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LMX2430

LMX2433

LMX2434

SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

LMX243x PLLatinum™ Dual High-Frequency Synthesizer for RF Personal

Communications

1 Features 2 Applications

1• Low Current Consumption • Mobile Handsets

• Cordless Handsets

– LMX2430 (RF/IF): 2.8 mA/ 1.4 mA • Wireless Data

– LMX2433 (RF/IF): 3.2 mA/ 2 mA • Cable TV Tuners

– LMX2434 (RF/IF): 4.6 mA/ 2.4 mA

• 2.25-V to 2.75-V Operation 3 Description

• Synchronous/Asynchronous Power Down Using a proprietary digital-phase, locked-loop

• Multiple PLL Options: technique, the LMX243x devices generate very

– LMX2430 (RF/IF): 3 GHz /0.8 GHz stable, low-noise control signals for RF and IF voltage

controlled oscillators. Both the RF and IF

– LMX2433 (RF/IF): 3.6 GHz /1.7 GHz synthesizers include a two-level programmable

– LMX2434 (RF/IF): 5 GHz /2.5 GHz charge pump. Both the RF and IF PLLs have

• Programmable Charge-Pump Current Levels dedicated fastlock circuitry with integrated time-out

counters which require only a single word write to

– RF and IF: 1 or 4 mA power up or change frequencies.

• Fastlock With Integrated Time-Out Counters

• Digital Filtered Lock-Detect Output Device Information(1)

• Analog Lock Detect (Push-Pull / Open-Drain) PART NUMBER PACKAGE BODY SIZE (NOM)

• 1.8-V MICROWIRE Logic Interface ULGA (20) 3.50 mm × 3.50 mm

LMX243x TSSOP (20) 6.50 mm × 4.40 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Functional Block Diagram

NOTE: 1 (2) refers to Pin 1 of the 20-Pin ULGA and Pin 2 of the 20-Pin TSSOP

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LMX2430

LMX2433

LMX2434

SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

www.ti.com

Table of Contents

9.4 Device Functional Modes........................................ 28

1 Features.................................................................. 19.5 Programming........................................................... 29

2 Applications ........................................................... 19.6 Register Maps......................................................... 30

3 Description............................................................. 110 Application and Implementation........................ 41

4 Revision History..................................................... 210.1 Application Information.......................................... 41

5 Description continued........................................... 310.2 Typical Application ............................................... 42

6 Pin Configuration and Functions......................... 311 Power Supply Recommendations ..................... 44

7 Specifications......................................................... 412 Layout................................................................... 44

7.1 Absolute Maximum Ratings ...................................... 412.1 Layout Guidelines ................................................. 44

7.2 Recommended Operating Conditions....................... 412.2 Layout Example .................................................... 44

7.3 Thermal Information.................................................. 513 Device and Documentation Support................. 45

7.4 Electrical Characteristics .......................................... 513.1 Device Support...................................................... 45

7.5 Timing Requirements................................................ 713.2 Related Links ........................................................ 45

7.6 Typical Characteristics.............................................. 813.3 Community Resources.......................................... 45

8 Parameter Measurement Information ................ 12 13.4 Trademarks........................................................... 45

8.1 Bench Test Setups.................................................. 12 13.5 Electrostatic Discharge Caution............................ 45

9 Detailed Description............................................ 23 13.6 Glossary................................................................ 45

9.1 Overview................................................................. 23 14 Mechanical, Packaging, and Orderable

9.2 Functional Block Diagram....................................... 23 Information ........................................................... 46

9.3 Feature Description................................................. 24

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (March 2013) to Revision D Page

• Shortened data sheet title LMX243x PLLatinum™ Dual High-Frequency Synthesizer for RF Personal

Communications LMX2430 3 GHz/0.8 GHz, LMX2433 3.6 GHz/1.7 GHz, LMX2434 5 GHz/2.5 GHz to LMX243x

PLLatinum™ Dual High-Frequency Synthesizer for RF Personal Communications because the extra information is

also listed in Features............................................................................................................................................................. 1

• Added Device Information table, Pin Configuration and Functions section, Thermal Information table, Feature

Description section, Device Functional Modes,Application and Implementation section, Power Supply

Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,

Packaging, and Orderable Information section ..................................................................................................................... 1

Changes from Revision B (March 2013) to Revision C Page

• Changed layout of National Data Sheet to TI format ........................................................................................................... 40

Product Folder Links: LMX2430 LMX2433 LMX2434

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LMX2433

LMX2434

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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

5 Description continued

The LMX243x devices are high-performance frequency synthesizers with integrated dual-modulus prescalers. A

32/33 or a 16/17 prescale ratio can be selected for the 5-GHz LMX2434 RF synthesizer. An 8/9 or a 16/17

prescale ratio can be selected for both the LMX2430 and LMX2433 RF synthesizers. The IF circuitry contains an

8/9 or a 16/17 prescaler.

Serial data is transferred to the devices through a three-wire interface (DATA, LE, CLK). A low voltage logic

interface allows direct connection to 1.8-V devices. Supply voltages from 2.25 V to 2.75 V are supported.

6 Pin Configuration and Functions

NPE Package PW Package

20-Pin ULGA Ultra Thin Chip Scale 20-Pin TSSOP Thin Shrink Small Outline

Top View Top View

Pin Functions

PIN I/O DESCRIPTION

NAME ULGA TSSOP

MICROWIRE Clock input. High-impedance CMOS input. DATA is clocked into the

CLK 18 19 I 24-bit shift register on the rising edge of CLK.

IF PLL charge-pump output. The output is connected to the external loop filter,

CPoutIF 4 5 O which drives the input of the IF VCO.

RF PLL charge-pump output. The output is connected to the external loop filter,

CPoutRF 12 13 O which drives the input of the RF VCO.

MICROWIRE Data input. High-impedance CMOS input. Binary serial data. The MSB

DATA 19 20 I of DATA is shifted in first. The two last bits are the control bits.

Chip Enable input. High-Impedance CMOS input. When this pin is set HIGH, the RF

and IF PLLs are powered up. Power down is then controlled through the

EN 3 4 I MICROWIRE. When this pin is set LOW, the device is asynchronously powered

down, and the charge-pump output is forced to a high-impedance state (tri-state).

Oscillator Enable input. High-impedance CMOS input. When this pin is set HIGH,

the oscillator buffer is always powered up, independent of the state of the EN pin.

ENosc 5 6 I When this pin is set LOW, the OSCout/ FLoutIF pin functions as an IF fastlock

output, which connects a resistor in parallel to R2 of the external loop filter.

FinIF 2 3 I IF PLL prescaler input. Small signal input from the VCO.

RF PLL fastlock output. This pin connects a resistor in parallel to R2 of the external

FLoutRF 10 11 O loop filter. This pin can also function as a general-purpose CMOS tri-state output.

FinRF 14 15 I RF PLL prescaler input. Small-signal input from the VCO.

RF PLL prescaler complementary input. For single-ended operation, this pin must be

FinRF* 15 16 I AC grounded through a 100-pF capacitor. The LMX243x can be driven differentially

when the AC-coupled capacitor is omitted.

Product Folder Links: LMX2430 LMX2433 LMX2434

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LMX2433

LMX2434

SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

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Pin Functions (continued)

PIN I/O DESCRIPTION

NAME ULGA TSSOP

Programmable multiplexed output. Functions as a general-purpose CMOS tri-state

output, N and R divider output, RF/ IF PLL push-pull analog lock-detect output, RF/

Ftest/LD 9 10 O IF PLL open-drain analog lock-detect output, or RF/ IF PLL digital filtered lock-detect

output.

1 2 Ground for the IF PLL analog and digital circuits, MICROWIRE, Ftest/LD and

GND 11 12 — oscillator circuits.

13 14 MICROWIRE Latch Enable input. High-impedance CMOS input. When LE

LE 17 18 I transitions HIGH, DATA stored in the shift register is loaded into one of 6 internal

control registers.

Oscillator output/ IF PLL fastlock output. The output configuration is dependent on

the state of the ENosc pin. When ENosc is set LOW, the pin functions as an IF

OSCout/ fastlock output, which connects a resistor in parallel to R2 of the external loop filter.

6 7 O

FLoutIF This configuration also functions as a general-purpose CMOS tri-state output. When

ENosc is set HIGH, the pin functions as an oscillator output so that an external

crystal can be used.

Reference oscillator input. The input has an approximate Vcc/2 threshold and is

OSCin 7 8 I driven by an external AC-coupled source.

16 17 Power supply bias for the RF PLL analog circuits. Vcc may range from 2.25 V to

Vcc 8 9 — 2.75 V. Bypass capacitors must be placed as close as possible to this pin and be

connected directly to the ground plane.

20 1

7 Specifications

7.1 Absolute Maximum Ratings

See (1)(2)(3)(4)

MIN MAX UNIT

Power supply voltage −0.3 3.25 V

VCC to GND

Voltage on any pin to GND

VI−0.3 VCC + 0.3 V

VImust be < +3.25 V

TLLead temperature (solder 4 seconds) 260 °C

Tstg Storage temperature −65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) This device is a high-performance RF integrated circuit with an ESD rating < 2000 V and is ESD-sensitive. Handling and assembly of

this device must be done at ESD-protected work stations.

(3) GND = 0 V.

(4) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

7.2 Recommended Operating Conditions MIN MAX UNIT

Power supply voltage Vcc to GND 2.25 2.75 V

Operating temperature, TA−40 85 °C

Product Folder Links: LMX2430 LMX2433 LMX2434

LMX2430

LMX2433

LMX2434

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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

7.3 Thermal Information LMX243x

THERMAL METRIC(1) NPE (ULGA) PW (TSSOP) UNIT

20 PINS 20 PINS

RθJA Junction-to-ambient thermal resistance 80.9 111.5 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 22.5 44.9 °C/W

RθJB Junction-to-board thermal resistance 40 63.5 °C/W

ψJT Junction-to-top characterization parameter 0.2 6.1 °C/W

ψJB Junction-to-board characterization parameter 40 62.8 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Electrical Characteristics

VCC = EN = 2.5 V, −40°C ≤TA≤+85°C, unless otherwise specified

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

ICC PARAMETERS

LMX2430 CLK, DATA and LE = 0 V 2.8 3.6 mA

Power supply current, OSCin = GND

LMX2433 3.2 4.4 mA

ICCRF RF RF_PD Bit = 0

synthesizer IF_PD Bit = 1

LMX2434 4.6 6.2 mA

RF_P Bit = 0

LMX2430 CLK, DATA and LE = 0 V 1.4 2 mA

Power supply current, OSCin = GND

LMX2433 2 2.8 mA

ICCIF IF RF_PD Bit = 1

synthesizer IF_PD Bit = 0

LMX2434 2.4 3.5 mA

IF_P Bit = 0

EN, ENosc, CLK, DATA

ICCPD Power-down current 10 μA

and LE = 0 V

RF SYNTHESIZER PARAMETERS

RF_P Bit = 0 250 2500 MHz

LMX2430 RF_P Bit = 1 250 3000 MHz

RF operating

fFinRF RF_P Bit = 0 500 3000 MHz

frequency LMX2433 RF_P Bit = 1 500 3600 MHz

LMX2434 RF_P Bit = 0 or 1 1000 5000 MHz

P = 8 / 9(1) 24 262,151

NRF N divider range P = 16 / 17(1) 48 524,287

P = 32 / 33(1) 96 524,287

RRF RF R divider range 3 32,767

fCOMPRF RF phase detector frequency 10 MHz

LMX2430 / 33 −15 0 dBm

2.25 V ≤VCC ≤2.75 V(2)

pFinRF RF input sensitivity LMX2434 −12 0 dBm

2.35 V ≤VCC ≤2.75 V(2)

VCPoutRF = VCC / 2 –1 mA

RF_CPG Bit = 0(3)

ICPoutRF RF charge-pump output source current

Source VCPoutRF = VCC / 2 –4 mA

RF_CPG Bit = 1(3)

VCPoutRF = VCC / 2 1 mA

RF_CPG Bit = 0(3)

ICPoutRF RF charge-pump output sink current

Sink VCPoutRF = VCC / 2 4 mA

RF_CPG Bit = 1(3)

(1) Some of the values in this range are illegal divide ratios (B < A). To obtain continuous legal division, the Minimum Divide Ratio must be

calculated. Use N ≥P * (P−1), where P is the value of the prescaler selected.

