REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
C
Convert to military drawing format. Add vendor CAGE 01295.
Changes to table I. Delete subgroup 9 from final electrical test
parameters. Add case outline X. Added four devices 09 - 12.
87-07-06
M. A. Frye
D
Update part numbers for vendor CAGE number 01295. Correction on
page 18, terminal connections. Editorial changes throughout. Add
vendor CAGE numger 01295 as a supplier of the K package for
device types 01 through 08. Changes to pages 5 and 6 table I.
Changes to pages 10 and 11 terminal connections. Changes on
pages 21 - 28.
88-05-06
M. A. Frye
E
Correct figure 1 device types 02 and 04 for case outline X. Boilerplate
updated. ksr
04-08-06
Raymond Monnin
F
Update drawing to current requirements. Editorial changes throughout.
ksr.
09-11-30
Charles F. Saffle
G
Update drawing to reflect current MIL-PRF-38535 requirements. – llb
17-09-27
Charles F. Saffle
REV
SHEET
REV
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
SHEET
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
REV STATUS
REV
G
G
G
G
G
G
G
G
G
G
G
G
G
G
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PMIC N/A
PREPARED BY
Greg Pitz
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
CHECKED BY
Charles Reusing
APPROVED BY
Michael Frye
MICROCIRCUIT, MEMORY, DIGITAL,
BIPOLAR, PROGRAMMABLE LOGIC,
MONOLITHIC SILICON
DRAWING APPROVAL DATE
84-08-24
REVISION LEVEL
SIZE
A
CAGE CODE
67268
84129
SHEET 1 OF 30
DSCC FORM 2233
APR 97 5962-E602-17
DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 2
DSCC FORM 2234
APR 97
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
84129
01
J
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device types. The device types identify the circuit function as follows:
Device type Generic number 1/ Circuit
01, 09 PAL20L8A, L8A-2 20-input 8-output AND-OR invert gate array
02, 10 PAL20R8A, R8A-2 20-input 8-output registered AND-OR gate array
03, 11 PAL20R6A, R6A-2 20-input 6-output registered AND-OR gate array
04, 12 PAL20R4A, R4A-2 20-input 4-output registered AND-OR gate array
05 PAL20L10A 20-input 10-output AND-OR invert gate array
06 PAL20X8A 20-input 8-output registered AND-OR-XOR gate array
07 PAL20X10A 20-input 10-output registered AND-OR-XOR gate array
08 PAL20X4A 20-input 4-output registered AND-OR-XOR gate array
1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
J GDIP1-T24 or CDIP2-T24 24 dual-in-line package
K GDFP2-F24 or CDFP3-24 24 flat package
L GDIP3-T24 or CDIP4-T24 24 dual-in-line package
X CQCC1-N28 28 square chip carrier package 1/
3 CQCC1-N28 28 square chip carrier package 1/
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range (VCC) ------------------------------------------------- -0.5 V dc to +12.0 V dc
Input voltage range ------- --------------------------------------------------- -1.5 V dc to +5.5 V dc
Storage temperature range ------------------------------------------------ -65°C to +150°C
Lead temperature (soldering, 10 seconds) ----------------------------- +260°C
Thermal resistance, junction-to-case (θJC): 2/ 3/
Cases J, K, L, X, and 3 -------------------------------------------------- (See MIL-STD-1835)
Output voltage applied -- --------------------------------------------------- -1.5 V dc to +12 V dc
Output sink current ------- --------------------------------------------------- 100 mA
Maximum power dissipation(PD) 3/ --------------------------------------- 1.2 W
Maximum junction temperature (TJ) -------------------------------------- +175°C
1/ See figure 1.
2/ Heat sinking is recommended to reduce the junction temperature.
3/ Must withstand the added PD due to short circuit test (e.g., IOS).
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 3
DSCC FORM 2234
APR 97
1.4 Recommended operating conditions.
Supply voltage (VCC) --------------------------------------------------------- 4.5 V dc minimum to 5.5 V dc maximum
Minimum high level input voltage (VIH) ---------------------------------- 2.0 V dc
Maximum low level input voltage (VIL) ----------------------------------- 0.8 V dc
Case operating temperature range (TC) --------------------------------- -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094).
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used. This drawing has been modified to allow the
manufacturer to use the alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other alternative
approved by the qualifying activity.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.2 Truth tables. The truth tables shall be as specified on figure 2.
3.2.2.1 Unprogrammed devices. The truth tables for unprogrammed devices for contracts involving no altered item drawing
shall be as specified on figure 2. When required in groups A, B, or C (see 4.4), the devices shall be programmed by the
manufacturer prior to test with a minimum of 50 percent of the total number of gates programmed or to any altered item
drawing pattern which includes at least 25 percent of the total number of gates programmed.
