General Description
The MAX2247 low-voltage, three-stage linear power
amplifier (PA) is optimized for 802.11b/g wireless LAN
(WLAN) applications in the 2.4GHz ISM band. The
device is integrated with an adjustable bias control,
power detector, and shutdown mode. The MAX2247
features 29dB of power gain and delivers up to
+24dBm of linear output power at 24% efficiency from a
single +3.3V supply. It achieves less than -32dBc first-
side lobe suppression and less than -55dBc second-
side lobe suppression under 802.11b modulation. In
addition, the device can be matched for optimum effi-
ciency and performance at output power levels from
+10dBm to +24dBm. Its high +28dBm saturated output
power also allows the device to meet the requirements
of 802.11g OFDM modulation.
The MAX2247 features an external bias-control pin that
allows the supply current of the device to be dynamical-
ly throttled back at lower output power levels, thus
improving efficiency while maintaining sufficient side-
lobe suppression. Proprietary internal bias circuitry
maintains stable device performance over temperature
and voltage-supply variations. An additional power-sav-
ing feature is a logic-level shutdown pin that reduces
supply current to 0.5µA and eliminates the need for an
external supply switch. The integrated shutdown func-
tion also allows guaranteed device ramp-on and ramp-
off times.
The MAX2247 integrates a power detector with 20dB
dynamic range and ±0.8dB accuracy at the highest
output power level. The detector provides a buffered
DC voltage proportional to the output power of the
device, saving cost and space by eliminating a coupler
and op amp usually required to implement a power
detector function. The device is packaged in the tiny
3 ✕4 chip-scale package (UCSP™), measuring only
1.5mm ✕2mm, making it the ideal solution for radios built
in small form factors.
Applications
IEEE 802.11b DSSS WLAN
IEEE 802.11g OFDM WLAN
HomeRF™
2.4GHz Cordless Phones
2.4GHz ISM Radios
Features
♦2.4GHz to 2.5GHz Operating Range
♦Up to +24dBm Linear Output Power (ACPR of
Less than -32dBc First-Side Lobe and Less than
-55dBc Second-Side Lobe)
♦24% PAE at +24dBm Linear Output Power, 3.3V
24% PAE at +21dBm Linear Output Power, 3.0V
♦29dB Power Gain
♦On-Chip Power Detector with Buffered Output
♦Internal 50ΩInput Matching
♦External Bias Control for Current Throttleback
♦Integrated Bias Circuitry
♦+2.7V to +4.2V Single-Supply Operation
♦0.5µA Shutdown Mode
♦Tiny Chip-Scale Package (1.5mm ✕2mm)
MAX2247
2.4GHz SiGe Linear Power Amplifier
________________________________________________________________ Maxim Integrated Products 1
Ordering Information
19-2520; Rev 4; 8/03
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Typical Operating Circuit appears at end of data sheet.
PART
TEMP RANGE
PIN-
PACKAGE
TOP
MARK
MAX2247EBC-T
-40°C to +85°C
3 x 4 UCSP*
AAW
TOP VIEW
BIAS
A1
GND3
B1
RF_
OUT
C1
VCC2
A2
C2
GND2
A3
PD_
OUT
B3
VCCB
C3
VCC1
A4
GND1
B4
RF_IN
C4
MAX2247
SHDN
Pin Configuration
*Requires special solder temperature profile in the Absolute
Maximum Ratings Sections.
UCSP is a trademark of Maxim Integrated Products, Inc.
HomeRF is a trademark of HomeRF Working Group.