(2) Refer to LMX243x FinRF Sensitivity Test Set-Up.

(3) Refer to LMX243x Charge Pump Test Set-Up.

Product Folder Links: LMX2430 LMX2433 LMX2434

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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

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Electrical Characteristics (continued)

VCC = EN = 2.5 V, −40°C ≤TA≤+85°C, unless otherwise specified

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

ICPoutRF RF charge-pump output tri-state current 0.5 V ≤VCPoutRF ≤VCC – 0.5 V(3) –2.5 2.5 nA

TRI RF charge-pump output sink current vs

ICPoutRF charge-pump output source current VCPoutRF = VCC / 2(4) 3% 10%

%MIS mismatch

RF charge-pump output current

ICPoutRF magnitude variation vs charge-pump 0.5 V ≤VCPoutRF ≤VCC – 0.5 V(4) 5% 15%

%VCPoutRF output voltage

ICPoutRF RF charge-pump output current VCPoutRF = VCC / 2(4) 2%

%TAmagnitude variation vs temperature

IF SYNTHESIZER PARAMETERS

LMX2430 IF_P Bit = 0 or 1 100 800 MHz

fFinIF IF operating frequency LMX2433 IF_P Bit = 0 or 1 250 1700 MHz

LMX2434 IF_P Bit = 0 or 1 500 2500 MHz

P = 8/9(1) 24 131,079

NIF IF N divider range P = 16/17(1) 48 262,143

RIF IF R divider range 3 32,767

fCOMPIF IF phase detector frequency 10 MHz

pFinIF IF input sensitivity 2.25 V ≤VCC ≤2.75 V(2) –15 0 dBm

VCPoutIF = VCC/2 –1 mA

IF_CPG Bit = 0(3)

ICPoutIF IF charge-pump output source current

Source VCPoutIF = VCC/2 –4 mA

IF_CPG Bit = 1(3)

VCPoutIF = VCC/2 1 mA

IF_CPG Bit = 0(3)

ICPoutIF IF charge-pump output sink current

Sink VCPoutIF = VCC/2 4 mA

IF_CPG Bit = 1(3)

ICPoutIF IF charge-pump output tri-state current 0.5 V ≤VCPoutIF ≤VCC – 0.5 V(3) –2.5 2.5 nA

TRI IF charge-pump output sink current vs

ICPoutIF charge-pump output source current VCPoutIF = VCC/2(4) 3% 10%

%MIS mismatch

ICPoutIF IF charge-pump output current magnitude 0.5 V ≤VCPoutIF ≤VCC – 0.5 V(4) 5% 15%

%VCPoutIF variation vs charge-pump output voltage

ICPoutIF IF charge-pump output current magnitude VCPoutIF = VCC/2(4) 2%

%TAvariation vs temperature

OSCILLATOR PARAMETERS

fOSCin Oscillator operating frequency 1 256 MHz

vOSCin Oscillator sensitivity See (5) 0.5 VCC VPP

VOSCin = VCC 100 µA

IOSCin Oscillator input current VOSCin = 0 V –100 µA

DIGITAL INTERFACE (DATA, CLK, LE, EN, ENosc, Ftest/LD, FLoutRF, OSCout/ FLoutIF)

VIH High-level input voltage 1.6 V

VIL Low-level input voltage 0.4 V

IIH High-level input current VIH = VCC 1μA

IIL Low-level input current VIL = 0 V −1μA

VOH High-level output voltage IOH =−500 μA VCC −0.4 V

VOL Low-level output voltage IOL = 500 μA 0.4 V

(4) Refer to Charge Pump Current Specification Definitions for details on how these measurements are made.

(5) Refer to LMX243x OSCin Sensitivity Test Set-Up.

Product Folder Links: LMX2430 LMX2433 LMX2434

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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

Electrical Characteristics (continued)

VCC = EN = 2.5 V, −40°C ≤TA≤+85°C, unless otherwise specified

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

PHASE NOISE CHARACTERISTICS

TCXO Reference Source

RF synthesizer normalized phase noise dBc/

LNRF(f) RF_CPG Bit = 1 –219

contribution(6) Hz

IF_PD Bit = 1

TCXO Reference Source

IF synthesizer normalized phase noise dBc/

LNIF(f) IF_CPG Bit = 1 –214

contribution(6) Hz

RF_PD Bit = 1

fFinRF = 2750 MHz

f = 10-kHz offset

fCOMPRF = 1 MHz

Loop Bandwidth = 100 kHz

NRF = 2750 dBc/

LMX2430 –90.3

fOSCin = 10 MHz Hz

vOSCin = 1 VPP

RF_CPG Bit = 1

IF_PD Bit = 1

TA= 25oC(7)

fFinRF = 3200 MHz

f = 10-kHz offset

fCOMPRF = 1 MHz

Loop Bandwidth = 100 kHz

RF synthesizer single- NRF = 3200 dBc/

LRF(f) side band phase noise LMX2433 –88.9

fOSCin = 10 MHz Hz

measured vOSCin = 1 VPP

RF_CPG Bit = 1

IF_PD Bit = 1

TA= 25°C(7)

fFinRF = 4700 MHz

f = 10-kHz offset

fCOMPRF = 1 MHz

Loop Bandwidth = 100 kHz

NRF = 4700 dBc/

LMX2434 –85.6

fOSCin = 10 MHz Hz

vOSCin = 1 VPP

RF_CPG Bit = 1

IF_PD Bit = 1

TA= 25°C(7)

(6) Normalized Phase Noise Contribution is defined as LN(f) = L(f) −20 log (N) −10 log (fCOMP), where L(f) is defined as the single side

band phase noise measured at an offset frequency, f, in a 1-Hz bandwidth. The offset frequency, f, must be chosen sufficiently smaller

than the loop bandwidth of the PLL, yet large enough to avoid substantial phase noise contribution from the reference source. N is the

value selected for the feedback divider and fCOMP is the RF/IF phase and frequency detector comparison frequency.

(7) The synthesizer phase noise is measured with the LMX2430PW/LMX2430NPE evaluation boards and the HP8566B Spectrum Analyzer.

7.5 Timing Requirements

See (1)

MIN NOM MAX UNIT

MICROWIRE INTERFACE

tCS DATA to CLK set-up time 50 ns

tCH DATA to CLK hold time 10 ns

tCWH CLK pulse width HIGH 50 ns

tCWL CLK pulse width LOW 50 ns

tES CLK to LE set-up time 50 ns

tEW LE pulse width 50 ns

(1) Refer to LMX243x Serial Data Input Timing figure.

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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

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7.6 Typical Characteristics

7.6.1 Sensitivity

VCC = EN = 2.25 V VCC = EN = 2.75 V

Figure 1. LMX2430 FinRF Input Power vs Frequency Figure 2. LMX2430 FinRF Input Power vs Frequency

VCC = EN = 2.25 V VCC = EN = 2.75 V

Figure 3. LMX2433 FinRF Input Power vs Frequency Figure 4. LMX2433 FinRF Input Power vs Frequency

VCC = EN = 2.35 V VCC = EN = 2.75 V

Figure 5. LMX2434 FinRF Input Power vs Frequency Figure 6. LMX2434 FinRF Input Power vs Frequency

Product Folder Links: LMX2430 LMX2433 LMX2434

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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

Sensitivity (continued)

VCC = EN = 2.25 V VCC = EN = 2.75 V

Figure 7. LMX2430 FinIF Input Power vs Frequency Figure 8. LMX2430 FinIF Input Power vs Frequency

VCC = EN = 2.25 V VCC = EN = 2.75 V

Figure 9. LMX2433 FinIF Input Power vs Frequency Figure 10. LMX2433 FinIF Input Power vs Frequency

VCC = EN = 2.25 V VCC = EN = 2.75 V

Figure 11. LMX2434 FinIF Input Power vs Frequency Figure 12. LMX2434 FinIF Input Power vs Frequency

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Sensitivity (continued)

VCC = EN = 2.25 V VCC = EN = 2.75 V

Figure 13. LMX243x OSCin Input Voltage vs Frequency Figure 14. LMX243x OSCin Input Voltage vs Frequency

7.6.2 Charge Pump

VCC = EN = 2.5 V −40°C ≤TA≤+85°C VCC = EN = 2.5 V −40°C ≤TA≤+85°C

Figure 15. LMX243x RF Charge-Pump Sweeps Figure 16. LMX243x IF Charge-Pump Sweeps

Product Folder Links: LMX2430 LMX2433 LMX2434

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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

7.6.3 Input Impedance

VCC = EN = 2.5 V TA= 25°C VCC = EN = 2.5 V TA= 25°C

Figure 17. LMX243x ULGA FinRF Input Impedance Figure 18. LMX243x TSSOP FinRF Input Impedance

VCC = EN = 2.5 V TA= 25°C VCC = EN = 2.5 V TA= 25°C

Figure 19. LMX243x ULGA FinIF Input Impedance Figure 20. LMX243x TSSOP FinIF Input Impedance

VCC = EN = 2.5 V TA= 25°C VCC = EN = 2.5 V TA= 25°C

Figure 21. LMX243x ULGA OSCin Input Impedance vs Figure 22. LMX233xU TSSOP OSCin Input Impedance vs

Frequency Frequency

Product Folder Links: LMX2430 LMX2433 LMX2434

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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

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8 Parameter Measurement Information

8.1 Bench Test Setups

8.1.1 LMX243x Charge-Pump Test Setup

Figure 23. Charge-Pump Current Test Setup

Figure 23 shows the setup required to measure the RF charge-pump sink current of the LMX243x device. The

same setup is used for the LMX2430PW evaluation board. The purpose of this test is to assess the functionality

of the RF charge pump. The IF charge pump is evaluated in the same way.

This setup uses an open-loop configuration. A power supply is connected to VCC. By means of a signal

generator, a 10-MHz signal is typically applied to the FinRF pin. The signal is one of two inputs to the phase /

frequency detector (PFD). The 3-dB pad provides a 50-Ωmatch between the PLL and the signal generator. The

OSCin pin is tied to Vcc. This establishes the other input to the PFD. Alternatively, this input can be tied directly

to the ground plane. The EN and ENosc pins are also both tied to Vcc. A semiconductor parameter analyzer is

connected to the CPoutRF pin and used to measure the sink, source, and tri-state leakage currents.

Let Frrepresent the frequency of the signal applied to the OSCin pin, which is simply zero in this case (DC), and

let Fprepresent the frequency of the signal applied to the FinRF pin. The PFD is sensitive to the rising edges of

Frand Fp. Assuming positive VCO characteristics (RF_CPP bit = 1); the charge pump turns ON, and sinks

current when the first rising edge of Fpis detected. Because Frhas no rising edge, the charge pump continues to

sink current indefinitely. In order to measure the RF charge-pump source current, the RF_CPP bit is simply set to

0 (negative VCO characteristics) in CodeLoader. Similarly, in order to measure the tri-state leakage current, the

RF_CPT bit is set to 1.

Product Folder Links: LMX2430 LMX2433 LMX2434

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LMX2433

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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

Bench Test Setups (continued)

The measurements are typically taken over supply voltage and temperature. The measurements are also

typically taken at the HIGH and LOW charge-pump current gains. The charge-pump current gain can be

controlled by the RF_CPG bit in CodeLoader. Once the charge-pump currents are determined, the (i) charge-

pump output current magnitude variation versus charge-pump output voltage, (ii) charge-pump output sink

current versus charge-pump output source current mismatch, and (iii) charge-pump output current magnitude

versus temperature, can be calculated. Refer to the Charge Pump Current Specifications Definition for more

details.

