DATA SH EET
Product specification
Supersedes data of 1998 Jul 29
File under Integrated Circuits, IC24
1999 Jun 15
INTEGRATED CIRCUITS
74LVC4245A
Octal dual supply translating
transceiver; 3-state
1999 Jun 15 2
Philips Semiconductors Product specification
Octal dual supply translating transceiver; 3-state 74LVC4245A
FEATURES
•In accordance with JEDEC
standard no. 8-1A
•Wide supply voltage range:
3 V port: 1.5 to 3.6 V
5 V port: 1.5 to 5.5 V
•CMOS low power consumption
•Direct interface with TTL levels
•Control inputs accept voltages up
to 5.5 V.
DESCRIPTION
The 74LVC4245A is a high-performance, low-power, low-voltage, Si-gate
CMOS device, superior to most advanced CMOS compatible TTL families.
The 74LVC4245A is an octal dual supply translating transceiver featuring
non-inverting 3-state bus compatible outputs in both send and receive
directions. It is designed to interface between a 3 and 5 V bus in a mixed 3/5 V
supply environment.
The 74LVC4245A features an output enable (OE) input for easy cascading and
a send/receive (DIR) input for direction control. (OE) controls the outputs so
that the buses are effectively isolated.
In suspend mode, when VCCA is zero, there will be no current flow from one
supply to the other supply. The A-outputs must be set 3-state and the voltage
on the A-bus must be smaller than Vdiode (typ. 0.7 V). VCCA ≥VCCB (except in
suspend mode).
QUICK REFERENCE DATA
GND = 0 V; Tamb =25°C; tr=t
f≤2.5 ns.
Note
1. CPD is used to determine the dynamic power dissipation (PDin µW).
PD=C
PD ×VCC2×fi+Σ(CL×VCC2×fo) where:
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in Volts;
Σ(CL×VCC2×fo) = sum of the outputs.
SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
tPHL/tPLH propagation delay CL=50pF
A
nto BnVCCA = 5.0 V 4.0 ns
Bnto AnVCCB = 3.3 V 4.0 ns
CI/O input/output capacitance 10.0 pF
CPDA A port
Anto BnVI= GND to VCC; note 1 7.8 pF
Bnto AnVI= GND to VCC; note 1 27.9 pF
CPDB B port
Anto BnVI= GND to VCC; note 1 26 pF
Bnto AnVI= GND to VCC; note 1 10.4 pF
1999 Jun 15 3
Philips Semiconductors Product specification
Octal dual supply translating transceiver; 3-state 74LVC4245A
FUNCTION TABLE
See note 1.
Note
1. H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.
ORDERING INFORMATION
PINNING
INPUT INPUT/OUTPUT
OE DIR AnBn
L L A = B inputs
L H inputs B = A
HX Z Z
OUTSIDE NORTH
AMERICA NORTH AMERICA PACKAGE
TEMPERATURE
RANGE PINS PACKAGE MATERIAL CODE
74LVC4245AD 74LVC4245AD −40 to +85 °C 24 SO plastic SOT137-1
74LVC4245ADB 74LVC4245ADB 24 SSOP plastic SOT340-1
74LVC4245APW 74LVC4245ADH 24 TSSOP plastic SOT355-1
PIN SYMBOL DESCRIPTION
1V
CCA DC supply voltage (5 V bus)
2 DIR direction control
3, 4, 5, 6, 7, 8, 9 and 10 A0to A7data inputs/outputs
11, 12 and 13 GND ground (0 V)
14, 15, 16, 17, 18, 19, 20 and 21 B7to B0data inputs/outputs
22 OE output enable input (active LOW)
23 and 24 VCCB DC supply voltage (3 V bus)
1999 Jun 15 4
Philips Semiconductors Product specification
Octal dual supply translating transceiver; 3-state 74LVC4245A
Fig.1 Pin configuration.
handbook, halfpage
VCCA
GND
VCCB
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
4245
MNA451
DIR
A0
A1
A2
A3
A4
A5
A6
A7
GND
VCCB
OE
B0
B1
B3
B4
B2
B5
B6
B7
Fig.2 Logic symbol.
