specified at 1 Msps, ADCCLK = 16 MHz, BIASPROG = 0, GPBIASACC = 0, unless otherwise indicated.
Table 4.29. Analog to Digital Converter (ADC)
Parameter Symbol Test Condition Min Typ Max Unit
Resolution VRESOLUTION 6 — 12 Bits
Input voltage range1VADCIN Single ended — — VFS V
Differential -VFS/2 — VFS/2 V
Input range of external refer-
ence voltage, single ended
and differential
VADCREFIN_P 1 — VAVDD V
Power supply rejection2PSRRADC At DC — 80 — dB
Analog input common mode
rejection ratio
CMRRADC At DC — 80 — dB
Current from all supplies, us-
ing internal reference buffer.
Continuous operation. WAR-
MUPMODE3 = KEEPADC-
WARM
IADC_CONTINU-
OUS_LP
1 Msps / 16 MHz ADCCLK, BIA-
SPROG = 0, GPBIASACC = 1 4
— 270 290 µA
250 ksps / 4 MHz ADCCLK, BIA-
SPROG = 6, GPBIASACC = 1 4
— 125 — µA
62.5 ksps / 1 MHz ADCCLK, BIA-
SPROG = 15, GPBIASACC = 1 4
— 80 — µA
Current from all supplies, us-
ing internal reference buffer.
Duty-cycled operation. WAR-
MUPMODE3 = NORMAL
IADC_NORMAL_LP 35 ksps / 16 MHz ADCCLK, BIA-
SPROG = 0, GPBIASACC = 1 4
— 45 — µA
5 ksps / 16 MHz ADCCLK BIA-
SPROG = 0, GPBIASACC = 1 4
— 8 — µA
Current from all supplies, us-
ing internal reference buffer.
Duty-cycled operation.
AWARMUPMODE3 = KEEP-
INSTANDBY or KEEPIN-
SLOWACC
IADC_STAND-
BY_LP
125 ksps / 16 MHz ADCCLK, BIA-
SPROG = 0, GPBIASACC = 1 4
— 105 — µA
35 ksps / 16 MHz ADCCLK, BIA-
SPROG = 0, GPBIASACC = 1 4
— 70 — µA
Current from all supplies, us-
ing internal reference buffer.
Continuous operation. WAR-
MUPMODE3 = KEEPADC-
WARM
IADC_CONTINU-
OUS_HP
1 Msps / 16 MHz ADCCLK, BIA-
SPROG = 0, GPBIASACC = 0 4
— 325 — µA
250 ksps / 4 MHz ADCCLK, BIA-
SPROG = 6, GPBIASACC = 0 4
— 175 — µA
62.5 ksps / 1 MHz ADCCLK, BIA-
SPROG = 15, GPBIASACC = 0 4
— 125 — µA
Current from all supplies, us-
ing internal reference buffer.
Duty-cycled operation. WAR-
MUPMODE3 = NORMAL
IADC_NORMAL_HP 35 ksps / 16 MHz ADCCLK, BIA-
SPROG = 0, GPBIASACC = 0 4
— 85 — µA
5 ksps / 16 MHz ADCCLK BIA-
SPROG = 0, GPBIASACC = 0 4
— 16 — µA
Current from all supplies, us-
ing internal reference buffer.
Duty-cycled operation.
AWARMUPMODE3 = KEEP-
INSTANDBY or KEEPIN-
SLOWACC
IADC_STAND-
BY_HP
125 ksps / 16 MHz ADCCLK, BIA-
SPROG = 0, GPBIASACC = 0 4
— 160 — µA
35 ksps / 16 MHz ADCCLK, BIA-
SPROG = 0, GPBIASACC = 0 4
— 125 — µA
Current from HFPERCLK IADC_CLK HFPERCLK = 16 MHz — 140 — µA
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 45
Parameter Symbol Test Condition Min Typ Max Unit
ADC clock frequency fADCCLK — — 16 MHz
Throughput rate fADCRATE — — 1 Msps
Conversion time5tADCCONV 6 bit — 7 — cycles
8 bit — 9 — cycles
12 bit — 13 — cycles
Startup time of reference
generator and ADC core
tADCSTART WARMUPMODE3 = NORMAL — — 5 µs
WARMUPMODE3 = KEEPIN-
STANDBY
— — 2 µs
WARMUPMODE3 = KEEPINSLO-
WACC
— — 1 µs
SNDR at 1Msps and fIN =
10kHz
SNDRADC Internal reference6, differential
measurement
58 67 — dB
External reference7, differential
measurement
— 68 — dB
Spurious-free dynamic range
(SFDR)
SFDRADC 1 MSamples/s, 10 kHz full-scale
sine wave
— 75 — dB
Differential non-linearity
(DNL)
DNLADC 12 bit resolution, No missing co-
des
-1 — 2 LSB
Integral non-linearity (INL),
End point method
INLADC 12 bit resolution -6 — 6 LSB
Offset error VADCOFFSETERR -3 0 3 LSB
Gain error in ADC VADCGAIN Using internal reference — -0.2 3.5 %
Using external reference — -1 — %
Temperature sensor slope VTS_SLOPE — -1.84 — mV/°C
Note:
1. The absolute voltage allowed at any ADC input is dictated by the power rail supplied to on-chip circuitry, and may be lower than
the effective full scale voltage. All ADC inputs are limited to the ADC supply (AVDD or DVDD depending on
EMU_PWRCTRL_ANASW). Any ADC input routed through the APORT will further be limited by the IOVDD supply to the pin.
2. PSRR is referenced to AVDD when ANASW=0 and to DVDD when ANASW=1 in EMU_PWRCTRL.
3. In ADCn_CNTL register.
4. In ADCn_BIASPROG register.
5. Derived from ADCCLK.
6. Internal reference option used corresponds to selection 2V5 in the SINGLECTRL_REF or SCANCTRL_REF register field. The
differential input range with this configuration is ± 1.25 V. Typical value is characterized using full-scale sine wave input. Minimum
value is production-tested using sine wave input at 1.5 dB lower than full scale.
7. External reference is 1.25 V applied externally to ADCnEXTREFP, with the selection CONF in the SINGLECTRL_REF or
SCANCTRL_REF register field and VREFP in the SINGLECTRLX_VREFSEL or SCANCTRLX_VREFSEL field. The differential
input range with this configuration is ± 1.25 V.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 46
4.1.14 Analog Comparator (ACMP)
Table 4.30. Analog Comparator (ACMP)
Parameter Symbol Test Condition Min Typ Max Unit
Input voltage range VACMPIN ACMPVDD =
ACMPn_CTRL_PWRSEL 1
— — VACMPVDD V
Supply voltage VACMPVDD BIASPROG2 ≤ 0x10 or FULL-
BIAS2 = 0
1.8 — VVREGVDD_
MAX
V
0x10 < BIASPROG2 ≤ 0x20 and
FULLBIAS2 = 1
2.1 — VVREGVDD_
MAX
V
Active current not including
voltage reference3
IACMP BIASPROG2 = 1, FULLBIAS2 = 0 — 50 — nA
BIASPROG2 = 0x10, FULLBIAS2
= 0
— 306 — nA
BIASPROG2 = 0x02, FULLBIAS2
= 1
— 6.1 11 µA
BIASPROG2 = 0x20, FULLBIAS2
= 1
— 74 92 µA
Current consumption of inter-
nal voltage reference3
IACMPREF VLP selected as input using 2.5 V
Reference / 4 (0.625 V)
— 50 — nA
VLP selected as input using VDD — 20 — nA
VBDIV selected as input using
1.25 V reference / 1
— 4.1 — µA
VADIV selected as input using
VDD/1
— 2.4 — µA
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 47
Parameter Symbol Test Condition Min Typ Max Unit
Hysteresis (VCM = 1.25 V,
BIASPROG2 = 0x10, FULL-
BIAS2 = 1)
VACMPHYST HYSTSEL4 = HYST0 -3 0 3 mV
HYSTSEL4 = HYST1 5 18 27 mV
HYSTSEL4 = HYST2 12 33 50 mV
HYSTSEL4 = HYST3 17 46 67 mV
HYSTSEL4 = HYST4 23 57 86 mV
HYSTSEL4 = HYST5 26 68 104 mV
HYSTSEL4 = HYST6 30 79 130 mV
HYSTSEL4 = HYST7 34 90 155 mV
HYSTSEL4 = HYST8 -3 0 3 mV
HYSTSEL4 = HYST9 -27 -18 -5 mV
HYSTSEL4 = HYST10 -50 -33 -12 mV
HYSTSEL4 = HYST11 -67 -45 -17 mV
HYSTSEL4 = HYST12 -86 -57 -23 mV
HYSTSEL4 = HYST13 -104 -67 -26 mV
HYSTSEL4 = HYST14 -130 -78 -30 mV
HYSTSEL4 = HYST15 -155 -88 -34 mV
Comparator delay5tACMPDELAY BIASPROG2 = 1, FULLBIAS2 = 0 — 30 95 µs
BIASPROG2 = 0x10, FULLBIAS2
= 0
— 3.7 10 µs
BIASPROG2 = 0x02, FULLBIAS2
= 1
— 360 1000 ns
BIASPROG2 = 0x20, FULLBIAS2
= 1
— 35 — ns
Offset voltage VACMPOFFSET BIASPROG2 =0x10, FULLBIAS2
= 1
-35 — 35 mV
Reference voltage VACMPREF Internal 1.25 V reference 1 1.25 1.47 V
Internal 2.5 V reference 1.98 2.5 2.8 V
Capacitive sense internal re-
sistance
RCSRES CSRESSEL6 = 0 — infinite — kΩ
CSRESSEL6 = 1 — 15 — kΩ
CSRESSEL6 = 2 — 27 — kΩ
CSRESSEL6 = 3 — 39 — kΩ
CSRESSEL6 = 4 — 51 — kΩ
CSRESSEL6 = 5 — 102 — kΩ
CSRESSEL6 = 6 — 164 — kΩ
CSRESSEL6 = 7 — 239 — kΩ
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 48
Parameter Symbol Test Condition Min Typ Max Unit
Note:
1. ACMPVDD is a supply chosen by the setting in ACMPn_CTRL_PWRSEL and may be IOVDD, AVDD or DVDD.
2. In ACMPn_CTRL register.
3. The total ACMP current is the sum of the contributions from the ACMP and its internal voltage reference. IACMPTOTAL = IACMP +
IACMPREF.
4. In ACMPn_HYSTERESIS registers.
5. ± 100 mV differential drive.
6. In ACMPn_INPUTSEL register.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 49
4.1.15 Digital to Analog Converter (VDAC)
DRIVESTRENGTH = 2 unless otherwise specified. Primary VDAC output.
Table 4.31. Digital to Analog Converter (VDAC)
Parameter Symbol Test Condition Min Typ Max Unit
Output voltage VDACOUT Single-Ended 0 — VVREF V
Differential1-VVREF — VVREF V
Current consumption includ-
ing references (2 channels)2
IDAC 500 ksps, 12-bit, DRIVES-
TRENGTH = 2, REFSEL = 4
— 396 — µA
44.1 ksps, 12-bit, DRIVES-
TRENGTH = 1, REFSEL = 4
— 72 — µA
200 Hz refresh rate, 12-bit Sam-
ple-Off mode in EM2, DRIVES-
TRENGTH = 2, BGRREQTIME =
1, EM2REFENTIME = 9, REFSEL
= 4, SETTLETIME = 0x0A, WAR-
MUPTIME = 0x02
— 1.2 — µA
Current from HFPERCLK3IDAC_CLK — 5.8 — µA/MHz
Sample rate SRDAC — — 500 ksps
DAC clock frequency fDAC — — 1 MHz
Conversion time tDACCONV fDAC = 1MHz 2 — — µs
Settling time tDACSETTLE 50% fs step settling to 5 LSB — 2.5 — µs
Startup time tDACSTARTUP Enable to 90% fs output, settling
to 10 LSB
— — 12 µs
Output impedance ROUT DRIVESTRENGTH = 2, 0.4 V ≤
VOUT ≤ VOPA - 0.4 V, -8 mA <
IOUT < 8 mA, Full supply range
— 2 — Ω
DRIVESTRENGTH = 0 or 1, 0.4 V
≤ VOUT ≤ VOPA - 0.4 V, -400 µA <
IOUT < 400 µA, Full supply range
— 2 — Ω
DRIVESTRENGTH = 2, 0.1 V ≤
VOUT ≤ VOPA - 0.1 V, -2 mA <
IOUT < 2 mA, Full supply range
— 2 — Ω
DRIVESTRENGTH = 0 or 1, 0.1 V
≤ VOUT ≤ VOPA - 0.1 V, -100 µA <
IOUT < 100 µA, Full supply range
— 2 — Ω
Power supply rejection ratio4PSRR Vout = 50% fs. DC — 65.5 — dB
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 50
Parameter Symbol Test Condition Min Typ Max Unit
Signal to noise and distortion
ratio (1 kHz sine wave),
Noise band limited to 250
kHz
SNDRDAC 500 ksps, single-ended, internal
1.25V reference
— 60.4 — dB
500 ksps, single-ended, internal
2.5V reference
— 61.6 — dB
500 ksps, single-ended, 3.3V
VDD reference
— 64.0 — dB
500 ksps, differential, internal
1.25V reference
— 63.3 — dB
500 ksps, differential, internal
2.5V reference
— 64.4 — dB
500 ksps, differential, 3.3V VDD
reference
— 65.8 — dB
Signal to noise and distortion
ratio (1 kHz sine wave),
Noise band limited to 22 kHz
SNDRDAC_BAND 500 ksps, single-ended, internal
1.25V reference
— 65.3 — dB
500 ksps, single-ended, internal
2.5V reference
— 66.7 — dB
500 ksps, single-ended, 3.3V
VDD reference
— 70.0 — dB
500 ksps, differential, internal
1.25V reference
— 67.8 — dB
500 ksps, differential, internal
2.5V reference
— 69.0 — dB
500 ksps, differential, 3.3V VDD
reference
— 68.5 — dB
Total harmonic distortion THD — 70.2 — dB
Differential non-linearity5DNLDAC -0.99 — 1 LSB
Intergral non-linearity INLDAC -4 — 4 LSB
Offset error6VOFFSET T = 25 °C -8 — 8 mV
Across operating temperature
range
-25 — 25 mV
Gain error6VGAIN T = 25 °C, Low-noise internal ref-
erence (REFSEL = 1V25LN or
2V5LN)
-2.5 — 2.5 %
T = 25 °C, Internal reference (RE-
FSEL = 1V25 or 2V5)
-5 — 5 %
T = 25 °C, External reference
(REFSEL = VDD or EXT)
-1.8 — 1.8 %
Across operating temperature
range, Low-noise internal refer-
ence (REFSEL = 1V25LN or
2V5LN)
-3.5 — 3.5 %
Across operating temperature
range, Internal reference (RE-
FSEL = 1V25 or 2V5)
-7.5 — 7.5 %
Across operating temperature
range, External reference (RE-
FSEL = VDD or EXT)
-2.0 — 2.0 %
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 51
Parameter Symbol Test Condition Min Typ Max Unit
External load capactiance,
OUTSCALE=0
CLOAD — — 75 pF
Note:
1. In differential mode, the output is defined as the difference between two single-ended outputs. Absolute voltage on each output is
limited to the single-ended range.
2. Supply current specifications are for VDAC circuitry operating with static output only and do not include current required to drive
the load.
3. Current from HFPERCLK is dependent on HFPERCLK frequency. This current contributes to the total supply current used when
the clock to the DAC module is enabled in the CMU.
4. PSRR calculated as 20 * log10(ΔVDD / ΔVOUT), VDAC output at 90% of full scale
5. Entire range is monotonic and has no missing codes.
6. Gain is calculated by measuring the slope from 10% to 90% of full scale. Offset is calculated by comparing actual VDAC output at
10% of full scale to ideal VDAC output at 10% of full scale with the measured gain.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 52
4.1.16 Current Digital to Analog Converter (IDAC)
Table 4.32. Current Digital to Analog Converter (IDAC)
Parameter Symbol Test Condition Min Typ Max Unit
Number of ranges NIDAC_RANGES — 4 — ranges
Output current IIDAC_OUT RANGSEL1 = RANGE0 0.05 — 1.6 µA
RANGSEL1 = RANGE1 1.6 — 4.7 µA
RANGSEL1 = RANGE2 0.5 — 16 µA
RANGSEL1 = RANGE3 2 — 64 µA
Linear steps within each
range
NIDAC_STEPS — 32 — steps
Step size SSIDAC RANGSEL1 = RANGE0 — 50 — nA
RANGSEL1 = RANGE1 — 100 — nA
RANGSEL1 = RANGE2 — 500 — nA
RANGSEL1 = RANGE3 — 2 — µA
Total accuracy, STEPSEL1 =
0x10
ACCIDAC EM0 or EM1, AVDD=3.3 V, T = 25
°C
-3 — 3 %
EM0 or EM1, Across operating
temperature range
-18 — 22 %
EM2 or EM3, Source mode,
RANGSEL1 = RANGE0,
AVDD=3.3 V, T = 25 °C
— -2 — %
EM2 or EM3, Source mode,
RANGSEL1 = RANGE1,
AVDD=3.3 V, T = 25 °C
— -1.7 — %
EM2 or EM3, Source mode,
RANGSEL1 = RANGE2,
AVDD=3.3 V, T = 25 °C
— -0.8 — %
EM2 or EM3, Source mode,
RANGSEL1 = RANGE3,
AVDD=3.3 V, T = 25 °C
— -0.5 — %
EM2 or EM3, Sink mode, RANG-
SEL1 = RANGE0, AVDD=3.3 V, T
= 25 °C
— -0.7 — %
EM2 or EM3, Sink mode, RANG-
SEL1 = RANGE1, AVDD=3.3 V, T
= 25 °C
— -0.6 — %
EM2 or EM3, Sink mode, RANG-
SEL1 = RANGE2, AVDD=3.3 V, T
= 25 °C
— -0.5 — %
EM2 or EM3, Sink mode, RANG-
SEL1 = RANGE3, AVDD=3.3 V, T
= 25 °C
— -0.5 — %
Start up time tIDAC_SU Output within 1% of steady state
value
— 5 — µs
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 53
Parameter Symbol Test Condition Min Typ Max Unit
Settling time, (output settled
within 1% of steady state val-
ue),
tIDAC_SETTLE Range setting is changed — 5 — µs
Step value is changed — 1 — µs
Current consumption2IIDAC EM0 or EM1 Source mode, ex-
cluding output current, Across op-
erating temperature range
— 11 15 µA
EM0 or EM1 Sink mode, exclud-
ing output current, Across operat-
ing temperature range
— 13 18 µA
EM2 or EM3 Source mode, ex-
cluding output current, T = 25 °C
— 0.023 — µA
EM2 or EM3 Sink mode, exclud-
ing output current, T = 25 °C
— 0.041 — µA
EM2 or EM3 Source mode, ex-
cluding output current, T ≥ 85 °C
— 11 — µA
EM2 or EM3 Sink mode, exclud-
ing output current, T ≥ 85 °C
— 13 — µA
Output voltage compliance in
source mode, source current
change relative to current
sourced at 0 V
ICOMP_SRC RANGESEL1=0, output voltage =
min(VIOVDD, VAVDD2-100 mV)
— 0.11 — %
RANGESEL1=1, output voltage =
min(VIOVDD, VAVDD2-100 mV)
— 0.06 — %
RANGESEL1=2, output voltage =
min(VIOVDD, VAVDD2-150 mV)
— 0.04 — %
RANGESEL1=3, output voltage =
min(VIOVDD, VAVDD2-250 mV)
— 0.03 — %
Output voltage compliance in
sink mode, sink current
change relative to current
sunk at IOVDD
ICOMP_SINK RANGESEL1=0, output voltage =
100 mV
— 0.12 — %
RANGESEL1=1, output voltage =
100 mV
— 0.05 — %
RANGESEL1=2, output voltage =
150 mV
— 0.04 — %
RANGESEL1=3, output voltage =
250 mV
— 0.03 — %
Note:
1. In IDAC_CURPROG register.
2. The IDAC is supplied by either AVDD, DVDD, or IOVDD based on the setting of ANASW in the EMU_PWRCTRL register and
PWRSEL in the IDAC_CTRL register. Setting PWRSEL to 1 selects IOVDD. With PWRSEL cleared to 0, ANASW selects be-
tween AVDD (0) and DVDD (1).