8.1.2 Charge-Pump Current Specification Definitions

I1 = Charge-Pump Sink Current at VCPout = Vcc − ΔV

I2 = Charge-Pump Sink Current at VCPout = Vcc//2

I3 = Charge-Pump Sink Current at VCPout =ΔV

I4 = Charge-Pump Source Current at VCPout = Vcc − ΔV

I5 = Charge-Pump Source Current at VCPout = Vcc/2

I6 = Charge-Pump Source Current at VCPout =ΔV

ΔV = Voltage offset from the positive and negative rails. Dependent on the VCO tuning range relative to Vcc and

GND. Typical values are between 0.5V and 1.0V.

VCPout refers to either VCPoutRF or VCPoutIF

ICPout refers to either ICPoutRF or ICPoutIF

Figure 24. Charge-Pump Parameters

8.1.2.1 Charge-Pump Output Current Variation vs Charge-Pump Output Voltage

(1)

8.1.2.2 Charge-Pump Sink Current vs Charge-Pump Output Source Current Mismatch

(2)

Product Folder Links: LMX2430 LMX2433 LMX2434

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Bench Test Setups (continued)

8.1.2.3 Charge-Pump Output Current Variation vs Temperature

(3)

8.1.3 LMX243x FinRF Sensitivity Test Setup

Figure 25. RF Input Sensitivity Test Setup

Figure 25 shows the setup required to measure the RF input sensitivity level of the LMX243x device. The same

setup is used for the LMX2430PW evaluation board. The purpose of this test is to measure the acceptable signal

level to the FinRF input of the PLL chip. Outside the acceptable signal range, the feedback divider begins to

divide incorrectly and miscount the frequency. The FinIF sensitivity is evaluated in the same way.

The setup uses an open-loop configuration. A power supply is connected to Vcc. The IF PLL is powered down

(IF_PD bit = 1). By means of a signal generator, an RF signal is applied to the FinRF pin. The 3-dB pad provides

a 50-Ωmatch between the PLL and the signal generator. The EN, ENosc, and OSCin pins are all tied to VCC.

The N value is typically set to 10000 in CodeLoader, that is, RF_B word = 156 and RF_A word = 16 for RF_P bit

= 0 (LMX2434) or RF_P bit = 1 (LMX2430 and LMX2433). The feedback divider output is routed to the Ftest/LD

Product Folder Links: LMX2430 LMX2433 LMX2434

LMX2430

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pin by selecting the RF_N/2 Frequency word (MUX[3:0] word = 15) in CodeLoader. A Universal Counter is

connected to the Ftest/LD pin and used to monitor the output frequency of the feedback divider. The expected

frequency must be the signal generator frequency divided by twice the corresponding counter value, that is,

20,000. The factor of two comes in because the LMX43x device has an internal /2 circuit which is used to

provide a 50% duty cycle.

Sensitivity is typically measured over frequency, supply voltage and temperature. In order to perform the

measurement, the temperature, frequency, and supply voltage is set to a fixed value, and the power level of the

signal at FinRF is varied. Sensitivity is reached when the frequency error of the divided RF input is greater than

or equal to 1 Hz. The power attenuation from the cable and the 3-dB pad must be accounted for. The feedback

divider miscounts if too much or too little power is applied to the FinRF input. Therefore, the allowed input power

level is bounded by the upper and lower sensitivity limits. In a typical application, if the power level to the FinRF

input approaches the sensitivity limits, this can introduce spurs or cause degradation to the phase noise. When

the power level gets even closer to these limits, or exceeds them, the RF PLL loses lock.

8.1.4 LMX243x OSCin Sensitivity Test Setup

Figure 26. OSCin Sensitivity Test Setup

Figure 26 shows the setup required to measure the OSCin buffer sensitivity level in the LMX243x device. The

same setup is used for the LMX2430PW evaluation board. This setup is similar to the FinRF sensitivity setup

except that the signal generator is now connected to the OSCin pin, and both Fin pins are tied to VCC. The 51-Ω

shunt resistor matches the OSCin input to the signal generator. The R counter is typically set to 1000, that is,

RF_R word = 1000 or IF_R word = 1000. The reference divider output is routed to the Ftest/LD pin by selecting

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Bench Test Setups (continued)

the RF_R/ 2 frequency word (MUX[3:0] word = 14) or the IF_R/ 2 frequency word (MUX[3:0] word = 12) in

CodeLoader. A universal counter is connected to the Ftest/LD pin and is used to monitor the output frequency of

the reference divider. The expected frequency must be the signal generator frequency divided by twice the

corresponding counter value, that is, 2000. The factor of two comes in because the LMX243x device has an

internal /2 circuit which is used to provide a 50% duty cycle.

In a similar way, sensitivity is typically measured over frequency, supply voltage and temperature. In order to

perform the measurement, the temperature, frequency, and supply voltage is set to a fixed value and the power

level (voltage level) of the signal at OSCin is varied. Sensitivity is reached when the frequency error of the

divided input signal is greater than or equal to 1 Hz.

8.1.5 LMX243x FinRF Input Impedance Test Setup

Figure 27. Imput Impedance Test Setup

Notes:

1. DATA is clocked into the 24-bit shift register on the rising edge of CLK

2. The MSB of DATA is shifted in first.

Figure 28. LMX243x Serial Data Input Timing

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Figure 28 shows the setup required to measure the RF input impedance of the LMX243x device. The same

setup is used for the LMX2430PW evaluation board. Measuring the input impedance of the device facilitates the

design of appropriate matching networks to match the PLL to the VCO, or in more critical situations, to the

characteristic impedance of the printed-circuit-board (PCB) trace, to prevent undesired transmission line effects.

The FinIF input impedance is evaluated in the same way.

Before the actual measurements are taken, the network analyzer must be calibrated, that is, the error coefficients

must be calculated. The calibration standard of the network analyzer is used to calculate these coefficients. The

calibration standard includes an open, short and a matched load. A 1-port calibration is implemented here.

To calculate the coefficients, the PLL chip is first removed from the PCB. A piece of semi-rigid coaxial cable is

then soldered to the pad on the PCB which is equivalent to the FinRF pin on the PLL chip. Proper grounding

near the exposed tip of the semi-rigid coaxial cable is required for accurate results. The DC blocking capacitor is

removed for this test. The network analyzer port is then connected to the other end of the semi-rigid coaxial

cable. In this way, the semi-rigid coaxial cable acts as a transmission line. This transmission line adds electrical

length and produces an offset from the reference plane of the network analyzer; therefore, it must be included in

the calibration. The desired operating frequency is then set. The typical frequency range selected for the RF

synthesizer of the LMX243x device is from 100 MHz to 6000 MHz.

The network analyzer calculates the calibration coefficients based on the measured S11 parameters. With this all

done, calibration is now complete.

The PLL chip is then placed on the PCB, and a power supply connected to VCC. The EN, ENosc, and OSCin pins

are all tied to VCC. Alternatively, the OSCin pin can be tied to ground. In this setup, the complementary input

(FinRF*) is AC-coupled to ground. With the network analyzer still connected to the semi-rigid coaxial cable, the

measured FinRF impedance is displayed.

The OSCin input impedance is measured in the same way. The impedance is measured when the oscillator

buffer is powered up (ENosc is set HIGH) and when the oscillator buffer is powered down (ENosc pin is set

LOW).

Table 1. LMX243x ULGA FinRF Input Impedance Table(1)

fFinRF |Γ| ANGLE (Γ) Re {ZFinRF} Im {ZFinRF} |ZFinRF|

(MHz) (°) (Ω) (Ω) (Ω)

100 0.86 –8.63 334.27 –339.55 476.48

200 0.86 –10.72 265.44 –313.48 410.77

300 0.85 –13.48 202.09 –281.42 346.46

400 0.84 –17.01 150.76 –245.31 287.93

500 0.83 –21.05 112.18 –212.85 240.60

600 0.82 –25.32 85.96 –185.41 204.37

700 0.82 –29.78 67.32 –162.49 175.88

800 0.81 –34.35 54.27 –143.15 153.09

900 0.80 –39.02 44.76 –127.07 134.72

1000 0.80 –43.83 37.32 –113.62 119.59

1100 0.79 –48.76 31.65 –102.07 106.86

1200 0.79 –53.90 27.30 –91.89 95.86

1300 0.78 –59.07 23.84 –82.83 86.19

1400 0.78 –64.41 21.34 –74.84 77.82

1500 0.77 –70.04 19.20 –67.56 70.24

1600 0.76 –75.84 17.46 –60.88 63.33

1700 0.75 –82.06 16.27 –54.72 57.09

1800 0.73 –88.56 15.36 –48.89 51.25

1900 0.72 –95.19 14.90 –43.34 45.83

2000 0.70 –101.45 14.32 –38.66 41.23

(1) VCC = EN = 2.5 V, TA= 25°C

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Table 1. LMX243x ULGA FinRF Input Impedance Table(1) (continued)

fFinRF |Γ| ANGLE (Γ) Re {ZFinRF} Im {ZFinRF} |ZFinRF|

(MHz) (°) (Ω) (Ω) (Ω)

2100 0.68 –107.85 14.10 –34.26 37.05

2200 0.67 –114.12 13.81 –30.35 33.34

2300 0.66 –120.12 13.27 –27.09 30.17

2400 0.66 –126.01 12.50 –24.00 27.06

2500 0.67 –131.82 11.68 –21.22 24.22

2600 0.69 –137.96 10.55 –18.24 21.07

2700 0.71 –144.21 9.53 –15.58 18.26

2800 0.72 –150.25 8.55 –12.92 15.49

2900 0.74 –156.23 7.75 –10.25 12.85

3000 0.75 –161.92 7.22 –7.77 10.61

3100 0.76 –167.18 6.87 –5.48 8.79

3200 0.77 –172.05 6.63 –3.42 7.46

3300 0.77 –177.55 6.40 –1.49 6.57

3400 0.78 179.16 6.18 0.35 6.19

3500 0.79 174.92 5.99 2.18 6.37

3600 0.79 170.77 5.85 3.99 7.08

3700 0.80 166.54 5.74 5.80 8.16

3800 0.80 162.52 5.73 7.56 9.49

3900 0.80 158.74 5.73 9.22 10.86

4000 0.80 155.06 5.68 10.84 12.24

4100 0.80 151.49 5.69 12.38 13.62

4200 0.80 148.28 5.70 13.78 14.91

4300 0.80 146.02 5.73 14.88 15.95

4400 0.80 144.12 5.60 15.84 16.80

4500 0.82 142.31 5.41 16.66 17.52

4600 0.83 140.78 5.29 17.42 18.21

4700 0.83 139.65 5.14 17.95 18.67

4800 0.84 138.75 4.99 18.38 19.05

4900 0.84 137.79 4.84 18.85 19.46

5000 0.84 136.82 4.92 19.79 20.39

5100 0.84 135.77 4.88 18.89 19.51

5200 0.84 134.64 4.99 20.44 21.04

5300 0.84 133.33 5.11 21.16 21.77

5400 0.84 131.68 5.25 21.96 22.58

5500 0.83 129.77 5.43 23.01 23.64

5600 0.83 127.55 5.70 24.16 24.82

5700 0.82 125.41 6.03 25.33 26.04

5800 0.82 123.35 6.42 26.41 27.18

5900 0.81 121.68 6.75 27.30 28.12

6000 0.80 120.42 7.11 28.00 28.89

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Table 2. LMX243x TSSOP FinRF Input Impedance Table(1)

fFinRF |Γ| Angle (Γ) Re {ZFinRF} Im {ZFinRF} |ZFinRF|

(MHz) (°) (Ω) (Ω) (Ω)

