1. Product profile
1.1 General description
The BB189 is a planar technology variable capacitance diode in a SOD523 ultra small
leadless plastic SMD package. The excellent matching performance is achieved by gliding
matching and a Direct Matching Assembly (DMA) procedure.
1.2 Features
nExcellent linearity
nExcellent matching to 1.8 % DMA
nUltra small plastic SMD package
nCd(25V) : 2.05 pF; Cd(2V) to Cd(25V) ratio: 6.3 min.
nLow series resistance
1.3 Applications
nVoltage Controlled Oscillators (VCO)
nElectronic tuning in UHF television tuners
2. Pinning information
[1] The marking bar indicates the cathode.
3. Ordering information
BB189
UHF variable capacitance diode
Rev. 01 — 8 June 2009 Product data sheet
Table 1. Pinning
Pin Description Simplified outline Graphic symbol
1 cathode [1]
2 anode 21
sym008
Table 2. Ordering information
Type number Package
Name Description Version
BB189 SC-79 plastic surface-mounted package; 2 leads SOD523
BB189_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 8 June 2009 2 of 6
NXP Semiconductors BB189
UHF variable capacitance diode
4. Marking
5. Limiting values
6. Characteristics
Table 3. Marking codes
Type number Marking code
BB189 4
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRreverse voltage - 32 V
IFforward current - 20 mA
Tstg storage temperature −55 +150 °C
Tjjunction temperature −55 +125 °C
Table 5. Characteristics
T
j
=25
°
C unless otherwise specified
Symbol Parameter Conditions Min Typ Max Unit
IRreverse current see Figure 2
VR=30V - - 10 nA
VR=30V; T
j=85°C - - 200 nA
rsdiode series resistance f = 470 MHz at Cd= 9 pF - 0.6 0.7 Ω
Cddiode capacitance f = 1 MHz; see Figure 1 and
Figure 3
VR= 2 V 14.15 - 15.75 pF
VR= 25 V 1.89 - 2.18 pF
Cd(2V)/Cd(25V) diode capacitance ratio (2 V to 25 V) f = 1 MHz 6.3 - -
∆Cd/Cddiode capacitance matching VR= 2 V to 25 V; in sequence of
10 diodes (gliding) - - 1.8 %
BB189_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 8 June 2009 3 of 6
NXP Semiconductors BB189
UHF variable capacitance diode
Fig 1. Diode capacitance as a function of reverse voltage; typical values
Tj=0°C to 85 °C.
Fig 2. Reverse current as a function of junction
temperature; maximum values Fig 3. Temperature coefficient of diode capacitance
as a function of reverse voltage; typical values
001aak204
10
20
30
Cd
(pF)
0
VR (V)
10−1102
101
001aak205
102
10
103
IR
(nA)
1
Tj (°C)
0 1008040 6020 VR (V)
10−1102
101
001aak206
10−3
10−4
10−2
TCCd
(K−1)
10−5
BB189_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 8 June 2009 4 of 6
NXP Semiconductors BB189
UHF variable capacitance diode
7. Package outline
8. Abbreviations
9. Revision history
Fig 4. Package outline SOD523 (SC-79)
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOD523 SC-79 02-12-13
06-03-16
Plastic surface-mounted package; 2 leads SOD523
0 0.5 1 mm
scale
D
12
HE
Ebp
A
c
vMA
A
UNIT bpcDEv
mm
AH
E
DIMENSIONS (mm are the original dimensions)
Note
1. The marking bar indicates the cathode.
(1) 0.34
0.26 0.17
0.11 0.1
0.85
0.75
1.25
1.15
0.65
0.58 1.65
1.55
Table 6. Abbreviations
Acronym Description
SMD Surface Mounted Device
UHF Ultra High Frequency
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BB189_1 20090608 Product data sheet - -
BB189_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 8 June 2009 5 of 6
NXP Semiconductors BB189
UHF variable capacitance diode
10. Legal information
10.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors BB189
UHF variable capacitance diode
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 June 2009
Document identifier: BB189_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
12. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 4
9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 4
10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 5
10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 5
10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
11 Contact information. . . . . . . . . . . . . . . . . . . . . . 5
12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