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 54
4.1.17 Capacitive Sense (CSEN)
Table 4.33. Capacitive Sense (CSEN)
Parameter Symbol Test Condition Min Typ Max Unit
Single conversion time (1x
accumulation)
tCNV 12-bit SAR Conversions — 20.2 — µs
16-bit SAR Conversions — 26.4 — µs
Delta Modulation Conversion (sin-
gle comparison)
— 1.55 — µs
Maximum external capacitive
load
CEXTMAX IREFPROG=7 (Gain = 1x), includ-
ing routing parasitics
— 68 — pF
IREFPROG=0 (Gain = 10x), in-
cluding routing parasitics
— 680 — pF
Maximum external series im-
pedance
REXTMAX — 1 — kΩ
Supply current, EM2 bonded
conversions, WARMUP-
MODE=NORMAL, WAR-
MUPCNT=0
ICSEN_BOND 12-bit SAR conversions, 20 ms
conversion rate, IREFPROG=7
(Gain = 1x), 10 channels bonded
(total capacitance of 330 pF)1
— 326 — nA
Delta Modulation conversions, 20
ms conversion rate, IRE-
FPROG=7 (Gain = 1x), 10 chan-
nels bonded (total capacitance of
330 pF)1
— 226 — nA
12-bit SAR conversions, 200 ms
conversion rate, IREFPROG=7
(Gain = 1x), 10 channels bonded
(total capacitance of 330 pF)1
— 33 — nA
Delta Modulation conversions,
200 ms conversion rate, IRE-
FPROG=7 (Gain = 1x), 10 chan-
nels bonded (total capacitance of
330 pF)1
— 25 — nA
Supply current, EM2 scan
conversions, WARMUP-
MODE=NORMAL, WAR-
MUPCNT=0
ICSEN_EM2 12-bit SAR conversions, 20 ms
scan rate, IREFPROG=0 (Gain =
10x), 8 samples per scan1
— 690 — nA
Delta Modulation conversions, 20
ms scan rate, 8 comparisons per
sample (DMCR = 1, DMR = 2),
IREFPROG=0 (Gain = 10x), 8
samples per scan1
— 515 — nA
12-bit SAR conversions, 200 ms
scan rate, IREFPROG=0 (Gain =
10x), 8 samples per scan1
— 79 — nA
Delta Modulation conversions,
200 ms scan rate, 8 comparisons
per sample (DMCR = 1, DMR =
2), IREFPROG=0 (Gain = 10x), 8
samples per scan1
— 57 — nA
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 55
Parameter Symbol Test Condition Min Typ Max Unit
Supply current, continuous
conversions, WARMUP-
MODE=KEEPCSENWARM
ICSEN_ACTIVE SAR or Delta Modulation conver-
sions of 33 pF capacitor, IRE-
FPROG=0 (Gain = 10x), always
on
— 90.5 — µA
HFPERCLK supply current ICSEN_HFPERCLK Current contribution from
HFPERCLK when clock to CSEN
block is enabled.
— 2.25 — µA/MHz
Note:
1. Current is specified with a total external capacitance of 33 pF per channel. Average current is dependent on how long the module
is actively sampling channels within the scan period, and scales with the number of samples acquired. Supply current for a specif-
ic application can be estimated by multiplying the current per sample by the total number of samples per period (total_current =
single_sample_current * (number_of_channels * accumulation)).
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 56
4.1.18 Operational Amplifier (OPAMP)
Unless otherwise indicated, specified conditions are: Non-inverting input configuration, VDD = 3.3 V, DRIVESTRENGTH = 2, MAIN-
OUTEN = 1, CLOAD = 75 pF with OUTSCALE = 0, or CLOAD = 37.5 pF with OUTSCALE = 1. Unit gain buffer and 3X-gain connection as
specified in table footnotes1 2.
Table 4.34. Operational Amplifier (OPAMP)
Parameter Symbol Test Condition Min Typ Max Unit
Supply voltage (from AVDD) VOPA HCMDIS = 0, Rail-to-rail input
range
2 — 3.8 V
HCMDIS = 1 1.62 — 3.8 V
Input voltage VIN HCMDIS = 0, Rail-to-rail input
range
VVSS — VOPA V
HCMDIS = 1 VVSS — VOPA-1.2 V
Input impedance RIN 100 — — MΩ
Output voltage VOUT VVSS — VOPA V
Load capacitance3CLOAD OUTSCALE = 0 — — 75 pF
OUTSCALE = 1 — — 37.5 pF
Output impedance ROUT DRIVESTRENGTH = 2 or 3, 0.4 V
≤ VOUT ≤ VOPA - 0.4 V, -8 mA <
IOUT < 8 mA, Buffer connection,
Full supply range
— 0.25 — Ω
DRIVESTRENGTH = 0 or 1, 0.4 V
≤ VOUT ≤ VOPA - 0.4 V, -400 µA <
IOUT < 400 µA, Buffer connection,
Full supply range
— 0.6 — Ω
DRIVESTRENGTH = 2 or 3, 0.1 V
≤ VOUT ≤ VOPA - 0.1 V, -2 mA <
IOUT < 2 mA, Buffer connection,
Full supply range
— 0.4 — Ω
DRIVESTRENGTH = 0 or 1, 0.1 V
≤ VOUT ≤ VOPA - 0.1 V, -100 µA <
IOUT < 100 µA, Buffer connection,
Full supply range
— 1 — Ω
Internal closed-loop gain GCL Buffer connection 0.99 1 1.01 -
3x Gain connection 2.93 2.99 3.05 -
16x Gain connection 15.07 15.7 16.33 -
Active current4IOPA DRIVESTRENGTH = 3, OUT-
SCALE = 0
— 580 — µA
DRIVESTRENGTH = 2, OUT-
SCALE = 0
— 176 — µA
DRIVESTRENGTH = 1, OUT-
SCALE = 0
— 13 — µA
DRIVESTRENGTH = 0, OUT-
SCALE = 0
— 4.7 — µA
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 57
Parameter Symbol Test Condition Min Typ Max Unit
Open-loop gain GOL DRIVESTRENGTH = 3 — 135 — dB
DRIVESTRENGTH = 2 — 137 — dB
DRIVESTRENGTH = 1 — 121 — dB
DRIVESTRENGTH = 0 — 109 — dB
Loop unit-gain frequency5UGF DRIVESTRENGTH = 3, Buffer
connection
— 3.38 — MHz
DRIVESTRENGTH = 2, Buffer
connection
— 0.9 — MHz
DRIVESTRENGTH = 1, Buffer
connection
— 132 — kHz
DRIVESTRENGTH = 0, Buffer
connection
— 34 — kHz
DRIVESTRENGTH = 3, 3x Gain
connection
— 2.57 — MHz
DRIVESTRENGTH = 2, 3x Gain
connection
— 0.71 — MHz
DRIVESTRENGTH = 1, 3x Gain
connection
— 113 — kHz
DRIVESTRENGTH = 0, 3x Gain
connection
— 28 — kHz
Phase margin PM DRIVESTRENGTH = 3, Buffer
connection
— 67 — °
DRIVESTRENGTH = 2, Buffer
connection
— 69 — °
DRIVESTRENGTH = 1, Buffer
connection
— 63 — °
DRIVESTRENGTH = 0, Buffer
connection
— 68 — °
Output voltage noise NOUT DRIVESTRENGTH = 3, Buffer
connection, 10 Hz - 10 MHz
— 146 — µVrms
DRIVESTRENGTH = 2, Buffer
connection, 10 Hz - 10 MHz
— 163 — µVrms
DRIVESTRENGTH = 1, Buffer
connection, 10 Hz - 1 MHz
— 170 — µVrms
DRIVESTRENGTH = 0, Buffer
connection, 10 Hz - 1 MHz
— 176 — µVrms
DRIVESTRENGTH = 3, 3x Gain
connection, 10 Hz - 10 MHz
— 313 — µVrms
DRIVESTRENGTH = 2, 3x Gain
connection, 10 Hz - 10 MHz
— 271 — µVrms
DRIVESTRENGTH = 1, 3x Gain
connection, 10 Hz - 1 MHz
— 247 — µVrms
DRIVESTRENGTH = 0, 3x Gain
connection, 10 Hz - 1 MHz
— 245 — µVrms
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 58
Parameter Symbol Test Condition Min Typ Max Unit
Slew rate6SR DRIVESTRENGTH = 3,
INCBW=17
— 4.7 — V/µs
DRIVESTRENGTH = 3,
INCBW=0
— 1.5 — V/µs
DRIVESTRENGTH = 2,
INCBW=17
— 1.27 — V/µs
DRIVESTRENGTH = 2,
INCBW=0
— 0.42 — V/µs
DRIVESTRENGTH = 1,
INCBW=17
— 0.17 — V/µs
DRIVESTRENGTH = 1,
INCBW=0
— 0.058 — V/µs
DRIVESTRENGTH = 0,
INCBW=17
— 0.044 — V/µs
DRIVESTRENGTH = 0,
INCBW=0
— 0.015 — V/µs
Startup time8TSTART DRIVESTRENGTH = 2 — — 12 µs
Input offset voltage VOSI DRIVESTRENGTH = 2 or 3, T =
25 °C
-2 — 2 mV
DRIVESTRENGTH = 1 or 0, T =
25 °C
-2 — 2 mV
DRIVESTRENGTH = 2 or 3,
across operating temperature
range
-12 — 12 mV
DRIVESTRENGTH = 1 or 0,
across operating temperature
range
-30 — 30 mV
DC power supply rejection
ratio9
PSRRDC Input referred — 70 — dB
DC common-mode rejection
ratio9
CMRRDC Input referred — 70 — dB
Total harmonic distortion THDOPA DRIVESTRENGTH = 2, 3x Gain
connection, 1 kHz, VOUT = 0.1 V
to VOPA - 0.1 V
— 90 — dB
DRIVESTRENGTH = 0, 3x Gain
connection, 0.1 kHz, VOUT = 0.1 V
to VOPA - 0.1 V
— 90 — dB
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 59
Parameter Symbol Test Condition Min Typ Max Unit
Note:
1. Specified configuration for Unit gain buffer configuration is: INCBW = 0, HCMDIS = 0, RESINSEL = DISABLE. VINPUT = 0.5 V,
VOUTPUT = 0.5 V.
2. Specified configuration for 3X-Gain configuration is: INCBW = 1, HCMDIS = 1, RESINSEL = VSS, VINPUT = 0.5 V, VOUTPUT = 1.5
V. Nominal voltage gain is 3.
3. If the maximum CLOAD is exceeded, an isolation resistor is required for stability. See AN0038 for more information.
4. Current into the load resistor is excluded. When the OPAMP is connected with closed-loop gain > 1, there will be extra current to
drive the resistor feedback network. The internal resistor feedback network has total resistance of 143.5 kOhm, which will cause
another ~10 µA current when the OPAMP drives 1.5 V between output and ground.
5. In unit gain connection, UGF is the gain-bandwidth product of the OPAMP. In 3x Gain connection, UGF is the gain-bandwidth
product of the OPAMP and 1/3 attenuation of the feedback network.
6. Step between 0.2V and VOPA-0.2V, 10%-90% rising/falling range.
7. When INCBW is set to 1 the OPAMP bandwidth is increased. This is allowed only when the non-inverting close-loop gain is ≥ 3,
or the OPAMP may not be stable.
8. From enable to output settled. In sample-and-off mode, RC network after OPAMP will contribute extra delay. Settling error < 1mV.
9. When HCMDIS=1 and input common mode transitions the region from VOPA-1.4V to VOPA-1V, input offset will change. PSRR
and CMRR specifications do not apply to this transition region.
4.1.19 Pulse Counter (PCNT)
Table 4.35. Pulse Counter (PCNT)
Parameter Symbol Test Condition Min Typ Max Unit
Input frequency FIN Asynchronous Single and Quad-
rature Modes
— — 10 MHz
Sampled Modes with Debounce
filter set to 0.
— — 8 kHz
4.1.20 Analog Port (APORT)
Table 4.36. Analog Port (APORT)
Parameter Symbol Test Condition Min Typ Max Unit
Supply current1 2IAPORT Operation in EM0/EM1 — 7 — µA
Operation in EM2/EM3 — 63 — nA
Note:
1. Supply current increase that occurs when an analog peripheral requests access to APORT. This current is not included in repor-
ted module currents. Additional peripherals requesting access to APORT do not incur further current.
2. Specified current is for continuous APORT operation. In applications where the APORT is not requested continuously (e.g. peri-
odic ACMP requests from LESENSE in EM2), the average current requirements can be estimated by mutiplying the duty cycle of
the requests by the specified continuous current number.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 60
4.1.21 I2C
4.1.21.1 I2C Standard-mode (Sm)1
Table 4.37. I2C Standard-mode (Sm)1
Parameter Symbol Test Condition Min Typ Max Unit
SCL clock frequency2fSCL 0 — 100 kHz
SCL clock low time tLOW 4.7 — — µs
SCL clock high time tHIGH 4 — — µs
SDA set-up time tSU_DAT 250 — — ns
SDA hold time3tHD_DAT 100 — 3450 ns
Repeated START condition
set-up time
tSU_STA 4.7 — — µs
(Repeated) START condition
hold time
tHD_STA 4 — — µs
STOP condition set-up time tSU_STO 4 — — µs
Bus free time between a
STOP and START condition
tBUF 4.7 — — µs
Note:
1. For CLHR set to 0 in the I2Cn_CTRL register.
2. For the minimum HFPERCLK frequency required in Standard-mode, refer to the I2C chapter in the reference manual.
3. The maximum SDA hold time (tHD_DAT) needs to be met only when the device does not stretch the low time of SCL (tLOW).
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 61
4.1.21.2 I2C Fast-mode (Fm)1
Table 4.38. I2C Fast-mode (Fm)1
Parameter Symbol Test Condition Min Typ Max Unit
SCL clock frequency2fSCL 0 — 400 kHz
SCL clock low time tLOW 1.3 — — µs
SCL clock high time tHIGH 0.6 — — µs
SDA set-up time tSU_DAT 100 — — ns
SDA hold time3tHD_DAT 100 — 900 ns
Repeated START condition
set-up time
tSU_STA 0.6 — — µs
(Repeated) START condition
hold time
tHD_STA 0.6 — — µs
STOP condition set-up time tSU_STO 0.6 — — µs
Bus free time between a
STOP and START condition
tBUF 1.3 — — µs
Note:
1. For CLHR set to 1 in the I2Cn_CTRL register.
2. For the minimum HFPERCLK frequency required in Fast-mode, refer to the I2C chapter in the reference manual.
3. The maximum SDA hold time (tHD,DAT) needs to be met only when the device does not stretch the low time of SCL (tLOW).
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 62
4.1.21.3 I2C Fast-mode Plus (Fm+)1
Table 4.39. I2C Fast-mode Plus (Fm+)1
Parameter Symbol Test Condition Min Typ Max Unit
SCL clock frequency2fSCL 0 — 1000 kHz
SCL clock low time tLOW 0.5 — — µs
SCL clock high time tHIGH 0.26 — — µs
SDA set-up time tSU_DAT 50 — — ns
SDA hold time tHD_DAT 100 — — ns
Repeated START condition
set-up time
tSU_STA 0.26 — — µs
(Repeated) START condition
hold time
tHD_STA 0.26 — — µs
STOP condition set-up time tSU_STO 0.26 — — µs
Bus free time between a
STOP and START condition
tBUF 0.5 — — µs
Note:
1. For CLHR set to 0 or 1 in the I2Cn_CTRL register.
2. For the minimum HFPERCLK frequency required in Fast-mode Plus, refer to the I2C chapter in the reference manual.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 63
4.1.22 USART SPI
SPI Master Timing
Table 4.40. SPI Master Timing
Parameter Symbol Test Condition Min Typ Max Unit
SCLK period 1 2 3tSCLK 2 *
tHFPERCLK
— — ns
CS to MOSI 1 2tCS_MO -12.5 — 14 ns
SCLK to MOSI 1 2tSCLK_MO -8.5 — 10.5 ns
MISO setup time 1 2tSU_MI IOVDD = 1.62 V 90 — — ns
IOVDD = 3.0 V 42 — — ns
MISO hold time 1 2tH_MI -9 — — ns
Note:
1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0).