MAX2247
2.4GHz SiGe Linear Power Amplifier
2_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(MAX2247 EV kit, VCC_ = +2.7V to +4.2V, SHDN = VCC, RF_IN and RF_OUT terminated to 50Ω, TA= -40°C to +85°C. Typical values
are at +3V and TA= +25°C, unless otherwise noted.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC1, VCC2, VCCB, RF_OUT to GND....................-0.3V to +4.5V
SHDN, BIAS, PD_OUT ................................-0.3V to VCC_ + 0.3V
RF Input Power (50Ωsource)...........................................+5dBm
RF_IN Input Current............................................................±1mA
Maximum VSWR Without Damage ........................................10:1
Maximum VSWR for Stable Operation, POUT < +25dBm........5:1
Continuous Power Dissipation (TA= +70°C)
3 ✕4 UCSP (derate 28.5mW/°C above +70°C) ..............1.3W
Thermal Resistance .........................................................35°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +125°C
Bump Temperature (soldering) (Note 1)
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
Continuous Operating Lifetime.....................10yrs ×0.92(TA- 60°C)
(For Operating Temperature, TA≥+60°C)
PARAMETER CONDITIONS
MIN
MAX
UNITS
Supply Voltage 2.7 4.2 V
POUT = +24dBm, VCC_ = 3.3V 317
350
POUT = +25dBm, VCC_ = 4.2V 345
Idle current = 250mA
with VCC = 3.3V
POUT = +23dBm, VCC_ = 3.0V 305
POUT = +21dBm with optimized output-matching circuit.
Refer to the MAX2247 EV kit for details.
175
POUT = +18dBm with optimized output-matching circuit.
Refer to the MAX2247 EV kit for details.
120
Supply Current (Notes 3, 4)
POUT = +15dBm with optimized output-matching circuit.
Refer to the MAX2247 EV kit for details. 85
mA
Shutdown Supply Current SHDN = 0, no RF signal applied 0.5 10 µA
Digital Input Logic High 2V
Digital Input Logic Low 0.8 V
Digital Input Current High -1 +5 µA
Digital Input Current Low -1 +1 µA
CAUTION! ESD SENSITIVE DEVICE
MAX2247
2.4GHz SiGe Linear Power Amplifier
_______________________________________________________________________________________ 3
Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits the use of only the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not recommended.
Note 2: Characteristics are production tested at TA= +25°C. DC specifications over temperature are guaranteed by design
and characterization.
Note 3: Idle current is controlled by external DAC for best efficiency over the entire output power range.
Note 4: Parameter is measured with RF modulation based on IEEE 802.11b standard.
Note 5: Minimum and maximum specifications are guaranteed by design and characterization.
Note 6: Operation outside this range is possible but not guaranteed.
Note 7: The total turn-on time required for PA output power to settle to within 0.5dB of the final value.
Note 8: Specification is corrected for PC board loss of approximately 0.3dB, on the output of the MAX2247 EV kit.
Note 9: Total turn-off time required for PA supply current to fall below 10µA.
Note 10: See the Typical Operating Characteristics for statistical variation.
AC ELECTRICAL CHARACTERISTICS
(MAX2247 EV kit, VCC_ = +3V, fRF = 2.45GHz, SHDN = VCC, 50ΩRF system impedance, TA= +25°C, unless otherwise noted.) (Note 5)
PARAMETER CONDITIONS
TYP
MAX
UNITS
RF Frequency Range
(Notes 4, 6)
2.4 to 2.5
GHz
TA = +25°C 26
29.5
VCC_ = 3V, POUT = +23dBm TA = -40°C to +85°C 25
VCC_ = 3.3V, POUT = +24dBm
29.5
Power Gain (Notes 2, 4, 8)
VCC_ = 4.2V, POUT = +25dBm
30.5
dB
Gain Variation Over Supply
Voltage (Note 4) VCC = 3.0V to 3.6V
±0.5
dB
VCC_ = 3V 22 23
VCC_ = 3.3V 24
Output Power Over Temperature
(Notes 4, 8)
ACPR: First-side lobe < -32dBc,
second-side lobe < -55dBc VCC_ = 4.2V 25
dBm
Saturated Output Power PIN = +5dBm
27.8
dBm
Harmonic Output (2f, 3f, 4f) -45 dBc
Input VSWR Over full PIN range
1.8:1 2.5:1
Output VSWR Over full POUT range 2:1
2.5:1
Power Ramp Turn-On Time
(Note 7) 0.8 1.5 µs
Power Ramp Turn-Off Time
(Note 9) 0.8 1.5 µs
RF Output Detector
Response Time 0.9 µs
POUT = +23dBm 1
POUT = +15dBm 0.6
RF Output Detector Voltage
(Note 10) POUT = +7dBm
0.47
V
MAX2247
2.4GHz SiGe Linear Power Amplifier
4_______________________________________________________________________________________
Typical Operating Characteristics
(VCC_ = 3V, fRF = 2.45GHz, with MAX2247 EV kit optimized for POUT = +23dBm. TA= +25°C, unless otherwise noted.)
