CO M & PL A E IA C NT, CO * M *H A PL L IA O G NT EN F AE oH Test Qualification for Passive Components in Automotive Applications n Compact design to save board space 1206 footprint n Small size results in very fast time to react to fault events n Symmetrical design S n Low profile n Compliant with AEC-Q200 Rev-D Stress n RoHS compliant* and halogen free** *R C- *R Q2 oH 00 S CO and M PL IA NT Features n Agency recognition: MF-NSMF Series - PTC Resettable Fuses Electrical Characteristic Model MF-NSMF012 MF-NSMF016 MF-NSMF020 MF-NSMF020X MF-NSMF025X MF-NSMF035 MF-NSMF035X MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150 MF-NSMF200 V max. Volts I max. Amps 30.0 10 30.0 24.0 30.0 16.0 6.0 16.0 13.2 6.0 6.0 6.0 6.0 10 10 60 20 100 20 100 100 100 100 100 Ihold Itrip Amperes at 23 C Hold Trip 0.12 0.16 0.20 0.20 0.25 0.35 0.35 0.50 0.75 1.10 1.50 2.00 0.29 0.37 0.46 0.40 0.50 0.75 0.75 1.00 1.50 2.20 3.00 4.00 Resistance Ohms at 23 C RMin. R1Max. 1.35 0.70 0.60 0.60 0.45 0.30 0.30 0.15 0.10 0.06 0.03 0.02 8.50 6.00 2.60 3.30 2.30 1.20 1.40 0.70 0.40 0.20 0.13 0.085 Max. Time To Trip Amperes at 23 C Seconds at 23 C 1.0 0.20 1.0 1.0 1.0 8.0 8.0 3.5 8.0 8.0 8.0 8.0 8.0 0.30 0.60 0.60 0.08 0.10 0.14 0.10 0.20 0.10 0.30 1.00 Tripped Power Dissipation Watts at 23 C Typ. 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.7 Certifications cUL TUV E174545 R 50256634 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Environmental Characteristics Operating Temperature.......................................... -40 C to +85 C Recommended Storage........................................ +40 C max, 70 % R.H. max. Passive Aging........................................................ +85 C, 1000 hours................................................ 5 % typical resistance change Humidity Aging...................................................... +85 C, 85 % R.H. 1000 hours.............................. 5 % typical resistance change Thermal Shock...................................................... -40 C to +85 C, 20 times..................................... 10 % typical resistance change Solvent Resistance................................................ MIL-STD-202, Method 215.................................... No change (marking still legible) Vibration................................................................ MIL-STD-883C, Method 2007.1,............................ No change (Rmin < R < R1max) Condition A Moisture Sensitivity Level (MSL)........................... See Note ESD Classification - HBM...................................... 6 Test Procedures And Requirements Test Test Conditions Accept/Reject Criteria Visual/Mech. Verify dimensions and materials Per MF physical description Resistance............................................................. In still air @ 23 C.................................................. Rmin R R1max Time to Trip............................................................ At specified current, Vmax, 23 C.......................... T max. time to trip (seconds) Hold Current.......................................................... 30 min. at Ihold...................................................... No trip Trip Cycle Life........................................................ Vmax, Imax, 100 cycles......................................... No arcing or burning Trip Endurance...................................................... Vmax, 48 hours...................................................... No arcing or burning Solderability........................................................... 245 C 5 C, 5 seconds....................................... 