INTEGRATED CIRCUITS DATA SHEET TDA1579 TDA1579T Decoder for traffic warning (VWF) radio transmissions Product specification File under Integrated Circuits, IC01 May 1992 Philips Semiconductors Product specification Decoder for traffic warning (VWF) radio transmissions TDA1579 TDA1579T GENERAL DESCRIPTION Features The TDA1579 decoder is for radio transmissions having 57 kHz amplitude-modulated subcarriers as used in the German 'Verkehrs Warnfunk' (VWF) traffic warning system. * Selective subcarrier amplifier (57 kHz) with gain control * Transmitter identification signal (SK) decoder * Area identification signal (BK) and announcement identification signal (DK) active filtering * BK and DK decoders (Schmitt trigger with switched hysteresis) * BK and DK switch-on/switch-off delay circuits * Driver output for SK indicator (LED) * SK and BK control outputs. QUICK REFERENCE DATA Measured in Fig.1 at ViSK = 8 mV; f = 57 kHz amplitude modulated with fm = 34.95 Hz and m = 60% for `BK-traffic area C' signal; or with fm = 125 Hz and m = 30% for DK signal. PARAMETER CONDITIONS Supply voltage SYMBOL MIN. TYP. MAX. UNIT VP 7.5 8.5 12 V IP - 6 - mA Nominal input voltage at f = 57 kHz ViSK - 8 - mV Input impedance at f 57 kHz Zi 100 - - k Supply current Control level -3 dB ViSK - 2.4 - mV Input voltage peak-to-peak value Vi(p-p) 2 - - V SK switch-on mBKon - 42 - % SK switch hysteresis mBK - 3.5 - dB SK switch-on delay tdSKon - 150 - ms SK switch-off delay tdSKoff - 750 - ms mDKon - 13 - % DK switch hysteresis mDK - 3.6 - dB DK switch-on delay tdDKon - 750 - ms DK switch-off delay tdDKoff - 750 - ms Tamb -30 - + 80 C threshold level DK switch-on threshold level Ambient operating temperature range PACKAGE OUTLINES TDA1579: 18-lead DIL; plastic (SOT102); SOT102-1; 1996 August 12. TDA1579T: 20-lead mini-pack; plastic (SO20; SOT163A); SOT163-1; 1996 August 12. May 1992 2 Philips Semiconductors Product specification Decoder for traffic warning (VWF) radio transmissions TDA1579 TDA1579T RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134). All pin numbers in this table apply to TDA1579; for TDA1579T refer to Fig.1. PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage pin 7 VP = V7-18 - - 15 V Switch output voltage pin 1 V1-18 - - 23 V pins 2 or 3 V2; 3-18 - - 15 V pins 1, 2 or 3 -V1; 2; 3-18 - - 0.5 V Switch output current Signal input voltage Signal input current pin 1 I1 - - 50 mA pins 2 or 3 I2; 3 - - 5 mA pins 1, 2 or 3 -I1; 2; 3 - - 10 mA pin 13 V13-18 - - VP pin 13 -V13-18 - - 0.5 V pin 13 -I13 - - 10 mA Ptot - - 800 mW Tstg -55 - +150 C Tamb -30 - + 80 C Total power dissipation Storage temperature range Operating ambient temperature range CHARACTERISTICS VP = 8.5 V; Tamb = 25 C; measured at nominal input signal: ViSK = 8 mV, f = 57 kHz amplitude modulated with fm = 34.95 Hz and m = 60% for `BK-traffic area C' signal; or with fm = 125 Hz and m = 30% for DK signal. All pin numbers in this table apply to TDA1579, for TDA1579T refer to Fig.1. PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage pin 7 VP 7.5 - 12 V Supply current pin 7 IP - 6 10 mA f 57 kHz |Zi| 100 - - k Vi(p-p) 2 - - V Vo9BK = -3 dB ViSK - 2.4* - mV V9BK/V13SK Gv9-13 - 44* - dB Gv9-13 - - 2 dB Gain control range Gv 40 - - dB Controlled output voltage Vo9BK - 440 - mV Vo9DK - 220 - mV SK amplifier/decoder Input impedance Input voltage (peak-topeak value) Input voltage at start of gain control Voltage gain Gain spread May 1992 3 Philips Semiconductors Product specification Decoder for traffic warning (VWF) radio transmissions PARAMETER CONDITIONS TDA1579 TDA1579T SYMBOL MIN. TYP. MAX. UNIT BK circuit Vo5BKon 600 670 750 mV V o5BKon ---------------------V o5BKoff 3 3.5 4 dB conducting V4-18off 0.8 0.88 0.97 V I3 - - 1.5 mA saturation voltage I3 = 1.5 mA V3-18sat - - 0.35 V rejection voltage I3 < 5 A V3-18 18 - - V I1 - - 40 mA Switch-on threshold level pin 3 high-Z Switch hysteresis BK switch threshold level for BK-off (SK-off) pin 3 (typ. value = 0.21V8-18) SK output (pin 3) allowable load current Indicator driver (pin 1) allowable load current saturation voltage I1 = 20 mA V1-18sat - - 0.8 V rejection voltage I1 < 10 A V1-18 23 - - V pin 2 high-Z V15DKon 600 670 750 mV V 15DKon ---------------------V 15DKoff 3.1 3.6 4.1 dB V16-18off - 0.6 - V I2 - - 1.5 mA DK circuit Switch-on threshold level Switch hysteresis DK switch threshold level for DK-off (Schmitt pin 2 trigger output) conducting (typ. value 1 x VBE) DK output (pin 2) allowable load current saturation voltage I2 = 1.5 mA V2-18sat - - 0.35 V rejection voltage I2 < 5 A V2-18 18 - - V f = 100 Hz BK and DK filter amplifiers Go 84 - - dB Current gain Gi 120 - - dB Input bias current Ii - - 50 nA - - 50 mV Open loop gain Output offset voltage R5-6 = R14-15 = 680 k Vo5-8 V15-8 Available output current Io 1 - - mA Output resistance Ro - 2 3.5 k CL - - 50 pF Allowable load capacitance May 1992 4 Philips Semiconductors Product specification Decoder for traffic warning (VWF) radio transmissions PARAMETER CONDITIONS TDA1579 TDA1579T SYMBOL MIN. TYP. MAX. UNIT Internal reference voltage Output voltage V8-18 4.0 4.25 4.5 V (typ. value = 0.5 VP) Internal resistance of voltage source Available output current Output short-circuit current R8 - - 5 -I8 2 - - mA +I8 0.6 - - mA -I8sc - 8 - mA V17-18 - 3.6 - V Ri17 - 5 - k R17-18 180 - 270 k (typ. value = VP/1 k) Reference current source Reference voltage (typ. value = V8-18-VBE) Internal biasing resistor Allowable range of external reference resistor * Selectable by R12-8 or Z10-8. May 1992 5 Philips Semiconductors Product specification Decoder for traffic warning (VWF) radio transmissions TDA1579 TDA1579T APPLICATION INFORMATION (Fig.1) PARAMETER SYMBOL APPLICATION UNIT SK switch-on threshold level at mBK = 60% ViSKon typ. 1.8 mV mBKon typ. 32 % > 3.0 dB typ. < 3.5 4.0 dB dB typ. 95 ms tdSKon < 130 ms > 380 ms tdSKoff typ. 500 ms < 620 ms ViDKon typ. 1.5 mV mDKon typ. 13 % > 3.1 dB typ. < 3.6 4.1 dB dB typ. 750 ms tdDKon < 1000 ms > 600 ms tdDKoff typ. 750 ms < 1000 ms SK switch-on threshold level at ViSK = 8 mV SK switch hysteresis m BKon ----------------m BKoff SK switch-on delay (note 1) SK switch-off delay (note 2) DK switch-on threshold level at mDK = 30% DK switch-on threshold level at ViDK = 8 mV DK switch hysteresis m DKon ----------------m Dkoff DK switch-on delay (note 1) DK switch-off delay (note 2) Notes 1. Sequence for measuring switch-on delay times (tdon) a) Nominal BK or DK input signal at pin 13: Vi(p-p) = 8 mV; f = 57 kHz; modulation-on. b) Pin 4 of the BK detector (pin 16 of the DK detector) is switched to ground to cause a low signal at the SK output at pin 3 (DK output at pin 2). c) tdon commences when the ground connection is removed from pin 4 (pin 16) as the positive-going VoBK signal at pin 5 (VoDK signal at pin 15) crosses zero. tdon ends when the positive-going edge of the SK output arrives at pin 13 (DK at pin 2). 