2. Measurement done with 8 pF output loading at 10% and 90% of VDD (figure shows 50% of VDD).
3. tHFPERCLK is one period of the selected HFPERCLK.
CS
SCLK
CLKPOL = 0
MOSI
MISO
tCS_MO
tH_MI
tSU_MI
tSCKL_MO
tSCLK
SCLK
CLKPOL = 1
Figure 4.1. SPI Master Timing Diagram
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 64
SPI Slave Timing
Table 4.41. SPI Slave Timing
Parameter Symbol Test Condition Min Typ Max Unit
SCLK period 1 2 3tSCLK 6 *
tHFPERCLK
— — ns
SCLK high time1 2 3tSCLK_HI 2.5 *
tHFPERCLK
— — ns
SCLK low time1 2 3tSCLK_LO 2.5 *
tHFPERCLK
— — ns
CS active to MISO 1 2tCS_ACT_MI 4 — 70 ns
CS disable to MISO 1 2tCS_DIS_MI 4 — 50 ns
MOSI setup time 1 2tSU_MO 12.5 — — ns
MOSI hold time 1 2 3tH_MO 13 — — ns
SCLK to MISO 1 2 3tSCLK_MI 6 + 1.5 *
tHFPERCLK
— 45 + 2.5 *
tHFPERCLK
ns
Note:
1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0).
2. Measurement done with 8 pF output loading at 10% and 90% of VDD (figure shows 50% of VDD).
3. tHFPERCLK is one period of the selected HFPERCLK.
CS
SCLK
CLKPOL = 0
MOSI
MISO
tCS_ACT_MI
tSCLK_HI
tSCLK
tSU_MO
tH_MO
tSCLK_MI
tCS_DIS_MI
tSCLK_LO
SCLK
CLKPOL = 1
Figure 4.2. SPI Slave Timing Diagram
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 65
5. Typical Connection Diagrams
5.1 Typical BGM13S Connections
Typical connections for the BGM13S module are shown in Figure 5.1 Typical Connections for BGM13S with UART Network Co-Pro-
cessor on page 66. This diagram shows connections for:
• Power supplies
• Antenna loop for internal antenna usage or external antenna connection - The RF and ANTENNA pins should be tied together for
correct operation of the module. An optional 0R resistor can be added between RF and ANTENNA, making it possible to measure
the signal between these pins.
• Reset line
• UART connection to an external host for Network Co-Processor (NCP) usage (optional)
• 32.768 kHz crystal - Required in applications that must meet 500 ppm Bluetooth Sleep Clock accuracy requirement. More accurate
crystals can be used to reduce the listening window and thereby reduce overall current consumption. Recommended crystal is KDS
part number 1TJG125DP1A0012 or equivalent.
Note: It is recommended to connect the RESETn line to the host CPU when NCP mode is used.
Wireless
Module
Host CPU
RESETn
PA0 / UART_TX
PA1 / UART_RX
PA2 / UART_CTS
PA3 / UART_RTS
PB15 / LFXTAL_P
PB14 / LFXTAL_N
PB13 / PTI_FRAME
PB12 / PTI_DATA
VSS
PF3 / TDI
PF2 / TDO / SWO
PF1 / TMS / SWDIO
PF0 / TCK / SWCLK
RF
ANTENNA
RX
TX
RTS
CTS
GPIO
PTI_FRAME
PTI_DATA
TCK / SWCLK
TMS / SWDIO
TDO / SWO
TDI
R1 (0R)
Use 0R to connect
internal antenna
R2 (0R)
Use 0R to connect external
antenna
32.768 kHz XTAL
(optional)
VBATT
1V8
IOVDD
Battery / Supply Voltage
VDD
VSS
Battery or Regulator
Figure 5.1. Typical Connections for BGM13S with UART Network Co-Processor
Note: It is possible to power the IOVDD pin at 1.8 V from the DC-DC output (1V8). However, the 1V8 output is off by default, and
IOVDD must be powered when programming the device. Any system that powers IOVDD directly from 1V8 must power IOVDD exter-
nally during initial programming.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Typical Connection Diagrams
silabs.com | Building a more connected world. Rev. 1.0 | 66
Two common debug interface options are shown in Figure 5.2 Common Debug Connections on page 67. Refer to AN958 for more
information and additional options.
PTI_FRAME / PB13 PTI_DATA / PB12
TCK / SWCLK / PF0
TMS / SWDIO / PF1
TDO / SWO / PF2
TDI / PF3
1
3
5
7
9
11
13
15
17
19
2
4
6
8
10
12
14
16
18
20
RESETn
3 V
1
3
5
7
9
2
4
6
8
10
3 V
TDO / SWO / PF2
TCK / SWCLK / PF0TMS / SWDIO / PF1
RESETn
UART_TX / PA0
UART_RX / PA1
Standard ARM Cortex Debug Connector Mini Simplicity Debug Connector
Figure 5.2. Common Debug Connections
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Typical Connection Diagrams
silabs.com | Building a more connected world. Rev. 1.0 | 67
6. Layout Guidelines
For optimal performance of the BGM13S, please follow the PCB layout guidelines and ground plane recommendations indicated in this
section.
6.1 Layout Guidelines
This section contains generic PCB layout and design guidelines for the BGM13S module. For optimal performance:
• Place the module at the edge of the PCB, as shown in the figures in this chapter.
• Do not place any metal (traces, components, etc.) in the antenna clearance area.
• Connect all ground pads directly to a solid ground plane.
• Place the ground vias as close to the ground pads as possible.
Figure 6.1. BGM13S PCB Top Layer Design
The following rules are recommended for the PCB design:
•Trace to copper clearance 150um
• PTH drill size 300um
• PTH annular ring 150um
Important:
The antenna area must align with the pads precisely. Please refer to the recommended PCB land pattern for exact dimensions.
Figure 6.2. BGM13S PCB Middle and Bottom Layer Design
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Layout Guidelines
silabs.com | Building a more connected world. Rev. 1.0 | 68
Figure 6.3. Poor Layout Designs for the BGM13S
Layout checklist for BGM13S:
1. Antenna area is aligned relative to the module pads as shown in the recommended PCB land pattern.
2. Clearance area within the inner layers and bottom layer is covering the whole antenna area as shown in the layout guidelines.
3. The antenna loop is implemented on the top layer as shown in the layoyt guidelines.
4. All dimensions within the antenna area are precisely as shown in the recommended PCB land pattern.
5. The module is placed near the edge of the PCB with max 1mm indentation.
6. The module is not placed in the corner of the PCB.
6.2 Effect of PCB Width
The BGM13S module should be placed at the center of the PCB edge. The width of the board has an impact to the radiated efficiency
and, more importantly, there should be enough ground plane on both sides of the module for optimal antenna performance. Figure
6.4 BGM13S PCB Top Layer Design on page 69 gives an indcation of ground plane size vs. maximum achievable range.
Figure 6.4. BGM13S PCB Top Layer Design
The impact of the board size to the radiated performance is a generic feature of all PCB and chip antennas and it is not a unique fea-
ture of the BGM13S. For the BGM13S the depth of the board is not important and does not impact the radiated performance.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Layout Guidelines
silabs.com | Building a more connected world. Rev. 1.0 | 69
6.3 Effect of Plastic and Metal Materials
The antenna on the BGM13S is insensitive to the effects of nearby plastic and other materials with low dielectric constant. No separa-
tion between the BGM13S and plastic or other materials is needed. The board thickness does not have any impact on the module ei-
ther.
Any metal within the antenna area or in close proximity to the antenna area may detune the antenna. In this case it is possible to retune
the antenna by adjusting the width of the antenna loop. To avoid detuning of the antenna, the minimum distance to any metal should be
more than 3 mm. Encapsulating the module inside metal casing will prevent the radiation of the antenna.
Figure 6.5 Antenna Tuning on page 70 shows how it is possible to adjust the frequency of the antenna by adjusting the width of the
antenna loop. The antenna is extremely robust against any objects in close proximity or in direct contact with the antenna and it is rec-
ommended not to adjust the dimensions of the antenna area unless it is clear that a metal object, such as a coin cell battery, within the
antenna area is detuning the antenna.
Figure 6.5. Antenna Tuning
6.4 Effects of Human Body
Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Layout Guidelines
silabs.com | Building a more connected world. Rev. 1.0 | 70
6.5 2D Radiation Pattern Plots
Figure 6.6. Typical 2D Radiation Pattern – Front View
Figure 6.7. Typical 2D Radiation Pattern – Side View
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Layout Guidelines
silabs.com | Building a more connected world. Rev. 1.0 | 71
Figure 6.8. Typical 2D Radiation Pattern – Top View
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Layout Guidelines
silabs.com | Building a more connected world. Rev. 1.0 | 72
7. Pin Definitions
7.1 BGM13S Device Pinout
Figure 7.1. BGM13S Device Pinout
The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-
ported features for each GPIO pin, see 7.2 GPIO Functionality Table or 7.3 Alternate Functionality Overview.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 73
Table 7.1. BGM13S Device Pinout
Pin Name Pin(s) Description Pin Name Pin(s) Description
VSS
1
4
5
20
31
45
46
48
49
50
51
Ground ANTENNA 2 50 Ohm input pin for internal antenna.
RF 3 50 Ohm I/O for external antenna con-
nection. PD9 6 GPIO (5V)
PD10 7 GPIO (5V) PD11 8 GPIO (5V)
PD12 9 GPIO (5V) PD13 10 GPIO
PD14 11 GPIO PD15 12 GPIO
PA0 13 GPIO PA1 14 GPIO
PA2 15 GPIO PA3 16 GPIO
PA4 17 GPIO PA5 18 GPIO (5V)
PB15 19 GPIO PB14 21 GPIO
VBATT 22 Battery supply voltage input to the inter-
nal DC-DC and analog supply. 1V8 23
1.8V output of the internal DC-DC con-
verter. Internally decoupled - do not add
external decoupling.
IOVDD 24 Digital IO power supply. NC 25 No Connect.
PC6 26 GPIO (5V) PC7 27 GPIO (5V)
PC8 28 GPIO (5V) PF2 29 GPIO (5V)
PC9 30 GPIO (5V) PC10 32 GPIO (5V)
PC11 33 GPIO (5V) PF0 34 GPIO (5V)
PF1 35 GPIO (5V) PB13 36 GPIO
PB12 37 GPIO PB11 38 GPIO
PF3 39 GPIO (5V) PF4 40 GPIO (5V)
PF5 41 GPIO (5V) PF6 42 GPIO (5V)
PF7 43 GPIO (5V) RESETn 44
Reset input, active low. To apply an ex-
ternal reset source to this pin, it is re-
quired to only drive this pin low during
reset, and let the internal pull-up ensure
that reset is released.
ANT_GND 47 Antenna ground.
Note:
1. GPIO with 5V tolerance are indicated by (5V).
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 74
7.2 GPIO Functionality Table
A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of each GPIO
pin, followed by the functionality available on that pin. Refer to 7.3 Alternate Functionality Overview for a list of GPIO locations available
for each function.
Table 7.2. GPIO Functionality Table
GPIO Name Pin Alternate Functionality / Description
Analog Timers Communication Radio Other
PA0 BUSDY BUSCX
ADC0_EXTN
TIM0_CC0 #0
TIM0_CC1 #31
TIM0_CC2 #30
TIM0_CDTI0 #29
TIM0_CDTI1 #28
TIM0_CDTI2 #27
TIM1_CC0 #0
TIM1_CC1 #31
TIM1_CC2 #30
TIM1_CC3 #29
WTIM0_CC0 #0 LE-
TIM0_OUT0 #0 LE-
TIM0_OUT1 #31
PCNT0_S0IN #0
PCNT0_S1IN #31
US0_TX #0 US0_RX
#31 US0_CLK #30
US0_CS #29
US0_CTS #28
US0_RTS #27
US1_TX #0 US1_RX
#31 US1_CLK #30
US1_CS #29
US1_CTS #28
US1_RTS #27
LEU0_TX #0
LEU0_RX #31
I2C0_SDA #0
I2C0_SCL #31
FRC_DCLK #0
FRC_DOUT #31
FRC_DFRAME #30
MODEM_DCLK #0
MODEM_DIN #31
MODEM_DOUT #30
CMU_CLK1 #0
PRS_CH6 #0
PRS_CH7 #10
PRS_CH8 #9
PRS_CH9 #8
ACMP0_O #0
ACMP1_O #0
LES_CH8
PA1
BUSCY BUSDX
ADC0_EXTP
VDAC0_EXT
TIM0_CC0 #1
TIM0_CC1 #0
TIM0_CC2 #31
TIM0_CDTI0 #30
TIM0_CDTI1 #29
TIM0_CDTI2 #28
TIM1_CC0 #1
TIM1_CC1 #0
TIM1_CC2 #31
TIM1_CC3 #30