100 0.86 –12.47 214.61 –314.33 380.61

200 0.85 –15.35 166.75 –270.14 317.46

300 0.84 –19.41 122.76 –228.38 259.28

400 0.83 –24.22 89.48 –193.48 213.17

500 0.82 –28.97 67.73 –167.98 181.12

600 0.82 –33.65 52.07 –148.64 157.5

700 0.82 –38.37 41.64 –131.88 138.3

800 0.82 –43.22 34.6 –117.36 122.35

900 0.81 –48.37 29.69 –104.33 108.47

1000 0.8 –53.84 25.88 –92.74 96.28

1100 0.79 –59.8 22.78 –82.21 85.31

1200 0.78 –66.29 20.17 –72.67 75.42

1300 0.77 –73.3 17.88 –64.06 66.51

1400 0.76 –80.74 15.93 –56.21 58.42

1500 0.75 –88.27 14.5 –49.36 51.45

1600 0.74 –95.87 13.27 –43.3 45.29

1700 0.73 –103.41 12.42 –37.96 39.94

1800 0.72 –110.77 11.67 –33.2 35.19

1900 0.71 –118.23 11.2 –28.78 30.88

2000 0.7 –125.46 11.25 –24.74 27.18

2100 0.68 –131.35 11.37 –21.6 24.41

2200 0.68 –137.19 10.94 –18.79 21.74

2300 0.68 –143.41 10.37 –15.88 18.97

2400 0.69 –149.45 9.7 –13.18 16.36

2500 0.71 –156.15 8.62 –10.26 13.4

2600 0.73 –163.87 7.79 –6.92 10.42

2700 0.74 –171.33 7.47 –3.71 8.34

2800 0.75 –178.24 7.3 0.76 7.34

2900 0.75 174.91 7.24 2.18 7.56

3000 0.75 168.09 7.33 5.12 8.94

3100 0.74 161.11 7.53 8.14 11.09

3200 0.74 153.92 7.83 11.3 13.75

3300 0.74 146.42 8.19 14.72 16.85

3400 0.74 138.67 8.59 18.36 20.27

3500 0.74 130.89 8.97 22.22 23.96

3600 0.75 123.33 9.3 26.23 27.83

3700 0.76 116.17 9.54 30.32 31.79

3800 0.77 109.55 9.74 34.42 35.77

3900 0.78 103.54 9.91 38.43 39.69

4000 0.79 98.25 10.2 42.23 43.44

4100 0.79 93.38 10.71 45.97 47.2

4200 0.79 88.86 11.7 49.59 50.95

4300 0.78 85.1 13.43 52.63 54.32

4400 0.77 82.09 14.79 55.23 57.18

4500 0.77 78.59 16.13 58.48 60.66

4600 0.76 74.73 17.9 62.3 64.82

(1) VCC = EN = 2.5 V, TA= 25°C

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Table 2. LMX243x TSSOP FinRF Input Impedance Table(1) (continued)

fFinRF |Γ| Angle (Γ) Re {ZFinRF} Im {ZFinRF} |ZFinRF|

(MHz) (°) (Ω) (Ω) (Ω)

4700 0.76 70.66 19.89 66.66 69.56

4800 0.75 66.05 22.5 72.05 75.48

4900 0.75 61.68 25.37 77.73 81.77

5000 0.75 57.35 28.56 84.19 88.9

5100 0.76 53.11 31.7 91.39 96.73

5200 0.77 48.79 34.78 100.34 106.2

5300 0.78 43.56 40.56 112.59 119.67

5400 0.78 38.11 52.53 125.62 136.16

5500 0.76 32.89 71.05 135.74 153.21

5600 0.73 27.85 95.57 142.32 171.43

5700 0.71 21.89 133.18 141.32 194.19

5800 0.68 15.38 177.08 116.75 212.1

5900 0.65 9.47 207.23 77.49 221.24

6000 0.64 4.15 222.92 35.24 225.69

Table 3. LMX243x ULGA FinIF Input Impedance Table(1)

fFinIF |Γ| Angle (Γ) Re {ZFinIF} Im {ZFinIF} |ZFinIF|

(MHz) (°) (Ω) (Ω) (Ω)

100 0.87 –6.19 446.34 –341.41 561.94

200 0.86 –8.1 353.77 –328.44 482.73

300 0.85 –10.98 257.5 –300.77 395.94

400 0.84 –14.21 188.33 –268.39 327.87

500 0.83 –17.67 141.63 –235.88 275.13

600 0.83 –21.32 109.44 –206.86 234.03

700 0.82 –25.13 86.57 –182.41 201.91

800 0.81 –29.04 70.47 –161.46 176.17

900 0.8 –32.99 58.9 –144.27 155.83

1000 0.79 –36.73 50.96 –130.45 140.05

1100 0.79 –40.28 44.21 –120.14 128.02

1200 0.79 –44.11 37.38 –111.08 117.2

1300 0.79 –48.38 31.82 –101.96 106.81

1400 0.79 –52.91 27.95 –93.09 97.2

1500 0.78 –57.26 25.34 –85.47 89.15

1600 0.77 –61.56 23.28 –78.74 82.11

1700 0.77 –66.01 20.98 –72.74 75.71

1800 0.77 –71.39 18.4 –66.32 68.83

1900 0.77 –77.74 15.22 –59.4 61.32

2000 0.76 –84.72 15.02 –52.48 54.59

2100 0.73 –92.59 14.39 –46.17 48.36

2200 0.71 –100.18 14.07 –40.46 42.84

2300 0.69 –107.33 13.94 –35.79 38.41

2400 0.68 –114.48 13.37 –31.55 34.27

2500 0.68 –118.42 12.71 –28.62 31.32

(1) VCC = EN = 2.5 V, TA= 25°C

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Table 4. LMX243x TSSOP FinIF Input Impedance Table(1)

fFinIF |Γ| Angle (Γ) Re {ZFinIF} Im {ZFinIF} |ZFinIF|

(MHz) (°) (Ω) (Ω) (Ω)

100 0.87 –7.11 400.44 –348.14 530.62

200 0.86 –9.92 288.69 –318.81 430.1

300 0.85 –13.64 198.42 –281.45 344.36

400 0.84 –17.47 141.73 –246.13 284.02

500 0.84 –21.42 105.75 –214.58 239.22

600 0.83 –25.39 82 –188.43 205.5

700 0.83 –29.46 65.48 –166.34 178.76

800 0.82 –33.67 53.78 –147.46 156.96

900 0.81 –37.99 45.17 –131.83 139.35

1000 0.80 –42.47 38.82 –117.87 124.1

1100 0.79 –46.96 33.93 –106.36 111.64

1200 0.79 –51.67 29.53 –96.2 100.63

1300 0.78 –57.02 25.26 –86.47 90.08

1400 0.77 –63.11 22.15 –76.93 80.06

1500 0.76 –69.26 20.49 –68.42 71.42

1600 0.74 –74.82 19.54 –61.59 64.62

1700 0.74 –79.79 17.7 –56.35 59.06

1800 0.74 –86.55 15.09 –50.74 52.94

1900 0.74 –94.37 13.38 –44.56 46.53

2000 0.73 –101.95 12.62 –38.87 40.87

2100 0.72 –108.92 12.21 –34.18 36.3

2200 0.71 –115.63 11.65 –30.11 32.29

2300 0.71 –123.23 11.13 –25.97 28.25

2400 0.69 –131.44 11.08 –21.74 24.4

2500 0.67 –138.35 11.54 –18.31 21.64

(1) VCC = EN = 2.5 V, TA= 25°C

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Table 5. LMX243x ULGA OSCin Input Impedance Table(1)

ENosc = 1 ENosc = 0

fOSCin Re {ZOSCin} Im {ZOSCin} |ZOSCin| Re {ZOSCin} Im {ZOSCin} |ZOSCin|

(MHz) (Ω) (Ω) (Ω) (Ω) (Ω) (Ω)

5 5032.01 –10120.58 11302.53 2641.63 –13293.58 13553.5

7.5 2529.17 –7382.23 7803.46 1108.82 –8932.61 9001.17

10 1412.1 –5693.56 5866.06 526.74 –6461.11 6482.55

12.5 1051.18 –4930.8 5041.6 330.16 –5452.11 5462.1

15 710.63 –4099.58 4160.72 233.66 –4455.98 4462.1

17.5 545.87 –3584.6 3625.92 212.67 –3822.33 3828.24

20 442.32 –3125.21 3156.35 192.16 –3306.06 3311.64

22.5 314.15 –2806.1 2823.63 112.07 –2963.67 2965.79

25 316.48 –2518.94 2538.75 143.65 –2657.93 2661.81

27.5 223.49 –2280.02 2290.95 84.09 –2405.34 2406.81

30 196.9 –2105.11 2114.3 40.38 –2196.07 2196.45

32.5 175.38 –1942.45 1950.35 77.29 –2044.88 2046.34

35 158.95 –1816.83 1823.77 67.31 –1898.92 1900.12

37.5 137.8 –1701.59 1707.16 51.11 –1775.84 1776.58

40 114.2 –1573.28 1577.42 50.39 –1652.06 1652.83

(1) VCC = EN = 2.5 V, TA= 25°C

Table 6. LMX243x TSSOP OSCin Input Impedance Table(1)

ENosc = 1 ENosc = 0

fOSCin Re {ZOSCin} Im {ZOSCin} |ZOSCin| Re {ZOSCin} Im {ZOSCin} |ZOSCin|

(MHz) (Ω) (Ω) (Ω) (Ω) (Ω) (Ω)

5 1111.3 –4814.09 4940.69 654.13 –7449.33 7477.99

7.5 628.81 –3411.8 3469.26 388.42 –5150.6 5165.22

10 359.99 –2623.46 2648.04 237.72 –3892.18 3899.44

12.5 284.12 –2065 2084.46 159 –2988.66 2992.88

15 203.53 –1801.24 1812.7 152.53 –2597.16 2601.63

17.5 134.32 –1548.5 1554.32 82.41 –2222.34 2223.86

20 109.85 –1343.3 1347.78 60.86 –1956.99 1957.94

22.5 80.56 –1192.73 1195.45 47.56 –1730.53 1731.18

25 69.37 –1063.72 1065.98 47.47 –1553.43 1554.15

27.5 60.1 –973.84 975.7 37.83 –1414.54 1415.04

30 50.3 –890.31 891.73 34.8 –1290.03 1290.5

32.5 45.52 –816.01 817.28 29.72 –1188.88 1189.25

35 41.55 –758.24 759.38 31.5 –1096.89 1097.35

37.5 37.73 –707.57 708.57 23.04 –1024.88 1025.14

40 36.09 –661.87 662.86 22.61 –963.11 963.38

(1) VCC = EN = 2.5 V, TA= 25°C

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9 Detailed Description

9.1 Overview

The basic phase-lock-loop (PLL) configuration consists of a high-stability crystal reference oscillator, a frequency

synthesizer such as the LMX243x, a voltage controlled oscillator (VCO), and a passive loop filter. The frequency

synthesizer includes a phase detector, current-mode charge pump, programmable reference R and feedback N

frequency dividers. The VCO frequency is established by dividing the crystal reference signal down through the

reference divider to obtain a comparison reference frequency. This reference signal, fr, is then presented to the

input of a phase / frequency detector and compared with the feedback signal, fp, which was obtained by dividing

the VCO frequency down by way of the feedback divider. The phase and frequency detector (PFD) measures the

phase error between the frand fpsignals and outputs control signals that are directly proportional to the phase

error. The charge pump then pumps charge into or out of the loop filter based on the magnitude and direction of

the phase error. The loop filter converts the charge into a stable control voltage for the VCO. The function of the

PFD is to adjust the voltage presented to the VCO until the frequency of the feedback signal and phase match

that of the reference signal. When this phase-locked condition exists, the VCO frequency is N times that of the

comparison frequency, where N is the feedback divider ratio.

