A29L320A Series
4M X 8 Bit / 2M X 16 Bit CMOS 3.0 Volt-only,
Boot Sector Flash Memory
(November, 2012, Version 1.7) AMIC Technology, Corp.
Document Title
4M X 8 Bit / 2M X 16 Bit CMOS 3.0 Volt-only, Boot Sector Flash Memory
Revision History
Rev. No. History Issue Date Remark
0.0 Initial issue April 12, 2006 Preliminary
0.1 Error correction: Top/Bottom device ID code and pin configurations May 25, 2006
0.2 Change Table1 & Program/Erasure time July 3, 2006
1.0 Final version release January 5, 2007 Final
1.1 Modify symbol “L” outline dim ensions in TSOP 48L package November 15, 2007
1.2 Modify Figure 2-1 and Figure 2-2 August 18, 2008
Modify tWHWH1 and tWHWH2
Modify VHH and VID
1.3 Modify A29L320A top block sector 34 address December 12, 2008
1.4 Update VCC supply voltages for extended range devices (-I/-U) April 3, 2009
Modify the WP /ACC operation of write in Table 1
1.5 Remove non Pb-free package type February 8, 2010
1.6 Page 1: Change from typical 100,000 cycles to minimum 100,000 cycles November 25, 2010
1.7 Page 19: CFI query data change from 0001h to 0004h at address 8Eh November 23, 2012
CFI query data change from 0085 h to 00B5h at address 9Ah
CFI query data change from 0095 h to 00C5h at address 9Ch
A29L320A Series
4M X 8 Bit / 2M X 16 Bit CMOS 3.0 Volt-only,
Boot Sector Flash Memory
(November, 2012, Version 1.7) 1 AMIC Technology, Corp.
Features
Single power suppl y operation
- Regulated voltage range of commercial devices: 2.7 to
3.6 volt read and write operations for compatibility with
high performance 3 volt microprocess ors
- Regulated voltage rang e of extended range devices: 3.0
to 3.6 volt read and write operations for compatibility
with high performance 3 volt microprocessors
Access times:
- 70/80/90/120 (max.)
Current:
- 2mA active read current at 1M Hz
- 10mA active read curre nt at 5MHz
- 20 mA typical program/erase current
- 500 nA typical CMOS standby or Automatic Sleep Mode
current
Flexible sector architecture
- Eight 8 Kbyte sectors
- Sixty-three 64 kbyte sectors
- Any combination of sectors can be erased
- Supports full chip erase
- Sector protection:
Unlock Bypass Program Command
- Reduces overall programming time when issuing
multiple program command sequence
Top or bottom boot block configurations available
Embedded Algorithms
- Embedded Erase algorithm will automatically erase the
entire chip or any combination of designated sectors an d
verify the erased sectors
- Embedded Program algorithm automatically writes and
verifies data at specified addresses
Minimum 100,000 pr ogram/erase cycles per sector
20-year data retention at 125°C
- Reliable operation for the life of the system
CFI (Common Flash Interface) compliant
- Provides device-specific information to the system,
allowing host software to easily reconfigure for different
Flash devices
Compatible with JEDEC-standards
- Pinout and software compatible with single-p ower-supply
Flash memory standard
- Superior in advertent write protection
Data Polling and toggle bits
- Provides a software method of detecting completion of
program or erase operations
Ready / BUSY pin (RY / BY)
- Provides a hardware method of detecting completion of
program or erase operations
Erase Suspend/Erase Resume
- Suspends a sector erase operation to read d ata from, or
program data to, a non-erasing sector, then resumes the
erase operation
Hardware reset pin (RESET)
- Hardware method to reset the device to reading array
data
WP /ACC input pin
- Write protect ( WP ) function allows protection of two
outermost boot sectors, regardless of sector protect
status
- Acceleration (ACC) function provides accelerated
program times
Hardware/Software temporary sector bl ock unprotect
command allows code chang es in previously locked
sectors
Hardware/Software sector protect/unprotect command
Package options
- 48-pin TSOP (I) or 48-ball TFBGA
- All Pb-free (Le ad-free) products are RoHS compliant
General Description
The A29L320A is a 32Mbit, 3.3 volt-only Flash memory
organized as 2,097,152 words of 16 bits or 4,194,304 bytes
of 8 bits each. The 8 bits of data appear on I/O0 - I/O7; the 16
bits of data appear on I/O0~I/O15. The A29L320A is offered in
48-ball TFBGA and 48-Pin TSOP packages. This device is
designed to be programmed in-system with the standard
system 3.3 volt VCC supply. Additional 12.0 volt VPP is not
required for in-system write or erase operations. However,
the A29L320A can also be pr ogrammed in standard EPROM
programmers.
The A29L320A has the first toggle bit, I/O6, which indicates
whether an Embedded Progr am or Erase is in progress, or it
is in the Erase Suspend. Besides the I/O6 toggle bit, the
A29L320A has a second toggle bit, I/O2, to indicate whether
the addressed sector is being selected for erase. The
A29L320A also offers the ability to program in the Erase
Suspend mode. T he standard A29L320A offers access time s
of 70,80,90 and 120ns, allo wing high-speed microprocessors
to operate without wait states. To eliminate bus contention
the device has separate chip enable ( CE ), write enable
(WE ) and output enable (OE) controls.
The device requires only a single 3.3 volt power supply for
both read and write functions. Internally generated and
regulated voltages are provided for the program and erase
operations.
The A29L320A is entirely software command set compatible
with the JEDEC single-power-supply Flash standard.
Commands are written to the command register using
standard microprocessor write timings. Register contents
A29L320A Series
(November, 2012, Version 1.7) 2 AMIC Technology, Corp.
serve as input to an internal state-machine that controls the
erase and programming circuitry. Write cycles also internally
latch addresses and data needed for the programming and
erase operations. Reading da ta out of the device is similar to
reading from other Flash or EPROM devices.
Device programming occurs by writing the proper program
command sequence. This initiates the Embedded Program
algorithm - an internal algorithm that automatically times the
program pulse widths and verifies proper pro gram margin.
Device erasure occurs by executing the proper erase
command sequence. This initiates the Embedded Erase
algorithm - an internal algorithm that automatically
preprograms the array (if it is not already programmed)
before executing the erase operation. During erase, the
device automatically times the erase pulse widths and
verifies proper erase margin. The Unlock Bypass mode
facilitates faster programming times by requiring only two
write cycles to program data instead of four.
The host system can detect whether a program or erase
operation is complete by observing the RY / BY pin, or by
reading the I/O7 (Data Polling) and I/O6 (toggle) status bits.
After a program or erase cycle has been completed, the
device is ready to read array data or accept another
command.
The sector erase architecture allows memory sectors to be
erased and reprogrammed without affecting the data
contents of other sectors. The A29L320A is fully erased
when shipped from the factory.
The hardware sector protection feature disables operati ons
for both program and erase in an y combination of the
sectors of memory. This can be achieved via programmin g
equipment.
The Erase Suspend/Erase R esume feature enables the user
to put erase on hold for any period of time to read data from,
or program data to, any other sector that is not selected for
erasure. True backgroun d erase can thus be achieved.
The hardware RESET pin terminates any operation in
progress and resets the internal state machine to reading
array data. The RESET pin may be tied to the system reset
circuitry. A system reset would thus also reset the device,
enabling the system microprocessor to read the boot-up
firmware from the Flash memory.
The device offers two power-saving features. When
addresses have been stable for a specified amount of time,
the device enters the automatic sleep m ode. T he system can
also place the device into the standby mode. Power
consumption is greatly reduced in both th ese modes.
Pin Configurations
TSOP (I)
A29L320AV
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A14
A13
A12
A11
A10
A9
A8
A20
WE
RESET
NC
WP/ACC
RY/BY
A18
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33 I/O2
I/O10
I/O3
I/O11
VCC
I/O4
I/O12
I/O5
I/O13
I/O6
I/O14
I/O7
I/O15(A-1)
VSS
BYTE
A16A15
A19
17
18
19
20
21
22
23
24 25
26
27
28
29
30
31
32 I/O9
I/O1
I/O8
I/O0
OE
VSS
CE
A0
A17
A7
A6
A5
A4
A3
A2
A1
A29L320A Series
(November, 2012, Version 1.7) 3 AMIC Technology, Corp.
Pin Configurations (continued)
TFBGA
A6 B6 C6 D6 E6 F6 G6 H6
TFBGA
Top View, Bal l s Fac ing D own
A5 B5 C5 D5 E5 F5 G5 H5
A4 B4 C4 D4 E4 F4 G4 H4
A3 B3 C3 D3 E3 F3 G3 H3
A2 B2 C2 D2 E2 F2 G2 H2
A1 B1 C1 D1 E1 F1 G1 H1
A13 A12 A14 A15 A16 BYTE I/O15(A-1) VSS
A9 A8 A10 A11 I/O7I/O14 I/O13 I/O6
WE RESET NC A19 I/O5I/O12 VCC I/O4
RY/BY A18 A20 I/O2I/O10 I/O11 I/O3
A7 A17 A6 A5 I/O0I/O8I/O9I/O1
A3 A4 A2 A1 A0 CE OE VSS
WP/ACC
A29L320A Series
(November, 2012, Version 1.7) 4 AMIC Technology, Corp.
Block Diagram
Pin Descriptions
Pin No. Description
A0 - A20 Address Inputs
I/O0 - I/O14 Data Inputs/Outputs
I/O15 Data Input/Output, Word Mode
I/O15 (A-1) A-1 LSB Address Input, Byte Mode
CE Chip Enable
WE Write Enable
OE Output Enabl e
RESET Hardware Reset
BYTE Selects Byte Mode or Word Mode
RY/BY Ready/BUSY- Output
VSS Ground
VCC Power Supply
NC Pin not connected internally
WP /ACC Hardware Write Protect / Acceleration Pin
State
Control
Command
Register
Address Latch
X-decoder
Y-Decoder
Chip Enable
Output Enable
Logic
Cell Matrix
Y-Gating
VCC Detector
PGM Voltage
Generator
Data Latch
Input/Output
Buffers
Erase Voltage
Generator
VCC
VSS
WE
CE
OE
A0-A20
I/O0 - I/O15 (A-1)
Timer
STB
STB
RESET
Sector Switches
BYTE
RY/BY
WP/ACC
A29L320A Series
(November, 2012, Version 1.7) 5 AMIC Technology, Corp.
Absolute Maximum Ratings*
Storage Temperature Plastic Packages. . . -65°C to + 150°C
Ambient Temperature with Power Applied. -55°C to + 125°C
Voltage with Respect to Ground
VCC (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +4.0V
A9, OE & RESET (Note 2) . . . . . . . . . . . . . -0.5V to +12.5V
WP /ACC . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +12.5V
All other pins (Note 1) . . . . . . . . . . . . . . -0.5V to VCC + 0.5V
Output Short Circuit Current (Note 3) . . . . . . . . . . . . . 200mA
Notes:
1. Minimum DC voltage on input or I/O pins is -0.5V. During
voltage transitions, input or I/O pins may undershoot VSS
to -2.0V for periods of up to 20ns. Maximum DC voltage
on input and I/O pins is VCC +0.5V. During voltage
transitions, input or I/O pins may overshoot to VCC +2.0V
for periods up to 20ns.
2. Minimum DC input voltage on A9,OEand RESET is -
0.5V. During voltage transitions, A9, OE and RESET
may overshoot VSS to -2.0V for periods of up to 20ns.
Maximum DC input voltage on A9 is +12.5V which may
overshoot to 14.0V for periods up to 20ns.
3. No more than one out put is shorted at a time. Duration of
the short circuit should not be greater than one second.
*Comments
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of
this device at these or any other conditions above
those indicated in the operational sections of these
specification is not implied or intended. Exposure to
the absolute maximum rating conditi ons for extended p eriods
may affect device reliability.
Operating Ranges
Commercial (C) Devices
Ambient Temperature (TA) . . . . . . . . . . . . . . . . 0°C to +70°C
Extended Range Devices
Ambient Temperature (TA)
For –U series . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
For –I series . . . . . . . . . . . . . . . . . . . . . . . . . -25°C to +85°C
VCC Supply Voltages
VCC for commercial devices . . . . . . . . . . . . +2.7V to +3.6V
VCC for extended range devices . . . . . . . . . +3.0V to +3.6V
Operating ranges define those limits between which the
functionally of the device is guaranteed.
Device Bus Operations
This section describes the requirements and use of the
device bus operations, which are initiated through the
internal command register. T he command register itself does
not occupy any addressable memor y location. The register is
composed of latches that store the commands, along with
the address and data information needed to execute the
command. The contents of the register serve as inputs to th e
internal state machine. The state machine output s dictate the
function of the device. The appropriate devic e bus operati ons
table lists the inputs and control levels required, and the
resulting output. The following subsections describe each of
these operations in further detail.
