APL5901/2 Low IQ, Low Dropout 900mA Fixed Voltage Regulator Features General Description * Low Noise : 50VRMS (100Hz to 100kHz) * Low Quiescent Current : 50A (No load) The APL5901/2 is a micropower, low noise, and low dropout linear regulator. Operate from 2.7V to 6V input voltage * Low Dropout Voltage : 210mV (@900mA) * Very Low Shutdown Current : < 1A * Fixed Output Voltage : 1.3V ~ 3.4V * Stable with 4.7F Output Capacitor * Stable with Aluminum , Tantalum, or Ceramic and deliver up to 900mA. Typical output noise is just 50VRMS with the addition of an external 0.1F bypass capacitor in the BP pin and the typical dropout voltage is only 210mV at 900mA loading. Designed for use in batterypowered system, the low 50A quiescent current makes it an ideal choice. Capacitors Design with an internal P-channel MOSFET pass transistor, the APL5901/2 maintain a low supply current, * Reverse Current Protection * No Protection Diodes Needed * Built-in Thermal Protection * Built-in Current Limit Protection * Controlled Short Circuit Current : 200mA * Fast Transient Response * Short Setting Time * SOT-89, SOT-89-5, SOT-223, SOP-8 ,TO-252, * independent of the load current and dropout voltage. Other features including reverse current protection, thermalshutdown protection, and current-limit protection ensure specified output current and controlled short-circuit current. The APL5901/2 regulator come in a miniature SOT-89, SOT-89-5, SOT-223, SOP-8, TO-252, and TO252-5 packages. and TO-252-5 Packages Applications Lead Free and Green Devices Available * Notebook Computer * PDA or Portable Equipments * Noise-Sensitive Instrumentation Systems (RoHS Compliant) Pin Configuration APL5901 APL5902 BP TAB is GND 1 2 VIN GND 3 IN 1 8 OUT GND 2 7 GND GND 3 6 GND SHDN 4 5 BYP VOUT GND SHDN 5 4 1 2 SOP-8 (Top View) 3 1 VOUT GND SOT-89 (Top View) TAB is VOUT 2 3 VIN SOT-89-5 (Top View) GND VOUT VIN SOT-223 (Top View) TAB is GND TAB is GND VIN 2 3 TAB is GND 1 5 4 3 2 1 VOUT BP GND SHDN VIN 1 GND VOUT SOT-223 (Top View) VIN TO-252-5 (Top View) 2 3 VOUT TO-252 (Top View) ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 1 www.anpec.com.tw APL5901/2 Ordering and Marking Information Package Code D : SOT-89 D5 : SOT-89-5 U : TO-252 U5 : TO-252-5 V : SOT-223 K : SOP-8 Operating Ambient Temperature Range C : 0 to 70 oC Handling Code TR : Tape & Reel Voltage Code 13 : 1.3V ~ 34 : 3.4V Assembly Material L : Lead Free Device G : Halogen and Lead Free Device APL5901/2 Assembly Material Handling Code Temperature Range Package Code Voltage Code APL5901/2 13 D/V/K : APL5901/2 XXXXX13 XXXXX - Date Code , 13 - 1.3V APL5901/2 13 U : 13 APL5901/2 XXXXX XXXXX - Date Code , 13 - 1.3V Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines "Green" to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings Symbol VIN, VOUT SHDN PD TSTG TL (Note 1) Rating Unit Input Voltage or Out Voltage Parameter 6.5 V Shutdown Control Pin 6.5 V Internally Limited W -65 to +150 C 260 C Power Dissipation Storage Temperature Range Lead Temperature, 10 Seconds Note 1 : Stresses beyond the absolute maximum rating may damage the device and exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristics Symbol Parameter Typical Value Unit Thermal Resistance - Junction to Ambient RTH,JA SOT-89 SOT-223 SOP-8 TO-252 180 135 150 50 SOT-89 