WTIM0_CC0 #1 LE-
TIM0_OUT0 #1 LE-
TIM0_OUT1 #0
PCNT0_S0IN #1
PCNT0_S1IN #0
US0_TX #1 US0_RX
#0 US0_CLK #31
US0_CS #30
US0_CTS #29
US0_RTS #28
US1_TX #1 US1_RX
#0 US1_CLK #31
US1_CS #30
US1_CTS #29
US1_RTS #28
LEU0_TX #1
LEU0_RX #0
I2C0_SDA #1
I2C0_SCL #0
FRC_DCLK #1
FRC_DOUT #0
FRC_DFRAME #31
MODEM_DCLK #1
MODEM_DIN #0
MODEM_DOUT #31
CMU_CLK0 #0
PRS_CH6 #1
PRS_CH7 #0
PRS_CH8 #10
PRS_CH9 #9
ACMP0_O #1
ACMP1_O #1
LES_CH9
PA2
VDAC0_OUT1ALT /
OPA1_OUTALT #1
BUSDY BUSCX
OPA0_P
TIM0_CC0 #2
TIM0_CC1 #1
TIM0_CC2 #0
TIM0_CDTI0 #31
TIM0_CDTI1 #30
TIM0_CDTI2 #29
TIM1_CC0 #2
TIM1_CC1 #1
TIM1_CC2 #0
TIM1_CC3 #31
WTIM0_CC0 #2
WTIM0_CC1 #0 LE-
TIM0_OUT0 #2 LE-
TIM0_OUT1 #1
PCNT0_S0IN #2
PCNT0_S1IN #1
US0_TX #2 US0_RX
#1 US0_CLK #0
US0_CS #31
US0_CTS #30
US0_RTS #29
US1_TX #2 US1_RX
#1 US1_CLK #0
US1_CS #31
US1_CTS #30
US1_RTS #29
LEU0_TX #2
LEU0_RX #1
I2C0_SDA #2
I2C0_SCL #1
FRC_DCLK #2
FRC_DOUT #1
FRC_DFRAME #0
MODEM_DCLK #2
MODEM_DIN #1
MODEM_DOUT #0
PRS_CH6 #2
PRS_CH7 #1
PRS_CH8 #0
PRS_CH9 #10
ACMP0_O #2
ACMP1_O #2
LES_CH10
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 75
GPIO Name Pin Alternate Functionality / Description
Analog Timers Communication Radio Other
PA3
BUSCY BUSDX
VDAC0_OUT0 /
OPA0_OUT
TIM0_CC0 #3
TIM0_CC1 #2
TIM0_CC2 #1
TIM0_CDTI0 #0
TIM0_CDTI1 #31
TIM0_CDTI2 #30
TIM1_CC0 #3
TIM1_CC1 #2
TIM1_CC2 #1
TIM1_CC3 #0
WTIM0_CC0 #3
WTIM0_CC1 #1 LE-
TIM0_OUT0 #3 LE-
TIM0_OUT1 #2
PCNT0_S0IN #3
PCNT0_S1IN #2
US0_TX #3 US0_RX
#2 US0_CLK #1
US0_CS #0
US0_CTS #31
US0_RTS #30
US1_TX #3 US1_RX
#2 US1_CLK #1
US1_CS #0
US1_CTS #31
US1_RTS #30
LEU0_TX #3
LEU0_RX #2
I2C0_SDA #3
I2C0_SCL #2
FRC_DCLK #3
FRC_DOUT #2
FRC_DFRAME #1
MODEM_DCLK #3
MODEM_DIN #2
MODEM_DOUT #1
PRS_CH6 #3
PRS_CH7 #2
PRS_CH8 #1
PRS_CH9 #0
ACMP0_O #3
ACMP1_O #3
LES_CH11
GPIO_EM4WU8
PA4
VDAC0_OUT1ALT /
OPA1_OUTALT #2
BUSDY BUSCX
OPA0_N
TIM0_CC0 #4
TIM0_CC1 #3
TIM0_CC2 #2
TIM0_CDTI0 #1
TIM0_CDTI1 #0
TIM0_CDTI2 #31
TIM1_CC0 #4
TIM1_CC1 #3
TIM1_CC2 #2
TIM1_CC3 #1
WTIM0_CC0 #4
WTIM0_CC1 #2
WTIM0_CC2 #0 LE-
TIM0_OUT0 #4 LE-
TIM0_OUT1 #3
PCNT0_S0IN #4
PCNT0_S1IN #3
US0_TX #4 US0_RX
#3 US0_CLK #2
US0_CS #1
US0_CTS #0
US0_RTS #31
US1_TX #4 US1_RX
#3 US1_CLK #2
US1_CS #1
US1_CTS #0
US1_RTS #31
LEU0_TX #4
LEU0_RX #3
I2C0_SDA #4
I2C0_SCL #3
FRC_DCLK #4
FRC_DOUT #3
FRC_DFRAME #2
MODEM_DCLK #4
MODEM_DIN #3
MODEM_DOUT #2
PRS_CH6 #4
PRS_CH7 #3
PRS_CH8 #2
PRS_CH9 #1
ACMP0_O #4
ACMP1_O #4
LES_CH12
PA5
VDAC0_OUT0ALT /
OPA0_OUTALT #0
BUSCY BUSDX
TIM0_CC0 #5
TIM0_CC1 #4
TIM0_CC2 #3
TIM0_CDTI0 #2
TIM0_CDTI1 #1
TIM0_CDTI2 #0
TIM1_CC0 #5
TIM1_CC1 #4
TIM1_CC2 #3
TIM1_CC3 #2
WTIM0_CC0 #5
WTIM0_CC1 #3
WTIM0_CC2 #1 LE-
TIM0_OUT0 #5 LE-
TIM0_OUT1 #4
PCNT0_S0IN #5
PCNT0_S1IN #4
US0_TX #5 US0_RX
#4 US0_CLK #3
US0_CS #2
US0_CTS #1
US0_RTS #0
US1_TX #5 US1_RX
#4 US1_CLK #3
US1_CS #2
US1_CTS #1
US1_RTS #0
US2_TX #0 US2_RX
#31 US2_CLK #30
US2_CS #29
US2_CTS #28
US2_RTS #27
LEU0_TX #5
LEU0_RX #4
I2C0_SDA #5
I2C0_SCL #4
FRC_DCLK #5
FRC_DOUT #4
FRC_DFRAME #3
MODEM_DCLK #5
MODEM_DIN #4
MODEM_DOUT #3
CMU_CLKI0 #4
PRS_CH6 #5
PRS_CH7 #4
PRS_CH8 #3
PRS_CH9 #2
ACMP0_O #5
ACMP1_O #5
LES_CH13
ETM_TCLK #1
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 76
GPIO Name Pin Alternate Functionality / Description
Analog Timers Communication Radio Other
PB11 BUSCY BUSDX
OPA2_P
TIM0_CC0 #6
TIM0_CC1 #5
TIM0_CC2 #4
TIM0_CDTI0 #3
TIM0_CDTI1 #2
TIM0_CDTI2 #1
TIM1_CC0 #6
TIM1_CC1 #5
TIM1_CC2 #4
TIM1_CC3 #3
WTIM0_CC0 #15
WTIM0_CC1 #13
WTIM0_CC2 #11
WTIM0_CDTI0 #7
WTIM0_CDTI1 #5
WTIM0_CDTI2 #3
LETIM0_OUT0 #6
LETIM0_OUT1 #5
PCNT0_S0IN #6
PCNT0_S1IN #5
US0_TX #6 US0_RX
#5 US0_CLK #4
US0_CS #3
US0_CTS #2
US0_RTS #1
US1_TX #6 US1_RX
#5 US1_CLK #4
US1_CS #3
US1_CTS #2
US1_RTS #1
LEU0_TX #6
LEU0_RX #5
I2C0_SDA #6
I2C0_SCL #5
FRC_DCLK #6
FRC_DOUT #5
FRC_DFRAME #4
MODEM_DCLK #6
MODEM_DIN #5
MODEM_DOUT #4
PRS_CH6 #6
PRS_CH7 #5
PRS_CH8 #4
PRS_CH9 #3
ACMP0_O #6
ACMP1_O #6
PB12 BUSDY BUSCX
OPA2_OUT
TIM0_CC0 #7
TIM0_CC1 #6
TIM0_CC2 #5
TIM0_CDTI0 #4
TIM0_CDTI1 #3
TIM0_CDTI2 #2
TIM1_CC0 #7
TIM1_CC1 #6
TIM1_CC2 #5
TIM1_CC3 #4
WTIM0_CC0 #16
WTIM0_CC1 #14
WTIM0_CC2 #12
WTIM0_CDTI0 #8
WTIM0_CDTI1 #6
WTIM0_CDTI2 #4
LETIM0_OUT0 #7
LETIM0_OUT1 #6
PCNT0_S0IN #7
PCNT0_S1IN #6
US0_TX #7 US0_RX
#6 US0_CLK #5
US0_CS #4
US0_CTS #3
US0_RTS #2
US1_TX #7 US1_RX
#6 US1_CLK #5
US1_CS #4
US1_CTS #3
US1_RTS #2
LEU0_TX #7
LEU0_RX #6
I2C0_SDA #7
I2C0_SCL #6
FRC_DCLK #7
FRC_DOUT #6
FRC_DFRAME #5
MODEM_DCLK #7
MODEM_DIN #6
MODEM_DOUT #5
PRS_CH6 #7
PRS_CH7 #6
PRS_CH8 #5
PRS_CH9 #4
ACMP0_O #7
ACMP1_O #7
PB13 BUSCY BUSDX
OPA2_N
TIM0_CC0 #8
TIM0_CC1 #7
TIM0_CC2 #6
TIM0_CDTI0 #5
TIM0_CDTI1 #4
TIM0_CDTI2 #3
TIM1_CC0 #8
TIM1_CC1 #7
TIM1_CC2 #6
TIM1_CC3 #5
WTIM0_CC0 #17
WTIM0_CC1 #15
WTIM0_CC2 #13
WTIM0_CDTI0 #9
WTIM0_CDTI1 #7
WTIM0_CDTI2 #5
LETIM0_OUT0 #8
LETIM0_OUT1 #7
PCNT0_S0IN #8
PCNT0_S1IN #7
US0_TX #8 US0_RX
#7 US0_CLK #6
US0_CS #5
US0_CTS #4
US0_RTS #3
US1_TX #8 US1_RX
#7 US1_CLK #6
US1_CS #5
US1_CTS #4
US1_RTS #3
LEU0_TX #8
LEU0_RX #7
I2C0_SDA #8
I2C0_SCL #7
FRC_DCLK #8
FRC_DOUT #7
FRC_DFRAME #6
MODEM_DCLK #8
MODEM_DIN #7
MODEM_DOUT #6
CMU_CLKI0 #0
PRS_CH6 #8
PRS_CH7 #7
PRS_CH8 #6
PRS_CH9 #5
ACMP0_O #8
ACMP1_O #8
DBG_SWO #1
GPIO_EM4WU9
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 77
GPIO Name Pin Alternate Functionality / Description
Analog Timers Communication Radio Other
PB14 BUSDY BUSCX
LFXTAL_N
TIM0_CC0 #9
TIM0_CC1 #8
TIM0_CC2 #7
TIM0_CDTI0 #6
TIM0_CDTI1 #5
TIM0_CDTI2 #4
TIM1_CC0 #9
TIM1_CC1 #8
TIM1_CC2 #7
TIM1_CC3 #6
WTIM0_CC0 #18
WTIM0_CC1 #16
WTIM0_CC2 #14
WTIM0_CDTI0 #10
WTIM0_CDTI1 #8
WTIM0_CDTI2 #6
LETIM0_OUT0 #9
LETIM0_OUT1 #8
PCNT0_S0IN #9
PCNT0_S1IN #8
US0_TX #9 US0_RX
#8 US0_CLK #7
US0_CS #6
US0_CTS #5
US0_RTS #4
US1_TX #9 US1_RX
#8 US1_CLK #7
US1_CS #6
US1_CTS #5
US1_RTS #4
LEU0_TX #9
LEU0_RX #8
I2C0_SDA #9
I2C0_SCL #8
FRC_DCLK #9
FRC_DOUT #8
FRC_DFRAME #7
MODEM_DCLK #9
MODEM_DIN #8
MODEM_DOUT #7
CMU_CLK1 #1
PRS_CH6 #9
PRS_CH7 #8
PRS_CH8 #7
PRS_CH9 #6
ACMP0_O #9
ACMP1_O #9
PB15 BUSCY BUSDX
LFXTAL_P
TIM0_CC0 #10
TIM0_CC1 #9
TIM0_CC2 #8
TIM0_CDTI0 #7
TIM0_CDTI1 #6
TIM0_CDTI2 #5
TIM1_CC0 #10
TIM1_CC1 #9
TIM1_CC2 #8
TIM1_CC3 #7
WTIM0_CC0 #19
WTIM0_CC1 #17
WTIM0_CC2 #15
WTIM0_CDTI0 #11
WTIM0_CDTI1 #9
WTIM0_CDTI2 #7
LETIM0_OUT0 #10
LETIM0_OUT1 #9
PCNT0_S0IN #10
PCNT0_S1IN #9
US0_TX #10
US0_RX #9
US0_CLK #8
US0_CS #7
US0_CTS #6
US0_RTS #5
US1_TX #10
US1_RX #9
US1_CLK #8
US1_CS #7
US1_CTS #6
US1_RTS #5
LEU0_TX #10
LEU0_RX #9
I2C0_SDA #10
I2C0_SCL #9
FRC_DCLK #10
FRC_DOUT #9
FRC_DFRAME #8
MODEM_DCLK #10
MODEM_DIN #9
MODEM_DOUT #8
CMU_CLK0 #1
PRS_CH6 #10
PRS_CH7 #9
PRS_CH8 #8
PRS_CH9 #7
ACMP0_O #10
ACMP1_O #10
PC6 BUSBY BUSAX
TIM0_CC0 #11
TIM0_CC1 #10
TIM0_CC2 #9
TIM0_CDTI0 #8
TIM0_CDTI1 #7
TIM0_CDTI2 #6
TIM1_CC0 #11
TIM1_CC1 #10
TIM1_CC2 #9
TIM1_CC3 #8
WTIM0_CC0 #26
WTIM0_CC1 #24
WTIM0_CC2 #22
WTIM0_CDTI0 #18
WTIM0_CDTI1 #16
WTIM0_CDTI2 #14
LETIM0_OUT0 #11
LETIM0_OUT1 #10
PCNT0_S0IN #11
PCNT0_S1IN #10
US0_TX #11
US0_RX #10
US0_CLK #9
US0_CS #8
US0_CTS #7
US0_RTS #6
US1_TX #11
US1_RX #10
US1_CLK #9
US1_CS #8
US1_CTS #7
US1_RTS #6
LEU0_TX #11
LEU0_RX #10
I2C0_SDA #11
I2C0_SCL #10
FRC_DCLK #11
FRC_DOUT #10
FRC_DFRAME #9
MODEM_DCLK #11
MODEM_DIN #10
MODEM_DOUT #9
CMU_CLK0 #2
CMU_CLKI0 #2
PRS_CH0 #8
PRS_CH9 #11
PRS_CH10 #0
PRS_CH11 #5
ACMP0_O #11
ACMP1_O #11
ETM_TCLK #3
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 78
GPIO Name Pin Alternate Functionality / Description
Analog Timers Communication Radio Other
PC7 BUSAY BUSBX
TIM0_CC0 #12
TIM0_CC1 #11
TIM0_CC2 #10
TIM0_CDTI0 #9
TIM0_CDTI1 #8
TIM0_CDTI2 #7
TIM1_CC0 #12
TIM1_CC1 #11
TIM1_CC2 #10
TIM1_CC3 #9
WTIM0_CC0 #27
WTIM0_CC1 #25
WTIM0_CC2 #23
WTIM0_CDTI0 #19
WTIM0_CDTI1 #17
WTIM0_CDTI2 #15
LETIM0_OUT0 #12
LETIM0_OUT1 #11
PCNT0_S0IN #12
PCNT0_S1IN #11
US0_TX #12
US0_RX #11
US0_CLK #10
US0_CS #9
US0_CTS #8
US0_RTS #7
US1_TX #12
US1_RX #11
US1_CLK #10
US1_CS #9
US1_CTS #8
US1_RTS #7
LEU0_TX #12
LEU0_RX #11
I2C0_SDA #12
I2C0_SCL #11
FRC_DCLK #12
FRC_DOUT #11
FRC_DFRAME #10
MODEM_DCLK #12
MODEM_DIN #11
MODEM_DOUT #10
CMU_CLK1 #2
PRS_CH0 #9
PRS_CH9 #12
PRS_CH10 #1
PRS_CH11 #0
ACMP0_O #12
ACMP1_O #12
ETM_TD0
PC8 BUSBY BUSAX
TIM0_CC0 #13
TIM0_CC1 #12
TIM0_CC2 #11
TIM0_CDTI0 #10
TIM0_CDTI1 #9
TIM0_CDTI2 #8
TIM1_CC0 #13
TIM1_CC1 #12
TIM1_CC2 #11
TIM1_CC3 #10
WTIM0_CC0 #28
WTIM0_CC1 #26
WTIM0_CC2 #24
WTIM0_CDTI0 #20
WTIM0_CDTI1 #18
WTIM0_CDTI2 #16
LETIM0_OUT0 #13
LETIM0_OUT1 #12
PCNT0_S0IN #13
PCNT0_S1IN #12
US0_TX #13
US0_RX #12
US0_CLK #11
US0_CS #10
US0_CTS #9
US0_RTS #8
US1_TX #13
US1_RX #12
US1_CLK #11
US1_CS #10
US1_CTS #9
US1_RTS #8
LEU0_TX #13
LEU0_RX #12
I2C0_SDA #13
I2C0_SCL #12
FRC_DCLK #13
FRC_DOUT #12
FRC_DFRAME #11
MODEM_DCLK #13
MODEM_DIN #12
MODEM_DOUT #11
PRS_CH0 #10
PRS_CH9 #13
PRS_CH10 #2
PRS_CH11 #1
ACMP0_O #13
ACMP1_O #13
ETM_TD1
PC9 BUSAY BUSBX
TIM0_CC0 #14
TIM0_CC1 #13
TIM0_CC2 #12
TIM0_CDTI0 #11
TIM0_CDTI1 #10
TIM0_CDTI2 #9
TIM1_CC0 #14
TIM1_CC1 #13
TIM1_CC2 #12
TIM1_CC3 #11
WTIM0_CC0 #29
WTIM0_CC1 #27
WTIM0_CC2 #25
WTIM0_CDTI0 #21
WTIM0_CDTI1 #19
WTIM0_CDTI2 #17
LETIM0_OUT0 #14
LETIM0_OUT1 #13
PCNT0_S0IN #14
PCNT0_S1IN #13
US0_TX #14
US0_RX #13
US0_CLK #12
US0_CS #11
US0_CTS #10
US0_RTS #9
US1_TX #14
US1_RX #13
US1_CLK #12
US1_CS #11
US1_CTS #10
US1_RTS #9
LEU0_TX #14
LEU0_RX #13
I2C0_SDA #14
I2C0_SCL #13
FRC_DCLK #14
FRC_DOUT #13
FRC_DFRAME #12
MODEM_DCLK #14
MODEM_DIN #13
MODEM_DOUT #12
PRS_CH0 #11
PRS_CH9 #14
PRS_CH10 #3
PRS_CH11 #2
ACMP0_O #14
ACMP1_O #14
ETM_TD2
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 79
GPIO Name Pin Alternate Functionality / Description
Analog Timers Communication Radio Other
PC10 BUSBY BUSAX
TIM0_CC0 #15
TIM0_CC1 #14
TIM0_CC2 #13
TIM0_CDTI0 #12
TIM0_CDTI1 #11
TIM0_CDTI2 #10
TIM1_CC0 #15
TIM1_CC1 #14
TIM1_CC2 #13
TIM1_CC3 #12
WTIM0_CC0 #30
WTIM0_CC1 #28
WTIM0_CC2 #26
WTIM0_CDTI0 #22
WTIM0_CDTI1 #20
WTIM0_CDTI2 #18
LETIM0_OUT0 #15
LETIM0_OUT1 #14
PCNT0_S0IN #15
PCNT0_S1IN #14
US0_TX #15
US0_RX #14
US0_CLK #13
US0_CS #12
US0_CTS #11
US0_RTS #10
US1_TX #15
US1_RX #14
US1_CLK #13
US1_CS #12
US1_CTS #11
US1_RTS #10
LEU0_TX #15
LEU0_RX #14
I2C0_SDA #15
I2C0_SCL #14
I2C1_SDA #19
I2C1_SCL #18
FRC_DCLK #15
FRC_DOUT #14
FRC_DFRAME #13
MODEM_DCLK #15
MODEM_DIN #14
MODEM_DOUT #13
CMU_CLK1 #3
PRS_CH0 #12
PRS_CH9 #15
PRS_CH10 #4
PRS_CH11 #3
ACMP0_O #15
ACMP1_O #15
ETM_TD3
GPIO_EM4WU12
PC11 BUSAY BUSBX
TIM0_CC0 #16
TIM0_CC1 #15
TIM0_CC2 #14
TIM0_CDTI0 #13
TIM0_CDTI1 #12
TIM0_CDTI2 #11
TIM1_CC0 #16
TIM1_CC1 #15
TIM1_CC2 #14
TIM1_CC3 #13
WTIM0_CC0 #31
WTIM0_CC1 #29
WTIM0_CC2 #27
WTIM0_CDTI0 #23
WTIM0_CDTI1 #21
WTIM0_CDTI2 #19
LETIM0_OUT0 #16
LETIM0_OUT1 #15
PCNT0_S0IN #16
PCNT0_S1IN #15
US0_TX #16
US0_RX #15
US0_CLK #14
US0_CS #13
US0_CTS #12
US0_RTS #11
US1_TX #16
US1_RX #15
US1_CLK #14
US1_CS #13
US1_CTS #12
US1_RTS #11
LEU0_TX #16
LEU0_RX #15
I2C0_SDA #16
I2C0_SCL #15
I2C1_SDA #20
I2C1_SCL #19
FRC_DCLK #16
FRC_DOUT #15
FRC_DFRAME #14
MODEM_DCLK #16
MODEM_DIN #15
MODEM_DOUT #14
CMU_CLK0 #3
PRS_CH0 #13
PRS_CH9 #16
PRS_CH10 #5
PRS_CH11 #4
ACMP0_O #16
ACMP1_O #16
DBG_SWO #3
PD9 BUSCY BUSDX
TIM0_CC0 #17
TIM0_CC1 #16
TIM0_CC2 #15
TIM0_CDTI0 #14
TIM0_CDTI1 #13