9.2 Functional Block Diagram

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9.3 Feature Description

9.3.1 Reference Oscillator Input

The reference oscillator frequency for both the RF and IF PLLs is provided from an external reference through

the OSCin pin. The reference buffer circuit supports input frequencies from 5 to 40 MHz with a minimum input

sensitivity of 0.5 VPP. The reference buffer circuit has an approximate Vcc/2 input threshold and can be driven

from an external AC-coupled source. Typically, the OSCin pin is connected to the output of a crystal oscillator.

9.3.2 Reference Dividers (R Counters)

The reference dividers divide the reference input signal, OSCin, by a factor of R. The output of the reference

divider circuits feeds the reference input of the phase detector. This reference input to the phase detector is often

referred to as the comparison frequency. The divide ratio must be chosen such that the maximum phase

comparison frequency (fCOMPRF or fCOMPIF) of 10 MHz is not exceeded.

The RF and IF reference dividers are each comprised of 15-bit CMOS binary counters that support a continuous

integer divide ratio from 3 to 32,767. The RF and IF reference divider circuits are clocked by the output of the

reference buffer circuit which is common to both. Refer to RF_R[14:0] - RF Synthesizer Programmable

Reference Divider (R Counter) (R0[17:3]) and IF_R[14:0] - IF Synthesizer Programmable Reference Divider (R

Counter) (R3[17:3]) for details on how to program the RF_R and IF_R counters.

9.3.3 Prescalers

The FinRF and FinIF input pins drive the input of a differential-pair amplifier. The output of the differential-pair

amplifier drives a chain of D-type flip-flops in a dual modulus configuration. The output of the prescaler is used to

clock the subsequent feedback dividers. The RF PLL complementary inputs can be driven differentially, or the

negative input can be AC-coupled to ground through an external capacitor for single-ended configuration. A

16/17 or a 32/33 prescale ratio can be selected for the 5-GHz LMX2434 RF synthesizer. An 8/9 or a 16/17

prescale ratio can be selected for both the LMX2430 and LMX2433 RF synthesizers. The IF PLL is single-ended,

and an 8/9 or a 16/17 prescale ratio can be selected for the IF synthesizer.

9.3.4 Programmable Feedback Dividers (N Counters)

The programmable feedback dividers operate in concert with the prescalers to divide the input signal, Fin, by a

factor of N. The output of the programmable reference divider is provided to the feedback input of the phase

detector circuit. The divide ratio must be chosen so that the maximum phase comparison frequency (fCOMPRF or

fCOMPIF) of 10 MHz is not exceeded.

The programmable feedback divider circuit is comprised of an A counter (swallow counter) and a B counter

(programmble binary counter). For both the LMX2430 and LMX2433, the RF_A counter is a 4-bit swallow

counter, programmable from 0 to 15. The LMX2434 RF_A counter is a 5-bit swallow counter, programmable from

0 to 31. The LMX243x IF_A counter is a 4-bit swallow counter, programmable from 0 to 15. For both the

LMX2430 and LMX2433, the RF_B counter is a 15-bit binary counter, programmable from 3 to 32,767. The

LMX2434 RF_B counter is a 14-bit binary counter, programmable from 3 to 16,383. The LMX243x IF_B is a 14-

bit binary counter programmable from 3 to 16,383. A continuous integer divide ratio is achieved if N ≥P × (P−1),

where P is the value of the prescaler selected.

Divide ratios less than the minimum continuous divide ratio are achievable as long as the binary programmable

counter value is greater than the swallow counter value (B ≥A). Refer to RF_A[3:0] - LMX2430/33 RF

Synthesizer Swallow Counter (A Counter) (R1[6:3]),RF_A[4:0] - LMX2434 RF Synthesizer Swallow Counter (A

Counter) (R1[7:3]),RF_B[14:0] - LMX2430/33 RF Synthesizer Programmable Binary Counter (B Counter)

(R1[21:7]),RF_B[13:0] - LMX2434 RF Synthesizer Programmable Binary Counter (B Counter) (R1[21:8]),

IF_A[3:0] - IF Synthesizer Swallow Counter (A Counter) (R4[6:3]), and IF_B[13:0] - IF Synthesizer Programmable

Binary Counter (B Counter) (R4[20:7]) for details on how to program the A and B counters. Equation 4 and

Equation 5 are useful in determining and programming a particular value of N:

N = (P × B) + A (4)

Fin = N × fCOMP (5)

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Feature Description (continued)

9.3.5 Phase / Frequency Detectors

The RF and IF PFDs are driven from their respective N and R counter outputs. The maximum frequency for both

the RF and IF phase detector inputs is 10 MHz. The PFD outputs control the respective charge pumps. The

polarity of the pump-up or pump-down control signals are programmed using the RF_CPP or IF_CPP control

bits, depending on whether the RF or IF VCO characteristics are positive or negative. Refer to RF_CPP - RF

Synthesizer Phase Detector Polarity (R0[18]) and IF_CPP - IF Synthesizer Phase Detector Polarity (R3[18]) for

more details. The PFDs have a detection range of −2πto +2π. The PFDs also receive a feedback signal from

the charge pump in order to eliminate dead zone.

9.3.5.1 Phase Comparator and Internal Charge-Pump Characteristics

Notes:

1. The minimum width of the pump-up and pump-down current pulses occur at the CPoutRF or CPoutIF

pins when the loop is phase locked.

2. The diagram assumes positive VCO characteristic that is, RF_CPP or IF_CPP = 1.

3. fris the PFD input from the reference divider (R counter).

4. fpis the PFD input from the programmable feedback divider (N counter).

5. CPout refers to either the RF or IF charge-pump output

Figure 29. Phase Detector and Charge-Pump Operation

9.3.6 Charge Pumps

The charge pump directs charge into or out of an external loop filter. The loop filter converts the charge into a

stable control voltage which is applied to the tuning input of the VCO. The charge pump steers the VCO control

voltage towards VCC during pump-up events and towards GND during pump-down events. When locked,

CPoutRF or CPoutIF are primarily in a tri-state mode with small corrections occurring at the phase comparator

rate. The charge-pump output current magnitude can be selected by toggling the RF_CPG or IF_CPG control

bits.

9.3.7 Microwire Serial Interface

The programmable register set is accessed through the MICROWIRE serial interface. A low voltage logic

interface allows direct connection to 1.8-V devices. The interface is comprised of three signal pins: CLK, DATA

and LE. Serial data is clocked into the 24-bit shift register on the rising edge of CLK. The last two bits decode the

internal control register address. When LE transitions HIGH, DATA stored in the shift register is loaded into one

of four control registers depending on the state of the address bits. The MSB of DATA is loaded in first. The

synthesizers can be programmed even in power-down mode. A complete programming description is provided in

Programming.

9.3.8 Multi-Function Outputs

The Ftest/LD output pin of the LMX243x device is a multi-function output that can be configured as a general-

purpose CMOS tri-state output, push-pull analog lock-detect output, open-drain analog lock-detect output, digital

filtered lock-detect output, or used to monitor the output of the various reference divider (R counter) or feedback

divider (N counter) circuits. The Ftest/LD control word is used to select the desired output function. When the

PLL is in power-down mode, the Ftest/LD output is disabled and is in a high-impedance state. A complete

programming description of the multi-function output is provided in MUX[3:0] - Multifunction Output Select

(R3[23:22]:R0[23:22]).

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Feature Description (continued)

9.3.8.1 Push-Pull Analog Lock-Detect Output

An analog lock-detect status generated from the phase detector is available on the Ftest/LD output pin if

selected. A push-pull configuration can be selected for the lock-detect output signal. With this configuration, the

lock-detect output goes HIGH when the charge pump is inactive. It goes LOW when the charge pump is active

during a comparison cycle. Narrow low-going pulses are observed when the charge pump turns on.

There are three separate push-pull analog lock-detect signals that are routed to the multiplexer. Two of these

monitor the lock status of the individual synthesizers. The third detects the condition when both the RF and IF

synthesizers are in a locked state. External circuitry is required to provide a steady DC signal to indicate when

the PLL is in a locked state. Refer to MUX[3:0] - Multifunction Output Select (R3[23:22]:R0[23:22]) for details on

how to program the different push-pull analog lock-detect options.

9.3.8.2 Open-Drain Analog Lock-Detect Output

The lock-detect output can be an open-drain configuration. In this configuration, the lock-detect output goes to a

high impedance state when the charge pump is inactive. It goes LOW when the charge pump is active during a

comparison cycle. When a pullup resistor is used, narrow low-going pulses are observed when the charge pump

turns on.

Similarly, three separate open-drain analog lock-detect signals are routed to the multiplexer. Two of these

monitor the lock status of the individual synthesizers. The third detects the condition when both the RF and IF

synthesizers are in a locked state. External circuitry is required to provide a steady DC signal to indicate when

the PLL is in a locked state. Refer to MUX[3:0] - Multifunction Output Select (R3[23:22]:R0[23:22]) for details on

how to program the different open-drain analog lock-detect options.

9.3.8.3 Digital Filtered Lock-Detect Output

A digital filtered lock-detect status generated from the phase detector is also available on the Ftest/LD output pin

if selected. The lock-detect digital filter compares the difference between the phases of the inputs to the PFD to

an RC-generated delay of approximately 15 ns. If the phase error is less than the 15-ns RC delay for 5

consecutive reference cycles, the PLL enters a locked state (HIGH). Once in lock, the RC delay is changed to

approximately 30 ns. Once the phase error becomes greater than the 30-ns RC delay, the PLL falls out of lock

(LOW). When the PLL is in power-down mode, the Ftest/LD output is forced LOW. A flow chart of the digital

filtered lock-detect output is shown in Figure 30.

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Feature Description (continued)

Figure 30. Digital Lock-Detect Operation

Similarly, three separate digital filtered lock-detect signals are routed to the multiplexer. Two of these monitor the

lock status of the individual synthesizers. The third detects the condition when both the RF and IF synthesizers

are in a locked state. External circuitry is not required when the digital filtered lock-detect option is selected.

Refer to MUX[3:0] - Multifunction Output Select (R3[23:22]:R0[23:22]) for details on how to program the different

digital filtered lock-detect options.

9.3.8.4 Reference Divider and Feedback Divider Output

The outputs of the various N and R dividers can be monitored by selecting the appropriate Ftest/LD word. This is

essential when performing OSCin or Fin sensitivity measurements. Refer to the LMX243x FinRF Sensitivity Test

Setup or LMX243x OSCin Sensitivity Test Setup sections for more details.

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Feature Description (continued)

NOTE

The R and N outputs that are routed to the Ftest/LD are R/2 and N/2, respectively. The

internal /2 circuit is used to provide a 50% duty cycle. Refer to MUX[3:0] - Multifunction

Output Select (R3[23:22]:R0[23:22]) for more details on how to route the appropriate

divider output to the Ftest/LD pin.

9.3.9 Fastlock Output

The LMX243x fastlock feature allows a faster loop response time during lock aquisition. The loop response time

(lock time) can be approximately halved if the loop bandwidth is doubled. In order to achieve this, the same gain

/ phase relationship must be maintained when the loop bandwidth is doubled. When the FLoutRF or OSCout/

FLoutIF pins are configured as fastLock outputs, an open-drain device is enabled. The open-drain device

switches in a resistor parallel, and of equal value, to R2 of the external loop filter.