Table 1. A29L320A Device Bus Operations
I/O8 - I/O15 Operation CE OE WE RESET
WP/
ACC A0 - A20
(Note 1) I/O0 - I/O7
BYTE =VIH BYTE =VIL
Read L L H H L/H AIN DOUT DOUT
Write L H L H L/H
(Note 3) AIN (Note 4) (Note 4) I/O8~I/O14=High-Z
I/O15=A-1
Accelerated
Program L H L H VHH AIN (Note 4) (Note 4) High-Z
Standby VCC ±
0.3 V X X
VCC ±
0.3 V H X High-Z High-Z High-Z
Output Disable L H H H L/H X High-Z High-Z High-Z
Reset X X X L L/H X
High-Z High-Z High-Z
Sector Protect
(Note 2) L H L VID L/H Sector Address,
A6=L, A1=H, A0=L (Note 4) X X
Sector Unprotect
(Note 2) L H L VID L/H
Sector Address,
A6=H, A1=H, A0=L (Note 4) X X
Temporary Sector
Unprotect X X X VID L/H AIN (Note 4) (Note 4) High-Z
Legend:
L = Logic Low = VIL, H = Logi c High = VIH, VID = 11.5V-12 .5V, VHH = 11.5V-12.5V, X = Don't Care, DIN = Data In, DOUT = Data Ou t, AIN = Address In
Notes:
1. Addresses are A20:A0 in word mode (BYT
E
=VIH), A20: A-1 in byte mode (BYTE=VIL).
2. The sector protect and sector unprotect functions may also be implemented via programming equipment. See “Sector/Sector
Block Protection and Unprotection”.
3. If WP /ACC=VIL, the two outermost boot sectors remain protected. If WP /ACC=VIH, the two outermost boot sector
protection depends on whether they were last protected or unprotected using the method described in
“Sector/Sector Block Protection and Unprotection. If WP/ACC = VHH, all sectors are unprotected.
4. DIN or DOUT as required by command sequence, data polling, or sector protection algo rithm.
A29L320A Series
(November, 2012, Version 1.7) 6 AMIC Technology, Corp.
Word/Byte Configuration
The BYTE pin determines whether the I/O pins I/O15-I/O0
operate in the byte or word configuration. If the BYTE pin is
set at logic ”1”, the device is in word configuration, I/O15-I/O0
are active and controlled by CE and OE.
If the BYTE pin is set at logic “0”, the device is in byte
configuration, and only I/O0-I/O7 are active and controlled by
CE and OE. I/O8-I/O14 are tri-stated, and I/O15 pin is used
as an input for the LSB(A-1) address function.
Requirements for Reading Array Data
To read array data from the outputs, the system must drive
the CE and OE pins to VIL. CE is the power control and
selects the device. OE is the output control and gates array
data to the output pins. WE should remain at VIH all the time
during read operation. The BYTE pin determines whether
the device outputs array data in words and bytes. The
internal state machine is set for reading array data upon
device power-up, or after a hardware reset. This ensures that
no spurious alteration of the memory content occurs during
the power transition. No command is necessary in this mode
to obtain array data. Standard microprocessor read cycles
that assert valid addresses on the device address inputs
produce valid data on the device data outputs. The device
remains enabled for read access until the command register
contents are altered.
See "Reading Array Data" for more information. Refer to the
AC Read Operations table for timing specifications and to the
Read Operations Timings diagram for the timing waveforms,
lCC1 in the DC Characteristics table represents the active
current specification for reading arra y data.
Writing Commands/Command Sequences
To write a command or command sequence (which includes
programming data to the device and erasing sectors of
memory), the system must drive WE and CE to VIL, and
OE to VIH. For program operations, the BYTE pin
determines whether the device accepts program data in
bytes or words, Refer to “Word/Byte Configuration” for more
information. The device features an Unlock Bypass mode to
facilitate faster programming. Once the device enters the
Unlock Bypass mode, only two write cycles are required to
program a word or byte, instead of four. The “
Word / Byte Program Command Sequence” section has
details on programming data to the device using both
standard and Unlock Bypass command sequence. An erase
operation can erase one sector, multiple sectors, or the
entire device. The Sector Address Tables indicate the
address range that each s ector occupies. A "sector address"
consists of the address inputs required to uniquely select a
sector. See the "Command Definiti ons" section for details on
erasing a sector or the entire chip, or suspending/resuming
the erase operation.
After the system writes the autoselect command sequence,
the device enters the autoselec t mode. The system can then
read autoselect codes from the internal register (which is
separate from the memory array) on I/O7 - I/O0. Standard
read cycle timings apply in this mode. Refer to the
"Autoselect Mode" and "Autoselect Command Sequence"
sections for more information.
ICC2 in the DC Characteristics table represents the active
current specification for the write mode. The "AC
Characteristics" section contains timing specification tables
and timing diagrams for write operations.
Program and Erase Operation Status
During an erase or program operation, the system may
check the status of the operation by reading the status bits
on I/O7 - I/O0. Standard read cycle timings and ICC read
specifications apply. Refer to "Write Operation Status" for
more information, and to each AC Ch aracteristics section for
timing diagrams.
Standby Mode
When the system is not reading or writing to the device, it
can place the device in the standby mode. In this mode,
current consumption is greatly reduced, and the outputs are
placed in the high impedance state, independent of the OE
input.
The device enters the CMOS standb y mode when the CE &
RESET pins are both held at VCC ± 0.3V. (Note that this is a
more restricted voltage range than VIH.) If CEand RESET
are held at VIH, but not within VCC ± 0.3V, the device will be
in the standby mode, but the standby current will be greater.
The device requires the standard access time (tCE) before it
is ready to read data.
If the device is deselected during erasure or programming,
the device draws active current until the operation is
completed.
ICC3 and ICC4 in the DC Characteristics tables represent the
standby current specification.
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device energy
consumption. The device automatically enables this mode
when addresses remain stable for t ACC +30n s. The automatic
sleep mode is independent of the CE,WE and OE control
signals. Standard address access timings provide new data
when addresses are changed. While in sleep mode, output
data is latched and al ways available to the system. ICC4 in th e
DC Characteristics table represents the automatic sleep
mode current specification.
Output Disable Mode
When the OE input is at VIH, output from the device is
disabled. The output pins are placed in the high impedance
state.
RESET : Hardware Reset Pin
The RESET pin provides a hardware method of resetting
the device to reading array data. When the system drives the
RESET pin low for at least a period of tRP, the device
immediately terminates any operation in progress, tristates
all data output pins, and ignores all read/write attempts for
the duration of the RESET pulse. The device also resets the
internal state machine to reading array data. The operation
that was interrupted should be reinitiated once the device is
ready to accept another com mand sequence, to ensure data
integrity.
Current is reduced for the duration of the RESET pulse.
When RESET is held at VSS ± 0.3V, the device draws
CMOS standby current (ICC4 ). If RESETis held at VIL but not
within VSS ± 0.3V, the standby current will be greater.
A29L320A Series
(November, 2012, Version 1.7) 7 AMIC Technology, Corp.
The RESET pin may be tied to the system reset circuitry. A
system reset would thus also reset the Flash memory,
enabling the system to read the boot-up firmware from the
Flash memory.
If RESET is asserted during a program or erase operation,
the RY/BYpin remains a “0” (busy) until the internal reset
operation is complete, which requires a time tREADY (during
Embedded Algorithms). The system can thus monitor
RY/ BY to determine whether the reset operation is
complete. If RESET is asserted when a program or erase
operation is not executing (RY/ BY pin is “1”), the reset
operation is completed within a time of tREADY (not during
Embedded Algorithms). The system can read data tRH after
the RESET pin return to VIH.
Refer to the AC Characteristics tables for RESET
parameters and diagram.
Table 2. A29L320A Top Boot Block Sector Address Table
Address Range (in h exadecimal)
Sector A20-A12 Sector Size
(Kbytes/ Kwords) Byte Mode (x8) Word Mode (x16)
SA0 000000XXX 64/32 000000 - 00FFFF 000000 - 007FFF
SA1 000001XXX 64/32 010000 - 01FFFF 008000 - 00FFFF
SA2 000010XXX 64/32 020000 - 02FFFF 010000 - 017FFF
SA3 000011XXX 64/32 030000 - 03FFFF 018000 - 01FFFF
SA4 000100XXX 64/32 040000 - 04FFFF 020000 - 027FFF
SA5 000101XXX 64/32 050000 - 05FFFF 028000 - 02FFFF
SA6 000110XXX 64/32 060000 - 06FFFF 030000 - 037FFF
SA7 000111XXX 64/32 070000 - 07FFFF 038000 - 03FFFF
SA8 001000XXX 64/32 080000 - 08FFFF 040000 - 047FFF
SA9 001001XXX 64/32 090000 - 09FFFF 048000 - 04FFFF
SA10 001010XXX 64/32 0A0000 - 0AFFFF 050000 - 057FFF
SA11 001011XXX 64/32 0B0000 - 0BFFFF 058000 - 05FFFF
SA12 001100XXX 64/32 0C0000 - 0CFFFF 060000 - 067FFF
SA13 001101XXX 64/32 0D0000 - 0DFFFF 068000 - 06FFFF
SA14 001110XXX 64/32 0E0000 - 0EFFFF 070000 - 077FFF
SA15 001111XXX 64/32 0F0000 - 0FFFFF 078000 - 07FFFF
SA16 010000XXX 64/32 100000 - 10FFFF 080000 - 087FFF
SA17 010001XXX 64/32 110000 - 11FFFF 088000 - 08FFFF
SA18 010010XXX 64/32 120000 - 12FFFF 090000 - 097FFF
SA19 010011XXX 64/32 130000 - 13FFFF 098000 - 09FFFF
SA20 010100XXX 64/32 140000 - 14FFFF 0A0000 - 0A7FFF
SA21 010101XXX 64/32 150000 - 15FFFF 0A8000 - 0AFFFF
SA22 010110XXX 64/32 160000 - 16FFFF 0B0000 - 0B7FFF
SA23 010111XXX 64/32 170000 - 17FFFF 0B8000 - 0BFFFF
SA24 011000XXX 64/32 180000 - 18FFFF 0C0000 - 0C7FFF
SA25 011001XXX 64/32 190000 - 19FFFF 0C8000 - 0CFFFF
SA26 011010XXX 64/32 1A0000 - 1AFFFF 0D0000 - 0D7FFF
SA27 011011XXX 64/32 1B0000 - 1BFFFF 0D8000 - 0DFFFF
SA28 011100XXX 64/32 1C0000 - 1CFFFF 0E0000 - 0E7FFF
SA29 011101XXX 64/32 1D0000 - 1DFFFF 0E8000 - 0EFFFF
SA30 011110XXX 64/32 1E0000 - 1EFFFF 0F0000 - 0F7FFF
SA31 011111XXX 64/32 1F0000 - 1FFFFF 0F8000 - 0FBFFF
SA32 100000XXX 64/32 200000 - 20FFFF 100000 - 107FFF
SA33 100001XXX 64/32 210000 - 21FFFF 108000 - 10FFFF
SA34 100010XXX 64/32 220000 - 22FFFF 110000 - 117FFF
A29L320A Series
(November, 2012, Version 1.7) 8 AMIC Technology, Corp.
Table 2. A29L320A Top Boot Block Sector Address Table
Address Range (in h exadecimal)
Sector A20-A12 Sector Size
(Kbytes/ Kwords) Byte Mode (x8) Word Mode (x16)
SA35 100011XXX 64/32 230000 - 23FFFF 118000 - 11FFFF
SA36 100100XXX 64/32 240000 - 24FFFF 120000 - 127FFF
SA37 100101XXX 64/32 250000 - 25FFFF 128000 - 12FFFF
SA38 100110XXX 64/32 260000 - 26FFFF 130000 - 137FFF
SA39 100111XXX 64/32 270000 - 27FFFF 138000 - 13FFFF
SA40 101000XXX 64/32 280000 - 28FFFF 140000 - 147FFF
SA41 101001XXX 64/32 290000 - 29FFFF 148000 - 14FFFF
SA42 101010XXX 64/32 2A0000 - 2AFFFF 150000 - 157FFF
SA43 101011XXX 64/32 2B0000 - 2BFFFF 158000 - 15FFFF
SA44 101100XXX 64/32 2C0000 - 2CFFFF 160000 - 167FFF
SA45 101101XXX 64/32 2D0000 - 2DFFFF 168000 - 16FFFF
SA46 101110XXX 64/32 2E0000 - 2EFFFF 170000 - 177FFF
SA47 101111XXX 64/32 2F0000 - 2FFFFF 178000 - 17FFFF
SA48 110000XXX 64/32 300000 - 30FFFF 180000 - 187FFF
SA49 110001XXX 64/32 310000 - 31FFFF 188000 - 18FFFF
SA50 110010XXX 64/32 320000 - 32FFFF 190000 - 197FFF
SA51 110011XXX 64/32 330000 - 33FFFF 198000 - 19FFFF
SA52 110100XXX 64/32 340000 - 34FFFF 1A0000 - 1A7FFF
SA53 110101XXX 64/32 350000 - 35FFFF 1A8000 - 1AFFFF
SA54 110110XXX 64/32 360000 - 36FFFF 1B0000 - 1B7FFF
SA55 110111XXX 64/32 370000 - 37FFFF 1B8000 - 1BFFFF
SA56 111000XXX 64/32 380000 - 38FFFF 1C0000 - 1C7FFF
SA57 111001XXX 64/32 390000 - 39FFFF 1C8000 - 1CFFFF
SA58 111010XXX 64/32 3A0000 - 3AFFFF 1D0000 - 1D7FFF
SA59 111011XXX 64/32 3B0000 - 3BFFFF 1D8000 - 1DFFFF
SA60 111100XXX 64/32 3C0000 - 3CFFFF 1E0000 - 1E7FFF
SA61 111101XXX 64/32 3D0000 - 3DFFFF 1E8000 - 1EFFFF
SA62 111110XXX 64/32 3E0000 - 3EFFFF 1F0000 - 1F7FFF
SA63 111111000 8/4 3F0000 - 3FFFFF 1F8000 - 1F8FFF
SA64 111111001 8/4 3F2000 - 3F3FFF 1F9000 - 1F9FFF
SA65 111111010 8/4 3F4000 - 3F5FFF 1FA000 - 1FAFFF
SA66 111111011 8/4 3F6000 - 3F7FFF 1FB000 - 1FBFFF
SA67 111111100 8/4 3F8000 - 3F9FFF 1FC000 - 1FCFFF
SA68 111111101 8/4 3FA000 - 3FBFFF 1FD000 - 1FDFFF
SA69 111111110 8/4 3FC000 - 3FDFFF 1FE000 - 1FEFFF
SA70 111111111 8/4 3FE000 - 3FFFFF 1FF000 - 1FFFFF
Note:
Address range is A20 : A-1 in byte mode and A20 : A0 in word mode. See “Word/Byte Configuration” section.