OUTPUT POWER, SUPPLY CURRENT
vs. SUPPLY VOLTAGE
MAX2247 toc01
SUPPLY VOLTAGE (V)
POUT (dBm)
SUPPLY CURRENT (mA)
3.0 3.3 3.6 3.9
22
20
18
16
28
26
24
30 550
250
300
350
400
450
500
2.7 4.2
INPUT POWER ADJUSTED TO
KEEP ADJ/ALT CPR = -30dBc/-50dBc
TA = -40°C
TA = +25°CTA = +85°C
POUT
ICC
OUTPUT POWER, SUPPLY CURRENT
vs. SUPPLY VOLTAGE
MAX2247 toc02
SUPPLY VOLTAGE (V)
POUT (dBm)
SUPPLY CURRENT (mA)
3.0 3.3 3.6 3.9
22
20
18
16
28
26
24
14
550
250
300
350
400
450
500
2.7 4.2
TA = -40°C
TA = +25°CTA = +85°C
POUT
INPUT POWER ADJUSTED TO
KEEP ADJ/ALT CPR = -32dBc/-55dBc
ICC
GAIN vs. SUPPLY VOLTAGE
MAX2247 toc03
SUPPLY VOLTAGE (V)
GAIN (dB)
3.93.63.33.0
26
27
28
29
30
31
32
33
34
35
25
2.7 4.2
POUT = +23dBm
TA = -40°C
TA = +25°C
TA = +85°C
SUPPLY CURRENT
vs. SUPPLY VOLTAGE
MAX2247 toc04
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (mA)
3.93.63.33.0
260
270
280
290
300
310
320
330
340
350
250
2.7 4.2
POUT = +23dBm
TA = -40°C
TA = +25°C
TA = +85°C
ADJ CPR
vs. SUPPLY VOLTAGE
MAX2247 toc05
SUPPLY VOLTAGE (V)
ADJ CPR (dBc)
3.93.63.33.0
-38
-36
-34
-32
-30
-28
-26
-24
-40
2.7 4.2
POUT = +23dBm
TA = -40°C
TA = +25°CTA = +85°C
ALT CPR
vs. SUPPLY VOLTAGE
MAX2247 toc06
SUPPLY VOLTAGE (V)
ALT CPR (dBc)
3.93.63.33.0
-64
-62
-60
-58
-56
-54
-52
-50
-48
-46
-66
2.7 4.2
POUT = +23dBm
TA = -40°C
TA = +25°C
TA = +85°C
OUTPUT POWER vs. INPUT POWER
MAX2247 toc07
PIN (dBm)
POUT (dBm)
0-5-15 -10
5
10
15
20
25
30
35
40
0
-20 5
VCC = +4.2V
VCC = +3.3V
VCC = +3.0V
SUPPLY CURRENT vs. OUTPUT POWER
MAX2247 toc08
POUT (dBm)
SUPPLY CURRENT (mA)
222018161412
50
100
150
200
250
300
0
10
BIAS CURRENT ADJUSTED
TO KEEP ADJ/ALT CPR =
-32dBc/-55dBc
ADJ/ALT CPR vs. OUTPUT POWER
MAX2247 toc09
POUT (dBm)
ADJ/ALT CPR (dBc)
222014 16 1812
-65
-60
-55
-50
-45
-40
-35
-30
-25
-20
-70
10 24
ADJ CPR
ALT CPR
MAX2247
2.4GHz SiGe Linear Power Amplifier
_______________________________________________________________________________________ 5
ADJ CPR vs. FREQUENCY
MAX2247 toc10
FREQUENCY (MHz)
ADJ CPR (dBc)
2480246024402420
-36
-35
-34
-33
-32
-31
-30
-29
-28
-27
-37
2400 2500
POUT = +23dBm
TA = +25°C
TA = +85°C
TA = -40°C
ALT CPR vs. FREQUENCY
MAX2247 toc11
FREQUENCY (MHz)
ALT CPR (dBc)
2480246024402420
-58
-56
-54
-52
-50
-60
2400 2500
POUT = +23dBm
TA = +25°CTA = +85°C
TA = -40°C
SUPPLY CURRENT vs. FREQUENCY
MAX2247 toc12
FREQUENCY (MHz)
SUPPLY CURRENT (mA)
2480246024402420
270
280
290
300
310
320
260
2400 2500
POUT = +23dBm
TA = +85°C
TA = +25°C
TA = -40°C
GAIN vs. FREQUENCY
MAX2247 toc13
