VN2460 N-Channel Enhancement-Mode Vertical DMOS FETs Ordering Information Order Number / Package BVDSS / BVDGS RDS(ON) (max) ID(ON) (min) TO-92 TO-243AA* Die** 600V 20 0.25A VN2460N3 VN2460N8 VN2460NW * Same as SOT-89 Product Supplied on 2000 piece carrier tape reels. ** Die in wafer form. Product marking for TO-243AA: Features VN4F Free from secondary breakdown Low power drive requirement Where = 2-week alpha date code Ease of paralleling Low CISS and fast switching speeds Advanced DMOS Technology Excellent thermal stability Integral Source-Drain diode These low threshold enhancement-mode (normally-off) transistors utilize a vertical DMOS structure and Supertex's well-proven silicon-gate manufacturing process. This combination produces devices with the power handling capabilities of bipolar transistors and with the high input impedance and positive temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, these devices are free from thermal runaway and thermally-induced secondary breakdown. High input impedance and high gain Applications Motor controls Supertex's vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications where high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds are desired. Converters Amplifiers Switches Power supply circuits Drivers (relays, hammers, solenoids, lamps, memories, displays, bipolar transistors, etc.) Package Options Absolute Maximum Ratings D Drain-to-Source Voltage BVDSS Drain-to-Gate Voltage BVDGS Gate-to-Source Voltage 20V Operating and Storage Temperature Soldering Temperature* G D S TO-243AA (SOT-89) -55C to +150C SGD TO-92 300C * Distance of 1.6 mm from case for 10 seconds. Note: See Package Outline section for dimensions. 04/14/03 Supertex Inc. does not recommend the use of its products in life support applications and will not knowingly sell its products for use in such applications unless it receives an adequate "products liability indemnification insurance agreement." Supertex does not assume responsibility for use of devices described and limits its liability to the replacement of devices determined to be defective due to workmanship. No responsibility is assumed for possible omissions or inaccuracies. Circuitry and specifications are subject to change without notice. For the latest product specifications, refer to the Supertex website: http://www.supertex.com. For complete liability information on all Supertex products, refer to the most current databook or to the Legal/Disclaimer page on the Supertex website. 1 VN2460 Thermal Characteristics Package ID (continuous)* ID (pulsed) Power Dissipation @ TC = 25C jc ja C/W C/W IDR* IDRM TO-243AA 0.2A 0.6A 1.6W 15 78 0.2A 0.6A TO-92 0.16A 0.5A 1W 125 170 0.16A 0.5A * ID (continuous) is limited by max rated Tj. Mounted on FR5 board, 25mm x 25mm x 1.57mm. Significant PD increase possible on ceramic substrate. Electrical Characteristics (@ 25C unless otherwise specified) Symbol Parameter Min BVDSS Drain-to-Source Breakdown Voltage 600 VGS(th) Gate Threshold Voltage 1.5 