handbook, halfpage
3
2DIR
21
22
B0
B1
B2
B3
B4
B5
B6
B7
4
20
5
19
6
18
7
17
8
16
9
15
10
A0
A1
A2
A3
A4
A5
A6
A7
14
OE
MNA453
Fig.3 IEC logic symbol.
handbook, halfpage
20
3
2
22
2
1
19
4
18
5
17
6
16
7
15
8
14
9
21
G3
3EN1
3EN2
10
MNA452
1999 Jun 15 5
Philips Semiconductors Product specification
Octal dual supply translating transceiver; 3-state 74LVC4245A
RECOMMENDED OPERATING CONDITIONS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to GND (ground = 0 V).
Note
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
SYMBOL PARAMETER CONDITIONS LIMITS UNIT
MIN. MAX.
VCCA DC supply voltage 5 V port
(for maximum speed performance) VCCA ≥VCCB (see Fig.5) 1.5 5.5 V
VCCB DC supply voltage 3 V port
(for low-voltage applications) VCCA ≥VCCB (see Fig.5) 1.5 3.6 V
VIDC input voltage range (control inputs) 0 5.5 V
VI/O DC input voltage range; output 3-state 0 5.5 V
DC output voltage range; output HIGH or
LOW state 0V
CC V
Tamb operating ambient temperature range see DC and AC characteristics
per device −40 +85 °C
tr,tfinput rise and fall times VCCB = 2.7 to 3.0 V 0 20 ns/V
VCCB = 3.0 to 3.6 V 0 10
VCCA = 3.0 to 4.5 V 0 20
VCCA = 4.5 to 5.5 V 0 10
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCCA DC supply voltage 5 V port −0.5 +6.5 V
VCCB DC supply voltage 3 V port −0.5 +4.6 V
IIK DC input diode current VI<0 −−50 mA
VIDC input voltage note 1 −0.5 +6.5 V
IOK DC output diode current VO>V
CC or VO<0 −±50 mA
VI/O DC output voltage; output HIGH or LOW note 1 −0.5 VCC + 0.5 V
DC input voltage; output 3-state note 1 −0.5 +6.5 V
IODC output diode current VO=0toV
CC −±50 mA
IGND, ICC DC VCC or GND current −±100 mA
Tstg storage temperature −65 +150 °C
Ptot power dissipation per package
plastic mini-pack (SO) above 70 °C derate linearly
with 8 mW/K −500 mW
plastic shrink mini-pack (SSOP and
TSSOP) above 60 °C derate linearly
with 5.5 mW/K −500 mW
1999 Jun 15 6
Philips Semiconductors Product specification
Octal dual supply translating transceiver; 3-state 74LVC4245A
DC CHARACTERISTICS
Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).
Notes
1. All typical values are at VCCA = 5.0 V, VCCB = 3.3 V and Tamb =25°C.
2. Not for I/O pins.
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
OTHER VCCA/B
(V) −40 to +85
MIN. TYP.(1) MAX.
