Memory Product Specification
DDR2-667 SO-DIMM
Description
The Module is DDR2-667 CL5 Small Outline Memory module. The Module density from
512MB to 2GB, it consists 64/128Mx8 bit DDR2-667MHz Synchronous DRAMs in FBGA
packages, Memory Module intented for mounting into 200-pin edge connector sockets. The
electrical and mechanical specifications are as follows.
Features
• JEDEC Standard
• DDR2 Speed Grade : 667Mbps
• SO-DIMM : 200-pin
• Memory Organization : x8 , x16 FBGA DRAM chip
• DDR2 DRAM interface : SSTL_18
• CAS latency : 5-5-5
• Bandwidth : 5300MB/s
• VDD voltage : 1.8+-0.1V
• VDDQ voltage : 1.8+-0.1V
• Serial presence detect with EEPROM.
• PCB height : 1.181 inch
• RoHS Compliant
• Application : NoteBook
