TGA4823-SM 9.9 - 12.5 Gb/s Linear/Limiting Optical Modulator Driver Key Features * * * * * * * Measured Performance Up to 10 Vpp Linear Output Voltage > 12 Vpp Limiting Mode Output Voltage Gain: 19 dB Internal DC blocks Single-ended Input / Output Bias: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg = -0.3 V Typical for Linear operation Package Dimensions: 8 x 8 x 2.1 mm Primary Applications Bias conditions: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg -0.3 V Typical PRBS = 231-1; CPC = 50%, 10.7 GB/s; Vin = 1Vpp * Mach-Zehnder Modulator Driver for Metro and Long Haul Product Description The TriQuint TGA4823-SM is part of a series of optical driver amplifiers suitable for a variety of driver applications. The TGA4823-SM is a medium power wideband AGC amplifier that typically provides 19 dB small signal gain with 19 dB AGC range. The TGA4823-SM is an excellent choice for applications requiring high drive combined with high linearity. The TGA4823-SM has demonstrated capability to deliver 10Vpp while maintaining output harmonic levels near -30dBc for a 2GHz fundamental. The TGA4823-SM requires a low frequency choke and control circuitry. RoHS and Lead-Free compliant. Evaluation boards available on request. Datasheet subject to change without notice TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A 1 Table I Absolute Maximum Ratings 1/ Symbol Parameter Vd-Vg TGA4823-SM Value Notes Drain to Gate Voltage 12 V Vd Drain Voltage 9V 2/ Vg Gate Voltage Range -5 to 0 V 2/ Control Voltage Range -1 to +2 V 2/ 400 mA 2/ Vctrl Id Drain Current Ig Gate Current Range -1.8 to 18.9 mA Ictrl Control Current Range -1.8 to 18.9 mA Pin Input Continuous Wave Power 27.8 dBm 1/ These ratings represent the maximum operable values for this device. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device and / or affect device lifetime. These are stress ratings only, and functional operation of the device at these conditions is not implied. 2/ Combinations of supply voltage, supply current, input power, and output power shall not exceed the maximum power dissipation listed in Table IV. Table II Recommended Linear Operating Conditions Symbol Value Vd Drain Voltage 8V Id Drain Current 310 mA Drain Current under RF Drive 350 mA Id_Drive Vg Vctrl 1/ Parameter 1/ Typical Gate Voltage -0.3 V Control Voltage 1V See assembly diagram for bias instructions. 2 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A TGA4823-SM Table III RF Characterization Table Bias: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg = -0.3 V, typical SYMBOL PARAMETER TEST CONDITIONS MIN NOMINAL MAX 9.5 UNITS 3dB BW Small Signal 3 dB Bandwidth Relative to 2 GHz GHz Gain Small Signal Gain f = 0.1 - 4 GHz f = 6 GHz f = 8 GHz - 20 19 18 - dB IRL Input Return Loss f = 0.1 - 10GHz f = 10 - 16 GHz - 15 9 - dB ORL Output Return Loss f = 0.1 - 10 GHz f = 10 - 16 GHz - 15 12 - dB Psat Saturated Output Power f = 2 GHz - 26 ( 12.5) - dBm (Vpp) P1dB Output Power @ 1dB Compression f = 2 GHz - 25 - dBm AGC Range Small Signal AGC Range - 19 - dB 3 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A TGA4823-SM Table IV Power Dissipation and Thermal Properties Parameter Test Conditions Value Notes Tbaseplate = 70 C Pd = 3.17 W Tchannel = 150 C Tm = 1.0E+6 Hrs 1/ 2/ Thermal Resistance, jc Vd = 8 V Id = 310 mA Pd = 2.48 W jc = 24.3 (C/W) Tchannel = 130 C Tm = 5.8E+6 Hrs Thermal Resistance, jc Under RF Drive Vd = 8 V Id = 350 mA Pout = 26.5 dBm Pd = 2.36 W jc = 24.3 (C/W) Tchannel = 127 C Tm = 7.6E+6 Hrs Maximum Power Dissipation 1/ Mounting Temperature Refer to Solder Reflow Profiles (pp16) Storage Temperature -65 to 150 C For a median life of 1E+6 hours, Power Dissipation is limited to Pd(max) = (150 C - Tbase C)/jc. Channel operating temperature will directly affect the device median time to failure (MTTF). For maximum life, it is recommended that channel temperatures be maintained at the lowest possible levels. Power De-rating Curve Power Dissipated (W) 2/ 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 Tm= 1.0E+6 Hrs -50 -25 0 25 50 75 100 125 150 175 200 Baseplate Temp (C) 4 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A TGA4823-SM Measured Data Bias conditions: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg -0.3 V Typical 25 Gain (dB) 20 15 10 5 0 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) Input RL and Output RL (dB) 0 -10 -20 IRL -30 ORL -40 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) 5 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A TGA4823-SM Measured Data Bias conditions: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg -0.3 V Typical 25 Gain (dB) 20 15 10 5 0 0.00001 0.0001 0.001 0.01 0.1 1 10 Frequency (GHz) Input RL and Output RL (dB) 0 IRL ORL -10 -20 -30 -40 0.00001 0.0001 0.001 0.01 0.1 1 10 Frequency (GHz) 6 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A TGA4823-SM