A29L320A Series
(November, 2012, Version 1.7) 9 AMIC Technology, Corp.
Table 3. A29L320A Bottom Boot Block Sector Address Table
Address Range (in h exadecimal) Sector A20 -A12 Sector Size
(Kbytes/ Kwords) Byte Mode (x8) Word Mode (x16)
SA0 000000000 8/4 000000 - 001FFF 000000 - 000FFF
SA1 000000001 8/4 002000 - 003FFF 001000 - 001FFF
SA2 000000010 8/4 004000 - 005FFF 002000 - 002FFF
SA3 000000011 8/4 006000 - 007FFF 003000 - 003FFF
SA4 000000100 8/4 008000 - 009FFF 004000 - 004FFF
SA5 000000101 8/4 00A000 - 00BFFF 005000 - 0 05FFF
SA6 000000110 8/4 00C000 - 00DFFF 006000 - 006FFF
SA7 000000111 8/4 00E000 - 00FFFF 007000 - 007FFF
SA8 000001XXX 64/32 010000 - 01FFFF 008000 - 00FFFF
SA9 000010XXX 64/32 020000 - 02FFFF 010000 - 017FFF
SA10 000011XXX 64/32 030000 - 03FFFF 018000 - 01FFFF
SA11 000100XXX 64/32 040000 - 04FFFF 020000 - 027FFF
SA12 000101XXX 64/32 050000 - 05FFFF 028000 - 02FFFF
SA13 000110XXX 64/32 060000 - 06FFFF 030000 - 037FFF
SA14 000111XXX 64/32 070000 - 07FFFF 038000 - 03FFFF
SA15 001000XXX 64/32 080000 - 08FFFF 040000 - 047FFF
SA16 001001XXX 64/32 090000 - 09FFFF 048000 - 04FFFF
SA17 001010XXX 64/32 0A0000 - 0AFFFF 050000 - 057FFF
SA18 001011XXX 64/32 0B0000 - 0BFFFF 058000 - 05FFFF
SA19 001100XXX 64/32 0C0000 - 0CFFFF 060000 - 067FFF
SA20 001101XXX 64/32 0D0000 - 0DFFFF 068000 - 06FFFF
SA21 001110XXX 64/32 0E0000 - 0EFFFF 070000 - 077FFF
SA22 001111XXX 64/32 0F0000 - 0FFFFF 078000 - 07FFFF
SA23 010000XXX 64/32 100000 - 10FFFF 080000 - 087FFF
SA24 010001XXX 64/32 110000 - 11FFFF 088000 - 08FFFF
SA25 010010XXX 64/32 120000 - 12FFFF 090000 - 097FFF
SA26 010011XXX 64/32 130000 - 13FFFF 098000 - 09FFFF
SA27 010100XXX 64/32 140000 - 14FFFF 0A0000 - 0A7FFF
SA28 010101XXX 64/32 140000 - 14FFFF 0A8000 - 0AFFFF
SA29 010110XXX 64/32 160000 - 16FFFF 0B0000 - 0B7FFF
SA30 010111XXX 64/32 170000 - 17FFFF 0B8000 - 0BFFFF
SA31 011000XXX 64/32 180000 - 18FFFF 0C0000 - 0C7FFF
SA32 011001XXX 64/32 190000 - 19FFFF 0C8000 - 0CFFFF
SA33 011010XXX 64/32 1A0000 - 1AFFFF 0D0000 - 0D7FFF
SA34 011011XXX 64/32 1B0000 - 1BFFFF 0D8000 - 0DFFFF
A29L320A Series
(November, 2012, Version 1.7) 10 AMIC Technology, Corp.
Table 3. A29L320A Bottom Boot Block Sector Address Table
Address Range (in h exadecimal)
Sector A20 -A12 Sector Size
(Kbytes/ Kwords) Byte Mode (x8) Word Mode (x16)
SA35 011100XXX 64/32 1C0000 - 1CFFFF 0E0000 - 0E7FFF
SA36 011101XXX 64/32 1D0000 - 1DFFFF 0E8000 - 0EFFFF
SA37 011110XXX 64/32 1E0000 - 1EFFFF 0F0000 - 0F7FFF
SA38 011111XXX 64/32 1F0000 - 1FFFFF 0F8000 - 0FFFFF
SA39 100000XXX 64/32 200000 - 20FFFF 100000 - 107FFF
SA40 100001XXX 64/32 210000 - 21FFFF 108000 - 10FFFF
SA41 100010XXX 64/32 220000 - 22FFFF 110000 - 117FFF
SA42 100011XXX 64/32 230000 - 23FFFF 118000 - 11FFFF
SA43 100100XXX 64/32 240000 - 24FFFF 120000 - 127FFF
SA44 100101XXX 64/32 250000 - 25FFFF 128000 - 12FFFF
SA45 100110XXX 64/32 260000 - 26FFFF 130000 - 137FFF
SA46 100111XXX 64/32 270000 - 27FFFF 138000 - 13FFFF
SA47 101000XXX 64/32 280000 - 28FFFF 140000 - 147FFF
SA48 101001XXX 64/32 290000 - 29FFFF 148000 - 14FFFF
SA49 101010XXX 64/32 2A0000 - 2AFFFF 150000 - 157FFF
SA50 101011XXX 64/32 2B0000 - 2BFFFF 158000 - 15FFFF
SA51 101100XXX 64/32 2C0000 - 2CFFFF 160000 - 167FFF
SA52 101101XXX 64/32 2D0000 - 2DFFFF 168000 - 16FFFF
SA53 101110XXX 64/32 2E0000 - 2EFFFF 170000 - 177FFF
SA54 101111XXX 64/32 2F0000 - 2FFFFF 178000 - 17FFFF
SA55 110000XXX 64/32 300000 - 30FFFF 180000 - 187FFF
SA56 110001XXX 64/32 310000 - 31FFFF 188000 - 18FFFF
SA57 110010XXX 64/32 320000 - 32FFFF 190000 - 197FFF
SA58 110011XXX 64/32 330000 - 33FFFF 198000 - 19FFFF
SA59 110100XXX 64/32 340000 - 34FFFF 1A0000 - 1A7FFF
SA60 110101XXX 64/32 350000 - 35FFFF 1A8000 - 1AFFFF
SA61 110110XXX 64/32 360000 - 36FFFF 1B0000 - 1B7FFF
SA62 110111XXX 64/32 370000 - 37FFFF 1B8000 - 1BFFFF
SA63 111000XXX 64/32 380000 - 38FFFF 1C0000 - 1C7FFF
SA64 111001XXX 64/32 390000 - 39FFFF 1C8000 - 1CFFFF
SA65 111010XXX 64/32 3A0000 - 3AFFFF 1D0000 - 1D7FFF
SA66 111011XXX 64/32 3B0000 - 3BFFFF 1D8000 - 1DFFFF
SA67 111100XXX 64/32 3C0000 - 3CFFFF 1E0000 - 1E7FFF
SA68 111101XXX 64/32 3D0000 - 3DFFFF 1E8000 - 1EFFFF
SA69 111110XXX 64/32 3E0000 - 3EFFFF 1F0000 - 1F7FFF
SA70 111111XXX 64/32 3F0000 - 3FFFFF 1F8000 - 1FFFFF
Note:
Address range is A20 : A-1 in byte mode and A20 : A0 in word mode. See “Word/Byte Configuration” section.
A29L320A Series
(November, 2010, Version 1.7) 11 AMIC Technology, Corp.
Autoselect Mode
The autoselect mode provides manufacturer and device
identification, and sector protection verification, through
identifier codes output on I/O7 - I/O0. This mode is primarily
intended for programming equipment to automatically match
a device to be programmed with its corresponding
programming algorithm. However, the autoselect codes can
also be accessed in-system throug h the command register.
When using programming equipment, the autoselect mode
requires VID (11.5V to 12.5V) on address pin A9. Address
pins A6, A1, and A0 must be as shown in Autoselect Codes
(High Voltage Method) table. In addition, when verifying
sector protection, the sector address must appear on the
appropriate highest order address bits. Refer to the
corresponding Sector Address Tables. The Command
Definitions table shows the remaining address bits that are
don't care. When all necessary bits have been set as
required, the programming equipment may then read the
corresponding identifier code on I/O7 - I/O0.To access the
autoselect codes in-system, the host system can issue the
autoselect command via the command register, as shown in
the Command Definitions table. This method does not
require VID. See "Command Definitions" for details on using
the autoselect mode.
Table 4. A29L320A Autoselect Codes (High Voltage Metho d)
Description Mode CE
OE
WE
A20
to
A12
A11
to
A10
A9 A8
to
A7
A6 A5
to
A2
A1 A0 I/O8
to
I/O15
I/O7
to
I/O0
Manufacturer ID: AMIC L L H X X VID X L X L L X 37h
Word 22h F6h
Device ID:
A29L320A
(Top Boot Block) Byte L L H X X VID XLXLH X F6h
Word 22h F9h
Device ID:
A29L320A
(Bottom Boot Block) Byte L L H X X VID XLXLH X F9h
Continuation ID L L H X X VID X L X H H X 7Fh
X 01h
(protected)
Sector Protection Verification L L H SA X VID XLXHL X 00h
(unprotected)
L=Logic Low= VIL, H=Logic High=VIH, SA=Sector Address, X=Do n’t Care.
Note: The autoselect codes may also be accessed in-s ystem via command sequences.
A29L320A Series
(November, 2010, Version 1.7) 12 AMIC Technology, Corp.
Sector/Sector Block Protection and Unprotection
(Note: For the following discussion, the term “sector” applies
to both sectors and sector blocks. A sector block consists of two or more adjacent sectors that are protected or
unprotected at the same time (see Tables 5 and 6).
