DS314-1 (v1.0) October 18, 2004 www.xilinx.com 1
Advance Product Specification 1-800-255-7778
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Introduction
The Xilinx Automotive (XA) Spartan™-3 family of Field-Pro-
grammable Gate Arrays is specifically designed to meet the
needs of high volume, cost-sensitive automotive consumer
electronic applications. The four-member family offers den-
sities ranging from 50,000 to five million system gates, as
shown in Ta b l e 1 .
XA devices are available in both the extended-temperature
Q-grade (-40°C to +125°C) and industrial I-grade (-40°C to
+100°C) and are qualified to the industry-recognized
AEC-Q100 standard.
The XA Spartan-3 family builds on the success of the earlier
XA Spartan-IIE family by increasing the amount of logic
resources, the capacity of internal RAM, the total number of
I/Os, and the overall level of performance as well as by
improving clock management functions. Numerous
enhancements derive from state-of-the-art Virtex™-II tech-
nology. These Spartan-3 enhancements, combined with
advanced process technology, deliver more functionality
and bandwidth per dollar than was previously possible, set-
ting new standards in the programmable logic industry.
Because of their exceptionally low cost, Spartan-3 FPGAs
are ideally suited to a wide range of advanced automotive
electronics modules and systems ranging from the latest
driver assistance and infotainment systems to reconfig-
urable instrument clusters and ECU gateways.
The Spartan-3 family is a superior alternative to mask pro-
grammed ASICs. FPGAs avoid the high initial cost, the
lengthy development cycles, and the inherent inflexibility of
conventional ASICs. Also, FPGA programmability permits
design upgrades in the field with no hardware replacement
necessary, an impossibility with ASICs.
Features
AEC-Q100 device qualification and full PPAP support
available in both extended temperature Q-grade and
I-grade.
Guaranteed to meet full electrical specifications over
TJ=-40°C to +125°C.
Revolutionary 90-nanometer process technology
Very low cost, high-performance logic solution for
high-volume, automotive applications
- 326 MHz system clock rate
- Three power rails: for core (1.2V), I/Os (1.2V to
3.3V), and auxiliary purposes (2.5V)
SelectIO™ signaling
- Up to 333 I/O pins
- 622 Mb/s data transfer rate per I/O
- Seventeen single-ended signal standards
- Seven differential signal standards including LVDS
- Termination by Digitally Controlled Impedance
- Signal swing ranging from 1.14V to 3.45V
- Double Data Rate (DDR) support
Logic resources
- Abundant logic cells with shift register capability
- Wide multiplexers
- Fast look-ahead carry logic
- Dedicated 18 x 18 multipliers
- JTAG logic compatible with IEEE 1149.1/1532
SelectRAM™ hierarchical memory
- Up to 576 Kbits of total block RAM
- Up to 120 Kbits of total distributed RAM
Digital Clock Manager (up to four DCMs)
- Clock skew elimination
- Frequency synthesis
Fully supported by Xilinx ISE development system
- Synthesis, mapping, placement and routing
MicroBlaze™ processor, CAN, LIN, PCI, and other
cores
Pb-free packaging options
Additionally, Xilinx and all of our production partners
are qualified to QS-9000, moving to TS16949 in 2005.
06 Spartan-3 Automotive XA FPGA
Family:
Introduction and Ordering
DS314-1 (v1.0) October 18, 2004 00Advance Product Specification
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Spartan-3 Automotive XA FPGA Family: Introduction and Ordering Information
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.
Architectural Overview
The Spartan-3 family architecture consists of five funda-
mental programmable functional elements:
Configurable Logic Blocks (CLBs) contain RAM-based
Look-Up Tables (LUTs) to implement logic and storage
elements that can be used as flip-flops or latches.
CLBs can be programmed to perform a wide variety of
logical functions as well as to store data.
