For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
LINEAR & POWER AMPLIFIERS - CHIP
1
HMC498
v03.0713
GaAs pHEMT MMIC
POWER AMPLIFIER, 17 - 24 GHz
Functional Diagram
Features
Typical Applications
General Description
The HMC498 is ideal for:
• Point-to-Point Radios
• Point-to-Multi-Point Radios
• VSAT
• Military & Space
Output IP3: +34 dBm
Saturated Power: +27 dBm @ 25% PAE
Gain: 24 dB
Supply Voltage: +5V
50 Ohm Matched Input/Output
Die Size: 2.38 x 1.46 x 0.1 mm
The HMC498 is a high dynamic range GaAs pHEMT
MMIC Power Amplier which operates between
17 and 24 GHz. The HMC498 provides 24 dB of gain,
+27 dBm of saturated power and 25% PAE from
a +5V supply voltage. The HMC498 amplier can
easily be integrated into Multi-Chip-Modules (MCMs)
due to its small size. All data is with the chip in a
50 Ohm test xture connected via 0.025mm (1 mil)
diameter wire bonds of minimal length 0.31mm (12
mils).
Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Units
Frequency Range 17 - 19 19 - 22 22 - 24 GHz
Gain 20 23 28 21 24 28 20 23 28 dB
Gain Variation Over Temperature 0.03 0.04 0.03 0.04 0.03 0.04 dB/ °C
Input Return Loss 11 11 8dB
Output Return Loss 20 18 15 dB
Output Power for 1 dB Compression (P1dB) 20 23.5 22 25 21 24 dBm
Saturated Output Power (Psat) 27 26.5 25.5 dBm
Output Third Order Intercept (IP3) 34 34 34 dBm
Noise Figure 3.5 4.0 4.5 dB
Supply Current (Idd)(Vdd = 5V, Vgg = -0.8V Typ.) 250 275 250 275 250 275 mA
Electrical Specications, TA = +25° C, Vdd = 5V, Idd = 250mA*
* Adjust Vgg between -2 to 0V to achieve Idd = 250mA typical.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
LINEAR & POWER AMPLIFIERS - CHIP
2
HMC498
v03.0713
GaAs pHEMT MMIC
POWER AMPLIFIER, 17 - 24 GHz
Broadband Gain & Return Loss Gain vs. Temperature
Input Return Loss vs. Temperature Output Return Loss vs. Temperature
P1dB vs. Temperature Psat vs. Temperature
-30
-20
-10
0
10
20
30
12 14 16 18 20 22 24 26 28
S21 S11 S22
RESPONSE (dB)
FREQUENCY (GHz)
10
14
18
22
26
30
16 17 18 19 20 21 22 23 24 25
+25 C +85 C -55 C
GAIN (dB)
FREQUENCY (GHz)
-25
-20
-15
-10
-5
0
16 17 18 19 20 21 22 23 24 25
+25 C +85 C -55 C
RETURN LOSS (dB)
FREQUENCY (GHz)
-30
-25
-20
-15
-10
-5
0
16 17 18 19 20 21 22 23 24 25
+25 C +85 C -55 C
RETURN LOSS (dB)
FREQUENCY (GHz)
10
14
18
22
26
30
16 17 18 19 20 21 22 23 24 25
+25 C +85 C -55 C
P1dB (dBm)
FREQUENCY (GHz)
10
14
18
22
26
30
16 17 18 19 20 21 22 23 24 25
+25 C +85 C -55 C
Psat (dBm)
FREQUENCY (GHz)
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
LINEAR & POWER AMPLIFIERS - CHIP
3
HMC498
v03.0713
GaAs pHEMT MMIC
POWER AMPLIFIER, 17 - 24 GHz
[1] Footnote if needed
Output IP3 vs. Temperature Noise Figure vs. Temperature
Gain & Power vs. Supply
Voltage@ 20 GHz, Idd= 250mA Reverse Isolation vs. Temperature
Power Compression @ 20 GHz Power Compression @ 24 GHz
20
24
28
32
36
40
16 17 18 19 20 21 22 23 24 25
+25 C +85 C -55 C
IP3 (dBm)
FREQUENCY (GHz)
0
2
4
6
8
10
16 17 18 19 20 21 22 23 24 25
+25 C +85 C -55 C
NOISE FIGURE (dB)
FREQUENCY (GHz)
10
14
18
22
26
30
3 3.5 4 4.5 5 5.5
Gain P1dB Psat
GAIN (dB), P1dB (dBm), Psat (dBm)
Vdd Supply Voltage (V)
-70
-60
-50
-40
-30
-20
-10
0
16 17 18 19 20 21 22 23 24 25
+25 C +85 C -55 C
ISOLATION (dB)
FREQUENCY (GHz)
0
3
6
9
12
15
18
21
24
27
30
-10 -8 -6 -4 -2 0 2 4 6 8 10
Pout (dBm) Gain (dB) PAE (%)
Pout (dBm), GAIN (dB), PAE (%)
INPUT POWER (dBm)
0
5
10
15
20
25
30
-10 -8 -6 -4 -2 0 2 4 6 8 10
Pout (dBm) Gain (dB) PAE (%)
Pout (dBm), GAIN (dB), PAE (%)
INPUT POWER (dBm)
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
LINEAR & POWER AMPLIFIERS - CHIP
4
HMC498
v03.0713
GaAs pHEMT MMIC
POWER AMPLIFIER, 17 - 24 GHz
Outline Drawing
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Drain Bias Voltage (Vdd1, Vdd2, Vdd3) +5.5V
Gate Bias Voltage (Vgg) -4 to 0V