Table 5. Top Boot Sector/Sector Block Addresses for
Protection/Unprotection
Sector /
Sector Block A20–A12 Sector / Sector Block Size
SA0 000000XXX 64 Kbytes
SA1-SA3 000001XXX
000010XXX
000011XXX 192 (3x64) Kbytes
SA4-SA7 0001XXXXX 256 (4x64) Kbytes
SA8-SA11 0010XXXXX 256 (4x64) Kbytes
SA12-SA15 0011XXXXX 256 (4x64) Kbytes
SA16-SA19 0100XXXXX 256 (4x64) Kbytes
SA20-SA23 0101XXXXX 256 (4x64) Kbytes
SA24-SA27 0110XXXXX 256 (4x64) Kbytes
SA28-SA31 0111XXXXX 256 (4x64) Kbytes
SA32-SA35 1000XXXXX 256 (4x64) Kbytes
SA36-SA39 1001XXXXX 256 (4x64) Kbytes
SA40-SA43 1010XXXXX 256 (4x64) Kbytes
SA44-SA47 1011XXXXX 256 (4x64) Kbytes
SA48-SA51 1100XXXXX 256 (4x64) Kbytes
SA52-SA55 1101XXXXX 256 (4x64) Kbytes
SA56-SA59 1110XXXXX 256 (4x64) Kbytes
SA60-SA62 111100XXX
111101XXX
111110XXX 192 (3x64) Kbytes
SA63 111111000 8 Kbytes
SA64 111111001 8 Kbytes
SA65 111111010 8 Kbytes
SA66 111111011 8 Kbytes
SA67 111111100 8 Kbytes
SA68 111111101 8 Kbytes
SA69 111111110 8 Kbytes
SA70 111111111 8 Kbytes
Table 6. Bottom Boot Sector/Sector Block Addresses for
Protection/Unprotection
Sector /
Sector Block A20–A12 Sector / Sector Block Size
SA70 111111XXX 64 Kbytes
SA69- SA67 111110XXX
111101XXX
111100XXX 192 (3x64) Kbytes
SA66- SA63 1110XXXXX 256 (4x64) Kbytes
SA62- SA59 1101XXXXX 256 (4x64) Kbytes
SA58- SA55 1100XXXXX 256 (4x64) Kbytes
SA54- SA51 1011XXXXX 256 (4x64) Kbytes
SA50- SA47 1010XXXXX 256 (4x64) Kbytes
SA46-SA43 1001XXXXX 256 (4x64) Kbytes
SA42-SA39 1000XXXXX 256 (4x64) Kbytes
SA38-SA35 0111XXXXX 256 (4x64) Kbytes
SA34-SA31 0110XXXXX 256 (4x64) Kbytes
SA30-SA27 0101XXXXX 256 (4x64) Kbytes
SA26-SA23 0100XXXXX 256 (4x64) Kbytes
SA22-SA19 0011XXXXX 256 (4x64) Kbytes
SA18-SA15 0010XXXXX 256 (4x64) Kbytes
SA14-SA11 0001XXXXX 256 (4x64) Kbytes
SA10-SA8 000001XXX
000010XXX
000011XXX 192 (3x64) Kbytes
SA7 000000111 8 Kbytes
SA6 000000110 8 Kbytes
SA5 000000101 8 Kbytes
SA4 000000100 8 Kbytes
SA3 000000011 8 Kbytes
SA2 000000010 8 Kbytes
SA1 000000001 8 Kbytes
SA0 000000000 8 Kbytes
A29L320A Series
(November, 2012, Version 1.7) 13 AMIC Technology, Corp.
Sector Protection/Unprotection
The hardware sector protection feature disables both
program and erase operations in any sector. The hardware
sector unprotection feature re-enables both program and
erase operations in previous ly protected sectors.
It is possible to determine whether a sector is protected or
unprotected. See “Autoselect Mode” for details.
Sector protection / unprotection can be implemented via two
methods. The primary method requires VID on the
RESETpin only, and can be implemented either in-system or
via programming equipment. Figure 2 shows the algorithm
and the Sector Protect / Unprotect Timing Diagram il lustrates
the timing waveforms for this feature. This method uses
standard microprocessor bus cycle timing. For sector
unprotect, all unprotected sectors must first be protected
prior to the first sector unprotect write cycle. The alternate
method for protection and unprotection is by software sector
block protect/unprotect command. See Figure 2 for
Command Flow.
The device is shipped with all sectors unprotected.
It is possible to determine whether a sector is protected or
unprotected. See "Autoselect Mode" for details.
Hardware Data Protection
The requirement of command unlocking sequence for
programming or erasing provides data protection against
inadvertent writes (refer to the Command Definitions table).
In addition, the following hardware data protection measures
prevent accidental erasure or programming, which might
otherwise be caused by spur ious system level signals during
VCC power-up transitions, or from system noise. The device
is powered up to read array data to avoid accident ally writing
data to the array.
Write Pulse "Glitch" Protection
Noise pulses of less than 5ns (typical) on OE , CE or WE
do not initiate a write cycle.
Logical Inhibit
Write cycles are inhibited by holding any one of OE =VIL,
CE = VIH or WE = VIH. To initiate a write cycle, CE and
WE must be a logical zero while OE is a logical one.
Power-Up Write Inhibit
If WE = CE = VIL and OE = VIH during power up, the
device does not accept commands on the rising edge of
WE . The internal state machine is automatically reset to
reading array data on the initia l power-up.
Temporary Sector Unprotect
This feature allows temporary unprotection of previous
protected sectors to change data in-system. The Sector
Unprotect mode is activated by setting the RESET pin to VID.
During this mode, formerly protected sectors can be
programmed or erased by selecting the sector addresses.
Once VID is removed from the RESET pin, all the previously
protected sectors are protected again. Figure 1 shows the
algorithm, and the Temporary Sector Unprotect diagram
shows the timing waveforms, for this feature.
A29L320A Series
(November, 2012, Version 1.7) 14 AMIC Technology, Corp.
START
RESET = VID
(Note 1)
Perform Erase or
Program Operations
RESET = VIH
Temporary Sector
Unprotect
Comple ted (Note 2)
Notes:
1. All protected sectors unprotected (If WP/ACC=VIL,
outermost boot sectors will remain protected).
2. All previously protected sectors are protected once again.
Figure 1-1. Temporary Sector Unprotect Operation by RESET Mode
Figure 1-2. Temporary Sector Unprotect Operation by Software Mode
START
555/AA + 2AA/55 + 555/77
(Note 1 )
Perform Erase or
Program Opera tions
XXX/F0
(Reset Co m m a nd )
Soft-ware Temporary
Sector Un pro tect
Completed
(Note 2 )
Notes:
1. All protected sectors unprotected (If WP/ACC=VIL,
outermost boot sectors will remain protected).
2. All previously protected sectors are protected once again.
A29L320A Series
(November, 2012, Version 1.7) 15 AMIC Technology, Corp.
START
PLSCNT=1
RESET=VID
Wait 1 us
First Write
Cycle=60h?
Set up sector
address
Sector Protec:
Write 60h to sector
address with A6=0,
A1=1, A0=0
Wait 15 0 u s
Verify Sector
Protect: Write 40h
to sect or address
with A6=0, A1=1,
A0=0
Read from
sector address
with A6=0,
A1=1, A0=0
Data=01h?
Protect another
sector?
Remove VID
from RESET
Write reset
command
Sector Protect
complete
Sector Protect
Algorithm
Temporary Sector
Unprotect Mode
Increment
PLSCNT
PLSCNT
=25?
Device fai led
No
No
No
Yes
Reset
PLSCNT=1
Yes
Yes
No
Prote ct all secto r s:
The indi ca t e d po rt i o n of
the sector protect
algorithm mu st be
performed for all
unprotected sectors prior
to issuing the first sector
unprotect address
START
PLSCNT=1
RESET=VID
Wait 1 us
First Write
Cycle=60h? No Temporar y Se ct or
Unprotect Mode
Yes
No
All secto rs
protected?
Set up first sector
address
Sector Unprotect:
Write 60h to sector
address with A6=1,
A1=1, A0=0
Wait 100 ms
Verify Sector
Unprotect : Write
40h to sector
address with A6=1,
A1=1, A0=0
Read from sector
address with A6=1,
A1=1, A0=0
Data=00h?
Last sector
verified?
Remove VID
from RESET
Write reset
Command
Sector Unprotect
complete
Yes
Yes
Set up
next sector
address
No
Yes
Yes
Sector Unprotect
Algorithm
Increment
PLSCNT
PLSCNT=
10?
Device fai led
Yes
No
No
Figure 2-1. In-System Sector Protect/Unprotect Algorithms
PLSCNT=
10? No
Yes
Increment
PLSCNT
A29L320A Series
(November, 2010, Version 1.7) 16 AMIC Technology, Corp.
START
PLSCNT=1
555/AA + 2AA/55 +
555/77
Wait 1 us
First Write
Cycle=60h?
Set up sector
address
Sector Protect:
Write 60h to sector
address with A6=0,
A1=1, A0=0
Wait 150 us
Verify Sector
Protect: Write 40h
to sector address
with A6=0, A1=1,
A0=0
Read from
sector address
with A6=0,
A1=1, A0=0
Data=01h?**
Protect another
sector?
Write reset
command
Sector Protect
complete
Sector Protect
Algorithm
Temporary Sector
Unprotect Mode
Increment
PLSCNT
PLSCNT
=25?
Device failed
No
No
No
Yes
Reset
PLSCNT=1
Yes
Yes
No
Protect all sectors:
The indicated portion of
the sector protect
algorithm must be
performed for all
unprotected sectors prior
to issuing the first sector
unprotect address
START
PLSCNT=1
Wait 1 us
First Write
Cycle=60h? No Temporary Sector
Unprotect Mode
Yes
No
All se ctors
protected?
Set up first sector
address
Sector Unprotect:
Write 60h to sector
address with A6=1,
A1=1, A0=0
Wait 100 ms
Verify Sector
Unprot ect : W rite
40h to sector
address with A6=1,
A1=1, A0=0
Read from sector
address with A6=1,
A1=1, A0=0
Data=00h?**
Last sector
verified?
Write reset
Command
Sector Unprotect
complete
Yes
Yes
Set up
next sector
address
No
Yes
Yes
Sector Unprotect
Algorithm
Increment
PLSCNT
PLSCNT=
10?
Device failed
Yes
No
No
Figure 2-2. Softwa re S ector/ Se cto r B lock Protection and Unprotection Algorithms
Note: The term “sector” in the figure applies to both sectors and sector blocks
* No other command is allowed during this process
** Access time is 200ns-300ns
555/AA + 2AA/55 +
555/77
PLSCNT=
10? No
Yes
Increment
PLSCNT
A29L320A Series
(November, 2010, Version 1.7) 17 AMIC Technology, Corp.
Common Flash Memory Interface (CFI)
The Common Flash Interface (CFI) specification outlines
device and host system software interrogation handshake,
which allows specific vendor-specified soft ware algorithms to
be used for entire families of devices. Software support can
then be device-independent, JEDEC ID-independent, and
forward- and backward-compatible for the specified flash
device families. Flash vendors can standardize their existing
interface for long-term compatibilit y.
This device enters the CFI Query mode when the system
writes the CFI Query command, 98h, to address 55h in word
mode (or address AAh in byte mode), any time the device is
ready to read array data. The system can read CFI
information at the addresses given in Table 5-8. In word
mode, the upper address bits (A7-MSB) must be all zeros.
To terminate reading CFI data, the system must write the
reset command.
The system can also write the CFI quer y command when the
device is in the autoselect mode. The device enters the CFI
query mode, and the system can read CFI data at the
addresses given in Table 5-8. The system must write the
reset command to return the device to the autoselect mode.
Table 7. CFI Query Identification String
Addresses
(Word Mode)
Addresses
(Byte Mode) Data Description
10h
11h
12h
20h
22h
24h
0051h
0052h
0059h Query Unique ASCII string “QRY”
13h
14h 26h
28h 0002h
0000h Primary OEM Command Set
15h
16h 2Ah
2Ch 0040h
0000h Address for Primary Extended T able
17h
18h 2Eh
30h 0000h
0000h Alternate OEM Command Set (00h = none e xists)
19h
1Ah 32h
34h 0000h
0000h Address for Alternate OEM Extended Table (00h = none exists)
Table 8. System Interface String
Addresses
(Word Mode)
Addresses
(Byte Mode) Data Description
1Bh 36h 0027h VCC Min. (write/erase)
I/O7- I/O4 : volt, I/O3- I/O0: 100 millivolt
1Ch 38h 0036h VCC Max. (write/erase)
I/O7- I/O4: volt, I/O3- I/O0: 100 millivolt
1Dh 3Ah 0000h Vpp Min. voltage (00h = no Vpp pin present)
1Eh 3Ch 000 0h Vpp Max. voltage (00h = no Vpp pin present)
1Fh 3Eh 0004h
Typical timeout per single b yte/word write 2N μs
20h 40h 0000h
Typical timeout for Min. size buffer write 2N μs (00h = not supported)
21h 42h 000Ah Typical timeout per individual block erase 2N ms
22h 44h 0000h Typical timeout for full chip erase 2N ms (00h = not supported)
23h 46h 0005h Max. timeout for b yte/word write 2N times typical
24h 48h 0000h Max. timeout for buffer write 2N times typical
25h 4Ah 0004h Max. timeout per individual block erase 2N times typical
26h 4Ch 000 0h Max. timeout for full chip erase 2N times typical (00h = not supported)
A29L320A Series
(November, 2012, Version 1.7) 18 AMIC Technology, Corp.
Table 9. Device Geometry Definition
Addresses
(Word Mode)
Addresses
(Byte Mode) Data Description
27h 4Eh 0016h Device Size = 2N byte
28h
29h 50h
52h 0002h
0000h Flash Device Interface descri ption
2Ah
2Bh 54h
56h 0000h
0000h Max. number of byte in multi-byte write = 2N
(00h = not supported)
2Ch 58h 0002h Number of Erase Block Regions within devic e
2Dh
2Eh
2Fh
30h
5Ah
5Ch
5Eh
60h
0007h
0000h
0020h
0000h
Erase Block Region 1 Information
(refer to the CFI specification)
31h
32h
33h
34h
62h
64h
66h
68h
003Eh
0000h
0000h
0001h
Erase Block Region 2 Information
35h
36h
37h
38h
6Ah
6Ch
6Eh
70h
0000h
0000h
0000h
0000h
Erase Block Region 3 Information
39h
3Ah
3BH
3Ch
72h
74h
76h
78h
0000h
0000h
0000h
0000h
Erase Block Region 4 Information
A29L320A Series
(November, 2012, Version 1.7) 19 AMIC Technology, Corp.