The loop bandwidth is effectively doubled and stability is maintained. Once locked to the correct frequency, the

PLL returns to a steady-state condition. The LMX243x offers two methods to achieve fastlock: manual and

automatic. Manual fastlock is achieved by increasing the charge pump current from 1 mA (RF_CPG/ IF_CPG Bit

= 0) in the steady-state mode, to 4 mA (RF_CPG/ IF_CPG Bit = 1) in fastlock mode. Automatic fastlock is

achieved by programming the time-out counter register (RF_TOC/ IF_TOC) with the appropriate number of

phase comparison cycles that the RF/ IF synthesizer spends in the fastlock state. Refer to R2 Register and R5

9.3.10 Counter Reset

When the RF_RST/ IF_RST bit is enabled, both the feedback divider (RF_N/ IF_N) and reference divider (RF_R/

IF_R) are held at their load point. When the device is programmed to normal operation, both the feedback divider

and reference divider are enabled and resume counting in close alignment to each other. Refer to RF_RST - RF

Synthesizer Counter Reset (R0[21]) and IF_RST - IF Synthesizer Counter Reset (R3[21]) for more details.

9.4 Device Functional Modes

9.4.1 Power Control

The LMX243x device can be asynchronously powered down when the EN pin is set LOW, independent of the

state of the power-down bits.

NOTE

The OSCout/ FLoutIF pin can still be enabled if the ENosc pin is set HIGH, independent of

the state of the EN pin. This capability allows the oscillator buffer to be used as a crystal

oscillator.

When EN is set HIGH, power down is controlled through the MICROWIRE. The power-down word is comprised

of the RF_PD/IF_PD bit, in conjunction with the RF_CPT/IF_CPT bit. The power-down control word is used to

set the operating mode of the device. Refer to RF_CPT - RF Synthesizer Charge-Pump Tri-State (R0[20]),

RF_PD - RF Synthesizer Power Down (R1[23]),IF_CPT - IF Synthesizer Charge-Pump Tri-State (R3[20]), and

IF_PD - IF Synthesizer Power Down (R4[23]) for details on how to program the RF or IF power-down bits.

When either synthesizer is powered down, the respective prescaler, phase detector, and charge-pump circuit is

disabled. The CPoutRF/ CPoutIF, FinRF/ FinIF, and FinRF* pins are all forced to a high impedance state. The

reference divider and feedback divider circuits are held at the load point during power down. The oscillator buffer

is disabled when the ENosc pin is set LOW. The OSCin pin is forced to a HIGH state through an approximate

100-kΩresistance when this condition exists. When either synthesizer is activated, the respective prescaler,

phase detector, charge-pump circuit, and the oscillator buffer are all powered up. The feedback divider and

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Device Functional Modes (continued)

reference divider are held at their load point. This allows the reference oscillator, feedback divider, reference

divider, and prescaler circuitry to reach proper bias levels. After a finite delay, the feedback and reference

dividers are enabled and resume counting in close alignment (the maximum error is one prescaler cycle). The

MICROWIRE control register remains active and capable of loading and latching data while in power-down

mode.

9.4.1.1 Synchronous Power-Down Mode

In this mode, the power-down function is gated by the charge pump. When the device is configured for

synchronous power down, the device enters the power-down mode upon completion of the next charge-pump

pulse event.

9.4.1.2 Asynchronous Power-Down Mode

In the asynchronous power-down mode, the power-down function is NOT gated by the completion of a charge-

pump pulse event. When the device is configured for asynchronous power down, the part goes into power-down

mode immediately.

Table 7. Power-Down Modes

RF_CPT / IF_CPT RF_PD /

EN PIN OPERATING MODE

BIT IF_PD BIT

0 X(1) X(1) Asynchronous Power Down

1 0 0 PLL Active. Normal Operation

1 1 0 PLL Active. Charge-Pump Output in High-Impedance State

1 0 1 Synchronous Power Down

1 1 1 Asynchronous Power Down

(1) X refers to a don’t care condition.

9.5 Programming

9.5.1 Microwire Interface

The 24-bit shift register is loaded through the MICROWIRE interface. The shift register consists of a 21-bit

DATA[20:0] FIELD and a 3-bit ADDRESS[2:0] FIELD as shown in Table 8. The ADDRESS FIELD is used to

decode the internal control register address. When LE transitions HIGH, DATA stored in the shift register is

loaded into one of 6 control registers depending on the state of the ADDRESS bits. The MSB of DATA is loaded

into the shift register first. The DATA FIELD assignments are shown in Control Register Content Map.

Table 8. Register Structure

MSB LSB

DATA[20:0] ADDRESS[2:0]

23 3 2 0

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9.5.2 Control Register Location

The ADDRESS[2:0] bits decode the internal register address. The Table 9 shows how the ADDRESS bits are

mapped into the target control register.

Table 9. Control Register Locations

ADDRESS[2:0] TARGET

FIELD REGISTER

0 0 0 R0

0 0 1 R1

0 1 0 R2

0 1 1 R3

1 0 0 R4

1 0 1 R5

9.6 Register Maps

9.6.1 Control Register Content Map

The control register content map describes how the bits within each control register are allocated to specific

control functions. The bits that are marked 0 must be programmed as such to ensure proper device operation.

Table 10. Control Register Content Map

23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

ADDRESS

REG DATA[20:0] FIELD [2:0]

FIELD

RF RF RF RF

_ _ _ _

R0 MUX[3:2] RF_R[14:0] 0 0 0

RS CP CP CP

T T G P

RF RF LMX2430/33 LMX2430/33

R1 _ _ 0 0 1

RF_B[14:0] RF_A[3:0]

PD P

RF RF LMX2434 LMX2434

R1 _ _ 0 0 1

RF_B[13:0] RF_A[4:0]

PD P

R2 0 0 0 0 0 0 0 0 0 RF_TOC[11:0] 0 1 0

IF_ IF_ IF_ IF_

R3 MUX[1:0] RS CP CP CP IF_R[14:0] 0 1 1

T T G P

IF_ IF_

R4 0 IF_B[13:0] IF_A[3:0] 1 0 0

PD P

R5 0 0 0 0 0 0 0 0 0 IF_TOC[11:0] 1 0 1

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9.6.2 R0 Register

The R0 register contains the RF_R, RF_CPP, RF_CPG, RF_CPT, and RF_RST control words, in addition to two

of the four bits that compose the MUX control word. The detailed descriptions and programming information for

each control word is discussed in the following sections.

Table 11. R0 Register

23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

ADDRESS

REG DATA[20:0] FIELD [2:0]

FIELD

RF RF RF RF

_ _ _ _

R0 MUX[3:2] RF_R[14:0] 0 0 0

RS CP CP CP

T T G P

9.6.2.1 RF_R[14:0] - RF Synthesizer Programmable Reference Divider (R Counter) (R0[17:3])

The RF reference divider (RF_R) can be programmed to support divide ratios from 3 to 32,767. Divide ratios less

than 3 are prohibited.

Table 12. PLL R Divider

RF_R[14:0]

DIVIDE RATIO 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

3 000000000000011

4 000000000000100

• •••••••••••••••

32767 111111111111111

9.6.2.2 RF_CPP - RF Synthesizer Phase Detector Polarity (R0[18])

The RF_CPP bit is used to control the PFD polarity of the RF synthesizer based on the VCO tuning

characteristics.

Table 13. Phase Detector Polarity

FUNCTION

CONTROL BIT REGISTER LOCATION DESCRIPTION 0 1

RF_CPP R0[18] RF Phase and Frequency RF VCO Negative Tuning RF VCO Positive Tuning

Detector Polarity Characteristics Characteristics

Figure 31. RF VCO Characteristics

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9.6.2.3 RF_CPG - RF Synthesizer Charge-Pump Current Gain (R0[19])

The RF_CPG bit controls the charge-pump gain of the RF synthesizer. Two gain levels are available.

Table 14. Charge-Pump Polarity

FUNCTION

CONTROL BIT REGISTER LOCATION DESCRIPTION 0 1

RF Charge-Pump Current LOW HIGH

RF_CPG R0[19] Gain 1 mA 4 mA

9.6.2.4 RF_CPT - RF Synthesizer Charge-Pump Tri-State (R0[20])

The RF_CPT bit allows the charge pump to be switched between a normal operating mode and a high-

impedance output state. This happens asynchronously with the change in the RF_CPT bit.

Furthermore, the RF_CPT bit operates in conjuction with the RF_PD bit to set a synchronous or an

asynchronous power-down mode. Refer to RF_PD - RF Synthesizer Power Down (R1[23]) for more details on

how to program the RF_PD bit.

Table 15. Charge-Pump Tri-State

FUNCTION

CONTROL BIT REGISTER LOCATION DESCRIPTION 0 1

RF_CPT R0[20] RF Charge-Pump tri-state RF Charge Pump Normal RF Charge-Pump Output

Operation in High Impedance State

9.6.2.5 RF_RST - RF Synthesizer Counter Reset (R0[21])

The RF_RST bit resets the RF_A, RF_B and RF_R counters. After removing the reset, the RF_A and RF_B

counters resume counting in close alignment with the RF_R counter. The maximum error is one prescaler cycle.

Table 16. N Counter Reset

FUNCTION

CONTROL BIT REGISTER LOCATION DESCRIPTION 0 1

RF_RST R0[21] RF Counter Reset RF_A, RF_B and RF_R RF_A, RF_B and RF_R

Normal Operation Reset

9.6.3 R1 Register

The R1 register contains the RF_A, RF_B, RF_P, and RF_PD control words. The RF_A and RF_B control words

are used to set up the programmable feedback divider. The detailed descriptions and programming information

for each control word is discussed in the following sections.

Table 17. RI Register

23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

ADDRESS

REG DATA[20:0] FIELD [2:0]

FIELD

RF RF LMX2430/33 LMX2430/33

R1 _ _ 0 0 1

RF_B[14:0] RF_A[3:0]

PD P

RF RF LMX2434 LMX2434

R1 _ _ 0 0 1

RF_B[13:0] RF_A[4:0]

PD P

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9.6.3.1 LMX243x RF Synthesizer Swallow Counter

9.6.3.1.1 RF_A[3:0] - LMX2430/33 RF Synthesizer Swallow Counter (A Counter) (R1[6:3])

The RF_A control word is used to set up the A counter of the RF synthesizer. For both the LMX2430 and

LMX2433, the A counter is a 4-bit swallow counter used in the programmable feedback divider. The RF_A

control word can be programmed to values ranging from 0 to 15.

Table 18. RF_A Divider for LMX2430/33

LMX2430/33

RF_A[3:0]

DIVIDE RATIO 3210

00000

10001

•••••

15 1 1 1 1

9.6.3.1.2 RF_A[4:0] - LMX2434 RF Synthesizer Swallow Counter (A Counter) (R1[7:3])

The LMX2434 A counter is a 5-bit swallow counter used in the programmable feedback divider. The RF_A

control word can be programmed to values ranging from 0 to 31.

Table 19. RF A Divider for LMX2434

LMX2434

RF_A[4:0]

DIVIDE RATIO 4 3 2 1 0

0 0 0 0 0 0

1 0 0 0 0 1

• • • • • •

31 1 1 1 1 1

9.6.3.2 LMX243x RF Synthesizer Programmable Binary Counter

9.6.3.2.1 RF_B[14:0] - LMX2430/33 RF Synthesizer Programmable Binary Counter (B Counter) (R1[21:7])

The RF_B control word is used to set up the B counter of the RF synthesizer. For both the LMX2430 and

LMX2433, the B counter is a 15-bit programmable binary counter used in the programmable feedback divider.

The RF_B control word can be programmed to values ranging from 3 to 32,767. Divide ratios less than 3 are

prohibited.

Table 20. RF B Divider for LMX2430/33

LMX2430/33

DIVIDE RF_B[14:0]

RATIO 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

3000000000000011

4000000000000100

••••••••••••••••

32767111111111111111

9.6.3.2.2 RF_B[13:0] - LMX2434 RF Synthesizer Programmable Binary Counter (B Counter) (R1[21:8])

The LMX2434 B counter is a 14-bit programmable binary counter used in the programmable feedback divider.