VGS(th) Typ Max Unit Conditions V VGS = 0V, ID = 2.0mA 4.0 V VGS = VDS , ID = 2.0mA Change in VGS(th) with Temperature -5.5 mV/C VGS = VDS , ID = 2.0mA IGSS Gate Body Leakage 100 nA VGS = 20V, VDS = 0V IDSS Zero Gate Voltage Drain Current 10 A VGS = 0V, VDS = Max Rating 1 mA VGS = 0V, VDS = 0.8 Max Rating TA = 125C ON-State Drain Current 0.25 A RDS(ON) Static Drain-to-Source ON-State Resistance 25 RDS(ON) Change in RDS(ON) with Temperature 1.7 GFS Forward Transconductance CISS Input Capacitance COSS Common Source Output Capacitance 50 CRSS Reverse Transfer Capacitance 25 td(ON) Turn-ON Delay Time 10 tr Rise Time 10 td(OFF) Turn-OFF Delay Time 25 tf Fall Time 20 VSD Diode Forward Voltage Drop 1.5 20 %/C m 50 ID(ON) VGS = 10V, VDS = 25V VGS = 4.5V, ID = 100mA VGS = 10V, ID = 100mA VGS = 10V, ID = 100mA VDS = 25V, ID = 100mA 150 pF VGS = 0V, VDS = 25V f = 1.0 MHz ns VDD = 25V, ID = 250mA, RGEN = 25 V VGS = 0V, ISD = 400mA Notes: 1. All D.C. parameters 100% tested at 25C unless otherwise stated. (Pulse test: 300s pulse, 2% duty cycle.) 2. All A.C. parameters sample tested. Switching Waveforms and Test Circuit VDD RL 10V 90% PULSE GENERATOR INPUT 0V 10% t(ON) td(ON) Rgen t(OFF) tr td(OFF) OUTPUT tF D.U.T. VDD 10% INPUT 10% OUTPUT 0V 90% 90% 2 VN2460 Typical Performance Curves Output Characteristics Saturation Characteristics 1.2 0.5 VGS = 10V VGS = 10V 8V 0.8 6V 0.6 0.4 6V 5V 0.3 0.2 5V 4V 0.1 0.2 0 8V 0.4 ID (Amperes) ID (Amperes) 1.0 4V 0 10 20 30 40 3V 50 3V 0 0 2 4 VDS (Volts) 6 8 10 VDS (Volts) Transconductance vs. Drain Current Power Dissipation vs. Case Temperature 2.0 0.5 VDS = 25V 1.6 SOT-89 TA = -55C PD (Watts) GFS (siemens) 0.4 0.3 TA = 25C 0.2 1.2 0.8 TO-92 TA = 125C 0.1 0.4 0.0 0.0 0.1 0.2 0.3 0.4 0 0.5 0 25 50 Maximum Rated Safe Operating Area Thermal Resistance (normalized) ID (amperes) 150 1.0 TO-92 (pulsed) TO-92 (DC) SOT-89 (DC) 0.01 SOT-89 P D = 1.6W T C = 25C 0.8 0.6 0.4 0.2 TO-92 P D = 1W T C = 25C T C = 25C 0 0.001 1 125 Thermal Response Characteristics SOT-89 (pulsed) 0.1 100 TC (C) ID (Amperes) 1.0 75 10 100 1000 0.001 VDS (Volts) 0.01 0.1 tp (seconds) 3 1.0 10 VN2460 Typical Performance Curves On Resistance vs. Drain Current BVDSS Variation with Temperature 50 1.2 1.1 RDS(ON) (ohms) BVDSS (Normalized) VGS = 4.5V 40 1.0 30 VGS = 10V 20 0.9 10 -50 0 50 100 0 150 0.2 0.6 0.8 1.0 Transfer Characteristics VGS(TH) and RDS(ON) w/ Temperature VDS = 25V 1.6 3.0 1.4 2.5 TA = -55C VGS(th) (normalized) 0.4 TA = 25C 0.3 TA = 125C 0.2 0.1 1.2 0 2 4 6 8 1.0 1.5 0.8 1.0 0.5 RDS(on) @ 10V, 0.1A 0.4 -50 10 2.0 VGS(th) @ 2mA 0.6 0 0.4 ID (Amperes) 0.5 ID (Amperes) 0 TJ (C) -25 0 25 50 RDS(ON) (normalized) 0.8 75 100 125 0.0 150 TJ (C) VGS (Volts) Gate Drive Dynamic Characteristics Capacitance vs. Drain Source Voltage 10 300 ID = 0.5A f = 1MHz 8 VDS=10V 150 VGS (volts) C (picofarads) 225 CISS VDS=40V 6 4 75 2 COSS CRSS 0 0 0 10 20 30 0 40 1.0 2.0 3.0 4.0 5.0 QG (nanocoulombs) VDS (volts) 04/14/03 (c)2003 Supertex Inc. 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