Table 10. Primary Vendor-Specific Extended Query
Addresses
(Word Mode)
Addresses
(Byte Mode) Data Description
40h
41h
42h
80h
82h
84h
0050h
0052h
0049h Query-unique ASCII string “PRI”
43h 86h 0031h Major version number, ASCII
44h 88h 0031h Minor version number, ASCII
45h 8Ah 0000h Address Sensitive Unlock
0 = Required, 1 = Not Required
46h 8Ch 0002h Erase Suspend
0 = Not Supported, 1 = To Read Only, 2 = To Read & Write
47h 8Eh 0004h Sector Protect
0 = Not Supported, X = Number of sectors in per group
48h 90h 0001h Sector Temporary Unprotect
00 = Not Supported, 01 = Supported
49h 92h 0004h Sector Protect/Unprot ect scheme
01 = 29F040 mode, 02 = 29F016 mode,
03 = 29F400 mode, 04 = 29L160 mode
4Ah 94h 0000h Simultaneous Operation
00 = Not Supported, 01 = Supported
4Bh 96h 0000h Burst Mode T ype
00 = Not Supported, 01 = Supported
4Ch 98h 0000h Page Mode Type
00 = Not Supported, 01 = 4 Word Page, 02 = 8 W ord Page
4Dh 9Ah 00B5h ACC (Acceleration) Supply Minimum
00 = Not Supported, D7-D4: Volt, D3-D0: 100mV
4Eh 9Ch 00C5h ACC (Acceleration) Supply Maximum
00 = Not Supported, D7-D4: Volt, D3-D0: 100mV
4Fh 9Eh 000Xh Top/Bottom Boot Sector Flag
02 = Bottom Boot Device, 03h = Top Boot Device
A29L320A Series
(November, 2012, Version 1.7) 20 AMIC Technology, Corp.
Command Definitions
Writing specific address and data commands or sequences
into the command register initiates device operations. The
Command Definitions table defines the valid register
command sequences. Writing incorrect address and data
values or writing them in the improper sequence resets the
device to reading array data.
All addresses are latched on the falling edge of WE or CE,
whichever happens later. All data is latched on the rising
edge of WE or CE, whichever happens first. Refer to the
appropriate timing diagrams in the "AC Characteristics"
section.
Reading Array Data
The device is automatically set to reading array data after
device power-up. No commands are required to retrieve
data. The device is also ready to read array data after
completing an Embedded Program or Embedded Erase
algorithm. After the device accepts an Erase Suspend
command, the device enters the Erase Suspend mode. The
system can read array data using the standard read timings,
except that if it reads at an address within erase-suspended
sectors, the device outputs status data. After completing a
programming operation in the Erase Suspend mode, the
system may once again read array data with the same
exception. See "Erase Suspend/Erase Resume Commands"
for more information on this mode.
The system must issue the reset command to re-enable the
device for reading arr ay data if I/O5 goes hig h, or while in the
autoselect mode. See the "Reset Command" section, next.
See also "Requirements for Reading Array Data" in the
"Device Bus Operations" section for more information. The
Read Operations table provides the read parameters, and
Read Operation Timings diagram shows the timing diagram.
Reset Command
Writing the reset command to the device resets the device to
reading array data. Address bits are don't care for this
command. The reset command may be written between the
sequence cycles in an erase command sequence before
erasing begins. This resets the device to reading array data.
Once erasure begins, however, the device ignores reset
commands until the operation is complete.
The reset command may be written between the sequence
cycles in a program command sequence before
programming begins. This resets the device to reading array
data (also applies to programming in Erase Suspend mode).
Once programming begins, however, the device ignores
reset commands until the operation is complete.
The reset command may be written between the sequence
cycles in an autoselect command sequence. Once in the
autoselect mode, the reset command must be written to
return to reading array data (also applies to autoselect during
Erase Suspend).
If I/O5 goes high during a program or erase operation, writing
the reset command returns the device to reading array data
(also applies during Erase Su spend).
Autoselect Command Sequence
The autoselect command seq uence allo ws the host system to
access the manufacturer and devices codes, and determine
whether or not a sector is protected. The Command
Definitions table shows the address and data requirements.
This method is an alternative to that shown in the Autoselect
Codes (High Voltage Method) table, which is intended for
PROM programmers and requires VID on address bit A9.
The autoselect command sequence is initiated by writing two
unlock cycles, followed by the autoselect command. The
device then enters the autoselect mode, and the system may
read at any address any number of times, without initiating
another command sequence.
A read cycle at address XX00h retrieves the manufacturer
code and another read cycle at XX11h retrieves the
continuation code. A read cycl e at address XX01h returns the
device code. A read cycle containing a sector address (SA)
and the address 02h in ret urns 01h if that sector is protected,
or 00h if it is unprotected. Refer to the Sector Address tables
for valid sector addresses.
The system must write the reset command to exit the
autoselect mode and return to reading array data.
Word/Byte Program Command Sequence
The system may program the device by word or byte,
depending on the state of the BYTE pin. Programming is a
four-bus-cycle operation. The program c ommand sequenc e is
initiated by writing two unlock write cycles, followed by the
program set-up command. The program address and data are
written next, which in turn initiate the Embedded Program
algorithm. The system is not required to provide further
controls or timings. The device automatically provides
internally generated program pulses and verify the
programmed cell margin. T able 9 shows the address and data
requirements for the byte program command sequence.
When the Embedded Program algorithm is complete, the
device then returns to reading array data and addresses are
longer latched. The system can determine the status of the
program operation by using I/O7, I/O6, or RY/ BY. See “White
Operation Status” for information on these status bits.
Any commands written to the device during the Embedded
Program Algorithm are ignored. Note that a hardware reset
immediately terminates the programming operation. The Byte
Program command sequence should be reinitiated once the
device has reset to reading array data, to ensure data
integrity.
Programming is allowed in any sequence and across sector
boundaries. A bit cannot be programme d from a “0” back to a
“1”. Attempting to do so may halt the operation and set I/O5 to
“1”, or cause the Data Polling algorithm to indicate the
operation was successful. However, a succeeding read will
show that the data is still “0”. Only erase operations can
convert a “0” to a “1”.
A29L320A Series
(November, 2012, Version 1.7) 21 AMIC Technology, Corp.
START
Write Program
Command
Sequence
Data Poll
from System
Verify Data ?
Last Address ?
Programming
Completed
No
Yes
Yes
Increment Address
Embedded
Program
algorithm in
progress
Note : See the appropriate Command Definitions table for
program command sequence.
Figure 3. Program Operation
No
Unlock Bypass Command Sequenc e
The unlock bypass feature allows the system to program
bytes or words to the device faster than using the standard
program command sequence. The unlock bypass command
sequence is initiated by first writing two unloc k cycles. This is
followed by a third write cycle containing the unlock bypass
command, 20h. The device then enters the unlock bypass
mode. A two-cycle unlock bypass program command
sequence is all that is require d to program in this mode. The
first cycle in this sequence contains the unlock bypass
program command, A0h; the second cycle contains the
program address and data. Additio nal data is programmed in
the same manner. This mode dispenses with the initial two
unlock cycles required in the standard program command
sequence, resulting in faster total programm ing time. Table 9
shows the requirements for the command sequence.
During the unlock bypass mode, only the Unlock Bypass
Program and Unlock Bypass Reset commands are valid. To
exit the unlock bypass mode, the system must issue the two-
cycle unlock bypass reset command sequence. The first
cycle must contain the data 90h; the second cycle the data
00h. Addresses are don’t care for both cycle. The device
returns to reading array data.
Figure 3 illustrates the algorithm for the program operation.
See the Erase/Program Operations in “AC Characteristics” for
parameters, and to Program Operation Timings for timing
diagrams.
Chip Erase Command Sequence
Chip erase is a six-bus-cycle operation. The chip erase
command sequence is initiated by writing two unlock cycles,
followed by a set-up command. Two additional unlock write
cycles are then followed by the chip erase command, which
in turn invokes the Embedded Erase algorithm. The device
does not require the system to preprogram prior to erase. The
Embedded Erase algorithm automatically preprograms and
verifies the entire memory for an all zero data pattern pri or to
electrical erase. The system is not required to provide any
controls or timings during these operations. The Command
Definitions table shows the address and data requirements
for the chip erase command sequence.
Any commands written to the chip during the Embedded
Erase algorithm are ignored. The system can determine the
status of the erase operation by using I/O7, I/O6, or I/O2. See
"Write Operation Status" for information on these status bits.
When the Embedded Eras e algorithm is c omplete, the device
returns to reading array data and addresses are no longer
latched.
Figure 4 illustrates the algorithm for the erase operation. See
the Erase/Program Operations tables in "AC Characteristics"
for parameters, and to the Chip/Sector Erase Operation
Timings for timing waveforms.
Sector Erase Command Sequence
Sector erase is a six-bus-cycle operation. The sector erase
command sequence is initiated by writing two unlock cycles,
followed by a set-up command. Two additional unlock write
cycles are then followed by the address of the sector to be
erased, and the sector erase command. The Command
Definitions table shows the address and data requirements
for the sector erase command sequence.
The device does not require the system to preprogram the
memory prior to erase. The Embedded Erase algorithm
automatically programs and verifies the sector for an all zero
data pattern prior to electrical erase. The system is not
required to provide any controls or timings during these
operations.
After the command sequence is written, a sector erase time-
out of 50μs begins. During the time-out period, additional
sector addresses and sector erase commands may be
written. Loading the sector erase buffer may be done in any
sequence, and the number of sectors may be from one sector
to all sectors. The time between these additional cycles must
be less than 50μs, otherwise the last address and command
might not be accepted, and erasure may begin. It is
recommended that processor interrupts be disabled during
this time to ensure all commands are accepted. The
interrupts can be re-enabled after the last Sector Erase
command is written. If the time between additional sector
erase commands can be assumed to be less than 50μs, the
system need not monitor I/O3. Any command other than
Sector Erase or Erase Suspend during the time-out period
resets the device to reading array data. The system must
rewrite the command sequence and any additional sector
addresses and commands.
A29L320A Series
(November, 2012, Version 1.7) 22 AMIC Technology, Corp.
START
Write Erase
Command
Sequence
Data Poll
from System
Data = FFh ?
Erasure Completed
Yes
Embedded
Erase
algorithm in
progress
Note :
1. See the appropriate Command Definitions table for erase
command sequences.
2. See "I/O
3
: Sector Erase Timer" for more information.
No
Figure 4. Erase Operation
The system can monitor I/O3 to determine if the sector erase
timer has timed out. (See the " I/O3: Sector Erase Timer"
section.) The time-out begins from the rising edge of the final
WE pulse in the command sequence.
Once the sector erase operation has begun, only the Erase
Suspend command is valid. All other commands are ignored.
When the Embedded Erase algorit hm is com plete, the dev ice
returns to reading array data and addresses are no longer
latched. The system can determine the status of the erase
operation by using I/O7, I/O6, or I/O2. Refer to "Write
Operation Status" for information on these status bits.
4 illustrates the algorithm for the erase operation. Refer to
the Erase/Program Operations tables in the "AC
Characteristics" section for parameters, and to the Sector
Erase Operations Timing diagram for timing waveforms.
Erase Suspend/Erase Resume Commands
The Erase Suspend command allo ws the system to interrupt
a sector erase operation and then read data from, or
program data to, any sector not selected for erasure. This
command is valid only during the sector erase operation,
including the 50μs time-out period during the sector erase
command sequence. The Erase Suspend command is
ignored if written during the chip erase operation or
Embedded Program algorithm. Writing the Erase Suspend
command during the Sector Erase time-out immediately
terminates the time-out period and suspends the erase
operation. Addresses are "don't cares" when writing the
Erase Suspend command.
When the Erase Suspend command is written during a
sector erase operation, the device requires a maximum of
20μs to suspend the erase operation. However, when the
Erase Suspend command is written during the sector erase
time-out, the device immediately terminates the time-out
period and suspends the erase operation.
After the erase operation has been suspended, the system
can read array data from or program data to any sector not
selected for erasure. (The device "erase suspends" all
sectors selected for erasure.) Normal read and write timings
and command definitions apply. Reading at any address
within erase-suspended sector s produces status data on I/O7
- I/O0. The system can use I/O7, or I/O6 and I/O2 together, to
determine if a sector is actively erasing or is erase-
suspended. See "Write Operation Status" for information on
these status bits.
After an erase-suspended program operation is complete,
the system can once again read array data within non-
suspended sectors. The system can determine the status of
the program operation using the I/O7 or I/O6 status bits, just
as in the standard program operation. See "Write Operation
Status" for more information.
The system may also write the autoselect command
sequence when the device is in the Erase Suspend mode.
The device allows reading autoselect codes even at
addresses within erasing sectors, since the codes are not
stored in the memory array. When the device exits the
autoselect mode, the device reverts to the Erase Suspend
mode, and is ready for another valid operation. See
"Autoselect Command Sequence" for more information.
The system must write the Erase Resume command
(address bits are "don't care") to exit the erase suspend
mode and continue the sector erase oper ation. Further writes
of the Resume command are ignored. Another Erase
Suspend command can be written after the device has
resumed erasing.