TIM0_CDTI2 #12
TIM1_CC0 #17
TIM1_CC1 #16
TIM1_CC2 #15
TIM1_CC3 #14
WTIM0_CC1 #31
WTIM0_CC2 #29
WTIM0_CDTI0 #25
WTIM0_CDTI1 #23
WTIM0_CDTI2 #21
LETIM0_OUT0 #17
LETIM0_OUT1 #16
PCNT0_S0IN #17
PCNT0_S1IN #16
US0_TX #17
US0_RX #16
US0_CLK #15
US0_CS #14
US0_CTS #13
US0_RTS #12
US1_TX #17
US1_RX #16
US1_CLK #15
US1_CS #14
US1_CTS #13
US1_RTS #12
LEU0_TX #17
LEU0_RX #16
I2C0_SDA #17
I2C0_SCL #16
FRC_DCLK #17
FRC_DOUT #16
FRC_DFRAME #15
MODEM_DCLK #17
MODEM_DIN #16
MODEM_DOUT #15
CMU_CLK0 #4
PRS_CH3 #8
PRS_CH4 #0
PRS_CH5 #6
PRS_CH6 #11
ACMP0_O #17
ACMP1_O #17
LES_CH1
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 80
GPIO Name Pin Alternate Functionality / Description
Analog Timers Communication Radio Other
PD10 BUSDY BUSCX
TIM0_CC0 #18
TIM0_CC1 #17
TIM0_CC2 #16
TIM0_CDTI0 #15
TIM0_CDTI1 #14
TIM0_CDTI2 #13
TIM1_CC0 #18
TIM1_CC1 #17
TIM1_CC2 #16
TIM1_CC3 #15
WTIM0_CC2 #30
WTIM0_CDTI0 #26
WTIM0_CDTI1 #24
WTIM0_CDTI2 #22
LETIM0_OUT0 #18
LETIM0_OUT1 #17
PCNT0_S0IN #18
PCNT0_S1IN #17
US0_TX #18
US0_RX #17
US0_CLK #16
US0_CS #15
US0_CTS #14
US0_RTS #13
US1_TX #18
US1_RX #17
US1_CLK #16
US1_CS #15
US1_CTS #14
US1_RTS #13
LEU0_TX #18
LEU0_RX #17
I2C0_SDA #18
I2C0_SCL #17
FRC_DCLK #18
FRC_DOUT #17
FRC_DFRAME #16
MODEM_DCLK #18
MODEM_DIN #17
MODEM_DOUT #16
CMU_CLK1 #4
PRS_CH3 #9
PRS_CH4 #1
PRS_CH5 #0
PRS_CH6 #12
ACMP0_O #18
ACMP1_O #18
LES_CH2
PD11 BUSCY BUSDX
TIM0_CC0 #19
TIM0_CC1 #18
TIM0_CC2 #17
TIM0_CDTI0 #16
TIM0_CDTI1 #15
TIM0_CDTI2 #14
TIM1_CC0 #19
TIM1_CC1 #18
TIM1_CC2 #17
TIM1_CC3 #16
WTIM0_CC2 #31
WTIM0_CDTI0 #27
WTIM0_CDTI1 #25
WTIM0_CDTI2 #23
LETIM0_OUT0 #19
LETIM0_OUT1 #18
PCNT0_S0IN #19
PCNT0_S1IN #18
US0_TX #19
US0_RX #18
US0_CLK #17
US0_CS #16
US0_CTS #15
US0_RTS #14
US1_TX #19
US1_RX #18
US1_CLK #17
US1_CS #16
US1_CTS #15
US1_RTS #14
LEU0_TX #19
LEU0_RX #18
I2C0_SDA #19
I2C0_SCL #18
FRC_DCLK #19
FRC_DOUT #18
FRC_DFRAME #17
MODEM_DCLK #19
MODEM_DIN #18
MODEM_DOUT #17
PRS_CH3 #10
PRS_CH4 #2
PRS_CH5 #1
PRS_CH6 #13
ACMP0_O #19
ACMP1_O #19
LES_CH3
PD12
VDAC0_OUT1ALT /
OPA1_OUTALT #0
BUSDY BUSCX
TIM0_CC0 #20
TIM0_CC1 #19
TIM0_CC2 #18
TIM0_CDTI0 #17
TIM0_CDTI1 #16
TIM0_CDTI2 #15
TIM1_CC0 #20
TIM1_CC1 #19
TIM1_CC2 #18
TIM1_CC3 #17
WTIM0_CDTI0 #28
WTIM0_CDTI1 #26
WTIM0_CDTI2 #24
LETIM0_OUT0 #20
LETIM0_OUT1 #19
PCNT0_S0IN #20
PCNT0_S1IN #19
US0_TX #20
US0_RX #19
US0_CLK #18
US0_CS #17
US0_CTS #16
US0_RTS #15
US1_TX #20
US1_RX #19
US1_CLK #18
US1_CS #17
US1_CTS #16
US1_RTS #15
LEU0_TX #20
LEU0_RX #19
I2C0_SDA #20
I2C0_SCL #19
FRC_DCLK #20
FRC_DOUT #19
FRC_DFRAME #18
MODEM_DCLK #20
MODEM_DIN #19
MODEM_DOUT #18
PRS_CH3 #11
PRS_CH4 #3
PRS_CH5 #2
PRS_CH6 #14
ACMP0_O #20
ACMP1_O #20
LES_CH4
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 81
GPIO Name Pin Alternate Functionality / Description
Analog Timers Communication Radio Other
PD13
VDAC0_OUT0ALT /
OPA0_OUTALT #1
BUSCY BUSDX
OPA1_P
TIM0_CC0 #21
TIM0_CC1 #20
TIM0_CC2 #19
TIM0_CDTI0 #18
TIM0_CDTI1 #17
TIM0_CDTI2 #16
TIM1_CC0 #21
TIM1_CC1 #20
TIM1_CC2 #19
TIM1_CC3 #18
WTIM0_CDTI0 #29
WTIM0_CDTI1 #27
WTIM0_CDTI2 #25
LETIM0_OUT0 #21
LETIM0_OUT1 #20
PCNT0_S0IN #21
PCNT0_S1IN #20
US0_TX #21
US0_RX #20
US0_CLK #19
US0_CS #18
US0_CTS #17
US0_RTS #16
US1_TX #21
US1_RX #20
US1_CLK #19
US1_CS #18
US1_CTS #17
US1_RTS #16
LEU0_TX #21
LEU0_RX #20
I2C0_SDA #21
I2C0_SCL #20
FRC_DCLK #21
FRC_DOUT #20
FRC_DFRAME #19
MODEM_DCLK #21
MODEM_DIN #20
MODEM_DOUT #19
PRS_CH3 #12
PRS_CH4 #4
PRS_CH5 #3
PRS_CH6 #15
ACMP0_O #21
ACMP1_O #21
LES_CH5
PD14
BUSDY BUSCX
VDAC0_OUT1 /
OPA1_OUT
TIM0_CC0 #22
TIM0_CC1 #21
TIM0_CC2 #20
TIM0_CDTI0 #19
TIM0_CDTI1 #18
TIM0_CDTI2 #17
TIM1_CC0 #22
TIM1_CC1 #21
TIM1_CC2 #20
TIM1_CC3 #19
WTIM0_CDTI0 #30
WTIM0_CDTI1 #28
WTIM0_CDTI2 #26
LETIM0_OUT0 #22
LETIM0_OUT1 #21
PCNT0_S0IN #22
PCNT0_S1IN #21
US0_TX #22
US0_RX #21
US0_CLK #20
US0_CS #19
US0_CTS #18
US0_RTS #17
US1_TX #22
US1_RX #21
US1_CLK #20
US1_CS #19
US1_CTS #18
US1_RTS #17
LEU0_TX #22
LEU0_RX #21
I2C0_SDA #22
I2C0_SCL #21
FRC_DCLK #22
FRC_DOUT #21
FRC_DFRAME #20
MODEM_DCLK #22
MODEM_DIN #21
MODEM_DOUT #20
CMU_CLK0 #5
PRS_CH3 #13
PRS_CH4 #5
PRS_CH5 #4
PRS_CH6 #16
ACMP0_O #22
ACMP1_O #22
LES_CH6
GPIO_EM4WU4
PD15
VDAC0_OUT0ALT /
OPA0_OUTALT #2
BUSCY BUSDX
OPA1_N
TIM0_CC0 #23
TIM0_CC1 #22
TIM0_CC2 #21
TIM0_CDTI0 #20
TIM0_CDTI1 #19
TIM0_CDTI2 #18
TIM1_CC0 #23
TIM1_CC1 #22
TIM1_CC2 #21
TIM1_CC3 #20
WTIM0_CDTI0 #31
WTIM0_CDTI1 #29
WTIM0_CDTI2 #27
LETIM0_OUT0 #23
LETIM0_OUT1 #22
PCNT0_S0IN #23
PCNT0_S1IN #22
US0_TX #23
US0_RX #22
US0_CLK #21
US0_CS #20
US0_CTS #19
US0_RTS #18
US1_TX #23
US1_RX #22
US1_CLK #21
US1_CS #20
US1_CTS #19
US1_RTS #18
LEU0_TX #23
LEU0_RX #22
I2C0_SDA #23
I2C0_SCL #22
FRC_DCLK #23
FRC_DOUT #22
FRC_DFRAME #21
MODEM_DCLK #23
MODEM_DIN #22
MODEM_DOUT #21
CMU_CLK1 #5
PRS_CH3 #14
PRS_CH4 #6
PRS_CH5 #5
PRS_CH6 #17
ACMP0_O #23
ACMP1_O #23
LES_CH7
DBG_SWO #2
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 82
GPIO Name Pin Alternate Functionality / Description
Analog Timers Communication Radio Other
PF0 BUSBY BUSAX
TIM0_CC0 #24
TIM0_CC1 #23
TIM0_CC2 #22
TIM0_CDTI0 #21
TIM0_CDTI1 #20
TIM0_CDTI2 #19
TIM1_CC0 #24
TIM1_CC1 #23
TIM1_CC2 #22
TIM1_CC3 #21
WTIM0_CDTI1 #30
WTIM0_CDTI2 #28
LETIM0_OUT0 #24
LETIM0_OUT1 #23
PCNT0_S0IN #24
PCNT0_S1IN #23
US0_TX #24
US0_RX #23
US0_CLK #22
US0_CS #21
US0_CTS #20
US0_RTS #19
US1_TX #24
US1_RX #23
US1_CLK #22
US1_CS #21
US1_CTS #20
US1_RTS #19
US2_TX #14
US2_RX #13
US2_CLK #12
US2_CS #11
US2_CTS #10
US2_RTS #9
LEU0_TX #24
LEU0_RX #23
I2C0_SDA #24
I2C0_SCL #23
FRC_DCLK #24
FRC_DOUT #23
FRC_DFRAME #22
MODEM_DCLK #24
MODEM_DIN #23
MODEM_DOUT #22
PRS_CH0 #0
PRS_CH1 #7
PRS_CH2 #6
PRS_CH3 #5
ACMP0_O #24
ACMP1_O #24
DBG_SWCLKTCK
BOOT_TX
PF1 BUSAY BUSBX
TIM0_CC0 #25
TIM0_CC1 #24
TIM0_CC2 #23
TIM0_CDTI0 #22
TIM0_CDTI1 #21
TIM0_CDTI2 #20
TIM1_CC0 #25
TIM1_CC1 #24
TIM1_CC2 #23
TIM1_CC3 #22
WTIM0_CDTI1 #31
WTIM0_CDTI2 #29
LETIM0_OUT0 #25
LETIM0_OUT1 #24
PCNT0_S0IN #25
PCNT0_S1IN #24
US0_TX #25
US0_RX #24
US0_CLK #23
US0_CS #22
US0_CTS #21
US0_RTS #20
US1_TX #25
US1_RX #24
US1_CLK #23
US1_CS #22
US1_CTS #21
US1_RTS #20
US2_TX #15
US2_RX #14
US2_CLK #13
US2_CS #12
US2_CTS #11
US2_RTS #10
LEU0_TX #25
LEU0_RX #24
I2C0_SDA #25
I2C0_SCL #24
FRC_DCLK #25
FRC_DOUT #24
FRC_DFRAME #23
MODEM_DCLK #25
MODEM_DIN #24
MODEM_DOUT #23
PRS_CH0 #1
PRS_CH1 #0
PRS_CH2 #7
PRS_CH3 #6
ACMP0_O #25
ACMP1_O #25
DBG_SWDIOTMS
BOOT_RX
PF2 BUSBY BUSAX
TIM0_CC0 #26
TIM0_CC1 #25
TIM0_CC2 #24
TIM0_CDTI0 #23
TIM0_CDTI1 #22
TIM0_CDTI2 #21
TIM1_CC0 #26
TIM1_CC1 #25
TIM1_CC2 #24
TIM1_CC3 #23
WTIM0_CDTI2 #30
LETIM0_OUT0 #26
LETIM0_OUT1 #25
PCNT0_S0IN #26
PCNT0_S1IN #25
US0_TX #26
US0_RX #25
US0_CLK #24
US0_CS #23
US0_CTS #22
US0_RTS #21
US1_TX #26
US1_RX #25
US1_CLK #24
US1_CS #23
US1_CTS #22
US1_RTS #21
LEU0_TX #26
LEU0_RX #25
I2C0_SDA #26
I2C0_SCL #25
FRC_DCLK #26
FRC_DOUT #25
FRC_DFRAME #24
MODEM_DCLK #26
MODEM_DIN #25
MODEM_DOUT #24
CMU_CLK0 #6
PRS_CH0 #2
PRS_CH1 #1
PRS_CH2 #0
PRS_CH3 #7
ACMP0_O #26
ACMP1_O #26
DBG_TDO
DBG_SWO #0
GPIO_EM4WU0
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 83
GPIO Name Pin Alternate Functionality / Description
Analog Timers Communication Radio Other
PF3 BUSAY BUSBX
TIM0_CC0 #27
TIM0_CC1 #26
TIM0_CC2 #25
TIM0_CDTI0 #24
TIM0_CDTI1 #23
TIM0_CDTI2 #22
TIM1_CC0 #27
TIM1_CC1 #26
TIM1_CC2 #25
TIM1_CC3 #24
WTIM0_CDTI2 #31
LETIM0_OUT0 #27
LETIM0_OUT1 #26
PCNT0_S0IN #27
PCNT0_S1IN #26
US0_TX #27
US0_RX #26
US0_CLK #25
US0_CS #24
US0_CTS #23
US0_RTS #22
US1_TX #27
US1_RX #26
US1_CLK #25
US1_CS #24
US1_CTS #23
US1_RTS #22
US2_TX #16
US2_RX #15
US2_CLK #14
US2_CS #13
US2_CTS #12
US2_RTS #11
LEU0_TX #27
LEU0_RX #26
I2C0_SDA #27
I2C0_SCL #26
FRC_DCLK #27
FRC_DOUT #26
FRC_DFRAME #25
MODEM_DCLK #27
MODEM_DIN #26
MODEM_DOUT #25
CMU_CLK1 #6
PRS_CH0 #3
PRS_CH1 #2
PRS_CH2 #1
PRS_CH3 #0
ACMP0_O #27
ACMP1_O #27
DBG_TDI
PF4 BUSBY BUSAX
TIM0_CC0 #28
TIM0_CC1 #27
TIM0_CC2 #26
TIM0_CDTI0 #25
TIM0_CDTI1 #24
TIM0_CDTI2 #23
TIM1_CC0 #28
TIM1_CC1 #27
TIM1_CC2 #26
TIM1_CC3 #25 LE-
TIM0_OUT0 #28 LE-
TIM0_OUT1 #27
PCNT0_S0IN #28
PCNT0_S1IN #27
US0_TX #28
US0_RX #27
US0_CLK #26
US0_CS #25
US0_CTS #24
US0_RTS #23
US1_TX #28
US1_RX #27
US1_CLK #26
US1_CS #25
US1_CTS #24
US1_RTS #23
US2_TX #17
US2_RX #16
US2_CLK #15
US2_CS #14
US2_CTS #13
US2_RTS #12
LEU0_TX #28
LEU0_RX #27
I2C0_SDA #28
I2C0_SCL #27
FRC_DCLK #28
FRC_DOUT #27
FRC_DFRAME #26
MODEM_DCLK #28
MODEM_DIN #27
MODEM_DOUT #26
PRS_CH0 #4
PRS_CH1 #3
PRS_CH2 #2
PRS_CH3 #1
ACMP0_O #28
ACMP1_O #28
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 84
GPIO Name Pin Alternate Functionality / Description
Analog Timers Communication Radio Other
PF5 BUSAY BUSBX
TIM0_CC0 #29
TIM0_CC1 #28
TIM0_CC2 #27
TIM0_CDTI0 #26
TIM0_CDTI1 #25
TIM0_CDTI2 #24
TIM1_CC0 #29
TIM1_CC1 #28
TIM1_CC2 #27
TIM1_CC3 #26 LE-
TIM0_OUT0 #29 LE-
TIM0_OUT1 #28
PCNT0_S0IN #29
PCNT0_S1IN #28
US0_TX #29
US0_RX #28
US0_CLK #27
US0_CS #26
US0_CTS #25
US0_RTS #24
US1_TX #29
US1_RX #28
US1_CLK #27
US1_CS #26
US1_CTS #25
US1_RTS #24
US2_TX #18
US2_RX #17
US2_CLK #16
US2_CS #15
US2_CTS #14
US2_RTS #13
LEU0_TX #29
LEU0_RX #28
I2C0_SDA #29
I2C0_SCL #28
FRC_DCLK #29
FRC_DOUT #28
FRC_DFRAME #27
MODEM_DCLK #29
MODEM_DIN #28
MODEM_DOUT #27
PRS_CH0 #5
PRS_CH1 #4
PRS_CH2 #3
PRS_CH3 #2
ACMP0_O #29
ACMP1_O #29
PF6 BUSBY BUSAX
TIM0_CC0 #30
TIM0_CC1 #29
TIM0_CC2 #28
TIM0_CDTI0 #27
TIM0_CDTI1 #26
TIM0_CDTI2 #25
TIM1_CC0 #30
TIM1_CC1 #29
TIM1_CC2 #28
TIM1_CC3 #27 LE-
TIM0_OUT0 #30 LE-
TIM0_OUT1 #29
PCNT0_S0IN #30
PCNT0_S1IN #29
US0_TX #30
US0_RX #29
US0_CLK #28
US0_CS #27
US0_CTS #26
US0_RTS #25
US1_TX #30
US1_RX #29
US1_CLK #28
US1_CS #27
US1_CTS #26
US1_RTS #25
US2_TX #19
US2_RX #18
US2_CLK #17
US2_CS #16
US2_CTS #15
US2_RTS #14
LEU0_TX #30
LEU0_RX #29
I2C0_SDA #30
I2C0_SCL #29
FRC_DCLK #30
FRC_DOUT #29
FRC_DFRAME #28
MODEM_DCLK #30
MODEM_DIN #29
MODEM_DOUT #28
CMU_CLK1 #7
PRS_CH0 #6
PRS_CH1 #5
PRS_CH2 #4
PRS_CH3 #3
ACMP0_O #30
ACMP1_O #30
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 85
GPIO Name Pin Alternate Functionality / Description
Analog Timers Communication Radio Other
PF7 BUSAY BUSBX
TIM0_CC0 #31
TIM0_CC1 #30
TIM0_CC2 #29
TIM0_CDTI0 #28
TIM0_CDTI1 #27
TIM0_CDTI2 #26
TIM1_CC0 #31
TIM1_CC1 #30
TIM1_CC2 #29
TIM1_CC3 #28 LE-
TIM0_OUT0 #31 LE-
TIM0_OUT1 #30
PCNT0_S0IN #31
PCNT0_S1IN #30
US0_TX #31
US0_RX #30
US0_CLK #29
US0_CS #28
US0_CTS #27
US0_RTS #26
US1_TX #31
US1_RX #30
US1_CLK #29
US1_CS #28
US1_CTS #27
US1_RTS #26
US2_TX #20
US2_RX #19
US2_CLK #18
US2_CS #17
US2_CTS #16
US2_RTS #15
LEU0_TX #31
LEU0_RX #30
I2C0_SDA #31
I2C0_SCL #30
FRC_DCLK #31
FRC_DOUT #30
FRC_DFRAME #29
MODEM_DCLK #31
MODEM_DIN #30
MODEM_DOUT #29
CMU_CLKI0 #1
CMU_CLK0 #7
PRS_CH0 #7
PRS_CH1 #6
PRS_CH2 #5
PRS_CH3 #4
ACMP0_O #31
ACMP1_O #31
GPIO_EM4WU1
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 86
7.3 Alternate Functionality Overview
A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of the alter-
nate functionality in the first column, followed by columns showing the possible LOCATION bitfield settings and the associated GPIO
pin. Refer to 7.2 GPIO Functionality Table for a list of functions available on each GPIO pin.
