Memory Product Specification DDR2-667 SO-DIMM Description The Module is DDR2-667 CL5 Small Outline Memory module. The Module density from 512MB to 2GB, it consists 64/128Mx8 bit DDR2-667MHz Synchronous DRAMs in FBGA packages, Memory Module intented for mounting into 200-pin edge connector sockets. The electrical and mechanical specifications are as follows. Features * * * * * * * * * * * * * JEDEC Standard DDR2 Speed Grade : 667Mbps SO-DIMM : 200-pin Memory Organization : x8 , x16 FBGA DRAM chip DDR2 DRAM interface : SSTL_18 CAS latency : 5-5-5 Bandwidth : 5300MB/s VDD voltage : 1.8+-0.1V VDDQ voltage : 1.8+-0.1V Serial presence detect with EEPROM. PCB height : 1.181 inch RoHS Compliant Application : NoteBook Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Apacer: 78.02G72.402 78.02GCC.AF10C