A29L320A Series
(November, 2012, Version 1.7) 23 AMIC Technology, Corp.
Table 11. A29L320A Com m and Definitions
Bus Cycles (Notes 2 - 5)
First Second Third Fourth Fifth Sixth
Command
Sequence
(Note 1)
Cycles
Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
Read (Note 6) 1 RA RD
Reset (Note 7) 1 XXX F0
Word 555 2AA 555
Manufacturer ID Byte 4 AAA AA 555 55 AAA 90 X00 37
Word 555 2AA 555 X01 22F6Device ID,
Top Boot Block Byte 4 AAA AA 555 55 AAA 90 X02 F6
Word 555 2AA 555 X01 22F9Device ID,
Bottom Boot Block Byte 4 AAA AA 555 55 AAA 90 X02 F9
Word 555 2AA 555 X03
Continuation ID Byte 4 AAA AA 555 55 AAA 90 X06 7F
XX00
Word 555 2AA 555 (SA)
X02 XX01
00
Autoselect (Note 8)
Sector Protect Verify
(Note 9)
Byte 4 AAA AA 555 55 AAA 90 (SA)
X04 01
Word 55
CFI Query (Note 10) Byte 1 AA 98
Word 555 2AA 555
Command Temporary
Sector Unprotect (Note9) Byte 3 AAA AA 555 55 AAA 77
Byte 555 2AA 555
Program Byte 4 AAA AA 555 55 AAA A0 PA PD
Word 555 2AA 555
Unlock Bypass Byte 3 AAA AA 555 55 AAA 20
Unlock Bypass Program (Note
11) 2 XXX A0 PA PD
Unlock Bypass Reset (Note 12) 2 XXX 90 XXX 00
Word 555 2AA 555 555 2AA 555
Chip Erase Byte 6 AAA AA 555 55 AAA 80 AAA AA 555 55 AAA 10
Word 555 2AA 555 555 2AA
Sector Erase Byte 6 AAA AA 555 55 AAA 80 AAA AA 555 55 SA 30
Erase Suspend (Note 13) 1 XXX B0
Erase Resume (Note 14) 1 XXX 30
Legend:
X = Don't care
RA = Address of the memory location to be read.
RD = Data read from location RA during read operation.
PA = Address of the memory location to be programmed. Addresses latch on the falling edge of the WE or CE pulse,
whichever happens later.
PD = Data to be programmed a t loca tion PA. Data latches on the rising edge of WE or CE pulse, whichever happens first.
SA = Address of the sector to be verified (in autoselect mode) or erased. Address bits A20- A12 select a unique sector.
A29L320A Series
(November, 2012, Version 1.7) 24 AMIC Technology, Corp.
Note:
1. See Table 1 for description of bus operations.
2. All values are in he xadecimal.
3. Except when reading array or autoselect data, all bus c ycl es are write operation.
4. Address bits A20 - A11 are don't cares for unlock a nd command cycles, unless SA or PA required.
5. No unlock or command cycles required when reading array data.
6. The Reset command is required to return t o reading array data when device is in the autoselect mode, or if I/O5 goes high
(while the device is providing status data).
7. The fourth cycle of the autose lect command sequence is a read cycle.
8. The data is 00h for an unprotected sector and 01h for a protected sector. See "Autoselect Command Sequence" for more
information.
9. Once a reset command is applied, software temporary unprotect is exit to return to read array data. But under erase
suspend condition, this command is sti ll effective even a reset command has been appli ed. The reset command which can
deactivate the software temporary unprotect command is useful only after the erase command is complete.
10. Command is valid when device is ready to read array data or when device is in autoselect mode.
11. The Unlock Bypass command is required prior to the Unlock Bypass Program command.
12. The Unlock Bypass Reset command is required to return to reading array data when the device is in the unlock bypass
mode.
13. The system may read and program in non -erasing sectors, o r en ter the auto sele ct mode, w hen in the Era se Suspend mode .
14. The Erase Resume command is valid onl y during the Erase Suspend mode.
A29L320A Series
(November, 2010, Version 1.7) 25 AMIC Technology, Corp.
Write Operation Status
Several bits, I/O2, I/O3, I/O5, I/O6, I/O7, RY/BY are provided in
the A29L320A to determine the status of a write operation.
Table 10 and the following subsections describe the
functions of these status bits. I/O7, I/O6 and RY/BY each
offer a method for determining whether a program or erase
operation is complete or in progress. These three bits are
discussed first.
I/O7: Data Polling
The Data Polling bit, I/O7, indicates to the host system
whether an Embedded Algorithm is in progre ss or completed,
or whether the device is in Erase Suspend. Data Polling is
valid after the rising edge of the final WE pulse in the
program or erase command sequence.
During the Embedded Program algorithm, the device out puts
on I/O7 the complement of the datum programmed to I/O7.
This I/O7 status also applies to programming during Erase
Suspend. When the Embedded Program algorithm is
complete, the device outputs the datum programmed to I/O7.
The system must provide the program address to read valid
status information on I/O7. If a program address falls within a
protected sector, Data Polling on I/O7 is active for
approximately 2μs, then the device returns to reading array
data.
During the Embedded Erase algorithm, Data Polling
produces a "0" on I/O7. When the Embe dded Erase al gorit h m
is complete, or if the device enters the Eras e Suspend mo de,
Data Polling produces a "1" on I/O7.This is analo gous to the
complement/true datum output described for the Embedded
Program algorithm: the erase function changes all the bits in
a sector to "1"; prior to this, the device outputs the
"complement," or "0." The system must provide an address
within any of the sectors selected for erasure to read valid
status information on I/O7.
After an erase command sequence is written, if all sectors
selected for erasing are protected, Data Polling on I/O7 is
active for approximately 100μs, then the device returns to
reading array data. If not all selected sectors are protected,
the Embedded Erase algorithm erases the unprotected
sectors, and ignores the selected sectors that are protected.
When the system detects I/O7 has changed from the
complement to true data, it can read valid data at I/O7 - I/O0
on the following read cycles. This is because I/O7 may
change asynchronously with I/O0 - I/O6 while Output Enable
(OE ) is asserted low. The Data Polling Timings (During
Embedded Algorithms) figure in the "AC Characteristics"
section illustrates this. Table 10 shows the outputs for Data
Polling on I/O7. Figure 5 shows the Data Polling algorithm.
START
Read I/O
7
-I/O
0
Address = VA
I/O
7
= Data ?
FAIL
No
Note :
1. VA = Valid address for programming. During a sector
erase operation, a valid address is an address within any
sector selected for erasure. During chip erase, a valid
address is any non-protected sector address.
2. I/O
7
should be rechecked even if I/O
5
= "1" because
I/O
7
may change simultaneously with I/O
5
.
No
Read I/O
7
- I/O
0
Address = VA
I/O
5
= 1?
I/O
7
= Data ?
Yes
No
PASS
Yes
Yes
Figure 5. Data Polling Algorithm
A29L320A Series
(November, 2010, Version 1.7) 26 AMIC Technology, Corp.
RY/BY : Read/Busy
The RY/ BY is a dedicated, open-drain output pin that
indicates whether an Embedded algorithm is in progress or
complete. The RY/ BY status is valid after the rising edge of
the final WE pulse in the command sequence. Since RY/BY
is an open-drain output, several RY/ BY pins can be tied
together in parallel with a pull-up resistor to VCC.
If the output is low (Busy), the device is actively erasing or
programming. (This includes programming in the Erase
Suspend mode.) If the output is high (Ready), the device is
ready to read array data (including during the Erase Suspend
mode), or is in the standby mode.
Table 10 shows the outputs for RY/BY. Refer to “RESET
Timings”, “Timing Waveforms for Program Operation” and
“Timing Waveforms for Chip/Sector Erase Operation” for
more information.
I/O6: Toggle Bit I
Toggle Bit I on I/O6 indicates whether an Embedded Pro gram
or Erase algorithm is in progress or complete, or whether the
device has entered the Erase Suspend mode. Toggle Bit I
may be read at any address, and is valid after the risin g edge
of the final WE pulse in the command sequ ence (prior to the
program or erase operation), and during the sector erase
time-out.
During an Embedded Program or Erase algorithm operation,
successive read cycles to any address cause I/O6 to toggle.
(The system may use either OE or CE to control the read
cycles.) When the operation is complete, I/O6 stops toggling.
After an erase command sequence is written, if all sectors
selected for erasing are protected, I/O6 toggles for
approximately 100μs, then returns to reading array data. If not
all selected sectors are protected, the Embedded Erase
algorithm erases the unprotected sectors, and ignores the
selected sectors that are protected.
The system can use I/O6 and I/O2 together to determine
whether a sector is actively erasing or is erase-suspended.
When the device is actively erasing (that is, the Embedded
Erase algorithm is in progr ess), I/O6 toggles . When the device
enters the Erase Suspend mode, I/O6 stops toggling.
However, the system must also use I/O2 to determine which
sectors are erasing or erase-suspended. Alternatively, the
system can use I/O7 (see the subsection on " I/O7 : Data
Polling").
If a program address falls within a protected sector, I/O6
toggles for approximately 2μs after the program command
sequence is written, then returns to reading a rray data.
I/O6 also toggles during the erase-suspend-program mode,
and stops toggling once the Embedded Program algorithm is
complete.
The Write Operation Status table shows the outputs for
Toggle Bit I on I/O6. Refer to Figure 6 for the toggle bit
algorithm, and to the Toggle Bit Timings figure in the "AC
Characteristics" section for the timing diagram. The I/O2 vs.
I/O6 figure shows the differences between I/O2 and I/O6 in
graphical form. See also the subsection on " I/O2: Toggle Bit
II".
I/O2: Toggle Bit II
The "Toggle Bit II" on I/O2, when used with I/O6, indicates
whether a particular sector is actively erasing (that is, the
Embedded Erase algorithm is in progress), or whether that
sector is erase-suspended. Toggle Bit II is valid after the
rising edge of the final WE pulse in the command sequence.
I/O2 toggles when the system reads at addr esses within those
sectors that have been selected for eras ure. (The system may
use either OE or CE to control the read cycles.) But I/O2
cannot distinguish whether the sector is actively erasing or is
erase-suspended. I/O6, by comparison, indicates whether the
device is actively erasin g, or is in Erase Suspend, but can not
distinguish which sectors ar e selected for erasure. Thus, b oth
status bits are required for sector and mode information.
Refer to Table 10 to compare outputs for I/O2 and I/O6.
Figure 6 shows the toggle bit algor ithm in flowchart form, and
the section " I/O2: Toggle Bit II" explains the algorithm. See
also the " I/O6: Toggle Bit I" subsection. Refer to the Toggle
Bit Timings figure for the toggle bit timing diagram. The I/O2
vs. I/O6 figure shows the differences between I/O2 and I/O6 in
graphical form.
Reading Toggle Bits I/O6, I/O2
Refer to Figure 6 for the following discussion. Whenever the
system initially begins reading toggle bit status, it must read
I/O7 - I/O0 at least twice in a row to determine whether a
toggle bit is toggling. Typically, a system would note and sto re
the value of the toggle bit after the first read. After the second
read, the system would compare the new value of the toggle
bit with the first. If the toggle bit is not toggling, the device has
completed the program or erase operation. The system can
read array data on I/O7 - I/O0 on the following read cycle.
However, if after the initial two read cycles, the system
determines that the toggle bit is still toggling, the system also
should note whether the value of I/O 5 is high (see the section
on I/O5). If it is, the system should then determine again
whether the toggle bit is toggling, since the toggle bit may
have stopped toggling just as I/O5 went high. If the toggle bit
is no longer toggling, the device has successfully completed
the program or erase operation. If it is still toggling, the device
did not complete the operation successfully, and the system
must write the reset command to return to reading array data.
The remaining scenario is that the system initially determines
that the toggle bit is toggling and I/O 5 has not gone high. The
system may continue to monitor the toggle bit and I/O5
through successive read cycles, determining the status as
described in the previous paragraph. Alternatively, it may
choose to perform other system tasks. In this case, the
system must start at the beginning of the algorithm when it
returns to determine the status of the operation (top of Figu re
6).
I/O5: Exceeded Timing Limits
I/O5 indicates whether the program or erase time has
exceeded a specified internal pulse count limit. Under these
conditions I/O5 produces a "1." T his is a failure condition that
indicates the program or erase cycle was not successfully
completed.
A29L320A Series
(November, 2012, Version 1.7) 27 AMIC Technology, Corp.
The I/O5 failure condition may appear if the system tries to
program a "1 "to a location that is previously programmed to
"0." Only an erase operation can change a "0" back to a "1."
Under this condition, the device halts the operation, and
when the operation has exceeded the timing limits, I/O5
produces a "1."
Under both these conditions, the system must issue the reset
command to return the device to reading array data.