95 % min. coverage WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov * RoHS Directive 2015/863, Mar 31, 2015 and Annex. **Bourns considers a product to be "halogen free" if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Applications n USB port protection - USB 2.0, 3.0 & OTG n HDMI 1.4 Source protection n PC motherboards - Plug and Play protection n Mobile phones - Battery and port protection n PDAs / digital cameras n Game console port protection MF-NSMF Series - PTC Resettable Fuses Thermal Derating Chart - Ihold (Amps) Model MF-NSMF012 MF-NSMF016 MF-NSMF020 MF-NSMF020X MF-NSMF025X MF-NSMF035 MF-NSMF035X MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150 MF-NSMF200 -40 C 0.19 0.21 0.30 0.30 0.39 0.51 0.51 0.76 1.11 1.64 2.20 2.88 -20 C 0.17 0.20 0.27 0.27 0.35 0.46 0.46 0.68 1.00 1.46 1.99 2.61 0 C 0.15 0.18 0.24 0.24 0.31 0.40 0.40 0.59 0.85 1.30 1.77 2.28 Ambient Operating Temperature 23 C 40 C 50 C 0.12 0.11 0.10 0.16 0.14 0.13 0.20 0.18 0.16 0.20 0.18 0.16 0.25 0.23 0.21 0.35 0.30 0.27 0.35 0.30 0.27 0.50 0.44 0.40 0.75 0.67 0.61 1.10 0.92 0.83 1.50 1.34 1.23 2.00 1.80 1.66 Typical Time to Trip at 23 C 60 C 0.09 0.12 0.14 0.14 0.18 0.24 0.24 0.35 0.52 0.80 1.10 1.51 70 C 0.08 0.11 0.12 0.12 0.16 0.22 0.22 0.32 0.50 0.65 1.01 1.39 85 C 0.07 0.09 0.11 0.10 0.13 0.18 0.18 0.26 0.42 0.52 0.84 1.19 How to Order MF - NSMF 020 X - 2 100 Multifuse Product Designator Series NSMF = 1206 Surface Mount Component Hold Current, Ihold 012-200 (0.12 Amps - 2.00 Amps) Options __ = Standard X = Multifuse(R) freeXpansion DesignTM Packaging -2 = Tape and Reel Packaged per EIA 481 (R) MF-NSMF016 MF-NSMF025X 10 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF035 MF-NSMF020 MF-NSMF150 MF-NSMF012 MF-NSMF200 1 Typical Part Marking Time to Trip (Seconds) Represents total content. Layout may vary. 0 0.1 2 0.01 STYLE 1 PART IDENTIFICATION: MF-NSMF012 = 0 MF-NSMF016 = 1 MF-NSMF020 = 2 MF-NSMF035 = 3 MF-NSMF050 = 4 MF-NSMF075 = 5 MF-NSMF110 = 6 MF-NSMF150 = 8 MF-NSMF200 = A STYLE 2 PART IDENTIFICATION: MF-NSMF020X = 2 MF-NSMF025X = C MF-NSMF035X = 3 BIWEEKLY DATE CODE WILL APPEAR ON THE PACKAGING LABEL: WEEK 1 AND 2 = A WEEK 51 AND 52 = Z 0.001 0.1 1 10 100 Fault Current (Amps) The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. MF-NSMF MF-NSMF Series Series -- PTC PTC Resettable Resettable Fuses Fuses Product Dimensions Model A Min. 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) MF-NSMF012 MF-NSMF016 MF-NSMF020 MF-NSMF020X MF-NSMF025X MF-NSMF035 MF-NSMF035X MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150 MF-NSMF200 Max. 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.50 (0.138) Min. 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) B Max. 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) C Min. 0.70 (0.028) 0.48 (0.019) 0.48 (0.019) 0.40 (0.016) 0.40 (0.016) 0.48 (0.019) 0.40 (0.016) 0.48 (0.019) 0.40 (0.016) 0.40 (0.016) 0.40 (0.016) 0.70 (0.028) Max. 1.10 (0.043) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.70 (0.028) 0.70 (0.028) 0.70 (0.028) 1.60 (0.063) D Min. 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) DIMENSIONS: Style 1 Top and Bottom View A Side View Recommended Pad Layout C 1.0 0.05 (.039 .002) 1.0 0.05 (.039 .002) 1 1 1 2 2 1 2 1 1 1 1 1 MM (INCHES) Terminal material: Electroless Ni under immersion Au 1.6 0.1 (0.063 .004) B 2.0 0.1 (.079 .004) D Style 2 Style Top View Bottom View Side View A 2 Recommended Pad Layout C 1.6 0.10 (.063 .004) B D 1.0 0.05 (.039 .002) 2.0 0.10 (.079 .004) Packaging Quantity 3000 pcs. per reel Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. MF-NSMF MF-NSMF Series Series -- PTC PTC Resettable Resettable Fuses Fuses Solder Reflow Recommendations Notes: tp TP * CRITICAL ZONE T L TO TP RAMP-UP * TL Temperature tL * Ts max * RAMP-DOWN Ts min * ts PREHEAT * * 25 * t 25 C TO PEAK Time MF-NSMF models are intended for reflow soldering (including, but not limited to heating plate, hot air, IR, nitrogen, and vapor phase). Wave soldering is permissible only if the device is on the top of the PCB, opposite the heat source. Hand soldering is not recommended for these devices. All temperatures refer to the topside of the device, measured on the device body surface. If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. Compatible with Pb and Pb-free solder reflow profiles. Excess solder may cause a short circuit. Please refer to the Multifuse(R) Polymer PTC Resettable Fuse Soldering Recommendations for more details. Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Ts max to Tp) PREHEAT: Temperature Min. (Tsmin) Temperature Max. (Tsmax) Process Time (Tsmin to Tsmax) (ts) Materials Description MAINTAINED ABOVE: 1. TIME Apply solder paste to * Sn 96.5 / Ag 3.0 / Cu 0.5 test Temperature board (8 - 10 mil(T thick) Alloy water soluble or no L) clean solder paste Time (tL) 3 C / second max. Temperature Room temperature (see note 1) Peak Temperature (Tp) * single sided epoxy glass (G10) (UL approved) * PCPeak boardTemperature approx. 4x4x.06 in. Time within 5 C of Actual (tp) 2. Place test units onto board 6 units/board Ramp-Down Rate 3. Ramp up Convection oven (see note 2) 4. Time Preheat25 (TSC ) to Peak Temperature 150 C to 190 C 5. Time above liquidus (TL) 220 C 6. Peak temperature (TP) 7. Ramp down 8. Cleaning water clean profile Room temperature (see note 2) High pressure deionized water 65 PSI max. Temperature of Lead/Pad Junction (Derived using 6-zone Convection Oven) 72 F to 160 F (22 C to 71 C) 150 C 200 C Inspect solder joint to determine if solder joint is Time 60~180 seconds Interval acceptable (i.e. exhibits wetting of joint's surface). Use the following criteria (ref. acceptability of printed board assemblies, IPC-A-610): 217 C A) Acceptable (see Figure 1) 60~150 seconds 260 C (1) The solder connection wetting angle (solder to component and solder to PCB termination) does not exceed 90 . 20~40 seconds (2) Solder balls that do not violate minimum electrical clearances and are attached 6 C / second max. (soldered) to a metal surface. 2.5 C 0.5 /sec. Unacceptable (see Figure 2) max. 90 30 s8 ec.minutes B) (1) Solder connection wetting angle exceeding 90 . 250 C +0 /-5 (2) Incomplete reflow of solder paste. 10-20 sec. within 5 C of peak (3) Dewetting. 3 C 0.5 C/sec. If unacceptable, determine cause and correct prior to next run. As required NOTES: 60-90 sec. 1. Water soluble solder paste only above 100K. 2. Refer to ref. temperature profile. Temperature at lead/pad junction with "K" type thermocouple. 3. Units that are board mounted for environmental testing must see a peak temperature in the reflow zone, as specified. This is to ensure that all test units will see "worst case conditions". 4. Ramp down rate to be measured from 245 C to 150 C. 5. Process Description 8 does not apply to open frame trimmers. MF-NSMF SERIES, REV. Y, 04/19 "freeXpansion Design" is a trademark of Bourns, Inc. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. MF-NSMF Series Tape and Reel Specifications MF-NSMF020X, MF-NSMF012 MF-NSMF016 ~ MF-NSMF075 ~ MF-NSMF025X & MF-NSMF200 MF-NSMF050 MF-NSMF150 & MF-NSMF035X Tape Dimensions per EIA 481 per EIA 481 per EIA 481 per EIA 481 8.0 0.30 8.0 0.30 8.0 0.30 8.0 0.30 W (0.315 0.012) (0.315 0.012) (0.315 0.012) (0.315 0.012) 4.0 0.10 4.0 0.10 4.0 0.10 4.0 0.10 P0 (0.157 0.004) (0.157 0.004) (0.157 0.004) (0.157 0.004) 4.0 0.10 4.0 0.10 4.0 0.10 4.0 0.10 P1 (0.157 0.004) (0.157 0.004) (0.157 0.004) (0.157 0.004) 2.0 0.05 2.0 0.05 2.0 0.05 2.0 0.05 P2 (0.079 0.002) (0.079 0.002) (0.079 0.002) (0.079 0.002) 1.90 0.10 1.90 0.10 1.90 0.10 1.90 0.10 A0 (0.075 0.004) (0.075 0.004) (0.075 0.004) (0.075 0.004) 3.50 0.10 3.45 0.10 3.45 0.10 3.55 0.10 B0 (0.138 0.004) (0.136 0.004) (0.136 0.004) (0.140 0.004) 4.35 4.35 4.35 4.35 B1 max. (0.171) (0.171) (0.171) (0.171) 1.5 + 0.10/-0.0 1.5 + 0.10/-0.0 1.5 + 0.10/-0.0 1.5 + 0.10/-0.0 D0 (0.059 + 0.004/-0) (0.059 + 0.004/-0) (0.059 + 0.004/-0) (0.059 + 0.004/-0) 3.5 0.05 3.5 0.05 3.5 0.05 3.5 0.05 F (0.138 0.002) (0.138 0.002) (0.138 0.002) (0.138 0.002) 1.75 0.10 1.75 0.10 1.75 0.10 1.75 0.10 E1 (0.069 0.004) (0.069 0.004) (0.069 0.004) (0.069 0.004) 6.25 6.25 6.25 6.25 E2 min. (0.246) (0.246) (0.246) (0.246) 0.6 0.6 0.6 0.6 T max. (0.024) (0.024) (0.024) (0.024) 0.1 0.1 0.1 0.1 T1 max. (0.004) (0.004) (0.004) (0.004) 1.35 0.10 1.04 0.10 0.85 0.10 0.80 0.10 K0 (0.053 0.004) (0.041 0.004) (0.033 0.004) (0.032 0.004) 390 390 390 390 Leader min. (15.35) (15.35) (15.35) (15.35) 160 160 160 160 Trailer min. (6.30) (6.30) (6.30) (6.30) Reel Dimensions 185 (7.28) 50 (1.97) 8.4 + 1.5/-0.0 (0.331 + 0.059/-0.0) 14.4 (0.567) A max. N min. W1 W2 max. T D0 185 (7.28) 50 (1.97) 8.4 + 1.5/-0.0 (0.331 + 0.059/-0.0) 