? ? Low Insertion Force PGA Sockets PGA Sockets .100" (2.54mm) Standard Grid Table of Models Description: Peel-A-Way(R) (KIS) Material: Polyimide Film Index: -269C to 400C (-452F to 752F) .005 (.13) Description: FR-4 (FIS) Material: FR-4 Fiberglass Epoxy Board Index: -40C to 140C (-40F to 284F) Polyimide Film .062 (1.57) PC Board Description: Molded (RIS) Material: High Temp. Liquid Crystal Polymer (LCP) Index: -40C to 260C (-40F to 500F) Features: * Low insertion force (1 oz. average per pin) * Screw-machined terminals with multiple finger contacts for reliability * Closed bottom terminal for 100% anti-wicking of solder * Tapered entry for ease of insertion .100 (2.54) PC Board RIS replaces HCIS, HCS, CIS, and CS. Options Tape Sealant - add 3M to end of part number * Custom designs available * Removable tape seal protects plated contact in harsh environments * Sealed socket will not allow dirt and other contaminants to enter socket chamber and become entrapped behind contact fingers Specifications: * Spray flux without contaminating contact area Terminals: Brass - Copper Alloy (C36000) ASTM-B-16 Material Silicone Backed Polyimide Film, -74C to 260C (-100F to 500F) Contacts: Beryllium Copper (C17200) ASTM-B-194 Solder Preform: Standard: 63Sn/37Pb Lead-free: 95.5Sn/4.0Ag/0.5Cu Plating: G - Gold over Nickel M - Matte Tin over Nickel T - Tin/Lead over Nickel Gold per MIL-G-45204 Matte Tin per ASTM545-97 Tin/Lead per MIL-P-81728 Nickel per QQ-N-290 Intermittent to 371C (700F) How To Order 1 RIS 068 - 04 M G Footprint Dash # If Applicable* Contact Plating RoHS Compliant: G - Gold T - Tin/Lead Body Type RoHS Compliant Insulators: KIS - Peel-A-Way (R) Terminal Plating RoHS Compliant: FIS - FR-4 RIS - New Hi-Temp Molded Number of Pins 004 to 484 *Footprints available online or in separate booklet. G - Gold M - Matte Tin T - Tin/Lead Terminal Type See options on next page Note: Terminals plated with Matte Tin are available only with Gold plated contacts. Quick-Turn delivery is not available on products with Matte Tin plating. 5 Energy Way, West Warwick, RI 02893 USA Tel: 800.424.9850 | 401.823.5200 Fax: 401.823.8723 info@advanced.com | www.advanced.com CAT16-PREVIEW06 Rev. 1/06 1 ESX 503 - 234 M G Footprint Dash # Contact Products shown covered by patents issued and/or notice. Plating If Applicable * pending. Specifications subject to change withoutRoHS Compliant: Body Type8 G - Gold inch/(mm) Low Insertion Force PGA Sockets PGA Sockets .100" (2.54mm) Standard Grid Standard Quick-Turn Terminals Additional standard and custom terminals available. See Terminals section online or consult factory. Type -51 Type -04 .157/(3.99) Hole Depth .120 (3.05) .130 (3.30) .110 (2.79) .110 (2.79) .020 Dia. (.51) .028 Dia. (.71) Type -29 Molded or FR-4 only .072 Dia. (1.83) .072 Dia. (1.83) .072 Dia. (1.83) Type -01 Molded or FR-4 only .072 Dia. (1.83) .165 (4.19) .165 (4.19) .125 (3.18) .170 (4.32) .020 Dia. (.51) .020 Dia. (.51) Type -33 Type -50 Type -85 Type -176 Peel-A-Way(R) only Peel-A-Way(R) only Peel-A-Way(R) only Peel-A-Way(R) only .072 Dia. (1.83) .165 (4.19) .058 Dia. (1.47) .058 Dia. (1.47) .072 Dia. (1.83) .031 (.79) .031 (.79) .155 (3.94) .031 (.79) .155 (3.94) .155 (3.95) Footprints: .125 (3.18) .038 Dia. (.97) .053 Dia. (1.35) .020 Dia. (.51) .034 Dia. (.86) 200 Pins Footprint Number 200-1 Type -210 Peel-A-Way(R) only 1.600 Sq. (40.64) .058 Dia. (1.47) .015 (.38) .155 (3.94) .034 Dia. (.86) .100/(2.54) Typ. Solder Preform Terminals Tin/Lead: Type -150 Lead-free: Type -811 Tin/Lead: Type -151 Lead-free: Type -812 .072 Dia. (1.83) .165 (4.19) Solder Preform .125 (3.18) .020 Dia. (.51) 16 x 16 rows Peel-A-Way(R) only .072 Dia. (1.83) Solder Preform Tin/Lead: Type -111 Lead-free: Type -810 .130 (3.30) .058 Dia. (1.47) * Full grid insulators loaded to your specific footprint Solder Preform .031 (.79) .155 (3.94) .110 (2.79) .020 Dia. (.51) .038 Dia. (.97) * Open centers available upon request (consult factory) * Hundreds of footprints available online * Use our online Build-A-Part feature or download a Footprints Booklet in PDF format Intrusive Reflow Application * Combines the labor of socket loading and solder application into one operation. * Eliminates the use of solder paste and screening operation. Available Online: * Extraction Tools * RoHS Qualification Test Report * Eliminates solder bridges and/or solder shorts due to excess solder. * Ensures a reliable solder joint with controlled solder volume. Solder Preform PC Board * Ideal for surface mount and mixed technology applications. * For custom solder preform terminal applications consult factory. Preform After Solder Flow inch/(mm) Products shown covered by patents issued and/or pending. Specifications subject to change without notice. 9 5 Energy Way, West Warwick, RI 02893 USA Tel: 800.424.9850 | 401.823.5200 Fax: 401.823.8723 info@advanced.com | www.advanced.com CAT16-PREVIEW06 Rev. 1/06