FREQUENCY (MHz)
GAIN (dB)
2480246024402420
24
28
32
36
40
20
2400 2500
POUT = +23dBm
TA = +85°C
TA = +25°C
TA = -40°C
INPUT/OUTPUT RETURN LOSS
vs. FREQUENCY
MAX2247 toc14
FREQUENCY (MHz)
RETURN LOSS (dB)
2480246024402420
-35
-25
-30
-20
-15
-10
-40
2400 2500
OUTPUT RETURN
LOSS
INPUT RETURN
LOSS
POWER DETECTOR VOLTAGE
vs. OUTPUT POWER
MAX2247 toc15
POUT (dBm)
POWER DETECTOR VOLTAGE (V)
2015105
0.2
0.4
0.6
0.8
1.4
1.2
1.0
1.6
0
025
VCC = +2.7V,
TA = +85°C
VCC = +4.2V,
TA = -40°C
OUTPUT POWER HISTOGRAM AT FIXED
1V POWER DETECTOR VOLTAGE
MAX2247 toc16
OUTPUT POWER (dBm)
OCCURRENCES
23.37522.625 22.875 23.125
2
4
6
8
10
12
14
16
0
SIGMA =
0.25dBm
BASED ON
50 PARTS
OUTPUT POWER HISTOGRAM AT FIXED
0.6V POWER DETECTOR VOLTAGE
MAX2247 toc17
OUTPUT POWER (dBm)
OCCURRENCES
15.59315.35615.11914.88214.64514.408
5
10
15
20
0
SIGMA = 0.237dBm
BASED ON 50 PARTS
OUTPUT POWER HISTOGRAM AT FIXED
0.47V POWER DETECTOR VOLTAGE
MAX2247 toc18
OUTPUT POWER (dBm)
OCCURRENCES
7.957.577.196.816.436.05
5
10
15
20
0
SIGMA = 0.38dBm
BASED ON 50 PARTS
25
Typical Operating Characteristics (continued)
(VCC_ = 3V, fRF = 2.45GHz, with MAX2247 EV kit optimized for POUT = +23dBm. TA= +25°C, unless otherwise noted.)
MAX2247
2.4GHz SiGe Linear Power Amplifier
6_______________________________________________________________________________________
Pin Description
BUMP
NAME
DESCRIPTION
A1 BIAS Bias Control. The overall current is set by the current sourced through the bias pin. See the Bias Circuitry
section.
A2 VCC2S econd - S tag e D C S up p l y V ol tag e. S ets the b i as and exter nal m atchi ng for the second am p l i fi er stag e.
Req ui r es a sm al l i nd uctance. Byp ass to g r ound usi ng the confi g ur ati on i n the Typ i cal Op er ati ng C i r cui t.
A3 GND2 Second-Stage Ground. See the Applications Information section for detailed layout information.
A4 VCC1Fi r st- S tag e D C S up p l y V ol tag e. S ets the b i as and exter nal m atchi ng for the fi r st am p l i fi er stag e. Req ui r es a
sm al l i nd uctance. Byp ass to g r ound usi ng the confi g ur ati on i n the Typ i cal Op er ati ng C i r cui t.
B1 GND3 Third-Stage Ground. See the Applications Information section for detailed layout information.
B3
PD_OUT
Power-Detector Output. This output is a DC voltage indicating the PA output power.
B4 GND1 First-Stage and Bias-Control Circuit Ground
C1
RF_OUT
RF Output. Open-collector output. Requires a pullup inductor, which is part of the matching network.
