B57703M0103G040 - EPCOS - Datasheet.Live

NTC thermistors for

temperature measurement

Probe assemblies

Series/Type: B57703M

Date: February 2009

information contained therein without EPCOS' prior express consent is prohibited.

1) Depends on mounting situation.

Applications

Surface temperature measurement,

e.g. on housings and heat sinks

Features

High accuracy

Easy mounting

Good thermal coupling through metal tag

Thermistor encapsulated in metal-tag case

PTFE-insulated leads of silver-plated

nickel wire, AWG 30

UL approval (E69802)

Options

Alternative resistance ratings, rated

temperatures, resistance tolerances, lead

lengths and AWG 26 or AWG 28 stranded

wires available on request.

Delivery mode

Bulk

Dimensional drawing

Dimensions in mm

Approx. weight 0.8 g

General technical data

Climatic category (IEC 60068-1) 55/125/56

Max. power (at 25 °C) P25 150 mW

Resistance tolerance ∆RR/RR±2 %

Rated temperature TR25 °C

Dissipation factor (in air) δth1) approx. 3 mW/K

Thermal cooling time constant (in air) τc1) approx. 50 s

Heat capacity Cth1) approx. 150 mJ/K

Test voltage (t = 1 s) Vtest 1000 V AC

Electrical specification and ordering codes

R25

Ω

No. of R/T

characteristic

B25/100

Ordering code

5 k 8016 3988 ±1% B57703M0502G040

10 k 8016 3988 ±1% B57703M0103G040

30 k 8018 3964 ±1% B57703M0303G040

Temperature measurement B57703M

Probe assemblies M703

Page 2 of 10Please read Cautions and warnings and

Important notes at the end of this document.

Reliability data

Test Standard Test conditions ∆R25/R25

(typical)

Remarks

Storage in

dry heat

IEC

60068-2-2

Storage at upper

category temperature

T: 125 °C

t: 1000 h

< 1% No visible

damage

Storage in damp

heat, steady state

IEC

60068-2-78

Temperature of air: 40 °C

Relative humidity of air: 93%

Duration: 56 days

< 1% No visible

damage

Rapid temperature

cycling

IEC

60068-2-14

Lower test temperature: 55 °C

Upper test temperature: 125 °C

Number of cycles: 10

< 0.5% No visible

damage

Endurance Pmax: 150 mW

t: 1000 h

< 1% No visible

damage

Long-term stability

(empirical value)

Temperature: 70 °C

t: 10000 h

< 2% No visible

damage

Temperature measurement B57703M

Probe assemblies M703

Page 3 of 10Please read Cautions and warnings and

Important notes at the end of this document.

R/T characteristics

R/T No. 8016 8018

T (°C) B25/100 = 3988 K B25/100 = 3964 K

RT/R25 α(%/K) RT/R25 α(%/K)