SOT-223 SOP-8 TO-252 38 15 20 6 C/W Thermal Resistance - Junction to Case RTH,JC Operating Junction Temperature TJ Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 Control Section Power Transistor 2 0 to 125 0 to 150 C/W C www.anpec.com.tw APL5901/2 Electrical Characteristics Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1F, COUT=4.7F, SHDN=VIN, TJ=0 to 125C. Typical values refer to TJ=25C. Symbol Parameter APL5901/2 Test Conditions Min. VIN Input Voltage 2.7 - 6 V VOUT VOUT +2% V VIN=4.3V - 1.5 - A VOUT=0V - 200 - mA Output Voltage VOUT+1.0V< VCC<6.0V, 0mA< IOUT < IMAX ILIMIT Circuit Current Limit ISHORT Short Current IOUT Load Current Line Regulation REGLOAD Load Regulation VDROP PSRR Dropout Voltage (Note2) Unit Max. VOUT -2% VOUT REGLINE Typ. 900 - - mA VOUT+0.5V< VCC<6.0V, I = 1mA - 4 10 mV VIN =VOUT+1.0V, 0mA< IOUT < IMAX - 1 6 mV 1.3VVOUT<1.5V - 1100 1300 1.5VVOUT<2V - 900 1050 2VVOUT<2.5V - 500 700 2.5VVOUT<3.4V - 280 380 55 65 - No load - 50 100 IOUT=900mA - 370 450 - 0.01 1 A - 50 - Vrms - 40 - - 7 - - 70 - - 150 - C - 10 - C - 50 - ppm/C IOUT =900mA mV F1kHz, 1Vpp at VIN = VOUT+1.0V Ripple Rejection Quiescent Current Shutdown Supply Current (Note3) Shutdown = low IOUT=0, VCC =6.0V 100Hz<f<100kHz, typical load, CBP=0.01F, COUT = 1F IQ Noise 100Hz<f<100kHz, typical load, Shutdown Recovery Delay (Note3) CBP=0.01F,COUT=1F, no load CBP=0.1F,COUT=1F, no load Over-Temperature Shutdown Over-Temperature Shutdown Hysteresis TC A (Note3) CBP=0.1F, COUT = 1F OTS dB Hysteresis Output-Voltage Temperature Coefficient Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 3 ms www.anpec.com.tw APL5901/2 Electrical Characteristics (Cont.) Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1F, COUT=4.7F, SHDN=VIN, TJ=0 to 125C. Typical values refer to TJ=25C. Symbol COUT Parameter Unit Min. Typ. Max. Output Capacitor 4.2 4.7 5.2 F ESR 0.02 0.1 1 Ohm 0.4 0.7 1.6 V - 0.01 100 nA - 0.1 0.5 A - 11 50 mV Shutdown Input Threshold (Note3) ISHDN APL5901/2 Test Conditions Shutdown input Bias Current (Note3) VOUT+1.0V< VIN <6.0V VSHDN =VIN Input Reverse Leakage Current VOUT-VIN=0.1V Reverse Protection Threshold Note 2 : Dropout voltage definition : VIN-VOUT when VOUT is 2% below the value of VOUT for VIN = VOUT + 0.5V Note 3 : For 5-pin devices only. Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 4 www.anpec.com.tw APL5901/2 Typical Operating Characteristics Ground Pin Current vs. Output Current Current Limit vs. Input Voltage APL5901/2-33 Current Limit (mA) 2.5 2 1.5 1 0.5 0 3.5 4 4.5 5 5.5 APL5901/2-33 400 Ground Pin Current vs. Load Current (A) 3 350 300 250 200 150 100 50 0 0 6 150 Ground Pin Current vs. Input Voltage 600 750 900 Input Voltage vs. Output Voltage APL5901/2-33 APL5901/2-33 3.5 300 3 250 2.5 Output Voltage (V) Ground Pin Current vs. Load Current (A) 450 Output Current (mA) Input Voltage (V) 350 300 200 150 100 2 1.5 1 0.5 50 0 0 0 1 2 3 4 5 0 6 Input Voltage (V) Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 1 2 3 4 5 6 Input Voltage (V) 5 www.anpec.com.tw APL5901/2 Typical Operating Characteristics (Cont.) Output Current vs. Output Voltage Dropout Voltage vs. Output Current 1200 APL5901/2-33 0 1100 VOUT=1.5V -2 900 800 Output Current (A) Dropout Voltage (mV) 1000 VOUT=1.8V 700 600 500 VOUT=3.3V 400 300 VOUT=2.5V 200 -4 VIN=0V -6 -8 -10 100 0 -12 0 150 300 450 600 750 0 900 0.5 1 Output Current (mA) 1.5 2 2.5 Output Voltage (V) PSRR vs. Frequency SHDN Threshold Voltage vs. Input Voltage APL5901/2-33 APL5901/2-33 1 3 -10 0.9 -20 0.8 VIN=4V -30 VIN=0V PSRR (dB) SHDN Threshold Voltage (V) +0 0.7 0.6 -40 IOUT =50mA COUT=10F CBP=0.1F -50 -60 -70 0.5 VIN=5V -80 -90 0.4 3 3.5 4 4.5 5 5.5 -100 6 Input Voltage (V) Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 20 50 100 200 500 1k 2k 5k 10k 20k 50k 100k 200k Frequency (HZ) 6 www.anpec.com.tw APL5901/2 Typical Operating Characteristics (Cont.) Output Noise vs. Bypass Capacitor Output Noise APL5901/2-33 100u 450 400 40u 350 Output Noise (V) VOUT (50V/div) APL5901/2-33 500 VIN=4.3V 80u IOUT =0mA COUT=10uF 60u CBP=0.1uF 20u 0 -20u -40u -60u 300 250 200 150 100 50 -80u -100u 0 0 2m 4m 6m 8m 10m 0 Time (s) 0.1 0.2 0.3 Bypass Capacitor (F) Load-Transient Response Line-Transient Response APL5901/2-33 VOUT Output Voltage (20mV/div) Output Voltage (50mV/div) APL5901/2-33 VIN=VOUT+1V COUT=4.7F IOUT=1mA~900mA Time (10s/div) Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 0.4 VIN 4V 3V VOUT Time (40s/div) 7 www.anpec.com.tw APL5901/2 Typical Operating Characteristics (Cont.) Shutdown Exit Delay Shutdown Exit Delay APL5901/2-33 APL5901/2-33 3.3V 3.3V VOUT VOUT CBP=10nF No Load CBP=100nF No Load 0V 0V 4V 4V vSHDN vSHDN 0V 0V Time (1s/div) Time (20s/div) Region of Stable ESR vs. Load Current Entering Shutdown APL5901/2-33 APL5901/2-33 1 3.3V VOUT=3.3V VOUT 0.1 COUT ESR () COUT=1F No Load 0V 4V stable 0.01 unstable 0V 0.001 0 300 450 600 750 900 Load Current (mA) Time (200s/div) Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 150 8 www.anpec.com.tw APL5901/2 Typical Operating Characteristics (Cont.) Output Voltage vs. Temperature APL5901/2-33 3.35 Output Voltage (V) 3.33 3.31 3.29 3.27 3.25 -40 0 40 80 120 Temperature (C ) Pin Description PIN NO. 1 I/O NAME VIN FUNCTION I Supply voltage input. Ground pins of the circuitry, and all ground pins must be soldered to PCB with proper 2 GND power dissipation. 3 SHDN(Note 4) I Shutdown control pin, low = off , high = normal. Don't leave open. 4 BP(Note 4) O Bypass signal pin in fixed output type device 5 VOUT O Output pin of the regulator. Note 4 : These pins do not exist in 3-pin package. Typical Application Circuit INPUT 2.7V to 6V VIN VOUT VOUT APL5901 BP SHDN on GND CIN 1F COUT 4.7F off CBP Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 9 0.01F www.anpec.com.tw APL5901/2 Application Information Capacitor Selection and Regulator Stability shutdown mode, the quiescent current can reduce below The APL5901/2 use at least a 1F capacitor on the input, and this capacitor can be Aluminum, Tantalum, or Ce- 1A. The EN pin cannot be floating, a floating EN pin may cause an indeterminate state on the output. If it is no use, ramic capacitor. The input capacitor with larger value and lower ESR provides better PSRR and line-transient connect to VIN for normal operation. Current Limit response. The output capacitor also can use Aluminum, Tantalum, or Ceramic capacitor, and a minimum value of 4.7F and The APL5901/2 have a current-limit protection. The ouptut voltage will drop close to zero volt when load current reaches the limit, and then the load current will be limited at 200mA after output voltage is below 0.7V. When the