14.4 (0.567) P2 185 (7.28) 50 (1.97) 8.4 + 1.5/-0.0 (0.331 + 0.059/-0.0) 14.4 (0.567) 185 (7.28) 50 (1.97) 8.4 + 1.5/-0.0 (0.331 + 0.059/-0.0) 14.4 (0.567) DIMENSIONS: P0 E1 MM (INCHES) W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 A0 P1 W1(MEASURED AT HUB) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Bourns PPTC Resettable Fuses 3312 - (R)2 Multifuse mm SMD(R) Trimming Potentiometer Application Notice * Users are responsible for independent and adequate evaluation of Bourns(R) Multifuse(R) Polymer PTC devices in the user's application, including the PPTC device characteristics stated in the applicable data sheet. * Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated within the user's application during the PTC selection and qualification process. * Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions are expected to be repetitive or prolonged. * In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC device must be protected against mechanical stress, and must be given adequate clearance within the user's application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC devices if the thermal expansion is inhibited. * Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely affect the performance of polymer PTC devices. * Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene, which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect on the device. * Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet and on the Multifuse(R) Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note: https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf MFAN 12/18 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns(R) products manufactured by or on behalf of Bourns, Inc. and its affiliates (collectively, "Bourns"). Unless otherwise expressly indicated in writing, Bourns(R) products and data sheets relating thereto are subject to change without notice. Users should check for and obtain the latest relevant information and verify that such information is current and complete before placing orders for Bourns(R) products. The characteristics and parameters of a Bourns(R) product set forth in its data sheet are based on laboratory conditions, and statements regarding the suitability of products for certain types of applications are based on Bourns' knowledge of typical requirements in generic applications. The characteristics and parameters of a Bourns(R) product in a user application may vary from the data sheet characteristics and parameters due to (i) the combination of the Bourns(R) product with other components in the user's application, or (ii) the environment of the user application itself. The characteristics and parameters of a Bourns(R) product also can and do vary in different applications and actual performance may vary over time. Users should always verify the actual performance of the Bourns(R) product in their specific devices and applications, and make their own independent judgments regarding the amount of additional test margin to design into their device or application to compensate for differences between laboratory and real world conditions. Unless Bourns has explicitly designated an individual Bourns(R) product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949) or a particular qualification (e.g., UL listed or recognized), Bourns is not responsible for any failure of an individual Bourns(R) product to meet the requirements of such industry standard or particular qualification. Users of Bourns(R) products are responsible for ensuring compliance with safety-related requirements and standards applicable to their devices or applications. Bourns(R) products are not recommended, authorized or intended for use in nuclear, lifesaving, life-critical or life-sustaining applications, nor in any other applications where failure or malfunction may result in personal injury, death, or severe property or environmental damage. Unless expressly and specifically approved in writing by two authorized Bourns representatives on a case-by-case basis, use of any Bourns(R) products in such unauthorized applications might