3.2.2.2 Programmed devices. The truth tables for programmed devices shall be as specified by an attached altered item
drawing.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 4
DSCC FORM 2234
APR 97
3.2.3 Logic diagrams. The logic diagrams shall be as specified on figure 3.
3.2.4 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full (case or ambient) operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD
PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used. For product built in accordance with A.3.2.2 of
MIL-PRF-38535, or as modified in the manufacturer’s QM plan, the “QD” certification mark shall be used in place of the "Q" or
"QML" certification mark.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and
Maritime-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the
requirements of MIL-PRF-38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DLA Land and Maritime-VA shall be required for any change that
affects this drawing.
3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result
in a wide variety of configurations, two processing options are provided for selection in the contract, using an altered item
drawing.
3.10.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 3.2.2.1
and table II. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program
configuration.
3.10.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions
herein, including the requirements of the altered item drawing, shall be satisfied by the manufacturer prior to delivery.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
-55C TC +125C
Group A
subgroups
Device
type
Limits
Unit
unless otherwise specified
Min
Max
Input clamp voltage
VIC
VCC = 4.5 V, II = -18 mA
1
All
-1.5
V
High level output voltage
VOH
VCC = 4.5 V, VIL < 0.8 V,
VIH > 2.0 V, IOH = -2 mA
1, 2, 3
All
2.4
V
Low level output voltage
VOL
VCC = 4.5 V, VIL < 0.8 V,
VIH > 2.0 V, IOH = 12 mA
1, 2, 3
All
0.5
V
High level input voltage
VIH
VCC = 5.5 V 2/
1, 2, 3
All
2.0
V
Low level input voltage
VIL
VCC = 5.5 V 2/
1, 2, 3
All
0.8
V
High level input current
IIH
VCC = 5.5 V,
VI = 2.4 V 3/
OE
1, 2, 3
All
40
µA
others
25
Low level input current
IIL
VCC = 5.5.V, VI = 0.4 V 3/
1, 2, 3
All
-0.25
mA
Output short circuit current
IOS
VCC = 5.5.V, VO = 0.4 V 3/
1, 2, 3
01-08
-30
-250
mA
09,10,
11,12
-130
Input current
II
VCC = 5.5 V, VI = 5.5. V
1, 2, 3
All
1.0
mA
Off-state output current
IOZL
VCC = 5.5 V, VIL = 0.8 V,
VIH = 2.4 V, VO = 0.4 V 3/
1, 2, 3
All
-250
µA
Off-state output current
IOZH
VCC = 5.5 V, VIL = 0.8 V,
VIH = 2.4 V, VO = 2.4 V 3/
1, 2, 3
All
100
µA
Supply current
ICC
VCC = 5.5 V
1, 2, 3
01,02,
03,04
210
mA
05
165
06,07,
08
180
09,10,
11,12
105
Functional testing
See 4.3.1c
7, 8A, 8B
All
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions 1/
-55C TC +125C
Group A
subgroups
Device
type
Limits
Unit
unless otherwise specified
Min
Max
Propagation delay data
input to output
tPHL
VCC = 5.0 V, CL = 50 pF +10%,
R1 = 390Ω, +5%,
R2 = 750Ω +5%
(or equivalent load circuit)
Unless otherwise specified
9, 10, 11
01,03,
04
30
ns
05,06,
08
35
09,11,
12
50
Propagation delay data
input to output
tPLH
9, 10, 11
01,03,
04
30
ns
05,06,
08
35
09,11,
12
50
Propagation delay high
impedance to output
high
tPZH
9, 10, 11
01,03,
04
30
ns
05,06,
08
35
09,11,
12
45
Propagation delay high
impedance to output low
tPZL
9, 10, 11
01,03,
04
30
ns
05,06,
08
35
09,11,
12
45
Propagation delay output
high to high impedance
5/
tPHZ
9, 10, 11
01,03,
04
30
ns
05,06,
08
35
09,11,
12
45
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions 1/
-55C TC +125C
Group A
subgroups
Device
type
Limits
Unit
unless otherwise specified
Min
Max
Propagation delay output
low to high impedance
5/
tPLZ
