MBRS320
MBRS320, Rev. A1
Features
•Compact surface mount with J-bend leads (SMC)
•3.0 Watt Power Dissipation package
• 3.0 Ampere, forward voltage less than 500 mV
MBRS320
3.0 Schottky Power Rectifier
Absolute Maximum Ratings* TA = 25°C unless otherwise noted
Electrical Characteristics TA = 25°C unless otherwise noted
Symbol
Parameter
Value
Units
IF(AV) Average Rectified Forward Current
(TL = 100°C)
(TL = 90°C)
3.0
4.0
A
A
IFSM Surge Non Repetitive Forward Current
(Half wave, single phase, 60 Hz)
80 A
RθJL Junction to Case for Thermal Resistance 11 °C/W
Tstg Storage Temperature -65 to +150 °C
Tj max Maximum Junction Temperature -65 to +125 °C
2001 Fairchild Semiconductor Corporation
SMC (D0-214AB)
Color Band Denotes Cathode
Top Mark: B32
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
Symbol
Parameter
Value
Units
VRRM Repetitive Peak Reverse Voltage 20 V
IRM Maximum Reverse Leakage Current @ VR = 20 V, Tj = 25 °C
VR = 20 V, Tj = 100 °C
2.0
20
mA
mA
VFM Maximum Forward Voltage,
(Note 1) @ IF = 3.0A, Tj = 25 °C 500 mV
Note 1: Pulse Test: Pulse width <300µs, Duty Cycle < 2%
MBRS320
MBRS320, Rev. A1
Schottky Barrier Rectifier
(continued)
Typical Characteristics
Reverse Leakage Current
vs Temperature
0 2 4 6 8 10 12 14 16 18 20
0.00 1
0.01
0.1
1
5
10
V - REVERSE VOLTAGE (V)
I - REVERSE LEAKAGE CURRENT (mA)
25 C
R
125 C
100 C
75 C
R
Capacitance vs.
Reverse Bias Voltage
0 5 10 15 20
100
150
200
250
300
350
400
V - REVERSE BIAS VOLTAGE (V)
CAPACITANCE (pF)
R
T = +25 C
A
Forward Voltage
vs Temperature
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
0.05
0.1
0.2
0.5
1
2
5
10
V - FORWARD VOLTAGE (V)
I - FORWARD CURRENT (A)
25 C
F
100 C
F
DO-214AB(SMC) Tape and Reel Data
July 2000, Rev . A©2000 Fairchild Semiconductor International
Configuration: Figure 1.0
Components Leader Tape
390mm minimum
Trailer Tape
160mm minimum or
Configuration: Figure 2.0
Cover Tape
Carrier T ape
F63TNR Label sample
Cathode
F
924
B34
F
924
B34
F
924
B34
F
924
B34
F
924
B34
Human Readable Label sample Human readable/barcode Label
336mm x 336mm x 38mm
Intermediate container for 13" reel option
Human
Readable/
Barcode
Label
Antistatic Cover Tape
Embossed Carrier Tape
Human readable label
Under package
code P5
TNR
13
3,000
336x336x38
6,000
0.210
1.130
Barcode label
Under package
code MA
TNR
13
3,000
336X336X38
6,000
0.210
1.130
Human
Readable/Barcode
Label (on top)
Note/Comments
Packaging Option
Packaging type
Reel Size (inch diameter)
Qty per Reel/Tube/Bag
Box Dimension (mm)
Max qty per Box
Weight per unit (gm)
Weight per Reel (kg)
DO-214AB(SMC) Packaging
DO-214AB(SMC) Tape Leader and Trailer
DO-214AB(SMC) Packaging Information
Packaging Description:
DO-214AB(SMC) parts are shipped in tape. The carrier
tape is made from a dissipative (carbon filled)
polycarbonate resin. Alternate carrier tape is made of anti-
static plastic. The cover tape is a multilayer film (Heat
Activated Adhesive in nature) primarily composed of
polyester film, adhesive layer, sealant, and anti-static
sprayed agent. These reeled parts in standard option are
shipped with 7,500 units per 13" or 330cm diameter reel.