Input/Output Blocks (IOBs) control the flow of data
between the I/O pins and the internal logic of the
device. Each IOB supports bidirectional data flow plus
3-state operation. Twenty-four different signal
standards, including seven high-performance
differential standards, are available as shown in
Table 2. Double Data-Rate (DDR) registers are
included. The Digitally Controlled Impedance (DCI)
feature provides automatic on-chip terminations,
simplifying board designs.
Block RAM provides data storage in the form of 18-Kbit
dual-port blocks.
Multiplier blocks accept two 18-bit binary numbers as
inputs and calculate the product.
Digital Clock Manager (DCM) blocks provide
self-calibrating, fully digital solutions for distributing,
delaying, multiplying, dividing, and phase shifting clock
signals.
These elements are organized as shown in Figure 1. A ring
of IOBs surrounds a regular array of CLBs. The XA3S50
has a single column of block RAM embedded in the array.
Those devices ranging from the XA3S200 to the XA3S1000
have two columns of block RAM. Each column is made up
of several 18K-bit RAM blocks; each block is associated
with a dedicated multiplier. The DCMs are positioned at the
ends of the outer block RAM columns.
The Spartan-3 family features a rich network of traces and
switches that interconnect all five functional elements,
transmitting signals among them. Each functional element
has an associated switch matrix that permits multiple con-
nections to the routing.
Table 1:
Summary of Spartan-3 FPGA Attributes
Device
System
Gates
Logic
Cells
CLB Array
(One CLB = Four Slices) Distributed
RAM (bits1)
Block RAM
(bits1)
Dedicated
Multipliers DCMs
Maximum
User I/O
Maximum
Differential
I/O PairsRows Columns Total CLBs
XA3S50 50K 1,728 16 12 192 12K 72K 4 2 63 56
XA3S200 200K 4,320 24 20 480 30K 216K 12 4 173 76
XA3S400 400K 8,064 32 28 896 56K 288K 16 4 173 116
XA3S1000 1M 17,280 48 40 1,920 120K 432K 24 4 333 175
Notes:
1. By convention, one Kb is equivalent to 1,024 bits.
Spartan-3 Automotive XA FPGA Family: Introduction and Ordering Information
DS314-1 (v1.0) October 18, 2004 www.xilinx.com 3
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Figure 1:
Spartan-3 Family Architecture
DS099-1_01_032703
Notes:
1. The XA3S50 has only the block RAM column on the far left. The recommended memory for storing
the configuration data is the low-cost XA Platform Flash PROM family device/package combination,
which comprises the XAF00S PROMs for serial configuration.
Spartan-3 Automotive XA FPGA Family: Introduction and Ordering Information
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Configuration
Spartan-3 FPGAs are programmed by loading configuration
data into robust static memory cells that collectively control
all functional elements and routing resources. Before pow-
ering on the FPGA, configuration data is stored externally in
a PROM or some other nonvolatile medium either on or off
the board. After applying power, the configuration data is
written to the FPGA using any of five different modes: Mas-
ter Parallel, Slave Parallel, Master Serial, Slave Serial and
Boundary Scan (JTAG). The Master and Slave Parallel
modes use an 8-bit wide SelectMAP™ port.
The recommended memory for storing the configuration
data is the low-cost Xilinx Platform Flash PROM family,
which includes the XCF00S PROMs for serial configuration
and the higher density XCF00P PROMs for parallel or serial
configuration.
I/O Capabilities
The SelectIO feature of Spartan-3 devices supports 17 sin-
gle-ended standards and seven differential standards as
listed in Ta ble 2. Many standards support the DCI feature,
which uses integrated terminations to eliminate unwanted
signal reflections. Table 3 shows the number of user I/Os as
well as the number of differential I/O pairs available for each
device/package combination.