VCC = 5.0 V, CL = 50 pF +10%,
R1 = 390Ω, +5%,
R2 = 750Ω +5%
(or equivalent load circuit)
Unless otherwise specified
9, 10, 11
01,03,
04
30
ns
05,06,
08
35
09,11,
12
45
Propagation delay high
impedance to output
high OE to all output
pins
tPZH
9, 10, 11
02,03,
04,06,
07,08,
10,11,
12
25
ns
Propagation delay high
impedance to output low
OE to all output pins
tPZL
9, 10, 11
02,03,
04,06,
07,08,
10,11,
12
25
ns
Propagation delay output
high to high impedance
OE to all output pins
5/
tPHZ
9, 10, 11
02,03,
04,06,
07,08,
10,11,
12
25
ns
Propagation delay output
low to high impedance
OE to all output pins
5/
tPLZ
9, 10, 11
02,03,
04,06,
07,08,
10,11,
12
25
ns
Clock to output
tPCH
9, 10, 11
02,03,
04
20
ns
tPCL
06,07,
08,09,
10,11,
12
25
Minimum clock pulse width
tp(CL)
9, 10, 11
02,03,
04
20
ns
06,07,
08
35
09,10,
11,12
25
Minimum setup time 2/
tsu
9, 10, 11
02,03,
04
30
ns
06,07,
08
40
09,10,
11,12
50
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 8
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions 1/
-55C TC +125C
Group A
subgroups
Device
type
Limits
Unit
unless otherwise specified
Min
Max
Minimum hold time 2/
tH
VCC = 5.0 V, CL = 50 pF +10%,
R1 = 390Ω, +5%,
R2 = 750Ω +5%
(or equivalent load circuit)
Unless otherwise specified
9, 10, 11
03,03,
04,06,
07,08,
09,10,
11,12
0
ns
Maximum clock frequency
2/
fMAX
9, 10, 11
02,03,
04
20
MHz
06,07,
08,09,
10,11,
12
15.3
1/ Unless otherwise specified VCC is 4.5 V to 5.5 V.
2/ Tested only initially and after any design change, or used as setup condition, therefore guaranteed if not tested.
3/ I/O terminal leakage is the worst case of IIX or IOZX.
4/ Only one output shorted at a time.
5/ CL = 5 pF.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 9
DSCC FORM 2234
APR 97
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 10
DSCC FORM 2234
APR 97
FIGURE 1. Terminal connections – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 11
DSCC FORM 2234
APR 97
FIGURE 1. Terminal connections – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 12
DSCC FORM 2234
APR 97
FIGURE 1. Terminal connections – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 13
DSCC FORM 2234
APR 97
FIGURE 1. Terminal connections – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 14
DSCC FORM 2234
APR 97
FIGURE 1. Terminal connections – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 15
DSCC FORM 2234
APR 97
FIGURE 1. Terminal connections – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 16
DSCC FORM 2234
APR 97
FIGURE 1. Terminal connections – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 17
DSCC FORM 2234
APR 97
FIGURE 1. Terminal connections – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 18
DSCC FORM 2234
APR 97
FIGURE 1. Terminal connections – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 19
DSCC FORM 2234
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Device types 01 and 09
INPUTS
OUTPUTS
I13
I12
I11
I10
I9
I8
I7
I6
I5
I4
I3
I2
I1
I0
O7
I/O6
I/O5
I/O4
I/O3
I/O2
I/O1
O0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Z
Z
Z
Z
Z
Z
Z
Z
Device types 02 and 10
INPUTS
OUTPUTS
OE
I11
I10
I9
I8
I7
I6
I5
I4
I3
I2
I1
I0
CLK
O7
O6
O5
O4
O3
O2
O1
O0
H
X
X
X
X
X
X
X
X
X
X
X
X
CLK
Z
Z
Z
Z
Z
Z
Z
Z
L
X
X
X
X
X
X
X
X
X
X
X
X
CLK
H
H
H
H
H
H
H
H
Device types 03 and 11
INPUTS
OUTPUTS
OE
I11
I10
I9
I8
I7
I6
I5
I4
I3
I2
I1
I0
CLK
I/O7
O6
O5
O4
O3
O2
O1
I/O0
H
X
X
X
X
X
X
X
X
X
X
X
X
CLK
Z
Z
Z
Z
Z
Z
Z
Z
L
X
X
X
X
X
X
X
X
X
X
X
X
CLK
Z
H
H
H
H
H
H
Z
Device types 04 and 12
INPUTS
OUTPUTS
OE
I11
I10
I9
I8
I7
I6
I5
I4
I3
I2
I1
I0
CLK
I/O7
I/O6
O5
O4
O3
O2
I/O1
I/O0
H
X
X
X
X
X
X
X
X
X
X
X
X
CLK
Z
Z
Z
Z
Z
Z
Z
Z
L
X
X
X
X
X
X
X
X
X
X
X
X
CLK
Z
Z
H
H
H
H
Z
Z
FIGURE 2. Truth tables (unprogrammed).