55.0 96.3 7.4  

50.0 67.01 7.2  

45.0 47.17 6.9  

40.0 33.65 6.7 30.24 6.3

35.0 24.26 6.4 22.1 6.1

30.0 17.7 6.2 16.32 5.9

25.0 13.04 6.0 12.17 5.8

20.0 9.707 5.8 9.153 5.6

15.0 7.293 5.6 6.945 5.4

10.0 5.533 5.5 5.313 5.2

5.0 4.232 5.3 4.097 5.1

0.0 3.265 5.1 3.183 4.9

5.0 2.539 5.0 2.491 4.8

10.0 1.99 4.8 1.963 4.7

15.0 1.571 4.7 1.557 4.6

20.0 1.249 4.5 1.244 4.4

25.0 1.0000 4.4 1.0000 4.3

30.0 0.8057 4.3 0.8083 4.2

35.0 0.6531 4.1 0.6572 4.1

40.0 0.5327 4.0 0.5373 4.0

45.0 0.4369 3.9 0.4418 3.9

50.0 0.3603 3.8 0.365 3.7

55.0 0.2986 3.7 0.303 3.7

60.0 0.2488 3.6 0.2527 3.6

65.0 0.2083 3.5 0.2118 3.5

70.0 0.1752 3.4 0.1783 3.4

75.0 0.1481 3.3 0.1508 3.3

80.0 0.1258 3.2 0.128 3.2

85.0 0.1072 3.2 0.1091 3.2

90.0 0.09177 3.1 0.0933 3.1

95.0 0.07885 3.0 0.08016 3.0

100.0 0.068 2.9 0.0691 2.9

105.0 0.05886 2.9 0.05974 2.9

110.0 0.05112 2.8 0.05183 2.8

115.0 0.04454 2.7 0.04512 2.8

120.0 0.03893 2.6 0.0394 2.7

125.0 0.03417 2.6 0.0345 2.6

130.0 0.03009 2.5 0.03032 2.6

135.0 0.02654 2.5 0.02672 2.5

140.0 0.02348 2.4 0.02361 2.5

145.0 0.02083 2.4 0.02091 2.4

150.0 0.01853 2.3 0.01857 2.4

155.0 0.01653 2.3 0.016537 2.3

Temperature measurement B57703M

Probe assemblies M703

Page 4 of 10Please read Cautions and warnings and

Important notes at the end of this document.

Temperature measurement B57703M

Probe assemblies M703

Page 5 of 10Please read Cautions and warnings and

Important notes at the end of this document.

Cautions and warnings General

See "Important notes" at the end of this document.

Storage

Store thermistors only in original packaging. Do not open the package prior to storage.

Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative

humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is

inadmissible.

Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the

packing material may be deformed or components may stick together, causing problems during

mounting.

Avoid contamination of thermistor surface during storage, handling and processing.

Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc).

Use the components as soon as possible after opening the factory seals, i.e. the

polyvinyl-sealed packages.

Solder thermistors within the time specified after shipment from EPCOS.

For leaded components this is 24 months, for SMDs 12 months.

Handling

NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused

during handling of NTCs.

Do not touch components with bare hands. Gloves are recommended.

Avoid contamination of thermistor surface during handling.

Bending / twisting leads

A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from

the component head or housing. When bending ensure the wire is mechanically relieved at the

component head or housing. The bending radius should be at least 0.75 mm.

Twisting (torsion) by 180°of a lead bent by 90°is permissible at 6 mm from the bottom of the

thermistor body.

Soldering

Use resin-type flux or non-activated flux.

Insufficient preheating may cause ceramic cracks.

Rapid cooling by dipping in solvent is not recommended.

Complete removal of flux is recommended.

Temperature measurement B57703M

Probe assemblies M703

Page 6 of 10Please read Cautions and warnings and

Important notes at the end of this document.

Mounting

Ensure that no thermo-mechanical stress occurs due to production processes (curing or

overmolding processes) when thermistors are sealed, potted or overmolded or during their

subsequent operation. The maximum temperature of the thermistor must not be exceeded.

Ensure that the materials used (sealing/potting compound and plastic material) are chemically

neutral.

Electrodes/contacts must not be scratched or damaged before/during/after the mounting

process.

Contacts and housing used for assembly with the thermistor must be clean before mounting.

Ensure that adjacent materials are designed for operation at temperatures comparable to the

surface temperature of the thermistor. Be sure that surrounding parts and materials can

withstand the temperature.

Avoid contamination of the thermistor surface during processing.

The connections of sensors (e.g. cable end, wire end, plug terminal) may only be exposed to

an environment with normal atmospheric conditions.

Tensile forces on cables or leads must be avoided during mounting and operation.

Bending or twisting of cables or leads directly on the thermistor body is not permissible.

Avoid using chemical substances as mounting aids. It must be ensured that no water or other

liquids enter the NTC thermistors (e.g. through plug terminals). In particular, water based

substances (e.g. soap suds) must not be used as mounting aids for sensors.

Operation

Use thermistors only within the specified operating temperature range.

Use thermistors only within the specified power range.

Environmental conditions must not harm the thermistors. Only use the thermistors under

normal atmospheric conditions or within the specified conditions.

Contact of NTC thermistors with any liquids and solvents should be prevented. It must be

ensured that no water enters the NTC thermistors (e.g. through plug terminals). For

measurement purposes (checking the specified resistance vs. temperature), the component

must not be immersed in water but in suitable liquids (e.g. Galden).

Avoid dewing and condensation unless thermistor is specified for these conditions.

Bending or twisting of cables and/or wires is not permissible during operation of the sensor in

the application.

Be sure to provide an appropriate fail-safe function to prevent secondary product damage

caused by malfunction.

This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.