VIH HIGH-level input voltage 3 V port 2.7 to 3.6 2.0 −−V
5 V port 4.5 to 5.5 2.0 −−
V
IL LOW-level input voltage 3 V port 2.7 to 3.6 −−0.8 V
5 V port 4.5 to 5.5 −−0.8
VOH HIGH-level output voltage
(3 V port) VI=V
IH or VIL; IO=−12 mA 2.7 VCC −0.5 −−V
V
I
=V
IH or VIL; IO=−100 µA 3.0 VCC −0.2 VCC −
VI=V
IH or VIL; IO=−24 mA 3.0 VCC −1.0 −−
HIGH-level output voltage
(5 V port) VI=V
IH or VIL; IO=−12 mA 4.5 VCC −0.5 −−V
V
I
=V
IH or VIL; IO=−100 µA 4.5 VCC −0.2 VCC −
VI=V
IH or VIL; IO=−24 mA 4.5 VCC −0.8 −−
V
OL LOW-level output voltage
(3 V port) VI=V
IH or VIL; IO=12mA 2.7 −−0.40 V
VI=V
IH or VIL; IO= 100 µA 3.0 −−0.20
VI=V
IH or VIL; IO=24mA 3.0 −−0.55
LOW-level output voltage
(5 V port) VI=V
IH or VIL; IO=12mA 4.5 −−0.40 V
VI=V
IH or VIL; IO= 100 µA 4.5 −−0.20
VI=V
IH or VIL; IO=24mA 4.5 −−0.55
IIinput leakage current VI= 5.5 V or GND; note 2 3.6 −±0.1 ±5µA
IIHZ/IILZ input current for common
I/O pins (3 V port) VI=V
CC or GND 3.6 −0.1 ±15 µA
input current for common
I/O pins (5 V port) VI=V
CC or GND 5.5 −0.1 ±15 µA
IOZ 3-state output OFF-state
current (3 V port) VI=V
IH or VIL;
VO=V
CC or GND 3.6 −0.1 ±5µA
3-state output OFF-state
current (5 V port) VI=V
IH or VIL;
VO=V
CC or GND 5.5 −0.1 ±5µA
ICC quiescent supply current
(3 V port) VI=V
CC or GND; IO= 0 3.6 −0.1 10 µA
quiescent supply current
(5 V port) VI=V
CC or GND; IO= 0 5.5 −0.1 10 µA
∆ICC additional quiescent supply
current per control pin (3 V
port)
VI=V
CC −0.6 V; IO= 0 2.7 to 3.6 −5 500 µA
additional quiescent supply
current per control pin (5 V
port)
VI=V
CC −2.1 V; IO= 0 4.5 to 5.5 −5 500 µA
1999 Jun 15 7
Philips Semiconductors Product specification
Octal dual supply translating transceiver; 3-state 74LVC4245A
AC CHARACTERISTICS
GND = 0 V; tr=t
f≤2.5 ns; CL= 50 pF; Tamb =−40 to 85 °C.
Notes
1. Typical values are measured at VCCA = 5.0 V and VCCB = 3.3 V and Tamb =25°C.
2. Typical values are measured at VCCA = 5.0 V and Tamb =25°C.
SYMBOL PARAMETER WAVEFORMS
LIMITS
UNIT
VCCA =5V±0.5 V
VCCB = 3.3 V ±0.3 V VCCB = 2.7 V
MIN. TYP.(1) MAX. MIN. TYP.(2) MAX.
tPHL/tPLH propagation delay
Anto Bn
see Figs 4 and 7 1.5 4.0 6.5 1.5 4.5 7.0 ns
propagation delay
Bnto An
see Figs 4 and 7 1.5 4.0 6.5 1.5 4.5 7.0 ns
tPZH/tPZL 3-state output enable
time OE to An
see Figs 6 and 7 1.5 6.2 10 1.5 7.0 11.0 ns
3-state output enable
time OE to Bn
see Figs 6 and 7 1.5 5.0 8.1 1.5 5.7 8.7 ns
tPHZ/tPLZ 3-state output disable
time OE to An
see Figs 6 and 7 1.5 5.3 7.5 1.5 5.7 8.0 ns
3-state output disable
time OE to Bn
see Figs 6 and 7 1.5 5.8 7.8 1.5 6.2 8.5 ns
AC WAVEFORMS
Fig.4 The input (An, Bn) to output (Bn, An)
propagation delays.
handbook, halfpage
MNA366
An, Bn
INPUT
Bn, An
OUTPUT
tPHL tPLH
GND
VI
VM
VM
VOH
VOL
VM= 1.5 V at 2.7 V ≤VCCB ≤3.6 V;
VM= 0.5VCCA at VCCA ≥4.5 V;
VOL and VOH are typical output voltage drop that occur
with the output load.