ESR above 0.02 is recommended. A larger output capacitor can reduce noise and improve load-transient load current back to the value where limiting started, the output voltage and current will return to normal value. response, stability, and PSRR. Note that some ceramic dielectrics exhibit large capacitance and ESR variation When output is shortened to the ground, the APL5901/2 will keep short circuit current at 200mA . with temperature. When using this capacitor, a minimum 10F or more may be required to ensure that the stability Thermal Protection Thermal protection limits total power dissipation in the at low temperature operation. Use a bypass capacitor at BP pin for low output nvise. Increasing the capacitance o device. When the junction temperature exceeds TJ=+15 C, the thermal sensor generates a logic signal to turn off the will slightly decrease the output noise but increase the start-up time. Load-Transient Consideration pass transistor and allows IC to cool. When the IC's junco tion temperature is down by 10 C, the thermal sensor The APL5901/2 load-transient response graphs in typical characteristics show the transient response. A step change will turn the pass transistor on again, resulting in a pulsed output during continuous thermal protection. Thermal protection is designed to protect the APL5901/2 in the in the load current from 10mA to 900mA at 10s will cause a 20mV transient spike. Larger output capacitor and lower event of fault conditions. For continuous operation, do not exceed the absolute maximum junction temperature ESR can reduce transient spike. o of TJ=+150 C. Input-Output (Dropout)Voltage The minimum input-output voltage difference (dropout) Operating Region and Power Dissipation The thermal resistance of the case to circuit board, and determines the lowest usable supply voltage. In batterypowered systems, this will determine the useful end-of- the rate of air flow all control the APL5901/2's maximum power dissipation. The power dissipation across the life battery voltage. Because the APL5901/2 use a p-channel MOSFET pass transistor, the dropout voltage is the function of drain-to-source on-resistance (RDS(ON)) multiplied by the load current. device is PD = IOUT (VIN-VOUT) and the maximum power dissipation is: PDMAX = (TJ-TA) / ( JC + CA) Reverse Current Protection The APL5901/2 have an internal reverse protection, it does where TJ-TA is the temperature difference between the junction and ambient air, JC is the thermal resistance of the package, and CA is the thermal resistance through not need an external schottky diode to connect the regulator input and output. If the output voltage is forced above the printed circuit board, copper traces, and other materials to the ambient air. the input voltage by more than 11mV, the IC will be shutdown and the ground pin current is below 0.1A. Shutdown/Enable The GND pin of the APL5901 provides an electrical connection to the ground and channeling heat away. If power The APL5901/2 have an active high enable function. Force EN high (>1.6V) enables the regulator, EN low (<0.4V) dissipation is large, connect the GND pin to the ground using a large pad or a ground plane can improve the disables the regulator and enter the shutdown mode. In problem of over heat of IC. Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 10 www.anpec.com.tw APL5901/2 Package Information SOT-89 A D1 C L H E E1 D e e1 B B1 SOT-89 S Y M B O L A MIN. MAX. MIN. MAX. 1.40 1.60 0.055 0.063 B 0.44 0.56 0.017 0.022 B1 0.36 0.48 0.014 0.019 C 0.35 0.44 0.014 0.017 D 4.40 4.60 0.173 0.181 0.072 MILLIMETERS INCHES D1 1.62 1.83 0.064 E 2.29 2.60 0.090 0.102 E1 2.13 2.29 0.084 0.090 e 1.50 BSC e1 H L 0.059 BSC 3.00 BSC 3.94 0.89 0.118 BSC 4.25 0.155 0.167 1.20 0.035 0.047 Note : Follow JEDEC TO-243 AA. Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 11 www.anpec.com.tw APL5901/2 Package Information SOT-89-5 D D1 A L H E1 E C e e1 B SOT-89-5 S Y M B O L A MIN. MAX. MIN. MAX. 1.40 1.60 0.055 0.063 B 0.36 0.56 0.014 0.022 0.017 MILLIMETERS INCHES C 0.35 0.44 0.014 D 4.40 4.60 0.173 0.181 D1 1.62 1.83 0.064 0.072 E 2.29 2.60 0.090 0.102 E1 2.13 2.29 0.084 e 1.50 BSC e1 0.090 0.059 BSC 3.00 BSC 0.118 BSC H 3.94 4.25 0.155 0.167 L 0.89 1.20 0.035 0.047 Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 12 www.anpec.com.tw APL5901/2 Package Information SOT-223 D b2 E E1 SEE VIEW A e c 0.25 L b 0 A A1 A2 e1 GAUGE PLANE SEATING PLANE VIEW A S Y M B O L SOT-223 MILLIMETERS MIN. INCHES MAX. A MIN. MAX. 1.80 0.071 A1 0.02 0.10 0.001 0.004 A2 1.50 1.70 0.059 0.067 0.033 b 0.66 0.84 0.026 b2 2.90 3.10 0.114 0.122 c 0.23 0.33 0.009 0.013 D 6.30 6.70 0.248 0.264 E 6.70 7.30 0.264 0.287 E1 3.30 3.70 0.130 0.146 e 2.30 BSC e1 L 0 0.091 BSC 4.60 BSC 0.181 BSC 0.030 0.75 0 0 10 10 Note : 1. Follow from JEDEC TO-261 AA. 2. Dimension D and E1 are determined at the outermost extremes of the plastic exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body. Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 13 www.anpec.com.tw APL5901/2 Package Information TO-252 E A E1 c2 L4 H D D1 L3 b3 c b e SEE VIEW A 0 GAUGE PLANE SEATING PLANE 0.25 A1 L TO-252 S Y M B O L MIN. A 2.18 MILLIMETERS b c INCHES MAX. MIN. MAX. 2.39 0.086 0.094 0.005 0.13 A1 b3 VIEW A 0.89 0.020 0.035 4.95 5.46 0.195 0.215 0.46 0.61 0.018 0.024 0.035 0.50 c2 0.46 0.89 0.018 D 5.33 6.22 0.210 0.245 D1 4.57 6.00 0.180 0.236 E 6.35 6.73 0.250 0.265 E1 3.81 6.00 0.150 0.236 e 2.29 BSC 0.090 BSC H 9.40 10.41 0.370 0.410 L 0.90 1.78 0.035 0.070 L3 0.89 2.03 0.035 0.080 0 0.040 1.02 L4 0 8 0 8 Note : Follow JEDEC TO-252 . Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 14 www.anpec.com.tw APL5901/2 Package Information TO-252-5 E A c2 E1 H D D1 L3 b3 c b e SEE VIEW A 0 SEATING PLANE L A1 0.25 GAUGE PLANE VIEW A TO-252-5 S Y M B O L MIN. A 2.18 MILLIMETERS INCHES MAX. MIN. MAX. 2.39 0.086 0.094 0.005 0.13 A1 b 0.50 0.89 0.020 0.035 b3 4.32 5.46 0.170 0.215 0.61 0.018 0.024 0.89 0.018 0.035 c 0.46 c2 0.46 D 5.33 6.22 0.210 0.245 D1 4.57 6.00 0.180 0.236 E 6.35 6.73 0.250 0.265 E1 3.81 6.00 0.150 e 1.27 BSC 0.236 0.050 BSC H 9.40 10.41 0.370 0.410 L 1.40 1.78 0.055 0.070 L3 0.89 2.03 0.035 0.080 0 0 8 Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 0 15 8 www.anpec.com.tw APL5901/2 Package Information SOP-8 D E E1 SEE VIEW A h X 45 c A 0.25 b GAUGE PLANE SEATING PLANE A1 A2 e L VIEW A S Y M B O L SOP-8 INCHES MILLIMETERS MIN. MAX. A MIN. MAX. 1.75 0.069 0.004 0.25 0.010 A1 0.10 A2 1.25 b 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e 0.049 1.27 BSC 0.050 BSC h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 0 0 8 0 8 Note: 1. Follow