C2 SHDN Shutdown Input. Drive logic low to place the device in shutdown mode. Drive logic high for normal
operation.
C3 VCCB
Bias Circuit DC Supply Voltage. Bypass to ground using the configuration in the Typical Operating Circuit.
C4 RF_IN RF Input. Internally matched to 50Ω. Requires an external DC-blocking cap.
Functional Diagram/Typical Operating Circuit
MAX2247
BIAS
CIRCUIT DETECTOR
RF_IN
RF_OUT
VCCB
PD_OUT
GND1 GND3
BIAS
DAC
VCC
10nF
10nF
3.9nH
10nF
GND2
VCC1
VCC2
22pF
22pF
C3 C33*
22pF
C5
10nF POWER-DETECTOR
OUTPUT
RF
OUTPUT
SHUTDOWN
CONTROL
VCC
VCC
VCC
C4
RF
INPUT
INPUT
MATCH
SHDN
TRANSMISSION
LINE
*NOT REQUIRED FOR OUTPUT POWER
LESS THAN +23dBm.
REFER TO THE MAX2247 EV KIT FOR LAYOUT AND DESIGN DETAILS.
Detailed Description
The MAX2247 linear power amplifier (PA) offers a wide
variety of features incorporated into a tiny UCSP pack-
age. The device includes internal bias circuitry, an inte-
grated power detector with buffered output, low-power
shutdown mode, and internal input matching. The
MAX2247 output power can be optimized for +15dBm to
+24dBm by adjusting the output, first-stage, and second-
stage matching network (see the Typical Operating
Circuit) while exceeding 802.11b ACPR requirements. In
addition, external bias control allows dynamic throttle-
back of the supply current to increase efficiency.
The MAX2247’s performance can be optimized for lower
output power levels. Go to the Maxim website,
www.maxim-ic.com, for MAX2247 application notes cov-
ering performance at +21dBm, +18dbm, and +15dBm.
Bias Circuitry
To improve efficiency at lower output levels, a bias pin
is offered to allow dynamic current control. An external
current DAC or resistor network can be used to throttle-
back current at lower output powers while still maintain-
ing ACPR requirements. By including an internal volt-
age regulator along with the bias circuitry, no external
bias voltage is necessary. The internal voltage regula-
tor maintains stable performance of the bias circuitry
over temperature and supply variations.
The overall current of the MAX2247 is set by the current
sourced through the bias pin. The overall current is 540
times the bias current. An internal bandgap reference pro-
vides +1.2V to each bias stage (see Figure 1). An external
resistor to ground can be placed at the bias pin to set the
bias current (refer to the MAX2247 evaluation kit).
An external current DAC can be connected directly to the
bias pin to adjust the bias current of the MAX2247. Figure
2 shows the MAX2247 connected to the MAX2820 zero-IF
transceiver, which includes a 4-bit DAC.
Shutdown Mode
The MAX2247 features a low-power shutdown mode to
further reduce current consumption. The MAX2247
responds to logic-level signals at the SHDN pin. A
logic-level high enables all circuitry, while a logic-level
low places the device in low-power shutdown mode
and reduces supply current to 0.5µA (typ). Power-ramp
turn-on and turn-off times are guaranteed to be less
than 1.5µs.
Power Detector
This device includes a power detector that samples the
peak voltage of the output and generates a voltage
proportional to the output power. The detector is fully
temperature compensated and allows the user to set
the detector bandwidth with an external capacitor.
MAX2247
2.4GHz SiGe Linear Power Amplifier
_______________________________________________________________________________________ 7
INTERNAL
VOLTAGE
REFERENCE
1.2V 1.2V 1.2V
BIAS
MAX2247
1ST-STAGE
AMPLIFIER
BIAS CURRENT
2ND-STAGE
AMPLIFIER
BIAS CURRENT
3RD-STAGE
AMPLIFIER
BIAS CURRENT
RF
INPUT
RF
OUTPUT
RF_OUT
CONNECTED TO EXTERNAL RESISTOR/DAC FOR SETTING THE BIAS CURRENT
Figure 1. Internal Bias Circuitry
MAX2247
Applications Information
The MAX2247 is a three-stage amplifier that requires
special attention to board layout and grounding for
optimum output power, gain, efficiency, and side-lobe
suppression. For ease of implementation, the MAX2247
evaluation (EV) kit layout should be used as a model.
