SK-SX72-CG624RTFG484 - Microsemi

Application Note AC275

November 2011 1

CCGA to FBGA

Adapter Sockets

Table of Contents

Introduction

Microsemi® SoC Products Group recently introduced RTAX-S/L, the next generation designed-for-space

antifuse field programmable gate arrays (FPGAs). RTAX-S/L, with up to four million system gates, is SoC

Products Group's highest density family, providing the space designer with nearly 250 k ASIC gates and

error correction and detection (EDAC) protected static RAM. RTAX-S/L is the first SoC Products Group

family designed for use in the ceramic column grid array (CCGA) package configuration. SoC Products

Group has developed a low cost prototyping methodology for RTAX-S/L using the Axcelerator® family of

FPGAs.

RTAX-S/L is a derivative of the Axcelerator family. RTAX-S/L FPGAs can be prototyped using the

comparable commercial Axcelerator device at a much lower cost than the equivalent space device. SoC

Products Group has developed a CCGA to fine pitch ball grid array (FBGA) adapter socket to reduce

RTAX-S/L development costs. SoC Products Group is also offering the CG624 package with the

RTSX72SU, using the A54SX72A as the prototyping vehicle.

This assembly procedure document covers the RTAX-S/L and RTSX-SU product families, which explains

what a CCGA-FBGA adapter socket is, defines the component parts, and describes how to assemble the

adapter. Once the adapter is assembled, the care and handling are similar to a CCGA packaged device.

The intention of the prototyping adaptors is to provide functional validation and not at-speed timing

validation. The prototyping adaptors may limit the performance of the FPGA I/O buffers.

The CCGA to FBGA Adapter Socket

The CCGA to FBGA adapter socket has a CCGA ceramic package configuration on the bottom and an

FBGA configuration on top. The SoC Products Group CG (abbreviated for CCGA or ceramic column grid

array) to FG (abbreviated for FBGA or fine pitch ball grid array) adapter socket offering allows for easy

prototyping when using an FG package to prototype a CG package. The ordering part numbers are listed

in Table 1 on page 2.

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

The CCGA to FBGA Adapter Socket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

CCGA to FBGA Ceramic Adapter Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Assembly Procedure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

PCB Pad Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Alignment Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

CCGA to FBGA Adapter Pin Mapping List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Prototyped Product, Adapter, and PCB Design Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

CCGA to FBGA Adapter Sockets

Notes:

1. Top, from left: ceramic adapter, socket lid, socket housing.

2. Bottom, from left: socket interposer, alignment pins, fixing screws.

Table 1 • Ordering Part Numbers

Adapter Socket Ordering Part Number Prototyped and Prototype Device

CG624 to FG484 SK-SX72-CG624RTFG484 For prototyping RTSX72SU-CG624 or A54SX72A-CG624

using A54SX7A FG484

CG624 to FG896 SK-AX1-AX2-KITTOP and

SK-AX1-CG624-KITBTM

For prototyping RTAX1000S-CG624, RTAX1000SL-CG624, or

AX1000-CG624 using AX1000-FG896 package

CG624 to FG896 SK-AX1-AX2-KITTOP and

SK-AX2-CG624-KITBTM

For prototyping RTAX2000S-CG624, RTAX2000SL-CG624, or

AX2000-CG624 using AX2000-FG896 package

Figure 1 • CCGA to FBGA Adapter Socket Components

CCGA to FBGA Ceramic Adapter Configurations

Figure 2 • Ceramic Adapter Top View (Left) and Bottom View (Right) with Dimensions

RTSX72SU (or A54SX72A) CG624 to A54SX72A FG484 Adapter Outline Dimension

RTAX1000S (or AX1000) CG624 to AX1000 FG896 Adapter Outline Dimension

RTAX2000S (or AX2000) CG624 to AX2000 FG896 Adapter Outline Dimension

CCGA to FBGA Adapter Sockets

Assembly Procedure

Step 1

Note: The -KITBTM parts for CG624 devices contain all the parts needed for Step 1. Both the SK-AX1-

CG624-KITBTM and SK-AX2-CG624-KITBTM contain the housing, ceramic adapter, eight screws

and two alignment pins.

Note: See Figure 11 on page 7 for an outline drawing of the CG624 to FG484 23x23 Adapter Socket.

Alignment pins can (optionally) be used prior to step 1 to align the housing to the ceramic adapter.

The same alignment pins can be (optionally) used to align the assembled housing plus adapter to

the circuit board just prior to Step 2. Reflow in "Step 2" on page 5 means that you must have put the

solder onto the board, place the assembled ceramic adapter onto the PCB, and then complete the

reflow. Placing the assembled adapter onto the PCB is made easier if the alignment pins are used,

but corresponding alignment holes must have been pre-drilled into the PCB during PCB

manufacture for this to work.