The reel comes in plastic or carton which is made of
polystyrene plastic (anti-static coated) and thick white
paper respectively. Further information is described in the
Packaging Information table.
These full reels are individually labeled and placed inside
a bleach box (illustrated in figure 1.0) made of recyclable
carton paper with a Fairchild logo printing. One box
contains two reels maximum. Certain number of these
boxes are placed inside shipping box which comes in
different sizes depending on the number of parts shipped.
DO-214AB(SMC) unit orientation
LOT: CBVK741B019
FSID: MBRS340
D/C1: T0012 QTY1: SPEC REV:
SPEC:
QTY: 3000
D/C2: QTY2: CPN:
FAIRCHILD SEMICONDUCTOR INTERNATIONAL
(F63TNR)3.2
CAUTION: This container provides protection for static sensitive devices. Handle devices with caution upon remo v al.
MADE IN ONE OR MORE OF THE FOLLOWING COUNTRIES: PHILIPPINES (MACTAN,
EXPORT PROCESSING ZONE), MALAYSIA, CHINA, S. KOREA, T AIWAN, THAILAND,
SINGAPORE AND JAPAN.
ANTI-STATIC
MBRS340
I.D.Qty
D/C Lot
T0012 CBVK741B019
3000
July 2000, Rev . A
DO-214AB(SMC) Tape and Reel Data, continued
Dimensions are in millimeter
Pkgtype
A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc
6.00
+/-0.15 8.25
+/-0.20 16.0
+/-0.3 1.55
+/-0.05 1.125
+/-0.125 1.75
+/-0.10 10.25
min 7.5
+/-0.05 8.0
+/-0.1 4.0
+/-0.1 2.4
+/-0.30 0.40
+/-0.10 13.0
+/-0.3 0.06
+/-0.02
P1
A0 D1
P0
F
W
E1
D0
E2
B0
Tc
Wc
K0
T
Dimensions are in inches and millimeters
Tape S ize Reel
Opti on Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2
12mm 13" Dia 13.0
330 0.059
1.5 512 +0.020/-0.008
13 +0.5/- 0. 2 0.795
20.2 1.97
50 mi n 0.646 +0.078/ -0.000
16.4 +2/-0 0.724
18.4
See detail AA
Dim A
max
13" Diameter Option W2 max Measured at Hub
W1 Measured at Hub
Dim N Dim D
min
Dim C
B Min
DETAIL AA
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum component rotat ion
0.5mm
maximum
0.5mm
maximum
Sketch C (Top View)
Component lateral movement
Typical
component
cavity
center line
20 deg maximum
Typical
component
center line
B0
A0
Sketch B (Top View)
Component Rotation
Sketch A (Side or Front Sectional View)
Component Rotation
User Direction of Feed
Configuration: Figure 3.0
DO-214AB(SMC)
(12mm)
DO-214AB(SMC) Embossed Carrier Tape
DO-214AB(SMC) Reel Configuration:
Figure 4.0
DO-214AB(SMC) (FS PKG Code P7)
DO-214AB(SMC) Package Dimensions
August 1999, Rev. A
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Part Weight per unit (gram): 0.21
©2000 Fairchild Semiconductor International
21
0.320 (8. 128)
0.305 (7. 747)
0.280 (7. 1 12)
0.260 (6. 604)
0.103 (2. 616)
0.079 (2. 007)
0.245 (6. 223)
0.220 (5. 588)
0.008 (0. 203)
0.002 (0. 51)
0.012 (0. 305)
0.006 (0. 152)
0.060 (1. 524)
0.030 (0. 762)
0.128 (3. 25)
0.108 (2. 743)
+
6.18
5.98
3.27
3.07
4.69
4.49
7.67
7.47
Minimum Recommended
Land Pattern
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN T O IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS P ATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
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The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF F AIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT ST A TUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SILENT SWITCHER
SMART ST ART™
FAST
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
LittleFET™
MicroFET™
MICROWIRE™
OPTOLOGIC™
Rev. H3
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DenseTrench™
DOME™
EcoSPARK™
E2CMOSTM
EnSignaTM
FACT™
F ACT Quiet Series™
STAR*POWER™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
TruTranslation™
UHC™
UltraFET
VCX™
STAR*POWER is used under license
