Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 1 of 6 June 2005
AG303-63
InGaP HBT Gain Block Product Information
The Communications Edge
TM
Product Features
x DC – 6000 MHz
x +14 dBm P1dB at 900 MHz
x +26 dBm OIP3 at 900 MHz
x 20.5 dB Gain at 900 MHz
x Single Voltage Supply
x Green SOT-363 SMT Pkg.
x Internally matched to 50 :
Applications
x Mobile Infrastructure
x CATV / DBS
x W-LAN / ISM
x RFID
x Defense / Homeland Security
x Fixed Wireless
Product Description
The AG303-63 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 900 MHz, the AG303-63 typically provides
20.5 dB gain, +26 dBm OIP3, and +14 dBm P1dB. The
device combines dependable performance with consistent
quality to maintain MTTF values exceeding 100 years at
mounting temperatures of +85q C and is housed in a lead-
free/green/RoHS-compliant SOT-363 industry standard
SMT package.
The AG303-63 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT technology process
technology and only requires DC-blocking capacitors, a
bias resistor, and an inductive RF choke for operation.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the AG303-63 will work for other various applications
within the DC to 6 GHz frequency range such as CATV
and fixed wireless.
Functional Diagram
RF IN
GND
RF OUT
GND
GND
GND
1
2
3
4
6
5
Function Pin No.
Input 3
Output/Bias 6
Ground 1, 2, 4, 5
Specifications (1)
Parameter Units Min Typ Max
Operational Bandwidth MHz DC 6000
Test Frequency MHz 900
Gain dB 20.5
Input Return Loss dB 21
Output Return Loss dB 24
Output IP3 (2) dBm +25.8
Output IP2 dBm +34
Output P1dB dBm +14.0
Noise Figure dB 3.2
Test Frequency MHz 1900
Gain dB 17.3 18.3 19.3
Output IP3 (2) dBm +25.3
Output P1dB dBm +12.6
Device Voltage V 4.23
Device Current mA 35
1. Test conditions:. T = 25º C, Supply Voltage = +5 V, Rbias = 22.1
, 50
System.
2. 3OIP measured with two tones at an output power of -2 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Typical Performance (1)
Parameter Units Typical
Frequency MHz 500 900 1900 2140
S21 dB 21.1 20.5 18.3 17.7
S11 dB -20 -21 -20 -20
S22 dB -25 -24 -19 -18
Output P1dB dBm +14.0 +14.0 +12.6 +12.2
Output IP3 dBm +26.1 +25.8 +25.3 +24.9
Noise Figure dB 3.1 3.2 3.4 3.4
Absolute Maximum Rating
Parameter Rating
Operating Case Temperature -40 to +85 qC
Storage Temperature -55 to +125 qC
DC Voltage +4.5 V
RF Input Power (continuous) +10 dBm
Junction Temperature +250 qC
Operation of this device above any of these parameters may cause permanent damage.
Ordering Information
Part No. Description
AG303-63* InGaP HBT Gain Block
(lead-tin SOT-363 Pkg)
AG303-63G InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-363 Pkg)
AG303-63PCB 700 – 2400 MHz Fully Assembled Eval. Board
* This package is being phased out in favor of the green package type which is backwards compatible for
existing designs. Refer to Product Change Notification WJPCN06MAY05TC1 on the WJ website.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 2 of 6 February 2005
AG303-63
InGaP HBT Gain Block Product Information
The Communications Edge
TM
Typical Device RF Performance
Supply Bias = +5 V, Rbias = 22.1 :, Icc = 35 mA
Frequency MHz 100 500 900 1900 2140 2400 3500 5800
S21 dB 21.4 21.1 20.5 18.3 17.7 17.1 15.1 11.4
S11 dB -23 -20 -21 -20 -20 -20 -21 -20
S22 dB -20 -25 -24 -19 -18 17 -16 -11
Output P1dB dBm +14.0 +14.0 +14.0 +12.6 +12.2 +12.1 +9.8
Output IP3 dBm +26.3 +26.1 +25.8 +25.3 +24.9 +24.2
Noise Figure dB 3.1 3.1 3.2 3.4 3.4 3.5
1. Test conditions: T = 25º C, Supply Voltage = +5 V, Device Voltage = 4.23 V, Rbias = 22.1
, Icc = 35 mA typical, 50
System.
