MULTILAYER CERAMIC CAPACITORS High Q/Low ESR Series (GHQ) 1. INTRODUCTION MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization, high density and high efficiency, ceramic condensers are used. CCE's GHQ series MLCC is used at high frequencies generally have a small temperature coefficient of capacitance, typical within the 30ppm/C required for NP0 (C0G) classification and have excellent conductivity internal electrode. Thus, CCE GHQ series MLCC will be with the feature of low ESR and high Q characteristics. 2. FEATURES 3. APPLICATIONS a. b. a. b. c. High Q and low ESR performance at high frequency. Quality improvement of telephone calls for low power loss and better performance. Mobile telecommunication: Mobile phone, WLAN. RF module: Power amplifier, VCO. Tuners. 4. HOW TO ORDER GHQ 04 CG 100 G 50 N T Series Size Dielectric Capacitance Tolerance Rated voltage Termination Packaging GHQ=High Q/ 04=0402 (1005) Low ESR 10=0603 (1608) 21=0805 (2012) CG=NP0 (C0G) Two significant digits followed by no. of zeros. And R is in place of decimal point. eg.: R47=0.47pF 0R5=0.5pF 1R0=1.0pF 100=10x100 =10pF Calchip Electronics, INC. www.calchipelectronics.com B=0.1pF C=0.25pF D=0.5pF F=1% G=2% J=5% Two significant N=Ag/Ni/Sn digits followed by no. of zeros. And R is in place of decimal point. T=7" reeled TD= 13" reeled 16=16 VDC 25=25 VDC 50=50 VDC 100=100 VDC Phone: (215) 942-8900 Fax: (215) 942-6400 1/7 MULTILAYER CERAMIC CAPACITORS High Q/Low ESR Series (GHQ) 5. EXTERNAL DIMENSIONS Size Inch (mm) L (mm) W (mm) 0402 (1005) 1.000.05 0.500.05 0.500.05 N 0.25 +0.05/-0.10 0603 (1608) 1.600.10 0.800.10 0.800.07 S 0.400.15 T (mm)/Symbol L MB (mm) T W MB 0805 (2012) 2.000.15 1.250.10 0.600.10 A 0.500.20 MB Fig. 1 The outline of MLCC # 0402 size : Reflow soldering only. 6. GENERAL ELECTRICAL DATA Dielectric NP0 Size 0402, 0603,0805 Capacitance* 0402: 0.1pF to 470pF 0603: 0.5pF to 3300pF 0805: 0.5pF to 150pF Capacitance tolerance Cap5pF: B (0.1pF), C (0.25pF) 5pF<Cap<10pF: C (0.25pF), D (0.5pF) Cap10pF: F (1%), G (2%), J (5%) Rated voltage (WVDC) 16V, 25V, 50V, 100V Q* Cap<30pF: Q400+20C Cap30pF: Q1000 Insulation resistance at Ur 10G Operating temperature -55 to +125C Capacitance change 30ppm ESR Cap<2.2pF: 1000m@900100MHz 2.2pFCap470pF: 500m@900100MHz Cap>470pF: 500m@6010MHz Termination Ni/Sn (lead-free termination) * Measured at the conditions of 25C ambient temperature and 30~70% related humidity. Apply 1.00.2Vrms, 1.0MHz10% for Cap1000pF and 1.00.2Vrms, 1.0kHz10% for Cap>1000pF. Calchip Electronics, INC. www.calchipelectronics.com Phone: (215) 942-8900 Fax: (215) 942-6400 2/7 MULTILAYER CERAMIC CAPACITORS High Q/Low ESR Series (GHQ) 7. CAPACITANCE RANGE Capacitance DIELECTRIC SIZE RATED VOLTAGE (VDC) 0.1pF (0R1) 0.2pF (0R2) 0.3pF (0R3) 0.4pF (0R4) 0.5pF (0R5) 0.6pF (0R6) 0.7pF (0R7) 0.8pF (0R8) 0.9pF (0R9) 1.0pF (1R0) 1.2pF (1R2) 1.5pF (1R5) 1.8pF (1R8) 2.2pF (2R2) 2.7pF (2R7) 3.3pF (3R3) 3.9pF (3R9) 4.7pF (4R7) 5.6pF (5R6) 6.8pF (6R8) 8.2pF (8R2) 10pF (100) 12pF (120) 15pF (150) 18pF (180) 22pF (220) 27pF (270) 33pF (330) 39pF (390) 47pF (470) 56pF (560) 68pF (680) 82pF (820) 100pF (101) 120pF (121) 150pF (151) 180pF (181) 220pF (221) 270pF (271) 330pF (331) 390pF (391) 470pF (471) 560pF (561) 680pF (681) 820pF (821) 1,000pF (102) 1,200pF (122) 1,500pF (152) 1,800pF (182) 2,200pF (222) 2,700pF (272) 3,300pF (332) NP0 16 N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N 0402 25 N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N 0603 50 N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N N 0805 16 25 50 100 50 100 S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S X X X X X X S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A 1. The letter in cell is expressed the symbol of product thickness. 