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 20
DSCC FORM 2234
APR 97
Device types 05
INPUTS
OUTPUTS
I11
I10
I9
I8
I7
I6
I5
I4
I3
I2
I1
I0
O9
I/O8
I/O7
I/O6
I/O5
I/O4
I/O3
I/O2
I/O1
O0
X
X
X
X
X
X
X
X
X
X
X
X
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Device types 06
INPUTS
OUTPUTS
OE
I9
I8
I7
I6
I5
I4
I3
I2
I1
I0
CLK
I/O9
O8
O7
O6
O5
O4
O3
O2
O1
I/O0
H
X
X
X
X
X
X
X
X
X
X
CLK
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
L
X
X
X
X
X
X
X
X
X
X
CLK
Z
H
H
H
H
H
H
H
H
Z
Device types 07
INPUTS
OUTPUTS
OE
I9
I8
I7
I6
I5
I4
I3
I2
I1
I0
CLK
O9
O8
O7
O6
O5
O4
O3
O2
O1
O0
H
X
X
X
X
X
X
X
X
X
X
CLK
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
L
X
X
X
X
X
X
X
X
X
X
CLK
H
H
H
H
H
H
H
H
H
H
Device types 08
INPUTS
OUTPUTS
OE
I9
I8
I7
I6
I5
I4
I3
I2
I1
I0
CLK
I/O9
I/O8
I/O7
O6
O5
O4
O3
I/O2
I/O1
I/O0
H
X
X
X
X
X
X
X
X
X
X
CLK
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
L
X
X
X
X
X
X
X
X
X
X
CLK
Z
Z
Z
H
H
H
H
Z
Z
Z
FIGURE 2. Truth tables (unprogrammed) – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 21
DSCC FORM 2234
APR 97
FIGURE 3. (Unprogrammed) Logic diagrams.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 22
DSCC FORM 2234
APR 97
FIGURE 3. (Unprogrammed) Logic diagrams – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 23
DSCC FORM 2234
APR 97
FIGURE 3. (Unprogrammed) Logic diagrams – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 24
DSCC FORM 2234
APR 97
FIGURE 3. (Unprogrammed) Logic diagrams – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 25
DSCC FORM 2234
APR 97
FIGURE 3. (Unprogrammed) Logic diagrams – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 26
DSCC FORM 2234
APR 97
FIGURE 3. (Unprogrammed) Logic diagrams – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 27
DSCC FORM 2234
APR 97
FIGURE 3. (Unprogrammed) Logic diagrams – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 28
DSCC FORM 2234
APR 97
FIGURE 3. (Unprogrammed) Logic diagrams – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 29
DSCC FORM 2234
APR 97
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
(2) TA = +125C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
TABLE II. Electrical test requirements.
MIL-STD-883 test requirements
Subgroups
(per method
5005, table I)
Interim electrical parameters
(method 5004)
1
Final electrical test parameters
(method 5004) for programmed
devices
1*,2,3,7*,8A, 8B,9
Final electrical test parameters
(method 5004) for unprogrammed
devices
1*,2,3,7*,8A, 8B
Group A test requirements
(method 5005)
1,2,3,7,8A,8B,9
10, 11 4/
Groups C and D end-point
electrical parameters
(method 5005)
1,2,3
1/ * PDA applies to subgroups 1 and 7.
2/ Any or all subgroups may be combined when using high-speed testers.
3/ Subgroups 7, 8A, and 8B functional tests shall also verify that no fuses are
blown for unprogrammed devices or that the altered item drawing pattern
exists for programmed devices.
4/ Subgroups 10 and 11, if not tested, shall be guaranteed to specified limits in table I.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
84129
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET 30
DSCC FORM 2234
APR 97
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c. For unprogrammed devices, a sample shall be selected to satisfy programmability requirements prior to performing
subgroup 9. Twelve devices shall be submitted to programming (see 3.2.2.1). If more than two devices fail to
program, the lot shall be rejected. At the manufacturer's option, the sample may be increased to 24 total devices with
no more than 4 total device failures allowed.
d. For unprogrammed devices, 10 devices from the programmability sample shall be submitted to the requirements of
group A, subgroup 9. If more than two devices fail, the lot shall be rejected. At the manufacturer's option, the sample
may be increased to 20 total devices with no more than 4 total device failures allowable.
4.3.2 Groups C and D inspections.
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test conditions, method 1005 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1005 of MIL-STD-883.
(2) TA = +125C, minimum.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires
configuration control and the applicable SMD to that system. DLA Land and Maritime will maintain a record of users and this
list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics
devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108.
