Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 8
1Publication Order Number:
MBRB1045/D
MBRB1045G,
MBRD1045G,
SBRB1045G,
SBRD81045T4G
Preferred Device
SWITCHMODE
Schottky Power Rectifier
Surface Mount Power Package
This series of Power Rectifiers employs the Schottky Barrier
principle in a large metal−to−silicon power diode. State−of−the−art
geometry features epitaxial construction with oxide passivation and
metal overlay contact. Ideally suited for use in low voltage, high
frequency switching power supplies, free wheeling diodes, and
polarity protection diodes.
Features
Guardring for Stress Protection
Low Forward Voltage
175C Operating Junction Temperature
Epoxy Meets UL 94 V−0 @ 0.125 in
Short Heat Sink Tab Manufactured − Not Sheared!
AEC−Q101 Qualified and PPAP Capable
SBRB and SBRD8 Prefixes for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements
All Packages are Pb−Free*
Mechanical Characteristics:
Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
Weight: 1.7 grams for D2PAK (approximately)
0.4 grams for DPAK (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
Device Meets MSL1 Requirements
ESD Ratings:
Machine Model = C (> 400 V)
Human Body Model = 3B (> 8000 V)
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
SCHOTTKY BARRIER
RECTIFIER
10 AMPERES, 45 VOLTS
1
3
4
Preferred devices are recommended choices for future use
and best overall value.
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
D2PAK
CASE 418B
3
4
1
MARKING DIAGRAM
MBRB1045G
AKA
A = Assembly Location
Y = Year
WW = Work Week
MBRB1045 = Device Code
G = Pb−Free Package
AKA = Diode Polarity
AY WW
DPAK
CASE 369C
YWW
B10
45G
Y = Year
WW = Work Week
B1045 = Device Code
G = Pb−Free Package
MARKING DIAGRAM
12
3
4
MBRB1045G, MBRD1045G, SBRB1045G, SBRD81045T4G
http://onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
45 V
Average Rectified Forward Current (Rated VR) TC = 135C IF(AV) 10 A
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz) TC = 135C
IFRM 20
A
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
IFSM 150
(MBRB/SBRB)
70
(MBRD/SBRD)
A
Operating Junction and Storage Temperature Range (Note 1) TJ, Tstg −65 to +175 C
Voltage Rate of Change (Rated VR) dv/dt 10000 V/ms
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance,
(MBRB1045G)
Junction−to−Case (Note 2)
Junction−to−Ambient (Note 2)
(MBRD1045G)
Junction−to−Case (Note 2)
Junction−to−Ambient (Note 2)
RqJC
RqJA
RqJC
RqJA
1.0
50
2.43
68
C/W
2. When mounted using minimum recommended pad size on FR−4 board.
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Value Unit
Maximum Instantaneous Forward Voltage (Note 3)
(IF = 10 Amps, TJ = 125C)
(IF = 20 Amps, TJ = 125C)
(IF = 20 Amps, TJ = 25C)
VF
0.57
0.72
0.84
V
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, TJ = 125C)
(Rated dc Voltage, TJ = 25C)
IR
15
0.1
mA
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%
ORDERING INFORMATION
Device Package Shipping†
MBRB1045G D2PAK
(Pb−Free)
50 Units / Rail
SBRB1045G D2PAK
(Pb−Free)
50 Units / Rail
MBRB1045T4G D2PAK
(Pb−Free)
800 Units / Tape & Reel
SBRB1045T4G D2PAK
(Pb−Free)
800 Units / Tape & Reel
MBRD1045G DPAK
(Pb−Free)
50 Units / Rail
MBRD1045T4G DPAK
(Pb−Free)
2,500 Units / Tape & Reel
SBRD81045T4G DPAK
(Pb−Free)
2,500 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MBRB1045G, MBRD1045G, SBRB1045G, SBRD81045T4G
http://onsemi.com
3
Figure 1. Maximum Forward Voltage
1.2
vF
, INSTANTANEOUS VOLTAGE (VOLTS)
100
70