Note: Some functionality, such as analog interfaces, do not have alternate settings or a LOCATION bitfield. In these cases, the pinout
is shown in the column corresponding to LOCATION 0.
Table 7.3. Alternate Functionality Overview
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
ACMP0_O
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
6: PB11
7: PB12
8: PB13
9: PB14
10: PB15
11: PC6
12: PC7
13: PC8
14: PC9
15: PC10
16: PC11
17: PD9
18: PD10
19: PD11
20: PD12
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
Analog comparator
ACMP0, digital out-
put.
ACMP1_O
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
6: PB11
7: PB12
8: PB13
9: PB14
10: PB15
11: PC6
12: PC7
13: PC8
14: PC9
15: PC10
16: PC11
17: PD9
18: PD10
19: PD11
20: PD12
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
Analog comparator
ACMP1, digital out-
put.
ADC0_EXTN
0: PA0 Analog to digital
converter ADC0 ex-
ternal reference in-
put negative pin.
ADC0_EXTP
0: PA1 Analog to digital
converter ADC0 ex-
ternal reference in-
put positive pin.
BOOT_RX 0: PF1 Bootloader RX.
BOOT_TX 0: PF0 Bootloader TX.
CMU_CLK0
0: PA1
1: PB15
2: PC6
3: PC11
4: PD9
5: PD14
6: PF2
7: PF7
Clock Management
Unit, clock output
number 0.
CMU_CLK1
0: PA0
1: PB14
2: PC7
3: PC10
4: PD10
5: PD15
6: PF3
7: PF6
Clock Management
Unit, clock output
number 1.
CMU_CLKI0
0: PB13
1: PF7
2: PC6
4: PA5 Clock Management
Unit, clock input
number 0.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 87
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
DBG_SWCLKTCK
0: PF0 Debug-interface
Serial Wire clock
input and JTAG
Test Clock.
Note that this func-
tion is enabled to
the pin out of reset,
and has a built-in
pull down.
DBG_SWDIOTMS
0: PF1 Debug-interface
Serial Wire data in-
put / output and
JTAG Test Mode
Select.
Note that this func-
tion is enabled to
the pin out of reset,
and has a built-in
pull up.
DBG_SWO
0: PF2
1: PB13
2: PD15
3: PC11
Debug-interface
Serial Wire viewer
Output.
Note that this func-
tion is not enabled
after reset, and
must be enabled by
software to be
used.
DBG_TDI
0: PF3 Debug-interface
JTAG Test Data In.
Note that this func-
tion becomes avail-
able after the first
valid JTAG com-
mand is received,
and has a built-in
pull up when JTAG
is active.
DBG_TDO
0: PF2 Debug-interface
JTAG Test Data
Out.
Note that this func-
tion becomes avail-
able after the first
valid JTAG com-
mand is received.
ETM_TCLK
1: PA5
3: PC6
Embedded Trace
Module ETM clock .
ETM_TD0
3: PC7 Embedded Trace
Module ETM data
0.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 88
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
ETM_TD1
3: PC8 Embedded Trace
Module ETM data
1.
ETM_TD2
3: PC9 Embedded Trace
Module ETM data
2.
ETM_TD3
3: PC10 Embedded Trace
Module ETM data
3.
FRC_DCLK
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
6: PB11
7: PB12
8: PB13
9: PB14
10: PB15
11: PC6
12: PC7
13: PC8
14: PC9
15: PC10
16: PC11
17: PD9
18: PD10
19: PD11
20: PD12
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
Frame Controller,
Data Sniffer Clock.
FRC_DFRAME
0: PA2
1: PA3
2: PA4
3: PA5
4: PB11
5: PB12
6: PB13
7: PB14
8: PB15
9: PC6
10: PC7
11: PC8
12: PC9
13: PC10
14: PC11
15: PD9
16: PD10
17: PD11
18: PD12
19: PD13
20: PD14
21: PD15
22: PF0
23: PF1
24: PF2
25: PF3
26: PF4
27: PF5
28: PF6
29: PF7
30: PA0
31: PA1
Frame Controller,
Data Sniffer Frame
active
FRC_DOUT
0: PA1
1: PA2
2: PA3
3: PA4
4: PA5
5: PB11
6: PB12
7: PB13
8: PB14
9: PB15
10: PC6
11: PC7
12: PC8
13: PC9
14: PC10
15: PC11
16: PD9
17: PD10
18: PD11
19: PD12
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3
27: PF4
28: PF5
29: PF6
30: PF7
31: PA0
Frame Controller,
Data Sniffer Out-
put.
GPIO_EM4WU0
0: PF2 Pin can be used to
wake the system
up from EM4
GPIO_EM4WU1
0: PF7 Pin can be used to
wake the system
up from EM4
GPIO_EM4WU4
0: PD14 Pin can be used to
wake the system
up from EM4
GPIO_EM4WU8
0: PA3 Pin can be used to
wake the system
up from EM4
GPIO_EM4WU9
0: PB13 Pin can be used to
wake the system
up from EM4
GPIO_EM4WU12
0: PC10 Pin can be used to
wake the system
up from EM4
I2C0_SCL
0: PA1
1: PA2
2: PA3
3: PA4
4: PA5
5: PB11
6: PB12
7: PB13
8: PB14
9: PB15
10: PC6
11: PC7
12: PC8
13: PC9
14: PC10
15: PC11
16: PD9
17: PD10
18: PD11
19: PD12
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3
27: PF4
28: PF5
29: PF6
30: PF7
31: PA0
I2C0 Serial Clock
Line input / output.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 89
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
I2C0_SDA
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
6: PB11
7: PB12
8: PB13
9: PB14
10: PB15
11: PC6
12: PC7
13: PC8
14: PC9
15: PC10
16: PC11
17: PD9
18: PD10
19: PD11
20: PD12
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
I2C0 Serial Data in-
put / output.
I2C1_SCL
18: PC10
19: PC11
I2C1 Serial Clock
Line input / output.
I2C1_SDA 19: PC10 20: PC11 I2C1 Serial Data in-
put / output.
LES_CH1 0: PD9 LESENSE channel
1.
LES_CH2 0: PD10 LESENSE channel
2.
LES_CH3 0: PD11 LESENSE channel
3.
LES_CH4 0: PD12 LESENSE channel
4.
LES_CH5 0: PD13 LESENSE channel
5.
LES_CH6 0: PD14 LESENSE channel
6.
LES_CH7 0: PD15 LESENSE channel
7.
LES_CH8 0: PA0 LESENSE channel
8.
LES_CH9 0: PA1 LESENSE channel
9.
LES_CH10 0: PA2 LESENSE channel
10.
LES_CH11 0: PA3 LESENSE channel
11.
LES_CH12 0: PA4 LESENSE channel
12.
LES_CH13 0: PA5 LESENSE channel
13.
LETIM0_OUT0
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
6: PB11
7: PB12
8: PB13
9: PB14
10: PB15
11: PC6
12: PC7
13: PC8
14: PC9
15: PC10
16: PC11
17: PD9
18: PD10
19: PD11
20: PD12
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
Low Energy Timer
LETIM0, output
channel 0.
LETIM0_OUT1
0: PA1
1: PA2
2: PA3
3: PA4
4: PA5
5: PB11
6: PB12
7: PB13
8: PB14
9: PB15
10: PC6
11: PC7
12: PC8
13: PC9
14: PC10
15: PC11
16: PD9
17: PD10
18: PD11
19: PD12
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3
27: PF4
28: PF5
29: PF6
30: PF7
31: PA0
Low Energy Timer
LETIM0, output
channel 1.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 90
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
LEU0_RX
0: PA1
1: PA2
2: PA3
3: PA4
4: PA5
5: PB11
6: PB12
7: PB13
8: PB14
9: PB15
10: PC6
11: PC7
12: PC8
13: PC9
14: PC10
15: PC11
16: PD9
17: PD10
18: PD11
19: PD12
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3
27: PF4
28: PF5
29: PF6
30: PF7
31: PA0
LEUART0 Receive
input.
LEU0_TX
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
6: PB11
7: PB12
8: PB13
9: PB14
10: PB15
11: PC6
12: PC7
13: PC8
14: PC9
15: PC10
16: PC11
17: PD9
18: PD10
19: PD11
20: PD12
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
LEUART0 Transmit
output. Also used
as receive input in
half duplex commu-
nication.
LFXTAL_N
0: PB14 Low Frequency
Crystal (typically
32.768 kHz) nega-
tive pin. Also used
as an optional ex-
ternal clock input
pin.
LFXTAL_P
0: PB15 Low Frequency
Crystal (typically
32.768 kHz) posi-
tive pin.
MODEM_DCLK
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
6: PB11
7: PB12
8: PB13
9: PB14
10: PB15
11: PC6
12: PC7
13: PC8
14: PC9
15: PC10
16: PC11
17: PD9
18: PD10
19: PD11
20: PD12
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
MODEM data clock
out.
MODEM_DIN
0: PA1
1: PA2
2: PA3
3: PA4
4: PA5
5: PB11
6: PB12
7: PB13
8: PB14
9: PB15
10: PC6
11: PC7
12: PC8
13: PC9
14: PC10
15: PC11
16: PD9
17: PD10
18: PD11
19: PD12
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3
27: PF4
28: PF5
29: PF6
30: PF7
31: PA0
MODEM data in.
MODEM_DOUT
0: PA2
1: PA3
2: PA4
3: PA5
4: PB11
5: PB12
6: PB13
7: PB14
8: PB15
9: PC6
10: PC7
11: PC8
12: PC9
13: PC10
14: PC11
15: PD9
16: PD10
17: PD11
18: PD12
19: PD13
20: PD14
21: PD15
22: PF0
23: PF1
24: PF2
25: PF3
26: PF4
27: PF5
28: PF6
29: PF7
30: PA0
31: PA1
MODEM data out.
OPA0_N
0: PA4 Operational Amplifi-
er 0 external nega-
tive input.
OPA0_P
0: PA2 Operational Amplifi-
er 0 external posi-
tive input.
OPA1_N
0: PD15 Operational Amplifi-
er 1 external nega-
tive input.
OPA1_P
0: PD13 Operational Amplifi-
er 1 external posi-
tive input.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 91
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
OPA2_N
0: PB13 Operational Amplifi-
er 2 external nega-
tive input.
OPA2_OUT 0: PB12 Operational Amplifi-
er 2 output.
OPA2_P
0: PB11 Operational Amplifi-
er 2 external posi-
tive input.
PCNT0_S0IN
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
6: PB11
7: PB12
8: PB13
9: PB14
10: PB15
11: PC6
12: PC7
13: PC8
14: PC9
15: PC10
16: PC11
17: PD9
18: PD10
19: PD11
20: PD12
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
Pulse Counter
PCNT0 input num-
ber 0.
PCNT0_S1IN
0: PA1
1: PA2
2: PA3
3: PA4
4: PA5
5: PB11
6: PB12
7: PB13
8: PB14
9: PB15
10: PC6
11: PC7
12: PC8
13: PC9
14: PC10
15: PC11
16: PD9
17: PD10
18: PD11
19: PD12
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3
27: PF4
28: PF5
29: PF6
30: PF7
31: PA0
Pulse Counter
PCNT0 input num-
ber 1.
PRS_CH0
0: PF0
1: PF1
2: PF2
3: PF3
4: PF4
5: PF5
6: PF6
7: PF7
8: PC6
9: PC7
10: PC8
11: PC9
12: PC10
13: PC11 Peripheral Reflex
System PRS, chan-
nel 0.
PRS_CH1
0: PF1
1: PF2
2: PF3
3: PF4
4: PF5
5: PF6
6: PF7
7: PF0
Peripheral Reflex
System PRS, chan-
nel 1.
PRS_CH2
0: PF2
1: PF3
2: PF4
3: PF5
4: PF6
5: PF7
6: PF0
7: PF1
Peripheral Reflex
System PRS, chan-
nel 2.
PRS_CH3
0: PF3
1: PF4
2: PF5
3: PF6
4: PF7
5: PF0
6: PF1
7: PF2
8: PD9
9: PD10
10: PD11
11: PD12
12: PD13
13: PD14
14: PD15
Peripheral Reflex
System PRS, chan-
nel 3.
PRS_CH4
0: PD9
1: PD10
2: PD11
3: PD12
4: PD13
5: PD14
6: PD15
Peripheral Reflex
System PRS, chan-
nel 4.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 92
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
PRS_CH5
0: PD10
1: PD11
2: PD12
3: PD13
4: PD14
5: PD15
6: PD9
Peripheral Reflex
System PRS, chan-
nel 5.
PRS_CH6
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
6: PB11
7: PB12
8: PB13
9: PB14
10: PB15
11: PD9
12: PD10
13: PD11
14: PD12
15: PD13
16: PD14
17: PD15 Peripheral Reflex
System PRS, chan-
nel 6.
PRS_CH7
0: PA1
1: PA2
2: PA3
3: PA4
4: PA5
5: PB11
6: PB12
7: PB13
8: PB14
9: PB15
10: PA0
Peripheral Reflex
System PRS, chan-
nel 7.
PRS_CH8
0: PA2
1: PA3
2: PA4
3: PA5
4: PB11
5: PB12
6: PB13
7: PB14
8: PB15
9: PA0
10: PA1
Peripheral Reflex
System PRS, chan-
nel 8.
PRS_CH9
0: PA3
1: PA4
2: PA5
3: PB11
4: PB12
5: PB13
6: PB14
7: PB15
8: PA0
9: PA1
10: PA2
11: PC6
12: PC7
13: PC8
14: PC9
15: PC10
16: PC11
Peripheral Reflex
System PRS, chan-
nel 9.
PRS_CH10
0: PC6
1: PC7
2: PC8
3: PC9
4: PC10
5: PC11 Peripheral Reflex
System PRS, chan-
nel 10.
PRS_CH11
0: PC7
1: PC8
2: PC9
3: PC10
4: PC11
5: PC6 Peripheral Reflex
System PRS, chan-
nel 11.
TIM0_CC0
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
6: PB11
7: PB12
8: PB13
9: PB14
10: PB15
11: PC6
12: PC7
13: PC8
14: PC9
15: PC10
16: PC11
17: PD9
18: PD10
19: PD11
20: PD12
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
Timer 0 Capture
Compare input /
output channel 0.
TIM0_CC1
0: PA1
1: PA2
2: PA3
3: PA4
4: PA5
5: PB11
6: PB12
7: PB13
8: PB14
9: PB15
10: PC6
11: PC7
12: PC8
13: PC9
14: PC10
15: PC11
16: PD9
17: PD10
18: PD11
19: PD12
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3
27: PF4
28: PF5
29: PF6
30: PF7
31: PA0
Timer 0 Capture
Compare input /
output channel 1.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 93
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
TIM0_CC2
0: PA2
1: PA3
2: PA4
3: PA5
4: PB11
5: PB12
6: PB13
7: PB14
8: PB15
9: PC6
10: PC7
11: PC8
12: PC9
13: PC10
14: PC11
15: PD9
16: PD10
17: PD11
18: PD12
19: PD13
20: PD14
21: PD15
22: PF0
23: PF1
24: PF2
25: PF3
26: PF4
27: PF5
28: PF6
29: PF7
30: PA0
31: PA1
Timer 0 Capture
Compare input /
output channel 2.
TIM0_CDTI0
0: PA3
1: PA4
2: PA5
3: PB11
4: PB12
5: PB13
6: PB14
7: PB15
8: PC6
9: PC7
10: PC8
11: PC9
12: PC10
13: PC11
14: PD9
15: PD10
16: PD11
17: PD12
18: PD13
19: PD14
20: PD15
21: PF0
22: PF1
23: PF2
24: PF3
25: PF4
26: PF5
27: PF6
28: PF7
29: PA0
30: PA1
31: PA2
Timer 0 Compli-
mentary Dead Time
Insertion channel 0.
TIM0_CDTI1
0: PA4
1: PA5
2: PB11
3: PB12
4: PB13
5: PB14
6: PB15
7: PC6
8: PC7
9: PC8
10: PC9
11: PC10
12: PC11
13: PD9
14: PD10
15: PD11
16: PD12
17: PD13
18: PD14
19: PD15
20: PF0
21: PF1
22: PF2
23: PF3
24: PF4
25: PF5
26: PF6
27: PF7
28: PA0
29: PA1
30: PA2
31: PA3
Timer 0 Compli-
mentary Dead Time
Insertion channel 1.