2. 3OIP measured with two tones at an output power of -2 dBm/tone separated by 10 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gain vs. Frequency
12
14
16
18
20
22
0 1 2 3 4
Frequency (GHz)
Gain (dB)
-40 C +25 C +85 C
Return Loss
-40
-30
-20
-10
0
0123456
Frequency (GHz)
S11, S22 (dB)
S11 S22
I-V Curve
0
10
20
30
40
50
60
3.0 3.5 4.0 4.5
Device Voltage (V)
Device Current (mA)
Optimal operating point
Output IP3 vs. Frequency
10
15
20
25
30
0 0.5 1 1.5 2 2.5 3
Frequency (GHz)
OIP3 (dBm)
-40 C +25 C +85 C
Output IP2 vs. Frequency
20
25
30
35
40
0 200 400 600 800 1000
Frequency (MHz)
OIP2 (dBm)
-40C +25C +85C
Noise Figure vs. Frequency
0
1
2
3
4
5
0 0.5 1 1.5 2 2.5 3
Frequency (GHz)
NF (dB)
-40 C +25 C +85 C
P1dB vs. Frequency
0
5
10
15
20
0 0.5 1 1.5 2 2.5 3 3.5 4
Frequency (GHz)
P1dB (dBm)
-40 C +25 C +85 C
Output Power / Gain vs. Input Power
frequency = 900 MHz
10
12
14
16
18
20
-20 -16 -12 -8 -4 0 4
Input Power (dBm)
Gain (dB)
0
4
8
12
16
20
Output Power (dBm)
Output Power
Gain
Output Power / Gain vs. Input Power
frequency = 2000 MHz
8
10
12
14
16
18
-20 -16 -12 -8 -4 0 4
Input Power (dBm)
Gain (dB)
-4
0
4
8
12
16
Output Power (dBm)
Output Power
Gain
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 3 of 6 February 2005
AG303-63
InGaP HBT Gain Block Product Information
The Communications Edge
TM
Typical Device RF Performance (cont’d)
Supply Bias = +6 V, Rbias = 51 :, Icc = 35 mA
Gain vs. Frequency
12
14
16
18
20
22
0 1 2 3 4
Frequency (GHz)
Gain (dB)
-40 C +25 C +85 C
Output IP3 vs. Frequency
10
15
20
25
30
0 0.5 1 1.5 2 2.5
3
Frequency (GHz)
OIP3 (dBm)
-40 C +25 C +85 C
Output IP2 vs. Frequency
20
25
30
35
40
0 200 400 600 800 1000
Frequency (MHz)
OIP2 (dBm)
-40c +25c +85c
P1dB vs. Frequency
0
5
10
15
20
0 0.5 1 1.5 2 2.5 3 3.5 4
Frequency (GHz)
P1dB (dBm)
-40 C +25 C +85 C
Noise Figure vs. Frequency
0
1
2
3
4
5
0 0.5 1 1.5 2 2.5 3
Frequency (GHz)
NF (dB)
-40 C +25 C +85 C
Typical Device RF Performance
Supply Bias = +8 V, Rbias = 108 :, Icc = 35 mA
Gain vs. Frequency
12
14
16
18
20
22
0 1 2 3 4
Frequency (GHz)
Gain (dB)
-40 C +25 C +85 C
Output IP3 vs. Frequency
10
15
20
25
30
0 0.5 1 1.5 2 2.5 3
Frequency (GHz)
OIP3 (dBm)
-40 C +25 C +85 C
Output IP2 vs. Frequency
20
25
30
35
40
0 200 400 600 800 1000
Frequency (MHz)
OIP2 (dBm)
-40c +25c +85c
P1dB vs. Frequency
0
5
10
15
20
0 0.5 1 1.5 2 2.5 3 3.5 4
Frequency (GHz)
P1dB (dBm)
-40 C +25 C +85 C
Noise Figure vs. Frequency
0
1
2
3
4
5
0 0.5 1 1.5 2 2.5 3
Frequency (GHz)
NF (dB)
-40 C +25 C +85 C
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 4 of 6 February 2005
AG303-63
InGaP HBT Gain Block Product Information
The Communications Edge
TM
Application Circuit
Recommended Component Values
Reference Frequency (MHz)
Designator 50 500 900 1900 2200 2500 3500
L1 820 nH 220 nH 68 nH 27 nH 22 nH 18 nH 15 nH
C1, C2, C4 .018 µF 1000 pF 100 pF 68 pF 68 pF 56 pF 39 pF
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig. Value / Type Size
L1 39 nH wirewound inductor 0603
C1, C2 56 pF chip capacitor 0603
C3 0.018 PF chip capacitor 0603
C4 Do Not Place
R1 22.1 : 1% tolerance 0805
Recommended Bias Resistor Values
S upply
Voltage R1 value S ize
5 V 22.1 ohms 0603
6 V 51 ohms 0805
7 V 80 ohms 1206
8 V 108 ohms 1210
9 V 137 ohms 1210
10 V 166 ohms 1210
12 V 223 ohms 2010
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +5 V. A
1% tolerance resistor is recommended.