Gerber files are available from Maxim upon request.
Follow the recommendations below to optimize perfor-
mance when adapting the layout to your board.
Interstage Matching and Bypassing
VCC1 and VCC2 provide DC bias to the open-collector
outputs of the first- and second-stage amplifiers and
are also part of the interstage matching networks
required to optimize performance among the three
amplifier stages. The MAX2247 must have a small
amount of inductance on the VCC lines in addition to
the inductance already provided on-chip. See the
Typical Application Circuit for the lumped and discrete
component values used on the MAX2247 EV kit for opti-
mum interstage matching and RF bypassing.
In addition to RF bypass capacitors on each bias line, a
global bypass capacitor of 4.7µF is necessary to filter
any noise on the supply line. Route separate VCC bias
paths from the global bypass capacitor (using a star
topology) to avoid coupling between PA stages. Use
the MAX2247 EV kit PC board layout as a guide.
Input Matching
The MAX2247 includes internal input matching to 50Ω, so
no external matching network is required. A DC-blocking
capacitor is required at the input to the device.
Output Matching
The RF_OUT port is an open-collector output that must be
pulled to VCC through an RF choke for proper biasing (see
the Typical Operating Circuit). A shunt 22pF capacitor to
ground is required at the supply side of the inductor. In
addition, a matching network is required for optimum gain,
efficiency, ACPR, and output power. The EV kit should
serve as a good starting point for your layout. However,
optimum performance is layout dependent, and some
component optimization may be required. It is important to
leave room on your board for tuning/optimization.
2.4GHz SiGe Linear Power Amplifier
8_______________________________________________________________________________________
MAX2247
MAX2820
RF OUTPUT
CURRENT
DAC
BIAS
CIRCUIT
POWER
DETECTOR
PA DRIVER
BALUN
ZERO-IF TRANSCEIVER
STANDARD BASEBAND/MAC IC
SHUTDOWN CONTROL
TX POWER DETECTOR
TX BASEBAND I/Q
RX BASEBAND I/Q
Figure 2. The MAX2247 Connected to the Current DAC of the MAX2820 for Bias Control
Ground Vias
To achieve optimum gain, output power, thermal perfor-
mance, and ACPR performance, ground vias should be
properly placed throughout the layout. Each ground pin
requires its own through-hole via (diameter = 10mils)
placed as near as possible to the device pin. This
reduces ground inductance, thermal resistance, and
feedback between stages. Use the MAX2247 EV kit PC
board layout as a guide.
UCSP Reliability
The tiny chip-scale package (UCSP) represents a
unique package that greatly reduces board space
compared to other packages. UCSP reliability is inte-
grally linked to the user’s assembly methods, circuit
board material, and usage environment. Operating life
test and moisture resistance remains uncompromised,
as it is primarily determined by the wafer-fabrication
process. Mechanical stress performance is a greater
consideration for a UCSP. UCSP solder-joint contact
integrity must be considered because the package is
attached through direct solder contact to the user’s PC
board. Testing done to characterize the UCSP reliability
performance shows that it is capable of performing reli-
ably through environmental stresses. Users should also
be aware that as with any interconnect system there
are electromigration-based current limits that, in this
case, apply to the maximum allowable current in the
bumps. Reliability is a function of this current, the duty
cycle, lifetime, and bump temperature. See the
Absolute Maximum Ratings section for any specific lim-
itations listed under Continuous Operating Lifetime.
Results of environmental stress tests and additional
usage data and recommendations are detailed in the
UCSP application note, which can be found on Maxim’s
website at www.maxim-ic.com/1st_pages/UCSP.htm.
Chip Information
TRANSISTOR COUNT: 1425
MAX2247
2.4GHz SiGe Linear Power Amplifier
_______________________________________________________________________________________ 9
MAX2247
2.4GHz SiGe Linear Power Amplifier
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
10 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
©2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
12L, UCSP 4x3.EPS
F
1
1
21-0104
PACKAGE OUTLINE, 4x3 UCSP