Measured Data Bias conditions: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg -0.3 V Typical Freq = 2 GHz 14 Vout (Vpp) 12 10 8 6 4 2 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 Pout & Harmonics (dBm) Vin (Vpp) 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 P_Fundamental P_2nd_Harmonic P_3rd_Harmonic -20 -16 -12 -8 -4 0 4 8 Pin (dBm) 7 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A Measured Data TGA4823-SM Linear Mode: Bias conditions: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg -0.3 V Typical PRBS = 231-1; CPC = 50%, 10.7 GB/s Input Eye: Vin = 250 mVpp Output Eye: Vin = 250 mVpp, Vopp = 2.5 Vpp Input Eye: Vin = 500 mVpp Output Eye: Vin = 500 mVpp, Vopp = 5 Vpp 8 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A Measured Data TGA4823-SM Linear Mode: Bias conditions: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg -0.3 V Typical PRBS = 231-1; CPC = 50%, 10.7 GB/s Input Eye: Vin = 1 Vpp Output Eye: Vin = 1 Vpp, Vopp = 9.3 Vpp 9 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A Measured Data TGA4823-SM Limiting Mode: Bias conditions: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg -0.3 V Typical PRBS = 231-1; CPC = 50%, 10.7 GB/s Input Eye: Vin = 1700 mVpp Output Eye: Vin = 1700 Vpp, Vopp = 4.2 Vpp Output Eye: Vin = 1700 Vpp, Vopp = 8.3 Vpp Output Eye: Vin = 1700 Vpp, Vopp = 11 Vpp 10 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A TGA4823-SM Electrical Schematic Vctrl Vd_Bypass 26 25,27 RF In Vd 24 4 17 RF Out 12 Vg Bias Procedures Vd=8V, CPC=50% Bias ON Bias OFF 1. Disable the output of the PPG 1. Disable the output of the PPG 2. Set Vd = 0V, Vctrl = 0V & Vg = 0V 2. Set Vctrl = 0V 3. Set Vg = -1.5V 3. Set Vd = 0V 4. Increase Vd to 8V observing Id - Assure Id = 0mA 4. Set Vg = 0V 5. Set Vctrl = +1V - Id should still be 0mA 6. Make Vg more positive until Id = 310mA. Vg will be approximately -0.3V. 7. Enable the output of the PPG. 8. Output Swing Adjust: Adjust Vctrl slightly positive to increase output swing or adjust Vctrl slightly negative to decrease the output swing. 9. Crossover Adjust: Adjust Vg slightly positive to push the crossover down or adjust Vg slightly negative to push the crossover up. 11 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A TGA4823-SM Recommended Application Circuit Label L1 L2 R1,R2 R3 C1 C2,C3 C4 U1 Value 330nH 220uH 270 Ohm 620 Ohm 10uF 1uF 10uF Part Number ELJ-FAR33MF2 ELL-CTV221M ERJ-3GEYJ271V ERJ-3GEYJ621V TAJA106K016R 0603YG105ZAT2A GRM188R60J106ME47D TGA4823-SM Vendor Panasonic Panasonic Panasonic Panasonic AVX AVX Murata TriQuint ** Note: For Hot-Pluggable option, R3 is limited to Rx ohms, for a maximum Vctrl_user such that Vctrl pin on package does not exceed + 2 V Where Rx = (Vctrl_user - Vctrl_pin) / Ictrl_max = (Vctrl_user - 2V) / 18.9 mA GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A 12 TGA4823-SM Recommended Assembly Diagram GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A 13 TGA4823-SM Package Pinout Pin 1 indicator 28 27 26 25 24 23 22 22 23 24 25 26 27 28 Pin 1 indicator 1 21 21 1 2 20 20 2 3 19 19 3 4 18 18 5 17 17 5 6 16 16 6 7 15 15 7 8 9 10 11 12 13 29 14 14 Pin Description 1,2,3,5,6,7,8,9,10, 11,13,14,15,16,18, 19,20,21,22, 23,25,28 N/C 4 RF In 12 Vg 17 RF Out 24 Vd 26 Vd_Bypass 25, 27 Vctrl 29 GND 13 12 11 4 10 9 8 14 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A TGA4823-SM Mechanical Drawing 2.100 0.550 26 places 1.000 1.000 pitch 1.000 0.400 5.842 0.600 28 places 5.842 0.400 2 places 1.000 pitch 8.000 0.368 8.000 0.300 0.200 Isometric View SCALE 10 : 1 Units: millimeters Unless specified otherwise, tolerances: 0.100 Materials: Package base Aluminum Nitride (AlN) Package lid White Alumina (Al203) Pad finish on package base: Electroless gold (Au) 0.5 - 1.0 um Over Electroless nickel (Ni) 2.0 um min. GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. 15 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A TGA4823-SM Assembly Notes Recommended Surface Mount Package Assembly * Proper ESD precautions must be followed while handling packages. * Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry. * TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven vendors' recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. * Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. * Clean the assembly with alcohol. Typical Solder Reflow Profiles Reflow Profile SnPb Pb Free Ramp-up Rate 3 C/sec 3 C/sec Activation Time and Temperature 60 - 120 sec @ 140 - 160 C 60 - 180 sec @ 150 - 200 C Time above Melting Point 60 - 150 sec 60 - 150 sec Max Peak Temperature 240 C 260 C Time within 5 C of Peak Temperature 10 - 20 sec 10 - 20 sec Ramp-down Rate 4 - 6 C/sec 4 - 6 C/sec Ordering Information Part Package Style TGA4823-SM 8x8 Surface Mount GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. 16 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2008 (c) Rev A