JEDEC MS-012 AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 16 www.anpec.com.tw APL5901/2 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 OD1 B A B T SECTION A-A SECTION B-B H A d T1 Application SOT-89 A H 178.02.00 50 MIN. P0 P1 4.00.10 Application TO-252 Application SOT-223 Application SOP-8 T1 12.4+2.00 -0.00 C 13.0+0.50 -0.20 P2 D0 8.0 0.10 2.00.05 1.5+0.10 -0.00 T1 16.4+2.00 -0.00 C 13.0+0.50 -0.20 A H 330.02.00 50 MIN. P0 P1 P2 D0 d D W E1 F 1.5 MIN. 20.2 MIN. 12.00.30 1.750.10 5.500.05 D1 T A0 B0 K0 1.5 MIN. 0.6+0.00 -0.40 4.800.20 4.500.20 1.800.20 d D W E1 F 1.5 MIN. 20.2 MIN. 16.00.30 1.750.10 7.500.05 D1 T A0 B0 K0 1.5 MIN. 0.6+0.00 -0.40 d D 1.5 MIN. 20.2 MIN. 4.00.10 8.0 0.10 2.00.05 1.5+0.10 -0.00 A H 320.02.00 50 MIN. T1 12.4+2.00 -0.00 C 13.0+0.50 -0.20 P0 P1 P2 D0 D1 T A0 B0 K0 4.000.10 8.000.10 2.000.50 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 6.900.20 7.500.20 2.100.20 A H D W E1 F 50 MIN. C 13.0+0.50 -0.20 d 330.02.00 T1 12.4+2.00 -0.00 1.5 MIN. 20.2 MIN. 12.00.30 1.750.10 5.50.05 P0 P1 D1 T A0 B0 K0 1.5 MIN. 0.6+0.00 -0.40 6.400.20 5.200.20 2.100.20 4.00.10 8.0 0.10 Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 P2 D0 2.00.05 1.5+0.10 -0.00 17 6.800.20 10.400.20 2.500.20 W E1 12.000.30 1.750.10 F 5.500.05 (mm) www.anpec.com.tw APL5901/2 Devices Per Unit Package Type Unit Quantity SOT-89 Tape & Reel 1000 TO-252 Tape & Reel 2500 SOT-223 Tape & Reel 2500 SOP-8 Tape & Reel 2500 Taping Direction Information SOT-89 USER DIRECTION OF FEED TO-252 USER DIRECTION OF FEED Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 18 www.anpec.com.tw APL5901/2 Taping Direction Information SOT-223 USER DIRECTION OF FEED SOP-8 USER DIRECTION OF FEED Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 19 www.anpec.com.tw APL5901/2 Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone TL to TP Ramp-up Temperature TL tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25C to Peak Time Reliability Test Program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245C, 5 sec 1000 Hrs Bias @125C 168 Hrs, 100%RH, 121C -65C~150C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1tr > 100mA Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5C of actual Peak Temperature (tp) Ramp-down Rate Time 25C to Peak Temperature Sn-Pb Eutectic Assembly Pb-Free Assembly 3C/second max. 3C/second max. 100C 150C 60-120 seconds 150C 200C 60-180 seconds 183C 60-150 seconds 217C 60-150 seconds See table 1 See table 2 10-30 seconds 20-40 seconds 6C/second max. 6C/second max. 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface. Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 20 www.anpec.com.tw APL5901/2 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process - Package Peak Reflow Temperatures 3 3 Volume mm 350 225 +0/-5C 225 +0/-5C Volume mm <350 240 +0/-5C 225 +0/-5C Package Thickness <2.5 mm 2.5 mm Table 2. Pb-free Process - Package Classification Reflow Temperatures 3 3 3 Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0C* 260 +0C* 260 +0C* 1.6 mm - 2.5 mm 260 +0C* 250 +0C* 245 +0C* 2.5 mm 250 +0C* 245 +0C* 245 +0C* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0C. For example 260C+0C) at the rated MSL level. Package Thickness Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. B.3 - Sep., 2008 21 www.anpec.com.tw