Tighten the socket housing to the adapter. Step 1 includes three sub-steps:

1. Turn the socket housing and ceramic adapter upside down (Figure 3).

2. Fasten the socket housing to the ceramic adapter using eight of the screws provided (Figure 4).

3. Turn the ceramic adapter (with socket housing) over (Figure 5 on page 5).

Figure 3 • View of Ceramic Adapter (Top) and Socket Housing (Bottom) Turned Over

Figure 4 • View of Ceramic Adapter Fastened to Socket Housing Using the Screws Provided

Back Socket

Housing

Front Socket

Housing

Assembly Procedure

Step 2

Reflow the adapter to the printed circuit board (PCB) (Figure 6).

Step 3

Place the socket interposer into the adapter (Figure 7).

Figure 5 • View of Adapter Socket Assembly with Socket Housing Attached

Figure 6 • Adapter Reflowed to the PCB

PCB

Figure 7 • Socket Interposer Placement in the Adapter Assembly

PCB

CCGA to FBGA Adapter Sockets

Step 4

Place the FBGA package into the adapter (Figure 8).

Step 5

Fasten the socket lid to the socket housing using the remaining eight screws provided (Figure 9).

Note: If prototyping CG624 parts using AX1000-FG896 or AX2000-FG896, -KITTOP contains the screws,

interposer, and lid. The SoC Products Group part for these components is SK-AX1-AX2-KITTOP.

Figure 8 • View of the FPGA Package Placement in the Adapter Assembly

PCB

Figure 9 • View of the Socket Lid and Screw Placement

PCB

PCB Pad Layout

Pads should be laid out according to the solder column dimensions of the CG package. Refer to the CG

package drawing and the SoC Products Group application note, CCGA. Since the socket adapter’s

overall size is larger than the actual CG package, you must consider the size difference between the

socket adapter and CG package during board layout, particularly if the same board will be used for both

prototyping and production. Figure 10 shows PCB pad layout specifications.

Figure 10 • PCB Pad Layout Specifications

Figure 11 • CG624 to FG484 23x23 Adapter Socket Outline Drawing

a) Solder Mask Window

(Diameter)

b) Mounting Pad

(Diameter)

b) Mounting Pad

(Diameter)

d) Via Solder Mask Window

(Diameter)

e) Via

(Diameter)

f) Land

(Diameter) g) Typical

b) Diameter

c) Dia

Solderable

Surface

Section A–A

45˚ Typical

0.3mm Line

Feature 1.27mm Pitch 1.00mm Pitch

a 0.851mm

0.749mm

0.72mm

0.483mm

0.305mm

0.56mm

0.635mm

0.8mm

0.7mm

0.67mm

0.38mm

0.20mm

0.46mm

0.50mm

A) Socket Lid

C) Socket Interposer

D) Socket Housing

F) Ceramic Adapter

B) FG896 Package

G) Screws X16 #0–18,1/4L

H) Alignment Pins X2

FG484

Unit: mm

40.00

30.4169.41

CCGA to FBGA Adapter Sockets

Note:

1. A set of boards will require at least one -KITTOP and one -KITBTM kit for each board. The

-KITTOP components may be moved from board to board for testing one at a time, if a cost saving is

required.

2. SK-AX1-AX2-KITTOP contains a socket lid (A), an interposer (C), eight screws and two alignment

pins (half of G).SK-AX1-CG624-KITBTM contains the socket housing (D) a unique ceramic adapter

for AX1000 use (F), eight screws and two alignment pins. (half of G).

3. SK-AX2-CG624-KITBTM contains socket housing (D), a unique ceramic adapter for AX2000 use

(F), eight screws and two alignment pins (half of G).

Alignment Pins

There are two alignment pins for aligning the socket housing to the adapter. The same pins can be used

to align the assembled adapter socket to the PCB. Alignment holes on the PCB are optional. You must

decide whether or not to include alignment holes on a board. Two alignment pins are included in the -

KITBTM units. No alignment pins are included in -KITTOP units.

Figure 12 • CG624 to FG896 Adapter Socket Outline Drawing

A) Socket Lid

C) Socket Interposer

D) Socket Housing

F) Ceramic Adapter

B) FG896 Package

G) Screws X16 #0–18,1/4L

H) Alignment Pins X2

FG896

Unit: mm

43.00

14.96 14.03

Reflow Profile

Since reflow profiles depend heavily upon the size of the board and other components, you must perform

additional fine tuning from the general profile shown in Figure 13.

CCGA to FBGA Adapter Pin Mapping List

The CCGA to FBGA adapter is routed from the FBGA package to match the existing die pad available to

the CCGA device being prototyped (Table 2 on page 10).

Prototyped Product, Adapter, and PCB Design Matrix

Designing the PCB for a specific product requires an understanding of which adapter socket will work.