TIM0_CDTI2
0: PA5
1: PB11
2: PB12
3: PB13
4: PB14
5: PB15
6: PC6
7: PC7
8: PC8
9: PC9
10: PC10
11: PC11
12: PD9
13: PD10
14: PD11
15: PD12
16: PD13
17: PD14
18: PD15
19: PF0
20: PF1
21: PF2
22: PF3
23: PF4
24: PF5
25: PF6
26: PF7
27: PA0
28: PA1
29: PA2
30: PA3
31: PA4
Timer 0 Compli-
mentary Dead Time
Insertion channel 2.
TIM1_CC0
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
6: PB11
7: PB12
8: PB13
9: PB14
10: PB15
11: PC6
12: PC7
13: PC8
14: PC9
15: PC10
16: PC11
17: PD9
18: PD10
19: PD11
20: PD12
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
Timer 1 Capture
Compare input /
output channel 0.
TIM1_CC1
0: PA1
1: PA2
2: PA3
3: PA4
4: PA5
5: PB11
6: PB12
7: PB13
8: PB14
9: PB15
10: PC6
11: PC7
12: PC8
13: PC9
14: PC10
15: PC11
16: PD9
17: PD10
18: PD11
19: PD12
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3
27: PF4
28: PF5
29: PF6
30: PF7
31: PA0
Timer 1 Capture
Compare input /
output channel 1.
TIM1_CC2
0: PA2
1: PA3
2: PA4
3: PA5
4: PB11
5: PB12
6: PB13
7: PB14
8: PB15
9: PC6
10: PC7
11: PC8
12: PC9
13: PC10
14: PC11
15: PD9
16: PD10
17: PD11
18: PD12
19: PD13
20: PD14
21: PD15
22: PF0
23: PF1
24: PF2
25: PF3
26: PF4
27: PF5
28: PF6
29: PF7
30: PA0
31: PA1
Timer 1 Capture
Compare input /
output channel 2.
TIM1_CC3
0: PA3
1: PA4
2: PA5
3: PB11
4: PB12
5: PB13
6: PB14
7: PB15
8: PC6
9: PC7
10: PC8
11: PC9
12: PC10
13: PC11
14: PD9
15: PD10
16: PD11
17: PD12
18: PD13
19: PD14
20: PD15
21: PF0
22: PF1
23: PF2
24: PF3
25: PF4
26: PF5
27: PF6
28: PF7
29: PA0
30: PA1
31: PA2
Timer 1 Capture
Compare input /
output channel 3.
US0_CLK
0: PA2
1: PA3
2: PA4
3: PA5
4: PB11
5: PB12
6: PB13
7: PB14
8: PB15
9: PC6
10: PC7
11: PC8
12: PC9
13: PC10
14: PC11
15: PD9
16: PD10
17: PD11
18: PD12
19: PD13
20: PD14
21: PD15
22: PF0
23: PF1
24: PF2
25: PF3
26: PF4
27: PF5
28: PF6
29: PF7
30: PA0
31: PA1
USART0 clock in-
put / output.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 94
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
US0_CS
0: PA3
1: PA4
2: PA5
3: PB11
4: PB12
5: PB13
6: PB14
7: PB15
8: PC6
9: PC7
10: PC8
11: PC9
12: PC10
13: PC11
14: PD9
15: PD10
16: PD11
17: PD12
18: PD13
19: PD14
20: PD15
21: PF0
22: PF1
23: PF2
24: PF3
25: PF4
26: PF5
27: PF6
28: PF7
29: PA0
30: PA1
31: PA2
USART0 chip se-
lect input / output.
US0_CTS
0: PA4
1: PA5
2: PB11
3: PB12
4: PB13
5: PB14
6: PB15
7: PC6
8: PC7
9: PC8
10: PC9
11: PC10
12: PC11
13: PD9
14: PD10
15: PD11
16: PD12
17: PD13
18: PD14
19: PD15
20: PF0
21: PF1
22: PF2
23: PF3
24: PF4
25: PF5
26: PF6
27: PF7
28: PA0
29: PA1
30: PA2
31: PA3
USART0 Clear To
Send hardware
flow control input.
US0_RTS
0: PA5
1: PB11
2: PB12
3: PB13
4: PB14
5: PB15
6: PC6
7: PC7
8: PC8
9: PC9
10: PC10
11: PC11
12: PD9
13: PD10
14: PD11
15: PD12
16: PD13
17: PD14
18: PD15
19: PF0
20: PF1
21: PF2
22: PF3
23: PF4
24: PF5
25: PF6
26: PF7
27: PA0
28: PA1
29: PA2
30: PA3
31: PA4
USART0 Request
To Send hardware
flow control output.
US0_RX
0: PA1
1: PA2
2: PA3
3: PA4
4: PA5
5: PB11
6: PB12
7: PB13
8: PB14
9: PB15
10: PC6
11: PC7
12: PC8
13: PC9
14: PC10
15: PC11
16: PD9
17: PD10
18: PD11
19: PD12
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3
27: PF4
28: PF5
29: PF6
30: PF7
31: PA0
USART0 Asynchro-
nous Receive.
USART0 Synchro-
nous mode Master
Input / Slave Out-
put (MISO).
US0_TX
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
6: PB11
7: PB12
8: PB13
9: PB14
10: PB15
11: PC6
12: PC7
13: PC8
14: PC9
15: PC10
16: PC11
17: PD9
18: PD10
19: PD11
20: PD12
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
USART0 Asynchro-
nous Transmit. Al-
so used as receive
input in half duplex
communication.
USART0 Synchro-
nous mode Master
Output / Slave In-
put (MOSI).
US1_CLK
0: PA2
1: PA3
2: PA4
3: PA5
4: PB11
5: PB12
6: PB13
7: PB14
8: PB15
9: PC6
10: PC7
11: PC8
12: PC9
13: PC10
14: PC11
15: PD9
16: PD10
17: PD11
18: PD12
19: PD13
20: PD14
21: PD15
22: PF0
23: PF1
24: PF2
25: PF3
26: PF4
27: PF5
28: PF6
29: PF7
30: PA0
31: PA1
USART1 clock in-
put / output.
US1_CS
0: PA3
1: PA4
2: PA5
3: PB11
4: PB12
5: PB13
6: PB14
7: PB15
8: PC6
9: PC7
10: PC8
11: PC9
12: PC10
13: PC11
14: PD9
15: PD10
16: PD11
17: PD12
18: PD13
19: PD14
20: PD15
21: PF0
22: PF1
23: PF2
24: PF3
25: PF4
26: PF5
27: PF6
28: PF7
29: PA0
30: PA1
31: PA2
USART1 chip se-
lect input / output.
US1_CTS
0: PA4
1: PA5
2: PB11
3: PB12
4: PB13
5: PB14
6: PB15
7: PC6
8: PC7
9: PC8
10: PC9
11: PC10
12: PC11
13: PD9
14: PD10
15: PD11
16: PD12
17: PD13
18: PD14
19: PD15
20: PF0
21: PF1
22: PF2
23: PF3
24: PF4
25: PF5
26: PF6
27: PF7
28: PA0
29: PA1
30: PA2
31: PA3
USART1 Clear To
Send hardware
flow control input.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 95
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
US1_RTS
0: PA5
1: PB11
2: PB12
3: PB13
4: PB14
5: PB15
6: PC6
7: PC7
8: PC8
9: PC9
10: PC10
11: PC11
12: PD9
13: PD10
14: PD11
15: PD12
16: PD13
17: PD14
18: PD15
19: PF0
20: PF1
21: PF2
22: PF3
23: PF4
24: PF5
25: PF6
26: PF7
27: PA0
28: PA1
29: PA2
30: PA3
31: PA4
USART1 Request
To Send hardware
flow control output.
US1_RX
0: PA1
1: PA2
2: PA3
3: PA4
4: PA5
5: PB11
6: PB12
7: PB13
8: PB14
9: PB15
10: PC6
11: PC7
12: PC8
13: PC9
14: PC10
15: PC11
16: PD9
17: PD10
18: PD11
19: PD12
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3
27: PF4
28: PF5
29: PF6
30: PF7
31: PA0
USART1 Asynchro-
nous Receive.
USART1 Synchro-
nous mode Master
Input / Slave Out-
put (MISO).
US1_TX
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
6: PB11
7: PB12
8: PB13
9: PB14
10: PB15
11: PC6
12: PC7
13: PC8
14: PC9
15: PC10
16: PC11
17: PD9
18: PD10
19: PD11
20: PD12
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
USART1 Asynchro-
nous Transmit. Al-
so used as receive
input in half duplex
communication.
USART1 Synchro-
nous mode Master
Output / Slave In-
put (MOSI).
US2_CLK
12: PF0
13: PF1
14: PF3
15: PF4
16: PF5
17: PF6
18: PF7
30: PA5
USART2 clock in-
put / output.
US2_CS
11: PF0 12: PF1
13: PF3
14: PF4
15: PF5
16: PF6
17: PF7
29: PA5
USART2 chip se-
lect input / output.
US2_CTS
10: PF0
11: PF1
12: PF3
13: PF4
14: PF5
15: PF6
16: PF7 28: PA5
USART2 Clear To
Send hardware
flow control input.
US2_RTS
9: PF0
10: PF1
11: PF3
12: PF4
13: PF5
14: PF6
15: PF7
27: PA5
USART2 Request
To Send hardware
flow control output.
US2_RX
13: PF0
14: PF1
15: PF3
16: PF4
17: PF5
18: PF6
19: PF7
31: PA5 USART2 Asynchro-
nous Receive.
USART2 Synchro-
nous mode Master
Input / Slave Out-
put (MISO).
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 96
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
US2_TX
0: PA5 14: PF0
15: PF1
16: PF3
17: PF4
18: PF5
19: PF6
20: PF7 USART2 Asynchro-
nous Transmit. Al-
so used as receive
input in half duplex
communication.
USART2 Synchro-
nous mode Master
Output / Slave In-
put (MOSI).
VDAC0_EXT
0: PA1 Digital to analog
converter VDAC0
external reference
input pin.
VDAC0_OUT0 /
OPA0_OUT
0: PA3 Digital to Analog
Converter DAC0
output channel
number 0.
VDAC0_OUT0AL
T / OPA0_OUT-
ALT
0: PA5
1: PD13
2: PD15
Digital to Analog
Converter DAC0 al-
ternative output for
channel 0.
VDAC0_OUT1 /
OPA1_OUT
0: PD14 Digital to Analog
Converter DAC0
output channel
number 1.
VDAC0_OUT1AL
T / OPA1_OUT-
ALT
0: PD12
1: PA2
2: PA4
Digital to Analog
Converter DAC0 al-
ternative output for
channel 1.
WTIM0_CC0
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
15: PB11 16: PB12
17: PB13
18: PB14
19: PB15
26: PC6
27: PC7
28: PC8
29: PC9
30: PC10
31: PC11
Wide timer 0 Cap-
ture Compare in-
put / output channel
0.
WTIM0_CC1
0: PA2
1: PA3
2: PA4
3: PA5
13: PB11
14: PB12
15: PB13
16: PB14
17: PB15
24: PC6
25: PC7
26: PC8
27: PC9
28: PC10
29: PC11
31: PD9
Wide timer 0 Cap-
ture Compare in-
put / output channel
1.
WTIM0_CC2
0: PA4
1: PA5
11: PB11 12: PB12
13: PB13
14: PB14
15: PB15
22: PC6
23: PC7
24: PC8
25: PC9
26: PC10
27: PC11
29: PD9
30: PD10
31: PD11
Wide timer 0 Cap-
ture Compare in-
put / output channel
2.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 97
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
WTIM0_CDTI0
7: PB11 8: PB12
9: PB13
10: PB14
11: PB15
18: PC6
19: PC7
20: PC8
21: PC9
22: PC10
23: PC11
25: PD9
26: PD10
27: PD11
28: PD12
29: PD13
30: PD14
31: PD15
Wide timer 0 Com-
plimentary Dead
Time Insertion
channel 0.
WTIM0_CDTI1
5: PB11
6: PB12
7: PB13
8: PB14
9: PB15
16: PC6
17: PC7
18: PC8
19: PC9
20: PC10
21: PC11
23: PD9
24: PD10
25: PD11
26: PD12
27: PD13
28: PD14
29: PD15
30: PF0
31: PF1
Wide timer 0 Com-
plimentary Dead
Time Insertion
channel 1.
WTIM0_CDTI2
3: PB11 4: PB12
5: PB13
6: PB14
7: PB15
14: PC6
15: PC7
16: PC8
17: PC9
18: PC10
19: PC11
21: PD9
22: PD10
23: PD11
24: PD12
25: PD13
26: PD14
27: PD15
28: PF0
29: PF1
30: PF2
31: PF3
Wide timer 0 Com-
plimentary Dead
Time Insertion
channel 2.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 98
7.4 Analog Port (APORT) Client Maps
The Analog Port (APORT) is an infrastructure used to connect chip pins with on-chip analog clients such as analog comparators, ADCs,
DACs, etc. The APORT consists of a set of shared buses, switches, and control logic needed to configurably implement the signal rout-
ing. Figure 7.2 APORT Connection Diagram on page 99 shows the APORT routing for this device family (note that available features
may vary by part number). A complete description of APORT functionality can be found in the Reference Manual.
PF0
PF1
PF2
PF3
PF4
PF5
PF6
PF7
PC6
PC7
PC8
PC9
PC10
PC11
PD9
PD10
PD14
PD13
PD12
PD11
PD15
PA0
PA4
PA3
PA2
PA1
PA5
PB14
PB13
PB12
PB11
PB15
AX
AY
BX
BY
CX
CY
DX
DY
IDAC0 1X
1Y
POS
NEG
ACMP0
1Y
2Y
3Y
4Y
POS
NEG
ACMP1
ADC0
EXTP
EXTN
POS
NEG
OPA0
1X
2X
3X
4X
1Y
2Y
3Y
4Y
1X
OPA0_P
OPA0_N
OUT0
OUT0ALT
OUT1
OUT2
OUT3
OUT4
OUT
POS
NEG
OPA1
OUT
1X
2X
3X
4X
1Y
2Y
3Y
4Y
1X
OPA1_P
OPA1_N
OUT1
OUT1ALT
OUT1
OUT2
OUT3
OUT4
ADC_EXTP
ADC_EXTN
OUT0
OUT1
OPA0_N
OPA0_P
OPA1_N
OPA1_P
VDAC0_OUT0ALT
OUT0ALT
VDAC0_OUT0ALT
OUT0ALT
VDAC0_OUT0ALT
OUT0ALT
VDAC0_OUT1ALT
OUT1ALT
VDAC0_OUT1ALT
OUT1ALT
VDAC0_OUT0ALT
OUT1ALT
nX, nY APORTnX, APORTnY
AX, BY, … BUSAX, BUSBY, ...
POS
NEG
OPA2
1X
2X
3X
4X
1Y
2Y
3Y
4Y
1X
OPA2_P
OPA2_N
OUT2
OUT2ALT
OUT1
OUT2
OUT3
OUT4
OUT
CEXT
1X
1Y
3X
3Y
CSEN
CEXT_SENSE
2X
2Y
4X
4Y
OUT2
OPA2_P
OPA2_N
1X
2X
3X
4X
2X
3X
4X
1Y
2Y
3Y
4Y
1X
NEXT1
NEXT0
NEXT1
NEXT0
NEXT1
NEXT0
NEXT1
NEXT0
POS
NEG
1X
2X
3X
4X
1Y
2Y
3Y
4Y
NEXT0
NEXT1
NEXT2
NEXT2
NEXT0
NEXT1
Figure 7.2. APORT Connection Diagram
Client maps for each analog circuit using the APORT are shown in the following tables. The maps are organized by bus, and show the
peripheral's port connection, the shared bus, and the connection from specific bus channel numbers to GPIO pins.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 99
In general, enumerations for the pin selection field in an analog peripheral's register can be determined by finding the desired pin con-
nection in the table and then combining the value in the Port column (APORT__), and the channel identifier (CH__). For example, if pin
PF7 is available on port APORT2X as CH23, the register field enumeration to connect to PF7 would be APORT2XCH23. The shared
bus used by this connection is indicated in the Bus column.
