3–21 GHz THREE-CHANNEL DOWNCONVERTER
MODEL: 136460
FEATURES
• High reliability, spaceborne application
• Broadband RF/LO coverage..... 3–21 GHz
• Broadband IF operation............ 250–1550 MHz
• LO power range......................... 10–16 dBm
• Conversion gain ........................ 25 dB nominal
• LO/RF isolation.......................... 30 dB typ., 20 dB minimum
• LO/IF isolation ........................... 40 dB typ., 30 dB minimum
• Digital gain control.................... 0–31.5 dB, 0.5 dB steps
• Low power ................................. 165 mA (5 V),
2 mA (-5 V) typ. per channel
• Lightweight ................................ 400 grams typical
ELECTRICAL SPECIFICATIONS
RF INPUT PARAMETERS CONDITION UNITS MIN. TYP. MAX.
Frequency range GHz 3.2 21.2
IF/RF VSWR Ratio 1.5:1
LO frequency range GHz 4.8 19.5
LO power dBm 10 16
LO VSWR Ratio 2.5:1
IF OUTPUT PARAMETERS CONDITION UNITS MIN. TYP. MAX.
Number of IF outputs Per channel 2
Operating range MHz 250 1550
RF-to-IF gain At maximum gain dB 25
Digital attenuator control step size 6-BIT control dB 0.5
Digital attenuator dB 0 31.5
Output power (1 dB compression) dBm -1 0
Calibration port coupling value dB 16
Coupling flatness 250–1550 MHz dB ±1
VSWR 250–1550 MHz Ratio 1.5:1
OTHER PARAMETERS CONDITION UNITS MIN. TYP. MAX.
LO-to-RF isolation dB 20 30
LO-to-IF isolation dB 30 40
Connectors, RF, IF, LO SMA
Connectors, DC, control 1 per channel 15-pin, micro D
Supply voltage Volts ±5
DC power consumption for each At 5 V per channel mA 165
downconverter At -5 V per channel mA 2
Weight Grams 400
MITEQ’s model 136460 broadband three-channel downconverter functions as the second IF down conversion stage
of a low earth orbit-based millimeter-wave radiometer. Coupled with one of five MITEQ frequency multiplexers as
an input stage, the system provides maximally flat frequency response over the bands of interest, high linearity of
output power to input power, and high isolation between the frequency bands of interest as well as from other
undesirable signals. In addition, this high reliability, spaceborne integrated assembly is optimized for small size, low
power consumption, lightweight, and excellent thermal stability of operation.