I/O3: Sector Erase Timer
After writing a sector erase command sequence, the system
may read I/O3 to determine whether or not an erase
operation has begun. (T he sector erase timer does not apply
to the chip erase command.) If additional sectors are
selected for erasure, the entire time-out also applies after
each additional sector erase command. Whe n the time-out is
complete, I/O3 switches from "0" to "1." The system may
ignore I/O3 if the system can guarantee that the time
between additional sector erase commands will always be
less than 50μs. See also the "Sector Erase Command
Sequence" section.
After the sector erase command sequence is written, the
system should read the status on I/O7 ( Data Polling) or I/O6
(Toggle Bit 1) to ensure the device has accepted the
command sequence, and then read I/O3. If I/O3 is "1", the
internally controlled erase cycle has begun; all further
commands (other than Erase Suspend) are ignored until the
erase operation is complete. If I/O3 is "0", the device will
accept additional sector erase commands. To ensure the
command has been accepted, the system software should
check the status of I/O3 prior to and following each
subsequent sector erase command. If I/O3 is high on the
second status check, the last command might not have been
accepted. Table 10 shows the outputs for I/O3.
START
Read I/O
7
-I/O
0
Toggle Bit
= Toggle ?
Program/Erase
Operation Not
Commplete, Write
Reset Command
Yes
Notes :
1. Read toggle bit twice to determine whether or not it is
toggling. See text.
2. Recheck toggle bit because it may stop toggling as I/O
5
changes to "1". See text.
No
Read I/O
7
- I/O
0
Twice
I/O
5
= 1?
Toggle Bit
= Toggle ?
Yes
Yes
Program/Erase
Operation Complete
No
No
Read I/O
7
-I/O
0
(Notes 1,2)
Figure 6. Toggle Bit Algorithm
(Note 1)
A29L320A Series
(November, 2012, Version 1.7) 28 AMIC Technology, Corp.
Table 12. Write Operation Status
I/O7 I/O6 I/O5 I/O3 I/O2 RY/BY
Operation (Note 1) (Note 2) (Note 1)
Embedded Program Algorithm 7I/O Toggle 0 N/A No toggle 0
Standard
Mode Embedded Erase Algorithm 0 Toggle 0 1 Toggle 0
Reading within Erase
Suspended Sector 1 No toggle 0 N/A Toggle 1
Reading within Non-Erase
Suspend Sector Data Data Data Data Data 1
Erase
Suspend
Mode
Erase-Suspend-Program 7I/O Toggle 0 N/A N/A 0
Notes:
1. I/O7 and I/O2 require a valid address when reading status information. Refer to the appropriate subsection for further details.
2. I/O5 switches to “1” when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits.
See “I/O5: Exceeded Timing Limits” for more information.
Maximum Negative Input Overshoot
20ns 20ns
20ns
+0.8V
-0.5V
-2.0V
Maximum Positive Input Overshoot
20ns20ns
20ns
VCC+0.5V
2.0V
VCC+2.0V
A29L320A Series
(November, 2012, Version 1.7) 29 AMIC Technology, Corp.
DC Characteristics
CMOS Compatible
Parameter
Symbol Parameter Description Test Description Min. Typ. Max. Unit
ILI Input Load Current VIN = VSS to VCC. VCC = VCC Max
±1.0 μA
ILIT A9 Input Load Current VCC = VCC Max, A9 =12.5V 35 μA
ILO Output Leakage Current VOUT = VSS to VCC. VCC = VCC Max
±1.0 μA
5 MHz 10 16
CE = VIL, OE = VIH
Byte Mode 1 MHz 2 4
5 MHz 10 16
ICC1 VCC Active Read Current
(Notes 1, 2) CE = VIL, OE = VIH
Word Mode 1 MHz 2 4
mA
ICC2 VCC Active Write (Program/Erase)
Current (Notes 2, 3, 4) CE= VIL, OE =VIH 20 30 mA
ICC3 VCC Standby Current (Note 2) CE= RESET= VCC ± 0.3V 0.5 5 μA
ICC4 VCC Standby Current During Reset
(Note 2) RESET= VSS ± 0.3V 0.5 5 μA
ICC5 Automatic Sleep Mode
(Note 2, 4, 5) VIH = VCC ± 0.3V; VIL = VSS ± 0.3V 0.5 5 μA
VIL Input Low Level -0.5 0.8 V
VIH Input High Level 0.7 x VCC VCC + 0.3 V
VHH Voltage for WP/ACC Sector Protect/
Unprotect and Program Acceleration VCC=3.0V ± 10% 11.5 12.5 V
VID Voltage for Autoselect and
Temporary Unprotect Sector VCC = 3.0 V ± 10% 11.5 12.5 V
VOL Output Lo w Voltage IOL = 4.0mA, VCC = VCC Min
0.45 V
VOH1 IOH = -2.0 mA, VCC = VCC Min 0.85 x VCC
V
VOH2 Output High Voltage IOH = -100 μA, VCC = VCC Min VCC - 0.4
V
Notes:
1. The ICC current listed is typical ly less than 2 mA/MHz, withOEat VIH. Typical VCC is 3.3V.
2. Maximum ICC specifications are tested with VCC = VCC max.
3. ICC active while Embedded Algorithm (program or erase) is in progress.
4. Automatic sleep mode enables the low power mode when addresses rema in stable for tACC + 30ns. Typical sleep mode current
is 500nA.
5. Not 100% tested.
A29L320A Series
(November, 2012, Version 1.7) 30 AMIC Technology, Corp.
DC Characteristics (continued)
Zero Power Flash
0 500 1000 1500 2000 2500 3000 3500 4000
5
0
10
15
20
25
Time in ns
Supply Current in mA
Note: Addresses are switching at 1MHz
I
CC1
Current vs. Time (Showing Active and Automatic Sleep Currents)
12345
0
2
4
6
8
10
Frequency in MHz
Supply Current in mA
C25T :Note °=
Typical ICC1 vs. Frequency
3.6V
3.0V
A29L320A Series
(November, 2010, Version 1.7) 31 AMIC Technology, Corp.
AC Characteristics
Read Only Operations
Parameter
Symbols Speed Unit
JEDEC Std
Description Test Setup
-70 -80 -90 -120
tAVAV tRC Read Cycle T ime (Note 1) Min. 70 80 90 120 ns
tAVQV tACC Address to Output Delay CE = VIL
OE = VIL
Max. 70 80 90 120 ns
tELQV tCE Chip Enable to Output Delay OE = VIL Max. 70 80 90 120 ns
tGLQV tOE Output Enable to Output Delay Max. 30 30 40 50 ns
Read 0 0 0 0 0
ns
tOEH Output Enable Hold
Time (Note 1) Toggle and
Data Polling
10 10 10 10 10 ns
tEHQZ tHZ Chip Enable to Output High Z
(Notes 1) Max. 16 16 16 16 ns
tGHQZ tDF Output Enable to Output High Z
(Notes 1) 16 16 16 16 ns
tAXQX tOH Output Hold Time from Addresses,
CEor OE, Whichever Occurs First
(Note 1)
Min. 0 0 0 0 ns
Notes:
1. Not 100% tested.
2. See Test Conditions and Test Setup for test specifications.
Timing Waveforms for Read Only Operation
Addresses Addresses Stable
CE
OE
WE
Output Valid High-Z
Output
t
RC
t
OEH
t
OE
t
CE
High-Z
t
OH
t
DF
t
ACC
0V
RESET
RY/BY
A29L320A Series
(November, 2012, Version 1.7) 32 AMIC Technology, Corp.
AC Characteristics
Hardware Reset (RESET)
Parameter
JEDEC Std Description Test Setup All Speed Options Unit
tREADY RESET Pin Low (During Embedded
Algorithms) to Read or Write (See Note) Max 20 μs
tREADY RESET Pin Low (Not During Embed ded
Algorithms) to Read or Write (See Note) Max 500 ns
tRP RESET Pulse Width Min 500 ns
tRH RESET High Time Before Read (See Note) Min 50 ns
tRB RY/BY Recovery Time Min 0 ns
tRPD RESET Low to Standby Mode Min 20 μs
Note: Not 100% tested.
RESET Timings
CE, OE
RESET t
RH
t
RP
t
Ready
Reset Timings NOT during Embedded Algorithms
RESET
t
RP
~
~
Reset Timings during Embedded Algorithms
RY/BY
~
~
t
RB
~
~
t
Ready
CE, OE
RY/BY
A29L320A Series
(November, 2012, Version 1.7) 33 AMIC Technology, Corp.
Temporary Sector Unprotect
Parameter
JEDEC Std Description All Speed Options Unit
tVIDR VID Rise an d F all Time (See Note) Min 500 ns
tRSP RESET Setup Time for Temporary Sector
Unprotect Min 4 μs
tVHH VHH Rise and Fall Time (See Note) Min 250 ns
tRRB RESET Hold Time from RY/BY High for
Temporary Sector/Sector Block Unprotect Min 4 μs
Note: Not 100% tested.
Temporary Sector Unprotect Timing Diagram
Program or Erase Command Sequence
RESET
~
~~
~~
~
VID
VSS, VIL,
or VIH
tVIDR tVIDR
tRSP
CE
WE
RY/BY
~
~
VID
VSS, VIL,
or VIH
tRRB
Accelerated Program Timing Diagram
~
~
VHH
VIL or VIH VIL or VIH
VCC
WP/ACC tVHH tVHH
AC Characteristics
Word/Byte Configuration (BYTE)
Parameter All Speed Options Unit
JEDEC Std Description
-70 -80 -90 -120
tELFL/tELFH CE to BYTE Switching Low or High Max 5 ns
tFLQZ BYTE Switching Low to Output High-Z Max 25 25 30 30 ns
tHQV BYTE Switching High to Output Active Min 70 80 90 120 ns
A29L320A Series
(November, 2012, Version 1.7) 34 AMIC Technology, Corp.
Data Output
(I/O
0
-I/O
14
)Data Output
(I/O
0
-I/O
7
)
I/O
15
Output Address Input
Data Output
(I/O
0
-I/O
14
)
Data Output
(I/O
0
-I/O
7
)
I/O
15
Output
Address Input
t
FHQV
t
FLQZ
t
ELFH
t
ELFL
CE
OE
BYTE
I/O
0
-I/O
14
I/O
15
(A-1)
BYTE
I/O
0
-I/O
14
I/O
15
(A-1)
BYTE
Switching
from word to
byte mode
BYTE
Switching
from byte to
word mode
BYTE Timings for Read Operations
BYTE Timings for Write Operations
Note:
Refer to the Erase/Program Operations table for tAS and tAH specifications.
The falling edge of the last WE signal
t
HOLD
(t
AH
)
t
SET
(t
AS
)
CE
BYTE
WE
A29L320A Series
(November, 2012, Version 1.7) 35 AMIC Technology, Corp.
AC Characteristics
Erase and Program Operations
Parameter Speed
JEDEC Std
Description
-70 -80 -90
-120
Unit
tAVAV tWC Write Cycle Time (Note 1) Min. 70 80 90
120 ns
tAVWL tAS Address Setup Time Min. 0 0 0 0
ns
tWLAX tAH Address Hold Time Min. 40 45 45 50 ns
tDVWH tDS Data Setup Time Min. 40 45 45 50 ns
tWHDX tDH Data Hold Time Min. 0 ns
tOES Output Enable Setup Time Min. 0 ns
tGHWL tGHWL Read Recover Time Before Write
(OE high to WE low) Min. 0 ns
tELWL tCS CE Setup Time Min. 0 ns
tWHEH tCH CE Hold Time Min. 0 ns
tWLWH tWP Write Pulse Width Min. 30 35 35 50 ns
tWHWL tWPH Write Pulse Width High Min. 30 ns
Byte Typ. 20
tWHWH1 tWHWH1 Byte Programming Operation
(Note 2) Word Typ. 40 μs
tWHWH2 tWHWH2 Sector Erase Operation (Note 2) Typ. 1 sec
tvcs VCC Set Up Time (Note 1) Min. 50 μs
tRB Recovery Time from RY/BY (Note 1) Min 0 ns
tBUSY Program/Erase Valid to RY/BY Delay (Note 1) Min 90 ns
Notes:
1. Not 100% tested.
2. See the "Erase and Programming Performance" section for more information.
A29L320A Series
(November, 2012, Version 1.7) 36 AMIC Technology, Corp.
Timing Waveforms for Program Operation
Addresses
CE
OE
WE
Data
VCC
A0h PD
t
WC
PA
Program Command Sequence (last two cycles)
PA
D
OUT
~
~
~
~
PA
~
~
Status
~
~
~
~
~
~
~
~
t
AS
t
VCS
Read Status Data (last two cycles)
555h
t
AH
t
WHWH1
t
CH
t
WP
t
WPH
t
CS
t
DS
t
DH
Note :
1. PA = program addrss, PD = program data, Dout is the true data at the program address.
2. Illustration shows device in word mode.
~
~
t
RB
t
BUSY
RY/BY
A29L320A Series
(November, 2012, Version 1.7) 37 AMIC Technology, Corp.