2. For more information about products with special capacitance or other data, please contact Calchip local representative. Calchip Electronics, INC. www.calchipelectronics.com Phone: (215) 942-8900 Fax: (215) 942-6400 3/7 MULTILAYER CERAMIC CAPACITORS High Q/Low ESR Series (GHQ) 8. PACKAGING DIMENSION AND QUANTITY Size Paper tape Thickness (mm)/Symbol 7" reel 13" reel 0402 0.500.05 N 10K 20K 0603 0805 0.800.07 0.600.10 S A 4K 4k 15K 15k Unit: pieces 9. ELECTRICAL CHARACTERISTICS Q factor specification vs. Specific frequency Q value criteria vs. Specific frequency GHQ series, 0402 10000 100MHz 500MHz 1GHz Q 1000 100 10 Minimum (Solid line) Typical (Broken line) 1 0.1 1 10 100 Capacitance (pF) Fig. 2 Q factor specification vs. Specific frequency for 0402 Q factor specification vs. Specific frequency Q value criteria vs. Specific frequency GHQ series, 0603 10000 1GHz 100MHz 500MHz Q 1000 100 10 Minimum (Solid line) Typical (Broken line) 1 0.1 1 10 100 Capacitance (pF) Fig. 3 Q factor specification vs. Specific frequency for 0603 Calchip Electronics, INC. www.calchipelectronics.com Phone: (215) 942-8900 Fax: (215) 942-6400 4/7 MULTILAYER CERAMIC CAPACITORS High Q/Low ESR Series (GHQ) Typical ESR vs. Frequency 0402 "GHQ" series 0603 "GHQ" series 1 10 1pF 100pF 1 ESR (ohm) ESR (ohm) 5pF 0.1 10pF 1pF 4.7pF 10pF 0.1 68pF 0.01 100 1,000 0.01 100 10,000 1,000 Frequency (MHz) 10,000 Frequency (MHz) Fig. 4 ESR vs. Frequency 0402 Fig. 5 ESR vs. Frequency 0603 Typical Impedance vs. Frequency 0603 "GHQ" series 0402 "GHQ" series 10000 10000 Impedance (ohm) 100000 Impedance (ohm) 100000 1000 1pF 100 4.7pF 10 1 10pF 1000 1pF 100 10 1 100pF 0.1 68pF 4.7pF 10pF 0.1 10 100 1,000 10,000 10 100 Frequency (MHz) 1,000 10,000 Frequency (MHz) Fig. 6 Impedance vs. Frequency 0402 Fig. 7 Impedance vs. Frequency 0603 SRF vs. Capacitance Series Reasonant Frequency (MHz) 10,000 0402 1,000 0603 100 1 10 100 Capacitance (pF) Fig. 8 SRF vs. Capacitance Calchip Electronics, INC. www.calchipelectronics.com Phone: (215) 942-8900 Fax: (215) 942-6400 5/7 MULTILAYER CERAMIC CAPACITORS High Q/Low ESR Series (GHQ) APPENDIXES Tape & reel dimensions Fig. 9 The dimension of paper tape Size Thickness A0 B0 T K0 W P0 10xP0 P1 P2 D0 D1 E F Size Reel size C W1 A N 0402 N 0.620.05 1.120.05 0.600.05 8.000.10 4.000.10 40.00.10 2.000.05 2.000.05 1.550.05 1.750.05 3.500.05 0603 S 1.020.05 1.820.05 0.950.05 8.000.10 4.000.10 40.00.10 4.000.10 2.000.05 1.550.05 1.750.05 3.500.05 0805 A 1.500.10 2.300.10 0.750.05 8.000.10 4.000.10 40.00.10 4.000.10 2.000.05 1.550.05 1.750.05 3.500.05 0402, 0603,0805 7" 13" 13.0+0.5/-0.2 13.0+0.5/-0.2 8.4+1.5/-0 8.4+1.5/-0 178.00.10 330.01.0 60.0+1.0/-0 1001.0 Fig. 10 The dimension of reel Calchip Electronics, INC. www.calchipelectronics.com Phone: (215) 942-8900 Fax: (215) 942-6400 6/7 MULTILAYER CERAMIC CAPACITORS High Q/Low ESR Series (GHQ) Constructions No. Name NP0 1 Ceramic material BaTiO3 based 2 Inner electrode AgPd alloy 3 4 5 Termination Inner layer Ag Middle layer Ni Outer layer Sn (Matt) Fig. 11 The construction of MLCC Storage and handling conditions (1) To store products at 5 to 40C ambient temperature and 20 to 70%. related humidity conditions. (2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life extension is needed. Cautions: a. Don't store products in a corrosive environment such as sulfide, chloride gas, or acid. It may cause oxidization of electrode, which easily be resulted in poor soldering. b. To store products on the shelf and avoid exposure to moisture. c. Don't expose products to excessive shock, vibration, direct sunlight and so on. Recommended soldering conditions The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and concentration of N2 within oven are recommended. 4 / sec max Over 60sec at least by natural cooling Fig. 12 Recommended IR reflow soldering profile for SMT process with SnAgCu series solder paste. Calchip Electronics, INC. www.calchipelectronics.com Fig. 13 Recommended wave soldering profile for SMT process with SnAgCu series solder. Phone: (215) 942-8900 Fax: (215) 942-6400 7/7