The RF_B control word can be programmed to values ranging from 3 to 16,383. Divide ratios less than 3 are

prohibited.

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Table 21. RF B Divider for LMX2434

LMX2434

DIVIDE RF_B[13:0]

RATIO 13 12 11 10 9 8 7 6 5 4 3 2 1 0

300000000000011

400000000000100

•••••••••••••••

16383 1 1 1 1 1 1 1 1 1 1 1 1 1 1

9.6.3.3 LMX243x RF Synthesizer Prescaler Select

9.6.3.3.1 RF_P - LMX2430/33 RF Synthesizer Prescaler Select (R1[22])

Both the LMX2430 and LMX2433 RF synthesizers use a selectable dual-modulus prescaler. An 8/9 or a 16/17

prescale ratio can be selected.

Table 22. Prescaler Select Bit for LMX2430/33

FUNCTION

CONTROL BIT REGISTER LOCATION DESCRIPTION 0 1

RF_P R1[22] LMX2430/33 8/9 Prescaler Selected 16/17 Prescaler Selected

RF Prescaler Select

9.6.3.3.2 RF_P - LMX2434 RF Synthesizer Prescaler Select (R1[22])

The LMX2434 RF synthesizer uses a selectable dual-modulus prescaler. A 16/17 or a 32/33 prescale ratio can

be selected.

Table 23. Prescaler Select Bit for LMX2434

FUNCTION

CONTROL BIT REGISTER LOCATION DESCRIPTION 0 1

RF_P R1[22] LMX2434 16/17 Prescaler Selected 32/33 Prescaler Selected

RF Prescaler Select

9.6.3.4 RF_PD - RF Synthesizer Power Down (R1[23])

The RF_PD bit is used to switch the RF PLL between a powered-up and powered-down mode.

Furthermore, the RF_PD bit operates in conjunction with the RF_CPT bit to set a synchronous or an

asynchronous power-down mode. Refer to RF_CPT - RF Synthesizer Charge-Pump Tri-State (R0[20]) for more

details on how to program the RF_CPT bit.

Table 24. Power Down Bit

FUNCTION

CONTROL BIT REGISTER LOCATION DESCRIPTION 0 1

RF_PD R1[23] RF Power down RF PLL Active RF PLL Power down

9.6.4 R2 Register

The R2 Register contains the RF_TOC control word. The RF_TOC is used to set up the fastlock circuitry of the

RF synthesizer. The RF_TOC is a 12-bit binary counter programmable from 0 to 4095.

Table 25. R2 Register

23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

ADDRESS

REG DATA[20:0] FIELD [2:0]

FIELD

R2 0 0 0 0 0 0 0 0 0 RF_TOC[11:0] 0 1 0

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9.6.4.1 RF_TOC[0:11] - RF Synthesizer Time-Out Counter (R2[14:3])

The FLoutRF pin can be configured as a general-purpose CMOS tri-state output or as a fastlock output by

programming the RF_TOC appropriately. When the RF_TOC is programmed from 0 to 3, automatic fastlock is

disabled, and the FLoutRF pin is either configured as a general-purpose CMOS tri-state output or manual

fastlock is enabled. When the RF_TOC is programmed to 0, the FLoutRF pin is in tri-state (high impedance)

mode. The charge-pump current is then the value specified by RF_CPG (R0[19]). When the RF_TOC is

programmed to 1, the FLoutRF pin is pulled to a LOW state. The charge-pump current is then set to a HIGH gain

state (RF_CPG bit = 1). This condition is known as the manual fastlock. When the RF_TOC is programmed to 2,

the FLout_RF pin is again pulled to a LOW state, but this time the charge-pump current is the value specified by

RF_CPG (R0[19]). When the RF_TOC is programmed to 3, the FLoutRF pin is pulled to a HIGH state. Again, the

charge-pump current is the value specified by RF_CPG (R0[19]). When the RF_TOC is programmed from 4 to

4095, fastlock is enabled, and the FLoutRF pin is pulled to a LOW state. Fastlock time outs after the specified

number of PFD events. At this time, the FLoutRF pin switches to tri-state (high impedance) mode. The value

programmed into RF_TOC represents the number of PFD events that the RF synthesizer spends in the fastlock

state.

NOTE

Any write to the RF_TOC requires a PFD event on the RF synthesizer to latch the

contents. This means that writes to the RF_TOC take effect synchronously with the next

PFD event.

Table 26. Fastlock Time-Out Counter

FASTLOCK PERIOD FLoutRF PIN

RF_TOC[11:0] FASTLOCK MODE ICPoutRF MAGNITUDE

[PFD EVENTS] FUNCTIONALITY / STATE

0 Disabled N/A General-Purpose. ICPoutRF magnitude

High Impedance State controlled by R0[19]

1 Enabled N/A General-Purpose. ICPoutRF = 4 mA

Manual Fastlock Logic LOW State

2 Disabled N/A General-Purpose. ICPoutRF magnitude

Logic LOW State controlled by R0[19]

3 Disabled N/A General-Purpose. ICPoutRF magnitude

Logic HIGH State controlled by R0[19]

4 Enabled 4 FastLock. ICPoutRF = 4 mA

Automatic Fastlock Logic LOW State. Switches Switches to 1 mA after 4

to High Impedance after 4 PFD events

PFD events

… … … … …

4095 Enabled 4095 FastLock. ICPoutRF = 4 mA

Automatic Fastlock Logic LOW State. Switches Switches to 1 mA after

to High Impedance after 4095 PFD events

4095 PFD events

9.6.4.2 R3 Register

The R3 register contains the IF_R, IF_CPP, IF_CPG, IF_CPT, and IF_RST control words, in addition to two of

the four bits that compose the MUX control word. The detailed descriptions and programming information for

each control word is discussed in the following sections.

Table 27. R3 Register

REG 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

ADDRESS

DATA[20:0] FIELD [2:0]

FIELD

IF_ IF_ IF_ IF_

R3 MUX[1:0] RS CP CP CP IF_R[14:0] 0 1 1

T T G P

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9.6.4.2.1 IF_R[14:0] - IF Synthesizer Programmable Reference Divider (R Counter) (R3[17:3])

The IF reference divider (IF_R) can be programmed to support divide ratios from 3 to 32,767. Divide ratios less

than 3 are prohibited.

Table 28. IF R Divider

IF_R[14:0]

DIVIDE RATIO 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

3 000000000000011

4 000000000000100

• •••••••••••••••

32767 111111111111111

9.6.4.2.2 IF_CPP - IF Synthesizer Phase Detector Polarity (R3[18])

The IF_CPP bit is used to control the PFD polarity of the IF synthesizer based on the VCO tuning characteristics.

Table 29. IF PLL Charge-Pump Polarity

FUNCTION

CONTROL BIT REGISTER LOCATION DESCRIPTION 0 1

IF_CPP R3[18] IF PFD Polarity IF VCO Negative Tuning IF VCO Positive Tuning

Characteristics Characteristics

Figure 32. IF VCO Characteristics

9.6.4.2.3 IF_CPG - IF Synthesizer Charge-Pump Current Gain (R3[19])

The IF_CPG bit controls the charge-pump gain of the IF synthesizer. Two gain levels are available.

Table 30. IF PLL Phase Detector Polarity Bit

FUNCTION

CONTROL BIT REGISTER LOCATION DESCRIPTION 0 1

IF Charge-Pump Current LOW HIGH

IF_CPG R3[19] Gain 1 mA 4 mA

9.6.4.2.4 IF_CPT - IF Synthesizer Charge-Pump Tri-State (R3[20])

The IF_CPT bit allows the charge pump to be switched between a normal operating mode and a high impedance

output state. This happens asynchronously with the change in the IF_CPT bit.

Furthermore, the IF_CPT bit operates in conjuction with the IF_PD bit to set a synchronous or an asynchronous

power-down mode. Refer to IF_PD - IF Synthesizer Power Down (R4[23]) for more details on how to program

the IF_PD bit.

Table 31. IF PLL Charge-Pump Polarity Bit

FUNCTION

CONTROL BIT REGISTER LOCATION DESCRIPTION 0 1

IF_CPT R3[20] IF Charge-Pump Tri-State IF Charge Pump Normal IF Charge-Pump Output in

Operation High Impedance State

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LMX2433

LMX2434

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9.6.4.2.5 IF_RST - IF Synthesizer Counter Reset (R3[21])

The IF_RST bit resets of the IF_A, IF_B and IF_R counters. After removing the reset, the IF_A and IF_B

counters resume counting in close alignment with the IF_R counter. The maximum error is one prescaler cycle.

Table 32. IF PLL Counter Reset

FUNCTION

CONTROL BIT REGISTER LOCATION DESCRIPTION 0 1

IF_RST R3[21] IF Counter Reset IF_A, IF_B and IF_R IF_A, IF_B and IF_R

Normal Operation Reset

9.6.5 R4 Register

The R4 register contains the IF_A, IF_B, IF_P, and IF_PD control words. The IF_A and IF_B control words are

used to set up the programmable feedback divider. The detailed descriptions and programming information for

each control word is discussed in the following sections. R4[21] is always set to 0.

Table 33. R4 Register

REG 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

ADDRESS

DATA[20:0] FIELD [2:0]

FIELD

IF_ IF_

R4 0 IF_B[13:0] IF_A[3:0] 1 0 0

PD P

9.6.5.1 IF_A[3:0] - IF Synthesizer Swallow Counter (A Counter) (R4[6:3])

The IF_A control word is used to set up the A counter of the IF synthesizer. The A counter is a 4-bit swallow

counter used in the programmable feedback divider. The IF_A control word can be programmed to values

ranging from 0 to 15.

Table 34. IF A counter Bit

IF_A[3:0]

DIVIDE RATIO 3210

00000

10001

•••••

15 1 1 1 1

9.6.5.2 IF_B[13:0] - IF Synthesizer Programmable Binary Counter (B Counter) (R4[20:7])

The IF_B control word is used to set up the B counter of the IF synthesizer. The B counter is a 14-bit

programmable binary counter used in the programmable feedback divider. The IF_B control word can be

programmed to values ranging from 3 to 16,383. Divide ratios less than 3 are prohibited.

Table 35. IF B Counter

IF_B[13:0]

DIVIDE

RATIO 13 12 11 10 9 8 7 6 5 4 3 2 1 0

3 0 0 0 0 0 0 0 0 0 0 0 0 1 1

4 0 0 0 0 0 0 0 0 0 0 0 1 0 0

• • • • • • • • • • • • • • •

16383 1 1 1 1 1 1 1 1 1 1 1 1 1 1

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9.6.5.2.1 IF_P - IF Synthesizer Prescaler Select (R4[22])

The LMX243x IF synthesizer uses a selectable dual modulus prescaler. An 8/9 or a 16/17 prescale ratio can be

selected.

Table 36. IF Prescaler Select Bit

FUNCTION

CONTROL BIT REGISTER LOCATION DESCRIPTION 0 1

IF_P R4[22] IF Prescaler Select 8/9 Prescaler Selected 16/17 Prescaler Selected

9.6.5.3 IF_PD - IF Synthesizer Power Down (R4[23])

The IF_PD bit is used to switch the IF PLL between a powered-up and powered-down mode.

Furthermore, the IF_PD bit operates in conjuction with the IF_CPT bit to set a synchronous or an asynchronous

power-down mode. Refer to IF_CPT - IF Synthesizer Charge-Pump Tri-State (R3[20]) for more details on how to

program the IF_CPT bit.

Table 37. IF PLL Powerdown Bit

FUNCTION

CONTROL BIT REGISTER LOCATION DESCRIPTION 0 1

IF_PD R4[23] IF Power down IF PLL Active IF PLL Power down

9.6.6 R5 Register

The R5 Register contains the IF_TOC control word. The IF_TOC is used to set up the fastlock circuitry of the IF

synthesizer. The IF_TOC is a 12-bit binary counter programmable from 0 to 4095.

