Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 1 of 5 October 2005
EC1078B
InGaP HBT Gain Block Product Information
The Communications Ed
g
e TM
Product Features
• DC – 3.5 GHz
• +21 dBm P1dB at 1 GHz
• +37 dBm OIP3 at 1 GHz
• 20 dB Gain at 1 GHz
• 4.4 dB Noise Fi gu re at 2 GHz
• Lead-free / green SOT-89 pkg
• Internally matched to 50 Ω
Applications
• Mobile Infrastru cture
• CATV / DBS
• W-LAN / ISM
• RFID
• Defense / Homeland Security
• Fixed Wireless
Product Description
The EC1078B is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 1000 MHz, the EC1078B typically provides 20
dB of gain, +37 dBm Output IP3, and +21 dBm P1dB.
The EC1078B consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation. The device is
ideal for wireless applications and is available in a low-cost,
surface-mountable lead-free/green/RoHS-compliant SOT-
89 package. All devices are 100% RF and DC tested.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the EC1078B will work for other various applications
within the DC to 3.5 GHz frequency range such as CATV
and fixed wireless.
Functional Diagram
RF IN GND RF OUT
GND
1 23
4
Function Pin No.
Input 1
Output/Bias 3
Ground 2, 4
Specifications (1)
Parameter Units Min Typ Max
Operational Bandwidth MHz DC 3500
Test Frequency MHz 1000
Gain dB 20
Output P1dB dBm +21
Output IP3 (2) dBm +37
Test Frequency MHz 2000
Gain dB 17
Large-signal Gain (3) dB 14.7 16
Input Return Loss dB 12
Output Return Loss dB 8
Output P1dB dBm +20
Output IP3 (2) dBm +33
Noise Figure dB 4.4
Test Frequency MHz 3000
Gain dB 13 14.5
Device Voltage V 5.3 5.6 5.9
Device Current mA 96
1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +7 V, Rbias = 14 Ω, 50 Ω Sy s tem.
2. 3OIP measured with two tones at an output power of +7 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Large-signal gain is tested with an input power level of +3 dBm.
Absolute Maximum Rating
Parameter Rating
Operating Case Temperature -40 to +85 °C
Storage Temperature -55 to +150 °C
Device Current 150 mA
RF Input Power (continuous) +12 dBm
Junction Temperature +250 °C
Operation of this device above any of these parameters may cause permanent damage.
Typical Performance (4)
Parameter Units Typical
Frequency MHz 500 900 1900 2140
S21 dB 20.7 20 17.2 16.6
S11 dB -13 -14 -14 -15
S22 dB -12 -12 -12 -12
Output P1dB dBm +20.6 +21 +20.5 +20
Output IP3 (2) dBm +37.5 +37 +33.5 +32.5
Noise Figure dB 3.1 3.5 4.3 4.4
4. Test conditions: T = 2 5º C, Sup ply Voltage = +6 V, De vice Voltag e = +7V, Rbias = 14 Ω, 50 Ω Sys tem .
Ordering Information
Part No. Description
EC1078B (4) InGaP HBT Gain Block
(lead-tin SOT-89 Pkg)
EC1078B-G InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
EC1078B-PCB 700 – 2400 MHz Fully Assembled Eval. Board
4. This package is being phased out in favor of the green package type which is backward compatible for
existing designs.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 2 of 5 October 2005
EC1078
InGaP HBT Gain Block Product Information
The Communications Ed
g
e TM
Typical Device RF Performance
Supply Bias = +7 V, Rbias = 14 Ω, Icc = 96 mA
Frequency MHz 100 500 900 1900 2140 2400 3500
S21 dB 21.2 20.7 20 17.2 16.6 15.9 13.5
S11 dB -13 -13 -14 -14 -15 -15 -13
S22 dB -11 -12 -12 -12 -12 -11 -9.2
Output P1dB dBm +20 +20.6 +21 +20.5 +20 +19
Output IP3 dBm +38 +37. 5 +37 +33.5 +32.5 +32
Noise Figure dB 3.4 3.5 3.5 3.8 3.8 3.9
1. Test conditions: T = 25º C, Supply Voltage = +7 V, Device Voltage = 5.6 V, Rbias = 14 Ω, Icc = 96 mA typical, 50 Ω System.
2. 3OIP measured with two tones at an output power of +7 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. The performance data does not
account for losses attributed to recommended input and output series resistances shown in the application circuit on page 3.