Each adapter socket is routed differently, depending on the commercial Axcelerator FG package used for

prototyping and the Axcelerator device or RadTolerant equivalent derivative being prototyped. Table 3 on

page 10 shows the combinations that will work.

Figure 13 • Sample Temperature Profile for Infrared (IR) or Convection Reflow

Time (Seconds)

220˚C:

30 Seconds Maximum

Maximum Package Body

Temperature = 220˚C (±5˚C)

180˚C

125 ˚C to 180˚C

Temperature (˚C)

120 Seconds

Minimum

Keep Temperature

Above 183˚C

(Solder Melting Point)

For at Least 60 Seconds

1˚C to 3˚C

Per Second

250

200

150

100

50 100 150 200 250 3000

1˚C to 3˚C

Per Second

1˚C to 4˚C

Per Second

CCGA to FBGA Adapter Sockets

Note:

1. The PCB designer should consider the eight pin-pairs of the Phase-Locked Loop (PLL) analog

power supply (VCCPLA/VCOMPLA, VCCPLB/VCOMPLB, VCCPLC/VCOMPLC,

VCCPLD/VCOMPLD, VCCPLE/VCOMPLE,VCCPLF/VCOMPLF, VCCPLG/VCOMPLG, and

VCCPLH/VCOMPLH). They should be treated as follows:

VCCPLA/B/C/D/E/F/G/H – there are eight in each device. VCCPLA supports the PLL associated with

global resource HCLKA,VCCPLB supports the PLL associated with global resource HCLKB, etc.

These PLL analog power supply pins should be connected to 1.5 V, whether or not the PLL is used.

Refer to the Axcelerator Family FPGAs and RTAX-S/L Family FPGAs datasheets for pin assignment

information.

VCOMPLA/B/C/D/E/F/G/H – these are compensation reference signals for the internal PLLs. There

are eight in each device. VCOMPLA supports the PLL associated with global resource HCLKA,

VCOMPLE supports the PLL associated with global resource HCLKE, etc.

Table 2 • CCGA to FBGA Adapter Pin Mapping List Documents

Adapter Socket Ordering Part Number

Prototyped and

Prototype Device

Adapter Pin Mapping List

Document Number

CG624 to FG484 SK-SX72-CG624RTFG484 For prototyping

RTSX72SU-CG624 or

A54SX72A-CG624 using

A54SX72A FG484

www.microsemi.com/soc/te

chdocs/package/default.as

CG624 to FG896 SK-AX1-AX2-KITTOP and

SK-AX1-CG624-KITBTM

For prototyping

RTAX1000S-CG624,

RTAX1000SL-CG624, or

AX1000-CG624 using

AX1000-FG896 package

CG624 to FG896 SK-AX1-AX2-KITTOP and

SK-AX2-CG624-KITBTM

For prototyping

RTAX2000S-CG624,

RTAX2000SL-CG624, or

AX2000-CG624 using

AX2000-FG896 package

Table 3 • PCB Design Matrix

Prototyped Product Adapter Part Number Prototype Vehicle PCB Design

A54SX72A-CG624 SK-SX72-CG624RTFG484 A54SX72A-FG484 A54SX72A-CG624

RTSX72SU-CG624 SK-SX72-CG624RTFG484 A54SX72A-FG484 A54SX72A-CG624

AX1000-CG624 SK-AX1-AX2-KITTOP and

SK-AX1-CG624-KITBTM

AX1000-FG896 AX1000-CG624

AX2000-CG624 SK-AX1-AX2-KITTOP and

SK-AX2-CG624-KITBTM

AX2000-FG896 AX2000-CG624

RTAX1000SL-CG624 SK-AX1-AX2-KITTOP and

SK-AX1-CG624-KITBTM

AX1000-FG896 AX1000-CG6241

RTAX2000SL-CG624 SK-AX1-AX2-KITTOP and

SK-AX2-CG624-KITBTM

AX2000-FG896 AX2000-CG6241

RTAX1000SL-CG624 SK-AX1-AX2-KITTOP and

SK-AX1-CG624-KITBTM

AX1000-FG896 RTAX1000S-CG6241,2

RTAX2000SL-CG624 SK-AX1-AX2-KITTOP and

SK-AX2-CG624-KITBTM

AX2000-FG896 RTAX2000S-CG624 1,2

Support

The VCOMPLX pins should be left floating if the PLL is not being used. Refer to the Axcelerator

Family FPGAs and RTAX-S/L Family FPGAs datasheets for pin assignment information.

2. Since the AX and the RTAX-S/L devices are exactly pin compatible except for the PLL, which the

RTAX-S/L does not have, designing the PCB with VCCPL(X) pins connected to 1.5 V will not affect

the function of the RTAX-S/L devices. Pins for VCOMPL(X) can be designed with land patterns only.

These 16 PLL pins are not connected internally inside the RTAX-S/L packages.

Support

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Email Technical Support at soc_tech@microsemi.com

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650.318.4460

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