Typical Device Data
S-Parameters (Vdevice = +4.23 V, ICC = 35 mA, T = 25
C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
50 -22.98 179.98 21.98 177.39 -24.44 3.54 -20.65 -5.68
250 -22.69 159.13 21.87 167.91 -25.02 4.82 -20.97 -15.75
500 -20.16 143.45 21.63 156.07 -24.85 3.57 -25.40 -43.37
750 -20.26 125.22 21.26 144.84 -24.83 4.51 -25.00 -70.94
1000 -20.94 105.07 20.77 134.31 -24.96 3.28 -23.86 -91.79
1250 -20.59 89.33 20.29 124.27 -24.48 7.57 -22.22 -112.20
1500 -20.65 73.36 19.71 115.11 -24.24 5.92 -20.71 -125.75
1750 -20.44 58.55 19.14 106.54 -23.97 6.93 -19.65 -135.37
2000 -19.79 46.75 18.54 98.41 -23.30 9.91 -18.55 -142.40
2250 -16.65 30.04 17.95 91.26 -23.27 8.63 -16.11 -127.79
2500 -17.12 24.85 17.54 85.95 -23.55 5.06 -16.52 -139.55
2750 -17.94 23.45 17.04 78.85 -22.50 5.49 -16.78 -152.45
3000 -19.00 24.66 16.52 71.97 -22.27 7.44 -17.04 -171.24
3250 -20.08 31.09 16.06 65.74 -21.97 7.62 -16.83 169.31
3500 -21.05 44.35 15.56 59.22 -21.88 5.59 -16.19 149.95
3750 -20.77 62.21 15.09 52.71 -21.42 3.70 -14.57 132.43
4000 -19.88 76.48 14.56 46.28 -21.00 1.61 -12.93 122.50
4250 -18.40 88.30 14.12 40.49 -20.52 -0.58 -11.61 114.50
4500 -17.26 96.65 13.65 34.69 -20.29 -4.52 -10.81 107.97
4750 -16.54 101.15 13.23 28.72 -20.01 -4.49 -10.22 105.55
5000 -16.75 103.13 12.85 23.29 -20.11 -4.65 -9.92 105.40
5250 -17.21 108.11 12.49 18.36 -19.52 -7.40 -10.06 102.86
5500 -18.69 112.12 12.14 13.87 -19.18 -10.39 -10.32 103.16
5750 -20.02 123.21 11.90 8.93 -19.00 -12.21 -10.98 105.01
6000 -22.38 131.64 11.68 4.17 -18.60 -14.81 -11.52 103.93
Device S-parameters are available for download on the website at: http://www.wj.com
C1
Blocking
Capacitor
RF OUT
L1
RF Choke
C3
0.018 µF
R1
Bias
Resistor
RF IN
C4
Bypass
Capacitor
C2
Blocking
Capacitor
Vcc
Icc = 35 mA
AG303-63
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 5 of 6 February 2005
AG303-63
InGaP HBT Gain Block Product Information
The Communications Edge
TM
AG303-63 (SOT-363 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter Rating
Operating Case Temperature -40 to +85qC
Thermal Resistance, Rth (1) 350q C/W
Junction Temperature, Tjc (2) 137q C
1. The thermal resistance is referenced from the hottest part
of the junction to the ground pin (pin 4).
2. This corresponds to the typical biasing condition of
+4.23V, 35 mA at an 85
C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177
C.
Product Marking
The component will be marked with an “E”
designator followed by a two-digit numeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1C
Value: Passes at 1000 V min.
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Level 4
Value: Passes at 1000 V min.
Test: Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 1
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135” )
diameter drill and have a final plated thru diameter of .25 mm
(.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
MTTF vs. GND Lead Temperature
1
10
100
1000
10000
60 70 80 90 100 110 120
Ground Lead Temperature (°C)
MTTF (million hrs)
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 6 of 6 February 2005
AG303-63
InGaP HBT Gain Block Product Information
The Communications Edge
TM
AG303-63G (Green / Lead-free SOT-363 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded
(maximum 245qC reflow temperature) soldering processes. The plating material on the leads is annealed matte tin over copper.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter Rating
Operating Case Temperature -40 to +85qC
Thermal Resistance, Rth (1) 350q C/W
Junction Temperature, Tjc (2) 137q C
1. The thermal resistance is referenced from the hottest part
of the junction to the ground pin (pin 4).
2. This corresponds to the typical biasing condition of
+4.23V, 35 mA at an 85
C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177
C.
Product Marking
The component will be marked with a “ J”
designator followed by a two-digit numeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1C
Value: Passes at 1000 V min.
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value: Passes at 1000 V min.
Test: Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 3
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135” )
diameter drill and have a final plated thru diameter of .25 mm
(.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
MTTF vs. GND Lead Temperature
1
10
100
1000
10000
60 70 80 90 100 110 120
Ground Lead Temperature (°C)
MTTF (million hrs)