Temperature measurement B57703M

Probe assemblies M703

Page 7 of 10Please read Cautions and warnings and

Important notes at the end of this document.

Symbols and terms

Symbol English German

A Area Fläche

AWG American Wire Gauge Amerikanische Norm für Drahtquerschnitte

B B value B-Wert

B25/100 B value determined by resistance

measurement at 25 °C and 100 °C

B-Wert, ermittelt durch Widerstands-

messungen bei 25 °C und 100 °C

Cth Heat capacitance Wärmekapazität

I Current Strom

N Number (integer) Anzahl (ganzzahliger Wert)

P25 Maximum power at 25 °C Maximale Leistung bei 25 °C

Pdiss Power dissipation Verlustleistung

Pel Electrical power Elektrische Leistung

Pmax Maximum power within stated

temperature range

Maximale Leistung im

angegebenenTemperaturbereich

∆RB/RBResistance tolerance caused by

spread of B value

Widerstandstoleranz, die durch die

Streuung des B-Wertes verursacht wird

Rins Insulation resistance Isolationswiderstand

RPParallel resistance Parallelwiderstand

RRRated resistance Nennwiderstand

∆RR/RRResistance tolerance Widerstandstoleranz

RSSeries resistance Serienwiderstand

RTResistance at temperature T

(e.g. R25 = resistance at 25 °C)

Widerstand bei Temperatur T

(z.B. R25 = Widerstand bei 25 °C)

T Temperature Temperatur

∆T Temperature tolerance Temperaturtoleranz

t Time Zeit

TAAmbient temperature Umgebungstemperatur

Tmax Upper category temperature Obere Grenztemperatur

(Kategorietemperatur)

Tmin Lower category temperature Untere Grenztemperatur

(Kategorietemperatur)

Top Operating temperature Betriebstemperatur

TRRated temperature Nenntemperatur

Tsurf Surface temperature Oberflächentemperatur

V Voltage Spannung

Vins Insulation test voltage Isolationsprüfspannung

Vop Operating voltage Betriebsspannung

Vtest Test voltage Prüfspannung

Temperature measurement B57703M

Probe assemblies M703

Page 8 of 10Please read Cautions and warnings and

Important notes at the end of this document.

Symbol English German

αTemperature coefficient Temperaturkoeffizient

∆Tolerance, change Toleranz, Änderung

δth Dissipation factor Wärmeleitwert

τcThermal cooling time constant Thermische Abkühlzeitkonstante

τaThermal time constant Thermische Zeitkonstante

Abbreviations / Notes

Symbol English German

Surface-mounted devices Oberflächenmontierbares Bauelement

* To be replaced by a number in ordering

codes, type designations etc.

Platzhalter für Zahl im Bestellnummern-

code oder für die Typenbezeichnung.

+ To be replaced by a letter. Platzhalter für einen Buchstaben.

All dimensions are given in mm. Alle Maße sind in mm angegeben.

The commas used in numerical values

denote decimal points.

Verwendete Kommas in Zahlenwerten

bezeichnen Dezimalpunkte.

Temperature measurement B57703M

Probe assemblies M703

Page 9 of 10Please read Cautions and warnings and

Important notes at the end of this document.

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for

certain areas of application. These statements are based on our knowledge of typical re-

quirements that are often placed on our products in the areas of application concerned. We

nevertheless expressly point out that such statements cannot be regarded as binding

statements about the suitability of our products for a particular customer application.

As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar

with them than the customers themselves. For these reasons, it is always ultimately incum-

bent on the customer to check and decide whether an EPCOS product with the properties de-

scribed in the product specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or

failure before the end of their usual service life cannot be completely ruled out in the

current state of the art, even if they are operated as specified. In customer applications

requiring a very high level of operational safety and especially in customer applications in

which the malfunction or failure of an electronic component could endanger human life or

health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by

means of suitable design of the customer application or other action taken by the customer

(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by

third parties in the event of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this

publication may contain substances subject to restrictions in certain jurisdictions (e.g.

because they are classed as hazardous). Useful information on this will be found in our Ma-

terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-

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specifications. Please check therefore to what extent product descriptions and specifications

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aforementioned does not apply in the case of individual agreements deviating from the fore-

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dustry" published by the German Electrical and Electronics Industry Association

(ZVEI).

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MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT,

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Important notes

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