Table 2:
Signal Standards Supported by the Spartan-3 Family
Standard
Category Description
VCCO
(V) Class Symbol
DCI
Option
Single-Ended
GTL Gunning Transceiver Logic N/A Terminated GTL Yes
Plus GTLP Yes
HSTL High-Speed Transceiver Logic 1.5 I HSTL_I Yes
III HSTL_III Yes
1.8 I HSTL_I_18 Yes
II HSTL_II_18 Yes
III HSTL_III_18 Yes
LVCMOS Low-Voltage CMOS 1.2 N/A LVCMOS12 No
1.5 N/A LVCMOS15 Yes
1.8 N/A LVCMOS18 Yes
2.5 N/A LVCMOS25 Yes
3.3 N/A LVCMOS33 Yes
LVTTL Low-Voltage Transistor-Transistor Logic 3.3 N/A LVTTL No
PCI Peripheral Component Interconnect 3.0 33 MHz PCI33_3 No
SSTL Stub Series Terminated Logic 1.8 N/A SSTL18_I Yes
2.5 I SSTL2_I Yes
II SSTL2_II Yes
Differential
LDT
(ULVDS)
Lightning Data Transport
(HyperTransport™)
2.5 N/A LDT_25 No
LVDS Low-Voltage Differential Signaling Standard LVDS_25 Yes
Bus BLVDS_25 No
Extended Mode LVDSEXT_25 Yes
LVPECL Low-Voltage Positive Emitter-Coupled
Logic
2.5 N/A LVPECL_25 No
RSDS Reduced-Swing Differential Signaling 2.5 N/A RSDS_25 No
Spartan-3 Automotive XA FPGA Family: Introduction and Ordering Information
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Ordering Information
Spartan-3 FPGAs are available in both standard and Pb-free packaging options for all device/package combinations. The
Pb-free packages include a special ’G’ character in the ordering code.
Standard Packaging
Pb-Free Packaging
For additional information on Pb-free packaging, see XAPP427:
Xilinx Lead Free Packages.
Table 3:
Spartan-3 XA I/O Chart
Device
Available User I/Os and Differential (Diff) I/O
Pairs
VQG100 PQG208 FTG256 FGG456
User Diff User Diff User Diff User Diff
XA3S50 63 29 124 56 - - - -
XA3S200 63 29 141 62 173 76 - -
XA3S400 - - 141 62 173 76 - -
XA3S1000 - - - - - - 333 149
Notes:
1. All device options listed in a given package column are
pin-compatible.
XA3S50 -4 PQ 208 Q
Device Type
Speed Grade
Temperature Range:
Q = Automotive Extended (T
J
= -40
˚
C to +125
˚
C)
I = Automotive Industrial (T
J
= -40
˚
C to +100
˚
C)
Package Type Number of Pins
Example:
DS099-1_02a_100804
Device Speed Grade Package Type / Number of Pins Temperature Range (TJ)
XA3S50 -4 Standard Performance VQ(G)100 100-pin Very Thin Quad Flat Pack (VQFP) I Automotive Industrial
(–40°C to +100°C)
XA3S200 PQ(G)208 208-pin Plastic Quad Flat Pack (PQFP) Q Automotive Extended
(–40°C to +125°C)
XA3S400 FT(G)256 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA)
XA3S1000 FG(G)456 456-ball Fine-Pitch Ball Grid Array (FBGA)
XA3S50 -4 PQ G 208 Q
Device Type
Speed Grade
Temperature Range:
Q = Automotive Extended (T
J
= -40
˚
C to +125
˚
C)
I = Automotive Industrial (T
J
= -40
˚
C to +100
˚
C)
Package Type Number of Pins
Pb-free
Example:
DS099-1_02b_100804
Spartan-3 Automotive XA FPGA Family: Introduction and Ordering Information
6www.xilinx.com DS314-1 (v1.0) October 18, 2004
1-800-255-7778 Advance Product Specification
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Revision History
The Spartan-3 Family Data Sheet
DS099-1,
Spartan-3 FPGA Family: Introduction and Ordering Information
(Module 1)
DS099-2,
Spartan-3 FPGA Family: Functional Description
(Module 2)
DS099-3,
Spartan-3 FPGA Family: DC and Switching Characteristics
(Module 3)
DS099-4,
Spartan-3 FPGA Family: Pinout Descriptions
(Module 4)
Date Version No. Description
10/18/04 1.0 Initial Xilinx release.