Addresses
CE
OE
WE
Data
VCC
55h 30h
t
WC
SA
Erase Command Sequence (last two cycles)
VA
Complete
~
~
~
~
VA
~
~
In
Progress
~
~
~
~
~
~
~
~
t
AS
t
VCS
Read Status Data
2AAh
t
AH
t
WHWH2
t
CH
t
WP
t
WPH
t
CS
t
DS
t
DH
Note :
1. SA = Sector Address (for Sector Erase), VA = Valid Address for reading status data (see "Write Operaion Ststus").
2. Illustratin shows device in word mode.
555h for chip erase
10h for chip erase
~
~
t
RB
t
BUSY
RY/BY
Timing Waveforms for Chip/Sector Erase Operation
A29L320A Series
(November, 2012, Version 1.7) 38 AMIC Technology, Corp.
Timing Waveforms for Data Polling (During Embedded Algorithms)
Addresses
CE
OE
WE
I/O7
tRC
VAVA VA
~
~
~
~
~
~
~
~
~
~
Complement
~
~
Complement True Valid Data High-Z
Status Data
~
~
Status Data True Valid Data High-Z
I/O0 - I/O6
tACC
tCE
tCH tOE
tOEH tDF
tOH
Note : VA = Valid Address. Illustation shows first status cycle after command sequence, last status read cycle, and array data
read cycle.
~
~
tBUSY
RY/BY
High-Z
A29L320A Series
(November, 2012, Version 1.7) 39 AMIC Technology, Corp.
Timing Waveforms for Toggle Bit (During Embedded Algorith m s)
Note: VA = Valid Address; not required for I/O6. Illustration shows first two status cycle after command sequence, last status
read cycle, and array data read cycle.
Addresses
CE
OE
WE
I/O
6
,
I/O
2
t
RC
VAVA VA
~
~
~
~
~
~
~
~
~
~
Valid Status
t
ACC
t
CE
t
CH
t
OE
t
OEH
t
DF
t
OH
VA
Valid Status Valid Status Valid Data
~
~
(first read) (second read) (stop togging)
RY/BY
~
~
t
BUSY
High-Z
A29L320A Series
(November, 2012, Version 1.7) 40 AMIC Technology, Corp.
Timing Waveforms for Sector Protec t/Unpr otect
V
ID
Note : For sector protect, A6=0, A1=1, A0=0. For sector unprotect, A6=1, A1=1, A0=0
~
~
~
~~
~
~
~
V
IH
RESET
SA, A6,
A1, A0
Data
CE
WE
OE
Valid* Valid* Valid*
60h 60h 40h Status
Sector Protect/Unprotect Verify
1us Sector Protect:150us
Sector Unprotect:15ms
Timing Waveforms for I/O2 vs. I/O6
Enter
Embedded
Erasing
Erase
Suspend Enter Erase
Suspend Program Erase
Resume
WE
I/O
6
I/O
2
Erase Erase Suspend
Read Erase Suspend
Read Erase Erase
Complete
I/O
2
and I/O
6
toggle with OE and CE
Note : Both I/O
6
and I/O
2
toggle with OE or CE. See the text on I/O
6
and I/O
2
in the section "Write Operation Status" for
more information.
~
~
~
~
~
~
Erase
Suspend
Program
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
A29L320A Series
(November, 2012, Version 1.7) 41 AMIC Technology, Corp.
Timing Waveforms for A l ternate CE Controlled Write Operation
Addresses
WE
OE
CE
Data
555 for program
2AA for erase
PA
D
OUT
~
~
~
~
I/O
7
~
~
~
~
~
~
Data Polling
Note :
1. PA = Program Address, PD = Program Data, SA = Sector Address, I/O
7
= Complement of Data Input, D
OUT
= Array Data.
2. Figure indicates the last two bus cycles of the command sequence.
PD for program
30 for sector erase
10 for chip erase
~
~
t
BUSY
t
WHWH1 or 2
t
AH
t
AS
t
WC
t
WH
t
CP
t
WS
t
CPH
PA for program
SA for sector erase
555 for chip erase
A0 for program
55 for erase
t
RH
t
DS
t
DH
~
~
~
~
RESET
RY/BY
Erase and Programming Performance
Parameter Typ. (Note 1) Unit Comments
Sector Erase Time 1.0 sec
Chip Erase Time 45 sec
Excludes 00h programming prior to erasure
Byte Programming Time 20 μs
Word Programming Time 40 μs
Byte Mode 32 sec Chip Programming Time
(Note 2) Word Mode 20 sec
Excludes system-level overhead (Note 4)
Notes:
1. Typical program and erase times assume the follo wing conditions: 25 °C, 3.0V VCC, 10, 000 cycles. Addition ally, progr amming
typically assumes checkerboard pattern.
2. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes
program faster than the maximum byte program time listed . If the maximum byte program time given is exceeded, only then
does the device set I/O5 = 1. See the section on I/O5 for further information.
3. In the pre-programming step of the Embedded Erase algorithm, all bytes are programm ed to 00h before erasure.
4. System-level overhead is the time requ ired to execute the four-bus-cycle command se quence for programming. See Table 9
for further information on command definiti ons.
5. The device has a guaranteed minimum erase an d program cycle endurance of 100, 000 cycles.
A29L320A Series
(November, 2012, Version 1.7) 42 AMIC Technology, Corp.
Latch-up Characteristics
Description Min. Max.
Input Voltage with respect to VSS on all I/O pins -1.0V VCC+1.0V
VCC Current -100 mA +100 mA
Input voltage with respect to VSS on all pins except I/O pins
(including A9, OE and RESET) -1.0V 12.5V
Includes all pins except VCC. T est conditio ns: VCC = 5.0V, one pin at time.
TSOP/TFBGA Pin Capacitance
Parameter Symbol Paramete r Description Test Setup Typ. Max. Unit
TSOP 6 7.5 pF
CIN Input Capacitance VIN=0 TFBGA 4.2 5 pF
TSOP 8.5 12 pF
COUT Output Capacitance VOUT=0 TFBGA 5.4 6.5 pF
TSOP 7.5 9 pF
CIN2 Control Pin Capacitance VIN=0 TFBGA 3.9 4.7 pF
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0MHz
Data Retention
Parameter Test Conditions Min Unit
150°C 10 Years
Minimum Pattern Data Retention Time 125°C 20 Years
A29L320A Series
(November, 2012, Version 1.7) 43 AMIC Technology, Corp.
Test Conditions
Test Specifications
Test Condition -70 -80 -90 -120 Unit
Output Load 1 TTL gate
Output Load Capacitance, CL(including jig capacitance) 30 100 100 100 pF
Input Rise and Fall Times 5 ns
Input Pulse Levels 0.0 – VCC V
Input timing measurement referenc e levels 0.5VCC V
Output timing measurement reference levels 0.5VCC V
Test Setup
Input Waveforms and Measuremen t Levels
Measurement Level
Input 0.5VCC 0.5VCC Output
VCC
0.0V
6.2 KW
Device
Under
Test
CLDiodes = I N3064 or Equi valent
2.7 KW
3.0V
A29L320A Series
(November, 2012, Version 1.7) 44 AMIC Technology, Corp.
Ordering Information
Top Boot Sector Flash
Part No. Access Time
(ns)
Active Read
Current
Typ. (mA)
Program/Erase
Current
Typ. (mA)
Standby Current
Typ. (μA) Package
A29L320ATV-70F 48 Pin Pb-Free TSOP
A29L320ATV-70UF 48 Pin Pb-Free TSOP
A29L320ATV-70IF 48 Pin Pb-Free TSOP
A29L320ATG-70F 48 ball Pb-Free TFBGA
A29L320ATG-70UF 48 ball Pb-Free TFBGA
A29L320ATG-70IF
70 10 20 0.5
48 ball Pb-Free TFBGA
A29L320ATV-80F 48 Pin Pb-Free TSOP
A29L320ATV-80UF 48 Pin Pb-Free TSOP
A29L320ATV-80IF 48 Pin Pb-Free TSOP
A29L320ATG-80F 48 ball Pb-Free TFBGA
A29L320ATG-80UF 48 ball Pb-Free TFBGA
A29L320ATG-80IF
80 10 20 0.5
48 ball Pb-Free TFBGA
A29L320ATV-90F 48 Pin Pb-Free TSOP
A29L320ATV-90UF 48 Pin Pb-Free TSOP
A29L320ATV-90IF 48 Pin Pb-Free TSOP
A29L320ATG-90F 48 ball Pb-Free TFBGA
A29L320ATG-90UF 48 ball Pb-Free TFBGA
A29L320ATG-90IF
90 10 20 0.5
48 ball Pb-Free TFBGA
A29L320ATV-120F 48 Pin Pb-Free TSOP
A29L320ATV-120UF 48 Pin Pb-Free TSOP
A29L320ATV-120IF 48 Pin Pb-Free TSOP
A29L320ATG-120F 48 ball Pb-Free TFBGA
A29L320ATG-120UF 48 ball Pb-Free TFBGA
A29L320ATG-120IF
120 10 20 0.5
48 ball Pb-Free TFBGA
Note: -U is for industrial operating temperature range: -40°C to +85°C
-I is for industrial operating temperature range: -25°C to +85°C
A29L320A Series
(November, 2012, Version 1.7) 45 AMIC Technology, Corp.
Ordering Information (continued)
Bottom Boot Sector Flash
Part No. Access Time
(ns)
Active Read
Current
Typ. (mA)
Program/Erase
Current
Typ. (mA)
Standby Current
Typ. (μA) Package
A29L320AUV-70F 48 Pin Pb-Free TSOP
A29L320AUV-70UF 48 Pin Pb-Free TSOP
A29L320AUV-70IF 48 Pin Pb-Free TSOP
A29L320AUG-70F 48 ball Pb-Free TFBGA
A29L320AUG-70UF 48 ball Pb-Free TFBGA
A29L320AUG-70IF
70 10 20 0.5
48 ball Pb-Free TFBGA
A29L320AUV-80F 48 Pin Pb-Free TSOP
A29L320AUV-80UF 48 Pin Pb-Free TSOP
A29L320AUV-80IF 48 Pin Pb-Free TSOP
A29L320AUG-80F 48 ball Pb-Free TFBGA
A29L320AUG-80UF 48 ball Pb-Free TFBGA
A29L320AUG-80IF
80 10 20 0.5
48 ball Pb-Free TFBGA
A29L320AUV-90F 48 Pin Pb-Free TSOP
A29L320AUV-90UF 48 Pin Pb-Free TSOP
A29L320AUV-90IF 48 Pin Pb-Free TSOP
A29L320AUG-90F 48 ball Pb-Free TFBGA
A29L320AUG-90UF 48 ball Pb-Free TFBGA
A29L320AUG-90IF
90 10 20 0.5
48 ball Pb-Free TFBGA
A29L320AUV-120F 48 Pin Pb-Free TSOP
A29L320AUV-120UF 48 Pin Pb-Free TSOP
A29L320AUV-120IF 48 Pin Pb-Free TSOP
A29L320AUG-120F 48 ball Pb-Free TFBGA
A29L320AUG-120UF 48 ball Pb-Free TFBGA
A29L320AUG-120IF
120 10 20 0.5
48 ball Pb-Free TFBGA
Note: -U is for industrial operating temperature range: -40°C to +85°C
-I is for industrial operating temperature range: -25°C to +85°C
A29L320A Series
(November, 2012, Version 1.7) 46 AMIC Technology, Corp.
Package Information
TSOP 48L (Type I) Outline Dimensions unit: inches/mm
1
E
c
D
L
θ
Detail "A"
0.25
24 25
48
D
1
D
y
e
SA1
A2A
Detail "A"
b
Dimensions in inches Dimensio ns in mm
Symbol Min Nom Max Min Nom Max
A - - 0.047 - - 1.20
A1 0.002 - 0.006 0.05 - 0.15
A2 0.037 0.039 0.042 0.94 1.00 1.06
b 0.007 0.009 0.011 0.18 0.22 0.27
c 0.004 - 0.008 0.12 - 0.20
D 0.779 0.787 0.795 19.80 20.00 20.20
D1 0.720 0.724 0.728 18.30 18.40 18.50
E - 0.472 0.476 - 12.00 12.10
e 0.020 BASIC 0.50 BASIC
L 0.020 0.024 0.0275 0.50 0.60 0.70
S 0.011 Typ. 0.28 Typ.
y - - 0.004 - - 0.10
θ 0° - 8° 0° - 8°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flas h.
A29L320A Series
(November, 2012, Version 1.7) 47 AMIC Technology, Corp.
Package Information
48LD CSP (6 x 8 mm) Outline Dimensions unit: mm
(48TFBGA)
A1
H
G
F
E
D
C
B
A
TOP VIEW
SIDE VIEW
C SEATING PLANE
654321
BOTTOM VIEW
Ball*A1 CORNER
H
G
F
E
D
C
B
A
E
E1
e
e
D1
D
b
0.10 C
A
123456
Dimensions in mm
Symbol Min. Nom. Max.
A - - 1.20
A1 0.20 0.25 0.30
b 0.30 - 0.40
D 5.90 6.00 6.10
D1 4.00 BSC
e - 0.80 -
E 7.90 8.00 8.10
E1 5.60 BSC