2. Sequence for measuring switch-off delay times (tdoff) a) Nominal operating conditions as in note 1. b) tdoff commences when the input is switched off as the negative-going VoBK signal at pin 5 (VoDK signal at pin 15) crosses zero. tdoff ends when the negative-going edge of the SK output arrives at pin 3 (DK at pin 2). May 1992 6 (1) fo = 55 Hz; Q = 1.9 (2) fo = 24 Hz; Q = 1.9 (3) fo = 125 Hz Fig.1 Application diagram. L = 2.36 mH; QL = 70; C = 3.3 nF; fo = 57 kHz. Pin numbers in parentheses are for TDA1579T, other pin numbers are for TDA1579. Philips Semiconductors May 1992 Product specification Decoder for traffic warning (VWF) radio transmissions 7 TDA1579 TDA1579T Philips Semiconductors Product specification Decoder for traffic warning (VWF) radio transmissions Fig.2 BK signal voltage at pin 5 as a function of frequency. TDA1579 TDA1579T Fig.3 DK signal voltage at pin 15 as a function of frequency: fo = 125 Hz; Q 18. Fig.4 Control characteristic of the SK amplifier at VP = 8.5 V, mBK = 60% and QL = 70. May 1992 8 Philips Semiconductors Product specification Decoder for traffic warning (VWF) radio transmissions TDA1579 TDA1579T FILTER INFORMATION Gain Amplifier conditions: Go >> Gv and Go >> 2 Q2 p -------------------Vo R1 C1 G v = - ------------------------------------------------------------------------------------------------------------------- , in which p = j and Gv = ------ . Vi 2 C1 + C2 R1 + R2 p + p --------------------------------- + ---------------------------------------------------------R3 C1 C2 R1 R2 R3 C1 C2 C1 = C2 = C GENERAL EQUATION C1 = C2 = C R2 < < R1 Resonance frequency Gain at = r 1 r = ---------------------------------------------------------------R1 R2 ---------------------- R3 C1 C2 R1 + R2 C2 R3 - --------Gvr = --------------------C1 + C2 R1 Quality Q= C1 C2 R3 ( R1 + R2 )------------------------ ------------------------------------R1 R2 C1 + C2 1 -------------------------------------------R1 R2 C ---------------------- R3 R1 + R2 1 ----------------------------C R2 R3 1 R3 --- -------2 R1 1 R3 --- -------2 R1 1 R3 ( R1 + R2 ) --- -------------------------------------R1 R2 2 1 R3 --- -------2 R2 Recommended components C1, C2 metallized polycarbonate film (MKC) capacitors; 5% and R1, R2, R3 metal film (MR) resistors; 2% or C1, C2 metallized polyester film (MKT) capacitors; 5% and R1, R2, R3 May 1992 carbon film (CR) resistors; 2% 9 Philips Semiconductors Product specification Decoder for traffic warning (VWF) radio transmissions TDA1579 TDA1579T PACKAGE OUTLINES DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 1.40 1.14 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 0.85 inches 0.19 0.020 0.15 0.055 0.044 0.021 0.015 0.055 0.044 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.033 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 93-10-14 95-01-23 SOT102-1 May 1992 EUROPEAN PROJECTION 10 Philips Semiconductors Product specification Decoder for traffic warning (VWF) radio transmissions TDA1579 TDA1579T SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.42 0.39 inches 0.043 0.055 0.016 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC May 1992 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-24 11 o 8 0o Philips Semiconductors Product specification Decoder for traffic warning (VWF) radio transmissions Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE * The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. May 1992 TDA1579 TDA1579T 12 Philips Semiconductors Product specification Decoder for traffic warning (VWF) radio transmissions TDA1579 TDA1579T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. May 1992 13