5.0
10
3.0
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)
1.0
0.60.2 0.4 0.8 1.0 1.4
2.0
20
0.1
0.5
0.7
30
7.0
0.3
50
TJ = 150C
Figure 2. Typical Forward Voltage
0.2
1.2
vF
, INSTANTANEOUS VOLTAGE (VOLTS)
100
70
5.0
10
3.0
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)
1.0
0.60.2 0.4 0.8 1.0 1.4
2.0
20
0.1
0.5
0.7
30
7.0
0.3
50
TJ = 150C
0.2
100C
25C100C
25C
5.0 150
VR, REVERSE VOLTAGE (VOLTS)
10
1.0
0.1
0.01
0.001
VR, REVERSE VOLTAGE (VOLTS)
250
100
10
0.1
0.01
0.001
1010
, REVERSE CURRENT (mA)IR
20 3025
100
5.0 50
1.0
IR, REVERSE CURRENT (mA)
35 40 5045
Figure 3. Maximum Reverse Current Figure 4. Typical Reverse Current
2015 3530 4540
TJ = 150C
125C
100C
75C
25C
25C
75C
100C
125C
150C
MBRB1045G, MBRD1045G, SBRB1045G, SBRD81045T4G
http://onsemi.com
4
0
VR, REVERSE VOLTAGE (VOLTS)
800
600
200
0
TC, CASE TEMPERATURE (C)
145130
18
8.0
4.0
2.0
0
135
10
C, CAPACITANCE (pF)
20 30
1400
155
6.0
40 50
Figure 5. Typical Capacitance
Figure 6. Current Derating, Case,
RqJC = 1.0 C/W
140 150 2.00
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
8.0
5.0
4.0
2.0
0
4.0
, AVERAGE FORWARD POWER DISSIPATION (WATTS)PF(AV)
6.0 108.0
10
12 1814
Figure 7. Forward Power Dissipation
, AVERAGE FORWARD CURRENT (AMPS)IF(AV)
14
10
12
3.0
1.0
9.0
7.0
6.0
dc
SQUARE
WAVE
RATED VOLTAGE APPLIED
dc
SQUARE
WAVE
400
1200
1000
16
16
NUMBER OF CYCLES AT 60 Hz
101.0
200
100
50
30
20
3.02.0 100
70
IFSM, PEAK HALF-WAVE CURRENT (AMPS)
Figure 8. Maximum Surge Capability
7.05.0 3020 7050
MBRB1045G, MBRD1045G, SBRB1045G, SBRD81045T4G
http://onsemi.com
5
PACKAGE DIMENSIONS
SEATING
PLANE
S
G
D
−T−
M
0.13 (0.005) T
231
4
3 PL
K
J
H
V
E
C
A
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.340 0.380 8.64 9.65
B0.380 0.405 9.65 10.29
C0.160 0.190 4.06 4.83
D0.020 0.035 0.51 0.89
E0.045 0.055 1.14 1.40
G0.100 BSC 2.54 BSC
H0.080 0.110 2.03 2.79
J0.018 0.025 0.46 0.64
K0.090 0.110 2.29 2.79
S0.575 0.625 14.60 15.88
V0.045 0.055 1.14 1.40
−B−
M
B
W
W
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
F0.310 0.350 7.87 8.89
L0.052 0.072 1.32 1.83
M0.280 0.320 7.11 8.13
N0.197 REF 5.00 REF
P0.079 REF 2.00 REF
R0.039 REF 0.99 REF
D2PAK 3
CASE 418B−04
ISSUE K
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8.38
5.080
DIMENSIONS: MILLIMETERS
PITCH
2X
16.155
1.016
2X
10.49
3.504
MBRB1045G, MBRD1045G, SBRB1045G, SBRD81045T4G
http://onsemi.com
6
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C−01
ISSUE D
b
D
E
b3
L3
L4
b2
eM
0.005 (0.13) C
c2
A
c
C
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
D0.235 0.245 5.97 6.22
E0.250 0.265 6.35 6.73
A0.086 0.094 2.18 2.38
b0.025 0.035 0.63 0.89
c2 0.018 0.024 0.46 0.61
b2 0.030 0.045 0.76 1.14
c0.018 0.024 0.46 0.61
e0.090 BSC 2.29 BSC
b3 0.180 0.215 4.57 5.46
L4 −−− 0.040 −−− 1.01
L0.055 0.070 1.40 1.78
L3 0.035 0.050 0.89 1.27
Z0.155 −−− 3.93 −−−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
12 3
4
5.80
0.228
2.58
0.102
1.60
0.063
6.20
0.244
3.00
0.118
6.17
0.243
ǒmm
inchesǓ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
H0.370 0.410 9.40 10.41
A1 0.000 0.005 0.00 0.13
L1 0.108 REF 2.74 REF
L2 0.020 BSC 0.51 BSC
A1
H
DETAIL A
SEATING
PLANE
A
B
C
L1
L
H
L2 GAUGE
PLANE
DETAIL A
ROTATED 90 CW5
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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PUBLICATION ORDERING INFORMATION
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
MBRB1045/D
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