6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-0540.
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103 and QML-38535. The vendors
listed in MIL-HDBK-103 and QML-38535 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DLA Land and Maritime-VA.
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 17-09-27
Approved sources of supply for SMD 84129 are listed below for immediate acquisition information only and shall be
added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to
include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is
superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an
online database of all current sources of supply at https://landandmaritimeapps.dla.mil/Programs/Smcr.
Standard
Microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar part 2/
number
Reference
military specification
part number
84129013A
3/
PAL20L8AML/883B
M38510/50501B3A
8412901JA
3/
PAL20L8AMJTB
8412901KA
3/
PAL20L8AMW/883B
3/
TIBPAL20L8-20MWB
8412901LA
01295
TIBPAL20L8-20MJTB
M38510/50501BLA
3/
PAL20L8AMJS/883B
8412901XA
01295
TIBPAL20L8-20
84129023A
3/
PAL20R8AML/883B
M38510/50502B3A
8412902JA
3/
PAL20R8AMJTB
8412902KA
3/
PAL20R8AMW/883B
3/
TIBPAL20R8-20MWB
8412902LA
01295
TIBPAL20R8-20MJTB
M38510/50502BLA
3/
PAL20R8AMJS/883B
8412902XA
3/
TIBPAL20R8-20
84129033A
3/
PAL20R6AML/883B
M38510/50503B3A
8412903JA
3/
PAL20R6AMTJB
8412903KA
3/
PAL20R6AMW/883B
3/
TIBPAL20R6-20MWB
8412903LA
01295
TIBPAL20R6-20MJTB
M38510/50503BLA
3/
PAL20R6AMJS/883B
8412903XA
3/
TIBPAL20R6-20
84129043A
3/
PAL20R4AML/883B
M38510/50504B3A
8412904JA
3/
PAL20R4AMJTB
8412904KA
3/
PAL20R4AMW/883B
3/
TIBPAL20R4-20MWB
8412904LA
01295
TIBPAL20R4-20MJTB
M38510/50504BLA
3/
PAL20R4AMJS/883B
8412904XA
3/
TIBPAL20R4-20
84129053A
3/
PAL20L10AML/883B
8412905KA
3/
PAL20L10AMW/883B
3/
TIBPAL20L10-25MWB
8412905LA
3/
TIBPAL20L10-25MJTB
3/
PAL20L10AMJS/883B
8412905XA
3/
TIBPAL20L10-25MFKB
84129063A
3/
PAL20X8AML/883B
8412906KA
3/
PAL20X8AMW/883B
3/
TIBPAL20X8-25MWB
8412906LA
3/
TIBPAL20X8-25MJTB
3/
PAL20X8AMJS/883B
8412906XA
3/
TIBPAL20X8-25MFKB
84129073A
3/
PAL20X10AML/883B
8412907KA
3/
PAL20X10AMW/883B
3/
TIBPAL20X10-25MWB
8412907LA
3/
TIBPAL20X10-25MJTB
3/
PAL20X10AMJS/883B
8412907XA
3/
TIBPAL20X10-25MFKB
See footnotes at end of table.
1 of 2
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
DATE: 17-09-27
Standard
Microcircuit drawing
PIN 1/
Vendor CAGE
number
Vendor
similar part 2/
number
Reference
military specification
part number
84129083A
3/
PAL20X4AML/883B
8412908KA
3/
PAL20X4AMW/883B
3/
TIBPAL20X4-25MWB
8412908LA
3/
TIBPAL20X4-25MJTB
3/
PAL20X4AMJS/883B
8412908XA
3/
TIBPAL20X4-25MFKB
84129093A
3/
PAL20L8A-2ML/883B
8412909KA
3/
PAL20L8A-2MW/883B
8412909LA
3/
PAL20L8A-2MJS/883B
84129103A
3/
PAL20R8A-2ML/883B
8412910KA
3/
PAL20R8A-2MW/883B
8412910LA
3/
PAL20R8A-2MJS/883B
84129113A
3/
PAL20L6A-2ML/883B
8412911KA
3/
PAL20R6A-2MW/883B
8412911LA
3/
PAL20R6A-2MJS/883B
84129123A
3/
PAL20R4A-2ML/883B
8412912KA
3/
PAL20R4A-2MW/883B
8412912LA
3/
PAL20R4A-2MJS/883B
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Vendor CAGE Vendor name Fusible
number and address link
01295 Texas Instruments, Inc.
Semiconductor Group Titanium-Tungsten
8505 Forest Ln.
P O Box 660199
Dallas, TX 75243
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
2 of 2