RF Input Power (RFIN)(Vdd = +5V) +10 dBm
Channel Temperature 175 °C
Continuous Pdiss (T= 85 °C)
(derate 21.4mW/°C above 85 °C) 1.92 W
Thermal Resistance
(channel to die bottom) 46.8 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -55 to +85 °C
ESD Sensitivity (HBM) Class 1A
Absolute Maximum Ratings Typical Supply Current vs. Vdd
Vdd (V) Idd (mA)
+4.5 241
+5.0 250
+5.5 258
+3.0 240
+3.5 250
+4.0 259
Note: Amplier will operate over full voltage ranges shown above.
Vgg adjusted to achieve Idd= 250mA at +5V and +3.5V.
Die Packaging Information [1]
Standard Alternate
GP-2 (Gel Pack) [2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND IS .004” SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BOND PAD METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
LINEAR & POWER AMPLIFIERS - CHIP
5
HMC498
v03.0713
GaAs pHEMT MMIC
POWER AMPLIFIER, 17 - 24 GHz
Assembly Diagram
Pad Descriptions
Pad Number Function Description Interface Schematic
1RFIN This pad is AC coupled and matched to 50 Ohms.
2 - 4 Vdd1, Vdd2, Vdd3 Power Supply Voltage for the amplier. External bypass
capacitors of 100 pF and 0.01 µF are required.
5RFOUT This pad is AC coupled and matched to 50 Ohms.
6Vgg
Gate control for amplier. Adjust to achieve Idd of 250mA.
Please follow “MMIC Amplier Biasing Procedure” Appli-
cation Note. External bypass capacitors of 100 pF and 0.01
µF are required.
Die Bottom GND Die bottom must be connected to RF/DC ground.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
LINEAR & POWER AMPLIFIERS - CHIP
6
HMC498
v03.0713
GaAs pHEMT MMIC
POWER AMPLIFIER, 17 - 24 GHz
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
RF Ground Plane
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 2.
0.150mm (0.005”) Thick
Moly Tab
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
RF Ground Plane
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 1.
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina
thin lm substrates are recommended for bringing RF to and from the chip
(Figure 1). If 0.254mm (10 mil) thick alumina thin lm substrates must be
used, the die should be raised 0.150mm (6 mils) so that the surface of
the die is coplanar with the surface of the substrate. One way to accom-
plish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil)
thick molybdenum heat spreader (moly-tab) which is then attached to the
ground plane (Figure 2).
Microstrip substrates should brought as close to the die as possible in
order to minimize bond wire length. Typical die-to-substrate spacing is
0.076mm to 0.152 mm (3 to 6 mils).
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD pro-
tective containers, and then sealed in an ESD protective bag for shipment.
Once the sealed ESD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt
to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is
applied. Use shielded signal and bias cables to minimize inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet
or with a sharp pair of bent tweezers. The surface of the chip may have
fragile air bridges and should not be touched with vacuum collet, tweezers, or ngers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy.
The mounting surface should be clean and at.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool
temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO
NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of
scrubbing should be required for attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy llet is observed
around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage
temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is rec-
ommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started
on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils).
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
