S3AB thru S3MB
FEATURES
Glass passivated chip
For surface mounted applications
Low reverse leakage current
Low forward voltage drop
High current capability
Plastic material has UL flammability classification 94V-0
MECHANICAL DATA
Case : Molded plastic
Polarity : Color band denotes cathode
Weight : 0.003 ounces, 0.093 grams
NOTES : 1. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
2. Thermal Resistance Junction to Lead.
3. Thermal Resistance Junction to Ambient.
V
RMS
V
DC
V
RRM
I
(AV)
V
F
I
R
Maximum Average Forward
Rectified Current
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum forward Voltage at 3.0A DC
Maximum DC Reverse Current
at Rated DC Blocking Voltage
@T
J
=125 C
@T
J
=25 C
3.0
1.15
10
250
T
J
Operating Temperature Range
-55 to +150
C
T
STG
Storage Temperature Range
-55 to +150
C
Typical Thermal Resistance (Note 2)
R
0JL
10
C/W
C
J
Typical Junction Capacitance (Note 1)
40
pF
uA
V
A
V
UNIT
V
V
CHARACTERISTICS SYMBOL
@T
L
=75 C
200
140
200
50
35
50
1000
700
1000
100
70
100
800
560
800
600
420
600
400
280
400
S3AB S3MB S3KB S3JB S3GB S3DB S3BB
SMB
All Dimensions in millimeter
SMB
DIM. MIN. MAX.
A
C
D
E
F
G
H
B
4.06 4.57
3.94 3.30
1.96 2.21
0.31 0.15
5.21 5.59
0.05 0.20
2.01 2.40
0.76 1.52
C
B
A
H
E
F
G
D
Typical Thermal Resistance (Note 3)
R
0JA
50
C/W
SURFACE MOUNT
GLASS PASSIVATED RECTIFIERS
REVERSE VOLTAGE
- 50
to
1000
Volts
FORWARD CURRENT
- 3.0
Amperes
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
℃
ambient temperature unless otherwise specified.
SEMICONDUCTOR
LITE-ON
REV. 6, May-2011, KSDB03
42
A S
2
I t
2
I t Rating for fusing (3ms t 8.3ms)
≦ ≦
2
I
FSM
Peak Forward Surge
Current
(Non-repetitive)
120
100
A
1ms single half
sine-wave
8.3ms single half
sine-wave
240
200
Tj=125
℃
Tj=25
℃
Tj=125
℃
Tj=25
℃