not be safe and thus is at the user's sole risk. Life-critical applications include devices identified by the U.S. Food and Drug Administration as Class III devices and generally equivalent classifications outside of the United States. Bourns expressly identifies those Bourns(R) standard products that are suitable for use in automotive applications on such products' data sheets in the section entitled "Applications." Unless expressly and specifically approved in writing by two authorized Bourns representatives on a case-by-case basis, use of any other Bourns(R) standard products in an automotive application might not be safe and thus is not recommended, authorized or intended and is at the user's sole risk. If Bourns expressly identifies a sub-category of automotive application in the data sheet for its standard products (such as infotainment or lighting), such identification means that Bourns has reviewed its standard product and has determined that if such Bourns(R) standard product is considered for potential use in automotive applications, it should only be used in such sub-category of automotive applications. Any reference to Bourns(R) standard product in the data sheet as compliant with the AEC-Q standard or "automotive grade" does not by itself mean that Bourns has approved such product for use in an automotive application. Bourns(R) standard products are not tested to comply with United States Federal Aviation Administration standards generally or any other generally equivalent governmental organization standard applicable to products designed or manufactured for use in aircraft or space applications. Bourns expressly identifies Bourns(R) standard products that are suitable for use in aircraft or space applications on such products' data sheets in the section entitled "Applications." Unless expressly and specifically approved in writing by two authorized Bourns representatives on a case-by-case basis, use of any other Bourns(R) standard product in an aircraft or space application might not be safe and thus is not recommended, authorized or intended and is at the user's sole risk. The use and level of testing applicable to Bourns(R) custom products shall be negotiated on a case-by-case basis by Bourns and the user for which such Bourns(R) custom products are specially designed. Absent a written agreement between Bourns and the user regarding the use and level of such testing, the above provisions applicable to Bourns(R) standard products shall also apply to such Bourns(R) custom products. Users shall not sell, transfer, export or re-export any Bourns(R) products or technology for use in activities which involve the design, development, production, use or stockpiling of nuclear, chemical or biological weapons or missiles, nor shall they use Bourns(R) products or technology in any facility which engages in activities relating to such devices. The foregoing restrictions apply to all uses and applications that violate national or international prohibitions, including embargos or international regulations. Further, Bourns(R) products and Bourns technology and technical data may not under any circumstance be exported or re-exported to countries subject to international sanctions or embargoes. Bourns(R) products may not, without prior authorization from Bourns and/or the U.S. Government, be resold, transferred, or re-exported to any party not eligible to receive U.S. commodities, software, and technical data. To the maximum extent permitted by applicable law, Bourns disclaims (i) any and all liability for special, punitive, consequential, incidental or indirect damages or lost revenues or lost profits, and (ii) any and all implied warranties, including implied warranties of fitness for particular purpose, non-infringement and merchantability. For your convenience, copies of this Legal Disclaimer Notice with German, Spanish, Japanese, Traditional Chinese and Simplified Chinese bilingual versions are available at: Web Page: http://www.bourns.com/legal/disclaimers-terms-and-policies PDF: http://www.bourns.com/docs/Legal/disclaimer.pdf C1753 05/17/18R