Gain vs. Frequency
0
5
10
15
20
25
30
0123456
Frequency (GHz)
Gain
(
dB
)
S11, S22 vs. Frequency
-20
-16
-12
-8
-4
0
0123456
Frequency (G Hz)
S11, S22
(
dB
)
S22
S11
Icc vs. V de
0
40
80
120
160
200
02468
Vde (V)
Icc
(
mA
)
25°C
O IP3 vs. Frequency
20
25
30
35
40
500 1000 1500 2000 2500 3000
Frequency (M Hz)
OIP3
(
dBm
)
25°C 85°C -40°C
Noise Figure vs. Frequency
2
3
4
5
6
500 1000 1500 2000
Frequency (M Hz)
NF
(
dB
)
P1dB vs. Frequency
12
16
20
24
500 1000 1500 2000 2500 3000
Frequency (M Hz)
P1dB
(
dBm
)
25°C 85°C -40°C
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 3 of 5 October 2005
EC1078
InGaP HBT Gain Block Product Information
The Communications Ed
g
e TM
Recommended Application Circuit (EC1078B-PCB)
Recommended Component Values
Reference Frequency (MHz)
Designator 50 500 900 1900 2200 2500 3500
L1 820 nH 220 nH 68 nH 27 nH 22 nH 18 nH 15 nH
C1, C2, C3 .018 µF 1000 pF 100 pF 68 pF 68 pF 56 pF 39 pF
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The component values in the table below are contained on the evaluation board to achieve optimal broadband
performance.
3. R1 and R2 are shown in the circuit diagram to avoid potential instab ilities. The configurati on shown above assu res
of unconditional stability with the use of the device. It is expected that linearity parameters (OIP3 and P1dB) to
degrade about only 0.5 dB, while overall gain will be about 1 dB less than the performance shown in page 1 and 2 of
this data sheet. Input and output re turn loss is expected to improve with the use of the I/O series resistances at 2 GHz.
Ref. Desig. Value / Type Size
L1 39 nH wirewound inductor 0603
C1, C2 56 pF chip capacitor 0603
C3 0.018 μF chip capacitor 0603
C4 Do Not Place
R1 6 Ω chip resistor 0603
R2 6 Ω chip resistor 0603
R3 14 Ω 1% tolerance 2010
Recommended Bias Resistor Values
Supply
Voltage R bias val ue Size
7 V 14.6 ohms 1210
8 V 25 ohms 1210
9 V 35 ohms 2010
10 V 46 ohms 2010
12 V 67 ohms 2512
The proper value for R bias is dependent upon the
supply voltage and allows for bias stability over
temperature. WJ recommends a minimum supply bias
of +7 V. A 1% tolerance resistor is recommended.
Typical Device S-Parameters
S-Parameters (Vdevice = +5.6 V, ICC = 96 mA, T = 25°C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB ) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
50 -13.94 -3.83 21.57 176.70 -24.12 0.80 -11.86 -4.93
500 -13.75 -39.71 20.96 148.92 -23.37 6.98 -11.69 -48.17
1000 -13.18 -77.85 19.93 122.53 -22.08 8.80 -10.82 -90.17
1500 -12.31 -113.82 18.86 98.71 -20.68 4.63 -9.54 -126.09
2000 -11.09 -148.03 17.94 76.48 -19.38 -1.93 -8.31 -158.11
2500 -9.97 -177.99 16.84 54.17 -18.50 -11.42 -7.34 173.96
3000 -8.87 154.89 15.65 33.67 -17.80 -21.55 -6.41 148.41
3500 -7.79 129.58 14.44 13.81 -17.41 -32.42 -5.63 125.43
4000 -6.76 106.00 13.18 -5.36 -17.25 -43.17 -4.78 105.05
4500 -5.72 85.30 11.80 -23.83 -17.22 -53.97 -4.07 86.50
5000 -4.72 66.77 10.39 -41.03 -17.40 -64.41 -3.41 70.24
5500 -3.91 51.00 8.85 -57.10 -17.84 -74.10 -2.93 56.07
6000 -3.22 37.49 7.41 -71.74 -18.28 -83.92 -2.53 43.40
Device S-parameters are available for download off of the website at: http://www.wj.com
C1
Blocking
Capacitor
RF OUT
L1
RF Choke
C3
0.018 µF
Bias
Resisto
r
RF IN
C4
Bypass
Capacito
r
C2
Blocking
Ca
p
acito
r
Vcc
Icc = 96 mA
EC1078B
R1
6 Ω R2
6 Ω
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 4 of 5 October 2005
EC1078
InGaP HBT Gain Block Product Information
The Communications Ed
g
e TM
EC1078B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with an
“1078” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235° C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vi as are critical for the proper performance o f
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 5 of 5 October 2005
EC1078
InGaP HBT Gain Block Product Information
The Communications Ed
g
e TM
EC1078B-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded
(maximum 245°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with an
“1078G” designator with an alphanumeric lot
code on the top surface of the package. The
obsoleted model – EC1078C – was housed in
a SOT-86 package with an “xxE”
nomenclature, where the “xx” is a 2-digit
number.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260° C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vi as are critical for the proper performance o f
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