Table 7.4. ACMP0 Bus and Pin Mapping
Port
Bus
CH31
CH30
CH29
CH28
CH27
CH26
CH25
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
CH0
APORT1X
BUSAX
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT1Y
BUSAY
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT2X
BUSBX
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT2Y
BUSBY
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT3X
BUSCX
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
APORT3Y
BUSCY
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
APORT4X
BUSDX
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
APORT4Y
BUSDY
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 100
Table 7.5. ACMP1 Bus and Pin Mapping
Port
Bus
CH31
CH30
CH29
CH28
CH27
CH26
CH25
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
CH0
APORT1X
BUSAX
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT1Y
BUSAY
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT2X
BUSBX
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT2Y
BUSBY
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT3X
BUSCX
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
APORT3Y
BUSCY
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
APORT4X
BUSDX
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
APORT4Y
BUSDY
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 101
Table 7.6. ADC0 Bus and Pin Mapping
Port
Bus
CH31
CH30
CH29
CH28
CH27
CH26
CH25
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
CH0
APORT1X
BUSAX
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT1Y
BUSAY
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT2X
BUSBX
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT2Y
BUSBY
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT3X
BUSCX
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
APORT3Y
BUSCY
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
APORT4X
BUSDX
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
APORT4Y
BUSDY
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 102
Table 7.7. CSEN Bus and Pin Mapping
Port
Bus
CH31
CH30
CH29
CH28
CH27
CH26
CH25
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
CH0
CEXT
APORT1X
BUSAX
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT1Y
BUSAY
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT3X
BUSCX
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
APORT3Y
BUSCY
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
CEXT_SENSE
APORT2X
BUSBX
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT2Y
BUSBY
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT4X
BUSDX
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
APORT4Y
BUSDY
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
Table 7.8. IDAC0 Bus and Pin Mapping
Port
Bus
CH31
CH30
CH29
CH28
CH27
CH26
CH25
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
CH0
APORT1X
BUSCX
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
APORT1Y
BUSCY
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 103
Table 7.9. VDAC0 / OPA Bus and Pin Mapping
Port
Bus
CH31
CH30
CH29
CH28
CH27
CH26
CH25
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
CH0
OPA0_N
APORT1Y
BUSAY
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT2Y
BUSBY
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT3Y
BUSCY
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
APORT4Y
BUSDY
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
OPA0_P
APORT1X
BUSAX
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT2X
BUSBX
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT3X
BUSCX
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
APORT4X
BUSDX
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 104
Port
Bus
CH31
CH30
CH29
CH28
CH27
CH26
CH25
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
CH0
OPA1_N
APORT1Y
BUSAY
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT2Y
BUSBY
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT3Y
BUSCY
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
APORT4Y
BUSDY
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
OPA1_P
APORT1X
BUSAX
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT2X
BUSBX
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT3X
BUSCX
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
APORT4X
BUSDX
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
OPA2_N
APORT1Y
BUSAY
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT2Y
BUSBY
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT3Y
BUSCY
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
APORT4Y
BUSDY
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 105
Port
Bus
CH31
CH30
CH29
CH28
CH27
CH26
CH25
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
CH0
OPA2_OUT
APORT1Y
BUSAY
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT2Y
BUSBY
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT3Y
BUSCY
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
APORT4Y
BUSDY
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
OPA2_P
APORT1X
BUSAX
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT2X
BUSBX
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT3X
BUSCX
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
APORT4X
BUSDX
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
VDAC0_OUT0 / OPA0_OUT
APORT1Y
BUSAY
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT2Y
BUSBY
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT3Y
BUSCY
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
APORT4Y
BUSDY
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 106
Port
Bus
CH31
CH30
CH29
CH28
CH27
CH26
CH25
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
CH0
VDAC0_OUT1 / OPA1_OUT
APORT1Y
BUSAY
PF7
PF5
PF3
PF1
PC11
PC9
PC7
APORT2Y
BUSBY
PF6
PF4
PF2
PF0
PC10
PC8
PC6
APORT3Y
BUSCY
PB15
PB13
PB11
PA5
PA3
PA1
PD15
PD13
PD11
PD9
APORT4Y
BUSDY
PB14
PB12
PA4
PA2
PA0
PD14
PD12
PD10
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Pin Definitions
silabs.com | Building a more connected world. Rev. 1.0 | 107
8. Package Specifications
8.1 BGM13S Package Dimensions
Figure 8.1. BGM13S Package Dimensions
Dimension MIN NOM MAX
A 1.20 1.30 1.40
A1 0.26 0.30 0.34
A2 0.95 1.00 1.05
b 0.27 0.32 0.37
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Package Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 108
Dimension MIN NOM MAX
D 6.50 BSC
D2 2.92 BSC
D3 4.50 BSC
D4 0.68 BSC
D5 0.60 BSC
e 0.50 BSC
E 6.50 BSC
E2 1.00 BSC
E3 5.50 BSC
E4 4.00 BSC
E5 0.60 BSC
L 0.43 0.48 0.53
L1 0.11 0.16 0.21
L2 0.34 0.39 0.44
L3 0.24 0.29 0.34
L4 0.14 0.19 0.24
L5 0.62 0.67 0.72
eD1 1.20 BSC
eD2 2.40 BSC
eD3 0.07 BSC
eD4 1.50 BSC
eE1 0.30 BSC
eE2 0.20 BSC
eE3 1.60 BSC
eE4 1.65 BSC
eE5 0.80 BSC
aaa 0.10
bbb 0.10
ccc 0.10
ddd 0.10
eee 0.10
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Package Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 109
Dimension MIN NOM MAX
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Tolerances are:
a. Decimal:
X.X = ±0.1
X.XX = ±0.05
X.XXX = ±0.03
b. Angular:
±0.1 Degrees
3. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
4. This drawing conforms to the JEDEC Solid State Outline MO-220.
5. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
6. Hatching lines means package shielding area.
7. Solid pattern (3.1x3.1mm) shows non-shielding area including its side walls. For side wall, borderline between shielding area and
not-shielding area could not be defined clearly like top side.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Package Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 110
8.2 BGM13S Recommeded PCB Land Pattern
This section describes the recommended PCB land pattern for the BGM13S. The antenna copper clearance area is shown in Figure
8.2 BGM13S Recommended Antenna Clearance on page 111, while the X-Y cordinates of pads relative to the origin are shown in
Table 8.1 BGM13S Pad Coordinates and Sizing on page 112. The origin is the center point of pin number 47. It is very important to
align the antenna area relative to the module pads precisely.
Figure 8.2. BGM13S Recommended Antenna Clearance
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Package Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 111
Table 8.1. BGM13S Pad Coordinates and Sizing
Pad No. Pad coordinates (X,Y) Pad size (mm)
47 Pad Center, Origin (0,0) 0.32 x 0.48
1 (0,-1.60)
2 (0,-2.10)
9 (0,-5.60)
10 (0.60,-5.75)
19 (5.10,-5.75)
20 (5.70,-5.60)
31 (5.70,-0.10)
32 (5.10,-0.05)
36 (5.10,-1.65)
45 (0.60,-1.65)
49 (0,-1.00)
46 (2.92,0)
50 1.65,-3.70) 0.67 x 0.67
51 4.05,-3.70)
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Package Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 112
Figure 8.3. BGM13S Recommended PCB Land Pattern
Table 8.2. BGM13S Recommended PCB Land Pattern
Symbol NOM (mm)
b 0.32 BSC
D1 5.50 BSC
D2 3.70 BSC
D3 4.00 BSC
D4 0.05 BSC
D5 1.65 BSC
eD1 1.00 BSC
eD2 0.60 BSC
eD3 0.15 BSC
e 0.50 BSC
E1 5.70 BSC
E2 5.10 BSC
E3 3.60 BSC
E4 2.92 BSC
E5 1.65 BSC
E6 4.50 BSC
E7 4.50 BSC
L 0.48 BSC
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Package Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 113
Symbol NOM (mm)
L1 0.67 BSC
eE1 0.60 BSC
eE2 0.60 BSC
eE3 2.40 BSC
Notes:
1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
4. The stencil thickness should be 0.100mm (4 mils).
5. The stencil aperture to land pad size recommendation is 70% paste coverage.
6. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different
parameters and fine tune their SMT process as required for their application and tooling.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Package Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 114
8.3 BGM13S Package Marking
The figure below shows the package markings printed on the module.
Figure 8.4. BGM13S Package Marking
Explanations:
Marking Explanation
BGM13Sxxx Model Number
FCCIDQOQ13 FCC Certification ID
IC5123A-13 IC5123A-13
R-CRM-BGT-13 KC (Korea) Certification ID
YWWTTTT 1. Y = Manufacturing Year
2. WW = Manufacturing Work Week
3. TTTT = Trace Code
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Package Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 115
9. Soldering Recommendations
9.1 Soldering Recommendations
The BGM13S is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the ther-
mal mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used.
• Refer to technical documentations of particular solder paste for profile configurations.
• Avoid usining more than two reflow cycles.
• A no-clean, type-3 solder paste is recommended.
• A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
• Recommended stencil thickness is 0.100mm (4 mils).
• Refer to the recommended PCB land pattern for an example stencil aperture size.
• For further recommendation, please refer to the JEDEC/IPC J-STD-020, IPC-SM-782 and IPC 7351 guidelines.
• Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different
parameters and fine tune their SMT process as required for their application and tooling.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Soldering Recommendations
silabs.com | Building a more connected world. Rev. 1.0 | 116
10. Certifications
10.1 Qualified Antenna Types
The BGM13S variants supporting an external antenna have been designed to operate with a standard 2.14 dBi dipole antenna. Any
antenna of a different type or with a gain higher than 2.14 dBi is strictly prohibited for use with this device. Using an antenna of a differ-
ent type or gain more than 2.14 dBi will require additional testing for FCC, CE and IC. The required antenna impedance is 50 Ω.
Table 10.1. Qualified Antennas for BGM13S
Antenna Type Maximum Gain
Dipole 2.14 dBi
10.2 Bluetooth
The BGM13S is pre-qualified as a Low Energy RF-PHY tested component, having Declaration ID of TBD and QDID of TBD. For the
qualification of an end product embedding the BGM13S, the above should be combined with the most up to date Wireless Gecko Link
Layer and Host components.
10.3 CE
The BGM13S22 module is in conformity with the essential requirements and other relevant requirements of the Radio Equipment Direc-
tive (RED) (2014/53/EU). Please note that every application using the BGM13S22 will need to perform the radio EMC tests on the end
product, according to EN 301 489-17. It is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product.
The specific product assembly may have an impact to RF radiated characteristics, and manufacturers should carefully consider RF
radiated testing with the end-product assembly. A formal DoC is available via www.silabs.com
The BGM13S32 module is in conformity with the essential requirements and other relevant requirements of the Radio Equipment Direc-
tive(RED) at nominal 10 dBm transmit power.
The transmit power of the module is not limited and when an end product is using BGM13S32, the end product manufacturer is respon-
sible that the end product is in conformity of all relevant requirements of the RED.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Certifications
silabs.com | Building a more connected world. Rev. 1.0 | 117
10.4 FCC
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesirable operation.
Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.
FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif-
ic operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile limits as demonstrated
in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter
except in accordance with FCC multi-transmitter product procedures.
OEM Responsibilities to comply with FCC Regulations:
OEM integrator is responsible for testing their end-product for any additional compliance requirements required with this module instal-
led (for example, digital device emissions, PC peripheral requirements, etc.).
• With BGM13S32 the antenna(s) must be installed such that a minimum separation distance of 50.5 mm is maintained between the
radiator (antenna) and all persons at all times.
• With BGM13S22 the antenna(s) must be installed such that a minimum separation distance of 0 mm is maintained between the radi-
ator (antenna) and all persons at all times.
• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accord-
ance with FCC multi-transmitter product procedures.
Important Note:
In the event that the above conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC
authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM inte-
grator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
The variants of BGM13S Modules are labeled with their own FCC ID. If the FCC ID is not visible when the module is installed inside
another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed
module. In that case, the final end product must be labeled in a visible area with the following:
"Contains Transmitter Module FCC ID: QOQ13"
Or
"Contains FCC ID: QOQ13"
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or
change RF related parameters in the user manual of the end product.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Certifications
silabs.com | Building a more connected world. Rev. 1.0 | 118
10.5 ISED Canada
ISEDC
This radio transmitter (IC: 5123A-13) has been approved by Industry Canada to operate with the antenna types listed above, with the
maximum permissible gain indicared. Antenna types not included in this list, having a gain greater than the maximum gain indicated for
that type, are strictly prohibited for use with this device.
This device complies with Industry Canada’s license-exempt RSS standards. Operation is subject to the following two conditions:
1. This device may not cause interference; and
2. This device must accept any interference, including interference that may cause undesired operation of the device
RF Exposure Statement
Exception from routine SAR evaluation limits are given in RSS-102 Issue 5.
The models BGM13S32A and BGM13S32N meet the given requirements when the minimum separation distance to human body is 40
mm.
The models BGM13S22A and BGM13S22N meet the given requirements when the minimum separation distance to human body is 20
mm.
RF exposure or SAR evaluation is not required when the separation distance is same or more than stated above. If the separation dis-
tance is less than stated above the OEM integrator is responsible for evaluating the SAR.
OEM Responsibilities to comply with IC Regulations
The BGM13S modules have been certified for integration into products only by OEM integrators under the following conditions:
• The antenna(s) must be installed such that a minimum separation distance as stated above is maintained between the radiator (an-
tenna) and all persons at all times.
• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.
As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still respon-
sible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital
device emissions, PC peripheral requirements, etc.).
IMPORTANT NOTE
In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the ISEDC
authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integra-
tor will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate ISEDC authorization.
End Product Labeling
The BGM13S module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the
outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final
end product must be labeled in a visible area with the following:
“Contains Transmitter Module IC: 5123A-13 ”
or
“Contains IC: 5123A-13”
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or
change RF related parameters in the user manual of the end product.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Certifications
silabs.com | Building a more connected world. Rev. 1.0 | 119
ISEDC (Français)
Industrie Canada a approuvé l’utilisation de cet émetteur radio (IC: 5123A-13) en conjonction avec des antennes de type dipolaire à
2.14dBi ou des antennes embarquées, intégrée au produit. L’utilisation de tout autre type d’antenne avec ce composant est proscrite.
Ce composant est conforme aux normes RSS, exonérées de licence d'Industrie Canada. Son mode de fonctionnement est soumis aux
deux conditions suivantes:
1. Ce composant ne doit pas générer d’interférences.
2. Ce composant doit pouvoir est soumis à tout type de perturbation y compris celle pouvant nuire à son bon fonctionnement.
Déclaration d'exposition RF
L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5.
Les modules BGM13S32A and BGM13S32N répondent aux exigences requises lorsque la distance minimale de séparation avec le
corps humain est de 40 mm.
Les modules BGM13S22A and BGM13S22N répondent aux exigences requises lorsque la distance minimale de séparation avec le
corps humain est de 20 mm.
La déclaration d’exposition RF ou l'évaluation SAR n'est pas nécessaire lorsque la distance de séparation est identique ou supérieure à
celle indiquée ci-dessus. Si la distance de séparation est inférieure à celle mentionnées plus haut, il incombe à l'intégrateur OEM de
procédé à une évaluation SAR.
Responsabilités des OEM pour une mise en conformité avec le Règlement du Circuit Intégré
Le module BGM13S a été approuvé pour l'intégration dans des produits finaux exclusivement réalisés par des OEM sous les conditions
suivantes:
• L'antenne (s) doit être installée de sorte qu'une distance de séparation minimale indiquée ci-dessus soit maintenue entre le radiateur
(antenne) et toutes les personnes avoisinante, ce à tout moment.
• Le module émetteur ne doit pas être localisé ou fonctionner avec une autre antenne ou un autre transmetteur que celle indiquée
plus haut.
Tant que les deux conditions ci-dessus sont respectées, il n’est pas nécessaire de tester ce transmetteur de façon plus poussée. Ce-
pendant, il incombe à l’intégrateur OEM de s’assurer de la bonne conformité du produit fini avec les autres normes auxquelles il pour-
rait être soumis de fait de l’utilisation de ce module (par exemple, les émissions des périphériques numériques, les exigences de pé-
riphériques PC, etc.).
REMARQUE IMPORTANTE
ans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou co-implantation avec un autre émetteur), l'au-
torisation ISEDC n'est plus considérée comme valide et le numéro d’identification ID IC ne peut pas être apposé sur le produit final.
Dans ces circonstances, l'intégrateur OEM sera responsable de la réévaluation du produit final (y compris le transmetteur) et de l'ob-
tention d'une autorisation ISEDC distincte.
Étiquetage des produits finis
Les modules BGM13S sont étiquetés avec leur propre ID IC. Si l'ID IC n'est pas visible lorsque le module est intégré au sein d'un autre
produit, cet autre produit dans lequel le module est installé devra porter une étiquette faisant apparaitre les référence du module inté-
gré. Dans un tel cas, sur le produit final doit se trouver une étiquette aisément lisible sur laquelle figurent les informations suivantes:
“Contient le module transmetteur: 5123A-13 ”
or
“Contient le circuit: 5123A-13”
L'intégrateur OEM doit être conscient qu’il ne doit pas fournir, dans le manuel d’utilisation, d'informations relatives à la façon d'installer
ou de d’enlever ce module RF ainsi que sur la procédure à suivre pour modifier les paramètres liés à la radio.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Certifications
silabs.com | Building a more connected world. Rev. 1.0 | 120
10.6 Japan
The BGM13S22A and BGM13S22N are certified in Japan with certification number TBD.
Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host
equipment can place the certification mark and certification number (the same marking/number as depicted on the label of the radio
module) on the outside of the host equipment. The certification mark and certification number must be placed close to the text in the
Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination
of host and radio module to verify if they are actually using a radio device which is approved for use in Japan.
Certification Text to be Placed on the Outside Surface of the Host Equipment:
Translation of the text:
“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under
the Radio Law.”
The "Giteki" marking shown in the figures below must be affixed to an easily noticeable section of the specified radio equipment. Note
that additional information may be required if the device is also subject to a telecom approval.
Figure 10.1. GITEKI Mark and ID
Figure 10.2. GITEKI Mark
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Certifications
silabs.com | Building a more connected world. Rev. 1.0 | 121
11. Revision History
Revision 1.0
October 2018
•Added Electrical Specifications Tables for VDAC, CSEN, OPAMP, PCNT and APORT.
•5.1 Typical BGM13S Connections: Updated diagram to show IOVDD connection to Host CPU supply.
•Table 7.2 GPIO Functionality Table on page 75: Sorted by GPIO name.
• Removed unbonded I/O from APORT mapping tables.
• Packaging figures updated with latest annotations.
• Removed tape and reel specifications section.
• Added package marking specifications in 8.3 BGM13S Package Marking.
• Added certification chapter .
Revision 0.5
April 2018
• Removed PLFRCO content.
• Added V2 part numbers to Table 2.1 Ordering Information on page 3.
• Updated 4.1 Electrical Characteristics with latest characterization data and test limits.
•5.1 Typical BGM13S Connections: Added optional 32.768 kHz crystal connection.
•5.1 Typical BGM13S Connections: Corrected RTS/CTS naming on Host CPU for UART connection.
•5.1 Typical BGM13S Connections: Corrected TCK/TMS order on standard ARM Cortex debug connector.
•7.1 BGM13S Device Pinout: Changed pin 47 name from VSS to ANT_GND.
•7.1 BGM13S Device Pinout: Corrected numbering of pins 50 and 51.
• Updated 8.2 BGM13S Recommeded PCB Land Pattern with latest drawings and dimension recommendations.
Revision 0.1
July 10, 2017
• Initial Release.
BGM13S Blue Gecko Bluetooth ® SiP Module Data Sheet
Revision History
silabs.com | Building a more connected world. Rev. 1.0 | 122
http://www.silabs.com
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701
USA
Simplicity Studio
One-click access to MCU and
wireless tools, documentation,
software, source code libraries &
more. Available for Windows,
Mac and Linux!
IoT Portfolio
www.silabs.com/IoT
SW/HW
www.silabs.com/simplicity
Quality
www.silabs.com/quality
Support and Community
community.silabs.com
Disclaimer
Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or
intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"
parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes
without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included
information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted
hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of
Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal
injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass
destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.
Trademark Information
Silicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, Clockbuilder®, CMEMS®, DSPLL®, EFM®, EFM32®,
EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®,
Gecko®, ISOmodem®, Micrium, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress®, Zentri, Z-Wave, and others are trademarks or
registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM
Limited. All other products or brand names mentioned herein are trademarks of their respective holders.