Table 38. R5 Register

REG 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

ADDRESS

DATA[20:0] FIELD [2:0]

FIELD

R5 0 0 0 0 0 0 0 0 0 IF_TOC[11:0] 1 0 1

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LMX2430

LMX2433

LMX2434

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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

9.6.6.1 IF_TOC[0:11] - IF Synthesizer Time-Out Counter (R5[14:3])

The OSCout/ FLoutIF pin can be configured as a general-purpose CMOS tri-state output or as a fastlock output

by programming the IF_TOC appropriately. When the IF_TOC is programmed from 0 to 3, automatic fastlock is

disabled, and the OSCout/ FLoutIF pin is configured as a general-purpose CMOS tri-state output or manual

fastlock is enabled. When the IF_TOC is programmed to 0, the OSCout/ FLoutIF pin is in tri-state (high

impedance) mode. The charge-pump current is then the value specified by IF_CPG (R3[19]). When the IF_TOC

is programmed to 1, the OSCout/ FLoutIF pin is pulled to a LOW state. The charge-pump current is then set to a

HIGH gain state (IF_CPG bit = 1). This condition is known as the manual fastlock. When the IF_TOC is

programmed to 2, the OSCout/ FLout_IF pin is again pulled to a LOW state, but this time the charge-pump

current is the value specified by IF_CPG (R3[19]). When the IF_TOC is programmed to 3, the OSCout/ FLoutIF

pin is pulled to a HIGH state. Again, the charge-pump current is the value specified by IF_CPG (R3[19]). When

the IF_TOC is programmed from 4 to 4095, fastlock is enabled, and the OSCout/ FLoutIF pin is pulled to a LOW

state. Fastlock timeouts after the specified number of PFD events. At this time, the OSCout/ FLoutIF pin switches

to tri-state (high impedance) mode. The value programmed into IF_TOC represents the number of PFD events

that the IF synthesizer spends in the fastlock state.

NOTE

Any write to the IF_TOC requires a PFD event on the IF synthesizer to latch the contents.

This means that writes to the IF_TOC take effect synchronously with the next PFD event.

Table 39. IF PLL Fastlock Time-Out Counter

FASTLOCK PERIOD OSCout/ FLoutIF PIN

IF_TOC[11:0] FASTLOCK MODE ICPoutIF MAGNITUDE

[PFD Events] FUNCTIONALITY / STATE

0 Disabled N/A General-Purpose. ICPoutIF magnitude

High Impedance State controlled by R3[19]

1 Enabled N/A General-Purpose. ICPoutIF = 4 mA

Manual Fastlock Logic LOW State

2 Disabled N/A General-Purpose. ICPoutIF magnitude

Logic LOW State controlled by R3[19]

3 Disabled N/A General-Purpose. ICPoutIF magnitude

Logic HIGH State controlled by R3[19]

4 Enabled 4 FastLock. ICPoutIF = 4 mA

Automatic Fastlock Logic LOW State. Switches Switches to 1 mA after 4

to High Impedance after 4 PFD events

PFD events

… … … … …

4095 Enabled 4095 FastLock. ICPoutIF = 4 mA

Automatic Fastlock Logic LOW State. Switches Switches to 1 mA after

to High Impedance after 4095 PFD events

4095 PFD events

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9.6.7 MUX[3:0] - Multifunction Output Select (R3[23:22]:R0[23:22])

The MUX control word is used to determine which signal is routed to the Ftest/LD pin.

Table 40. Multifunction Output Select(1)

MUX[3:0] MUX OUTPUT STATE

0 0 0 0 High Impedance (Tri-state) State Output

0 0 0 1 Logic HIGH State Output

0 0 1 0 Logic LOW State Output

RF PLL and IF PLL Digital Lock Detect.

0 0 1 1 Open-Drain Output

RF PLL Digital Lock Detect.

0 1 0 0 Open-Drain Output

IF PLL Digital Lock Detect.

0 1 0 1 Open-Drain Output

RF PLL and IF PLL Analog Lock Detect.

0 1 1 0 Open-Drain Output

RF PLL Analog Lock Detect.

0 1 1 1 Open-Drain Output

IF PLL Analog Lock Detect.

1 0 0 0 Open-Drain Output

RF PLL and IF PLL Analog Lock Detect.

1 0 0 1 Push-Pull Output

RF PLL Analog Lock Detect.

1 0 1 0 Push-Pull Output

IF PLL Analog Lock Detect.

1 0 1 1 Push-Pull Output

1 1 0 0 IF_R/ 2 Frequency

1 1 0 1 IF_N/ 2 Frequency

1 1 1 0 RF_R/ 2 Frequency

1 1 1 1 RF_N/ 2 Frequency

(1) 1. RF_N = (RF_B × RF_P) + RF_A

2. IF_N = (IF_B × IF_P) + IF_A

Product Folder Links: LMX2430 LMX2433 LMX2434

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LMX2433

LMX2434

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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

10 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

10.1 Application Information

The LMX2430 family of devices can be used in a broad class of applications. LMX2430x devices have very low

current consumption and are well-suited for many lower power applications. Because these devices have two

PLLs, they can be used to generate two distinct frequencies. However, it is a perfectly valid thing to only use one

of the PLLs and power down the other side. When only one side is used, be sure to power the other side down,

but do NOT disconnect the power pins for the unused side as they are shared across several internal blocks.

When the unused side is powered down, it draws no current, and the counters and charge pump are not running

or generating any noise and spurs. Figure 33 generally applies to most applications.

Product Folder Links: LMX2430 LMX2433 LMX2434

DATA

VCC

GND

FinIF

CPoutiF

Enose

OSCout

OSCin

VCC

Ftest/LD

DATA

CLK

VCC

FinRF*

FinRF

GND

CPoutRF

GND

FLoutRF

V _PLL

R34

3.3 WU1

V _PLL

C21

100 pF

LMX243X

OSCin

V _PLL

R20

3.3 W

100 pF

Ftest/LD

CLK

R25

3.3 W

C12

100 pF

C14

100 pF

V _PLL

100k R21

100k R22

1 uF

IN+

V–

VOUT

IN–

V+

LM6211

10 W

R23

1 uF

V _AMP

R1_RF

Ca_LF

Open

TBD

R2_RF

C1_RF

C2_RF

R3_RF R4_RF

C3_RF

0WC4_RF

Open

V _RF

VCC

GND

MOD

GND

R24

5.6 W

C10

1 uF

GND

RFOUT

R27

18 W

R26

18 W

R26 C15

100 pF

RFOUT

VCO

LMX2430

LMX2433

LMX2434

SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

www.ti.com

10.2 Typical Application

Figure 33. Typical Use Case

Product Folder Links: LMX2430 LMX2433 LMX2434

LMX2430

LMX2433

LMX2434

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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

10.2.1 Design Requirements

Table 41 lists the design parameters of the LMX243x.

Table 41. Design Parameters

PARAMETER VALUE

KPD Charge-Pump Gain 4 mA

CVCO VCO Input Capacitance 22 pF

fPD Phase Detector Frequency 1 MHz

fOSC OSCin Frequency 100 MHz

BW Loop Bandwidth 31.1 kHz

PM Phase Margin 59.6 degrees

Gamma Gamma 0.9

T3/T1 T3/T1 Ratio 177.1%

C1_RF 270 pF

C2_RF 10 nF

C3_RF 1 nF

C4_RF Loop Filter Components Open

R2_RF 1.8 Ω

R3_RF 820 Ω

R4_RF 0 Ω

10.2.2 Detailed Design Procedure

The loop filter design is key and involves trade-offs between lock time, phase noise, and spurs. The TI website

has references and design and simulation tools that can be used to design the loop filter and simulate the

performance.

10.2.3 Application Curves

Figure 35. Phase Detector Spurs

Figure 34. Phase Noise

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11 Power Supply Recommendations

Low-noise regulators are generally recommended for the supply pins. It is acceptable to have one regulator

supply the part, although it is best to implement individual bypassing as shown in the Layout Guidelines for the

best spur performance. The charge-pump pins are typically the most sensitive to supply noise, but the external

VCO used with this device is likely to be orders of magnitude more sensitive.

12 Layout

12.1 Layout Guidelines

In general, there are two cases for layout:

1. Use as a single PLL: In this case, all power supply pins must be connected, but for those on the unused PLL,

bypassing is not necessary, and they can be shorted together. Leave unused outputs unconnected, and do

not ground them.

2. Use as a dual PLL: In this case, supply coupling is much more critical as there can be crosstalk between the

two PLLs. There must be isolation in the form of resistors or inductors between the charge-pump supply pins,

and decoupling capacitors are more important.

12.2 Layout Example

Figure 36. Layout Example

Product Folder Links: LMX2430 LMX2433 LMX2434

LMX2430

LMX2433

LMX2434

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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

13 Device and Documentation Support

13.1 Device Support

13.1.1 Device Nomenclature

13.1.1.1 List of Definitions

fCOMP:RF or IF phase detector comparison frequency

Fin: RF or IF input frequency

A: RF_A or IF_A counter value

B: RF_B or IF_B counter value

P: Preset modulus of the dual moduIus prescaler

LMX2430 RF synthesizer: P = 8 or 16

LMX2433 RF synthesizer: P = 8 or 16

LMX2434 RF synthesizer: P = 16 or 32

LMX243x IF synthesizer: P = 8 or 16

13.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 42. Related Links

TECHNICAL TOOLS & SUPPORT &

PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY

LMX2430 Click here Click here Click here Click here Click here

LMX2433 Click here Click here Click here Click here Click here

LMX2434 Click here Click here Click here Click here Click here

13.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

13.4 Trademarks

PLLatinum, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

13.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

13.6 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

Product Folder Links: LMX2430 LMX2433 LMX2434

LMX2430

LMX2433

LMX2434

SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016

www.ti.com

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: LMX2430 LMX2433 LMX2434

PACKAGE OPTION ADDENDUM

www.ti.com 26-Jul-2017

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LMX2430SLEX/NOPB ACTIVE ULGA NPE 20 2500 Green (RoHS

& no Sb/Br) NIAU Level-1-260C-UNLIM -40 to 85 X2430

SLE

LMX2430TM/NOPB ACTIVE TSSOP PW 20 73 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMX2430

TM>D

LMX2430TMX/NOPB ACTIVE TSSOP PW 20 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMX2430

TM>D

LMX2433SLEX/NOPB ACTIVE ULGA NPE 20 2500 Green (RoHS

& no Sb/Br) NIAU Level-1-260C-UNLIM -40 to 85 X2433

SLE

LMX2434SLEX/NOPB ACTIVE ULGA NPE 20 2500 Green (RoHS

& no Sb/Br) NIAU Level-1-260C-UNLIM -40 to 85 X2434

SLE

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

PACKAGE OPTION ADDENDUM

www.ti.com 26-Jul-2017

Addendum-Page 2

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LMX2430SLEX/NOPB ULGA NPE 20 2500 330.0 12.4 3.8 3.8 1.3 8.0 12.0 Q1

LMX2430TMX/NOPB TSSOP PW 20 2500 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1

LMX2433SLEX/NOPB ULGA NPE 20 2500 330.0 12.4 3.8 3.8 1.3 8.0 12.0 Q1

LMX2434SLEX/NOPB ULGA NPE 20 2500 330.0 12.4 3.8 3.8 1.3 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Aug-2017

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LMX2430SLEX/NOPB ULGA NPE 20 2500 367.0 367.0 35.0

LMX2430TMX/NOPB TSSOP PW 20 2500 367.0 367.0 35.0

LMX2433SLEX/NOPB ULGA NPE 20 2500 367.0 367.0 35.0

LMX2434SLEX/NOPB ULGA NPE 20 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Aug-2017

Pack Materials-Page 2

MECHANICAL DATA

NPE0020A

www.ti.com

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TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI

products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,

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Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life

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