Fig.5 Supply operation area.
handbook, halfpage
1.5 2.7 5.7
Complies with TTL levels
3.9
0.9
MNA454
3.92.1 4.5 5.13.3
1.5
2.1
2.7
3.3
3.6
1.2
1.8
2.4
3.0
VCCA (V)
VCCB
(V) VCCA ≥ VCCB
Full operation
1999 Jun 15 8
Philips Semiconductors Product specification
Octal dual supply translating transceiver; 3-state 74LVC4245A
Fig.6 The 3-state enable and disable times.
handbook, full pagewidth
MNA367
tPLZ
tPHZ
outputs
disabled outputs
enabled
VY
VX
outputs
enabled
OUTPUT
LOW-to-OFF
OFF-to-LOW
OUTPUT
HIGH-to-OFF
OFF-to-HIGH
OE INPUT
VI
VOL
VOH
VCC
VM
GND
GND
tPZL
tPZH
VM
VM
VM= 1.5 V at 2.7 V ≤VCCB ≤3.6 V;
VM= 0.5VCCA at VCCA ≥4.5 V;
VX=V
OL +0.3VatV
CCB ≤3.6 V;
VX=V
OL + 0.1 (VCCA −VOL)atV
CCA ≥4.5 V
VY=V
OH −0.3VatV
CCB ≤3.6 V;
VY=V
OH −0.1 (VOH −GND) at VCCA ≥4.5 V;
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.7 Load circuitry for switching times.
Definitions for test circuit:
RL= Load resistor; see chapter “AC characteristics”.
CL= Load capacitance including jig and probe capacitance
(see chapter “AC characteristics”).
RT= Termination resistance should be equal to the output
impedance Z0 of the pulse generator.
TEST S1
tPLH/tPHL open
tPLZ/tPZL 2×VCC
tPHZ/tPZH GND
VCC VI
for A and B port
<2.7 V VCC
for B port
2.7 to 3.6 V 2.7 V
for A port
4.5 to 5.5 V 3.0 V
handbook, full pagewidth
open
GND
50 pF
2 × VCC
VCC
VIVO
MNA368
D.U.T.
CL
RT
RL
500 Ω
RL
500 Ω
PULSE
GENERATOR
S1
1999 Jun 15 9
Philips Semiconductors Product specification
Octal dual supply translating transceiver; 3-state 74LVC4245A
PACKAGE OUTLINES
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 15.6
15.2 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT137-1
X
12
24
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
c
L
vMA
13
(A )
3
A
y
0.25
075E05 MS-013AD
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.61
0.60 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
e
1
0 5 10 mm
scale
SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
95-01-24
97-05-22
1999 Jun 15 10
Philips Semiconductors Product specification
Octal dual supply translating transceiver; 3-state 74LVC4245A
UNIT A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.21
0.05 1.80
1.65 0.38
0.25 0.20
0.09 8.4
8.0 5.4
5.2 0.65 1.25
7.9
7.6 0.9
0.7 0.8
0.4 8
0
o
o
0.13 0.10.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
1.03
0.63
SOT340-1 MO-150AG 93-09-08
95-02-04
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
112
24 13
0.25
y
pin 1 index
0 2.5 5 mm
scale
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1
A
max.
2.0
1999 Jun 15 11
Philips Semiconductors Product specification
Octal dual supply translating transceiver; 3-state 74LVC4245A
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 7.9
7.7 4.5
4.3 0.65 6.6
6.2 0.4
0.3 8
0
o
o
0.13 0.10.21.0
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT355-1 MO-153AD 93-06-16
95-02-04
0.25 0.5
0.2
wM
bp
Z
e
112
24 13
pin 1 index
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
D
y
0 2.5 5 mm
scale
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1
A
max.
1.10
1999 Jun 15 12
Philips Semiconductors Product specification
Octal dual supply translating transceiver; 3-state 74LVC4245A
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
•Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
•For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
•For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Jun 15 13
Philips Semiconductors Product specification
Octal dual supply translating transceiver; 3-state 74LVC4245A
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE SOLDERING METHOD
WAVE REFLOW(1)
BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, SMS not suitable(2) suitable
PLCC(3), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(3)(4) suitable
SSOP, TSSOP, VSO not recommended(5) suitable
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1999 Jun 15 14
Philips Semiconductors Product specification
Octal dual supply translating transceiver; 3-state 74LVC4245A
NOTES
1999 Jun 15 15
Philips Semiconductors Product specification
Octal dual supply translating transceiver; 3-state 74LVC4245A
NOTES
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
1999 66
Philips Semiconductors – a worldwide company
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Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 02 67 52 2531, Fax. +39 02 67 52 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Printed in The Netherlands 245004/03/pp16 Date of release: 1999 Jun 15 Document order number: 9397 750 06037
